JP2012227219A - Package for housing electronic component, and electronic device - Google Patents

Package for housing electronic component, and electronic device Download PDF

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Publication number
JP2012227219A
JP2012227219A JP2011091204A JP2011091204A JP2012227219A JP 2012227219 A JP2012227219 A JP 2012227219A JP 2011091204 A JP2011091204 A JP 2011091204A JP 2011091204 A JP2011091204 A JP 2011091204A JP 2012227219 A JP2012227219 A JP 2012227219A
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electronic component
mounting base
conductor
circuit board
coaxial connector
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JP2011091204A
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JP5734072B2 (en
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Hiroyuki Nakamichi
博之 中道
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a good operation property of an electronic component at a high frequency by reducing a reflection loss at the time of inputting/outputting a high-frequency signal even when a frequency of an electric signal is increased.SOLUTION: A package for housing an electronic component has a base substance 1, a mounting base 5, a circuit board 4, a frame body 2 having a through-hole 2a formed in a lateral part, and a coaxial connector 3 fitted to the through-hole 2a and electrically connected to the circuit board 4. In the package, the frame body 2 has a projection part 2b protruded from an inner surface of the frame body 2 under the through-hole 2a toward the mounting base 5. An end surface of the projection part 2b and a lateral surface on the coaxial connector 3 side of the mounting base 5 are bonded with each other. Thereby, impedance mismatch is reduced, and reflection loss of a high-frequency signal is reduced, and a transmission efficiency is improved.

Description

本発明は、光通信分野やマイクロ波通信およびミリ波通信等の分野で用いられる、高い周波数帯域で作動する各種電子部品を収納する電子部品収納用パッケージおよびそれを用いた電子装置に関するものである。   The present invention relates to an electronic component storage package for storing various electronic components that operate in a high frequency band, and an electronic apparatus using the same, which are used in the fields of optical communication, microwave communication, millimeter wave communication, and the like. .

従来の光通信やマイクロ波通信またはミリ波通信等で使用される、高い周波数帯域で作動する各種電子部品を収納する電子部品収納用パッケージを用いた電子装置を図８に示す。   FIG. 8 shows an electronic apparatus using an electronic component storage package for storing various electronic components operating in a high frequency band, which is used in conventional optical communication, microwave communication, millimeter wave communication, or the like.

図８に示す例のように、従来の電子部品収納用パッケージは、上面にレーザダイオード（ＬＤ），フォトダイオード（ＰＤ）等の電子部品17が載置される基体11を有し、この基体11は、上面に信号線路導体14ａが形成され下面に接地導体14ｂが形成された回路基板14が載置用基台15を介して載置される載置部11ａを有していた。また、載置部11ａを囲繞するようにして基体11の上面に取着され、側部に貫通孔12ａが形成された枠体12を有していた。そして、枠体12の貫通孔12ａに同軸コネクタ13が嵌着され、この同軸コネクタ13と回路基板14とが、電気的に接続されたものであった。さらに、基体11に電子部品17を実装して、電子部品17と回路基板14の信号線路導体14ａとをボンディングワイヤ19で電気的に接続し、枠体12の上面に回路基板14および電子部品17を覆うように蓋体18を接合して気密封止することによって、電子装置としていた（例えば、特許文献１を参照）。   As in the example shown in FIG. 8, the conventional electronic component storage package has a base 11 on which an electronic component 17 such as a laser diode (LD) or a photodiode (PD) is placed. The circuit board 14 having the signal line conductor 14a formed on the upper surface and the ground conductor 14b formed on the lower surface has a mounting portion 11a on which the circuit board 14 is mounted via the mounting base 15. Further, the frame 12 was attached to the upper surface of the base 11 so as to surround the mounting portion 11a, and the through hole 12a was formed in the side portion. The coaxial connector 13 is fitted into the through hole 12a of the frame body 12, and the coaxial connector 13 and the circuit board 14 are electrically connected. Further, the electronic component 17 is mounted on the base 11, the electronic component 17 and the signal line conductor 14a of the circuit board 14 are electrically connected by the bonding wire 19, and the circuit board 14 and the electronic component 17 are formed on the upper surface of the frame body 12. The lid 18 is joined and hermetically sealed so as to cover the electronic device (see, for example, Patent Document 1).

特開2003−115630号公報JP 2003-115630 A

しかしながら、上記従来の電子部品収納用パッケージにおいて、信号線は、同軸コネクタ13の中心導体13ｃから回路基板14の信号線路導体14ａを伝搬するという経路を辿るのに対して、接地電位（グランド）は、図８に示す例の破線矢印のように、同軸コネクタ13の下面の外周導体13ａから、枠体12の内周側面および基体11の表面ならびに載置用基台15の側面を介して、回路基板14の下面に形成された接地導体14ｂに伝わるという経路を辿る。このように、同軸コネクタ13から回路基板14までの接地電位の伝搬経路が長くなるため、この接地電位の経路長と、同軸コネクタ13の中心導体13ｃから回路基板14の信号線路導体14ａを伝搬する信号線の経路長との長さに大きな差が生じる。その結果、インピーダンスの不整合が発生し、高周波信号の入出力時における反射損失が大きくなり高周波信号の伝送性が劣化し易くなるという問題点があった。   However, in the conventional electronic component storage package, the signal line follows the path of propagation from the center conductor 13c of the coaxial connector 13 to the signal line conductor 14a of the circuit board 14, whereas the ground potential (ground) is As shown by the broken line arrows in the example shown in FIG. 8, the circuit from the outer peripheral conductor 13 a on the lower surface of the coaxial connector 13 through the inner peripheral side surface of the frame body 12, the surface of the base 11, and the side surface of the mounting base 15. It follows a path of transmission to the ground conductor 14b formed on the lower surface of the substrate 14. Since the propagation path of the ground potential from the coaxial connector 13 to the circuit board 14 becomes long in this way, the propagation path length of the ground potential and the signal line conductor 14a of the circuit board 14 propagate from the center conductor 13c of the coaxial connector 13. A large difference is generated in the length of the signal line. As a result, there is a problem that impedance mismatch occurs, reflection loss at the time of input / output of the high frequency signal becomes large, and the transmission property of the high frequency signal is likely to deteriorate.

本発明は上記問題点に鑑み完成されたものであり、その目的は、同軸コネクタから回路基板までの接地電位の伝搬経路を短くしてインピーダンスの不整合を小さくし、高周波信号の反射損失を小さくすることにより、高周波信号を効率よく伝送させることができる電子部品収納用パッケージを提供することにある。また、電子部品収納用パッケージに実装された電子部品の高周波での作動性が良好な電子装置を提供することにある。   The present invention has been completed in view of the above problems, and its purpose is to shorten the propagation path of the ground potential from the coaxial connector to the circuit board to reduce impedance mismatch and to reduce reflection loss of high-frequency signals. Thus, an object of the present invention is to provide an electronic component storage package capable of efficiently transmitting a high-frequency signal. Another object of the present invention is to provide an electronic device in which the electronic component mounted in the electronic component storage package has good operability at high frequencies.

本発明の電子部品収納用パッケージは、上面に電子部品が搭載される基体と、該基体の上面の載置部に載置された載置用基台と、上面に信号線路導体が形成され、下面に接地導
体が形成されているとともに前記載置用基台の上面に載置された回路基板と、前記載置部を囲繞するように前記基体の上面に取着されているとともに側部に貫通孔が形成された枠体と、前記貫通孔に嵌着されて前記回路基板に電気的に接続された同軸コネクタとを具備した電子部品収納用パッケージにおいて、前記枠体は、前記貫通孔の下の前記枠体の内面から前記載置用基台側に突出した突出部を有し、該突出部の端面と前記載置用基台の前記同軸コネクタ側の側面とが接合されていることを特徴とするものである。 The electronic component storage package of the present invention has a base on which an electronic component is mounted on an upper surface, a mounting base mounted on a mounting portion on the upper surface of the base, and a signal line conductor formed on the upper surface. A grounding conductor is formed on the lower surface, and the circuit board is placed on the upper surface of the mounting base, and is attached to the upper surface of the base so as to surround the mounting portion and on the side portion. In the electronic component storage package comprising a frame body in which a through hole is formed and a coaxial connector that is fitted in the through hole and electrically connected to the circuit board, the frame body includes the through hole. A projecting portion projecting from the inner surface of the lower frame body toward the mounting base, and an end surface of the projecting portion and a side surface of the mounting base on the coaxial connector side are joined together It is characterized by.

また、本発明の電子部品収納用パッケージは、上記構成において、前記載置用基台は、該載置用基台の前記同軸コネクタ側の側面から前記同軸コネクタ側に突出した段部を有し、該段部の上面と前記突出部の下面とが接合されていることを特徴とするものである。   In the electronic component storage package according to the present invention, in the above configuration, the mounting base includes a stepped portion protruding from the side surface of the mounting base on the coaxial connector side to the coaxial connector side. The upper surface of the step portion and the lower surface of the protruding portion are joined.

本発明の電子装置は、上記本発明の電子部品収納用パッケージと、該電子部品収納用パッケージの前記基体に搭載されているとともに前記回路基板の前記信号線路導体に電気的に接続された電子部品と、前記枠体の上面に接合された蓋体とを具備していることを特徴とするものである。   The electronic device of the present invention includes the electronic component storage package of the present invention, and the electronic component mounted on the base of the electronic component storage package and electrically connected to the signal line conductor of the circuit board. And a lid joined to the upper surface of the frame.

本発明の電子部品収納用パッケージによれば、上面に電子部品が搭載される基体と、該基体の上面の載置部に載置された載置用基台と、上面に信号線路導体が形成され、下面に接地導体が形成されているとともに載置用基台の上面に載置された回路基板と、載置部を囲繞するように基体の上面に取着されているとともに側部に貫通孔が形成された枠体と、貫通孔に嵌着されて回路基板に電気的に接続された同軸コネクタとを具備した電子部品収納用パッケージにおいて、枠体は、前記貫通孔の下の前記枠体の内面から載置用基台側に突出した突出部を有し、該突出部の端面と載置用基台の同軸コネクタ側の側面とが接合されていることから、接地電位（グランド）は、同軸コネクタの下面の外周導体から突出部の上面を経て、回路基板の下面の接地導体に伝播し、接地電位（グランド）の伝搬経路が短くなって、接地電位の経路長と、信号線の経路長との差を小さくすることができる。その結果、インピーダンスの不整合を小さくすることができ、高周波信号の反射損失が小さくなり、高周波信号を効率よく伝送させることが可能となる。   According to the electronic component storage package of the present invention, the base on which the electronic component is mounted on the upper surface, the mounting base mounted on the mounting portion on the upper surface of the base, and the signal line conductor are formed on the upper surface. A grounding conductor is formed on the lower surface, and the circuit board is mounted on the upper surface of the mounting base, and is attached to the upper surface of the base so as to surround the mounting portion and penetrates to the side portion. An electronic component storage package comprising a frame having a hole formed therein and a coaxial connector fitted into the through hole and electrically connected to the circuit board, wherein the frame is the frame below the through hole Since it has a protruding portion that protrudes from the inner surface of the body to the mounting base side, and the end surface of the protruding portion and the side surface of the mounting base on the coaxial connector side are joined, the ground potential (ground) The lower surface of the circuit board passes through the upper surface of the protrusion from the outer peripheral conductor on the lower surface of the coaxial connector. Propagates to the ground conductor, shorter propagation paths of the ground potential (ground), it is possible to reduce the path length of the ground potential, the difference between the path length of the signal line. As a result, the impedance mismatch can be reduced, the reflection loss of the high-frequency signal is reduced, and the high-frequency signal can be transmitted efficiently.

本発明の電子部品収納用パッケージによれば、上記構成において、載置用基台は、該載置用基台の同軸コネクタ側の側面から同軸コネクタ側に突出した段部を有し、該段部の上面と突出部の下面とが接合されている場合は、枠体と載置用基台との接合において、突出部の側面と載置用基台の同軸コネクタ側の側面とに加えて、段部の上面と突出部の下面とが接合されることにより、枠体と載置用基台との接合面積が増加して、枠体と載置用基台とをより強固に接合することが可能となる。   According to the electronic component storage package of the present invention, in the above configuration, the mounting base has a stepped portion that protrudes from the side surface of the mounting base on the coaxial connector side to the coaxial connector side. In addition to the side surface of the projecting portion and the side surface of the mounting base on the coaxial connector side, when the upper surface of the portion and the lower surface of the projecting portion are joined, When the upper surface of the stepped portion and the lower surface of the protruding portion are joined, the joining area between the frame body and the mounting base is increased, and the frame body and the mounting base are joined more firmly. It becomes possible.

本発明の電子装置によれば、上記本発明の電子部品収納用パッケージと、該電子部品収納用パッケージの基体に搭載されているとともに回路基板の信号線路導体に電気的に接続された電子部品と、枠体の上面に接合された蓋体とを具備していることから、同軸コネクタから回路基板までの接地電位の伝搬経路を短くして、接地電位の経路長と、同軸コネクタの中心導体から回路基板の信号線路導体を伝搬する信号線の経路長とをほぼ等しくすることができる。その結果、インピーダンスの不整合を小さくすることができ、高周波信号を効率よく伝送させて、電子部品収納用パッケージに実装された電子部品を、高周波での作動性が良好なものとすることが可能となる。   According to the electronic device of the present invention, the electronic component storage package of the present invention, and the electronic component mounted on the base of the electronic component storage package and electrically connected to the signal line conductor of the circuit board, Since the cover body joined to the upper surface of the frame body is provided, the propagation path of the ground potential from the coaxial connector to the circuit board is shortened, and the length of the ground potential and the central conductor of the coaxial connector are reduced. The path length of the signal line propagating through the signal line conductor of the circuit board can be made substantially equal. As a result, impedance mismatching can be reduced, high-frequency signals can be transmitted efficiently, and electronic components mounted in electronic component storage packages can have high-frequency operability. It becomes.

（ａ）は、本発明の電子装置の実施の形態の一例を示す平面図であり、（ｂ）は、（ａ）のＸ−Ｘ線で切断した断面の一例を示す断面図である。(A) is a top view which shows an example of embodiment of the electronic device of this invention, (b) is sectional drawing which shows an example of the cross section cut | disconnected by the XX line of (a). 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大平面図である。It is a principal part enlarged plan view which shows the other example of embodiment of the electronic component storage package of this invention. （ａ）は、本発明の電子装置の実施の形態の他の例を示す平面図であり、（ｂ）は、（ａ）のＸ−Ｘ線で切断した断面の他の例を示す断面図である。(A) is a top view which shows the other example of embodiment of the electronic device of this invention, (b) is sectional drawing which shows the other example of the cross section cut | disconnected by the XX line of (a). It is. 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. 従来の電子装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the conventional electronic device.

本発明の電子部品収納用パッケージおよびそれを用いた電子装置について、添付の図面を参照しつつ詳細に説明する。   An electronic component storage package and an electronic apparatus using the same according to the present invention will be described in detail with reference to the accompanying drawings.

図１（ａ）は、本発明の電子部品収納用パッケージを用いた電子装置の蓋体を透視して上面からみた実施の形態の一例を示す平面図である。図１（ｂ）は、図１（ａ）のＸ−Ｘ線で切断した断面の一例を示す断面図である。図１（ａ），（ｂ）において、１は電子部品７を収容する電子部品収納用パッケージ本体の底面を構成する基体、２は電子部品収納用パッケージ本体の側壁用の枠体、２ａは枠体２の側部に形成され同軸コネクタ３が嵌着される貫通孔、２ｂは枠体２の貫通孔２ａの下の内面から載置用基台５側に突出した突出部である。３は高周波信号の入出力端子である同軸コネクタであり、外周導体３ａ、絶縁体３ｂ、中心導体３ｃからなる。４はインピーダンス整合用の回路基板であり、回路基板４の上面には信号線路導体４ａが形成され、回路基板４の上面および下面に接地導体４ｂが形成されている。回路基板４の上面および下面に形成された接地導体４ｂは、貫通導体４ｃを介して電気的に接続されている。５は基体１の上面の載置部１ａに載置され、回路基板４が搭載接合される載置用基台である。６は突出部２ｂの端面と載置用基台５の同軸コネクタ３側の側面とを接合する導電性接合材である。７は基体１に搭載実装されたＬＮ変調素子等の電子部品、８は枠体２の上面に接合され、回路基板４および電子部品７を気密封止する蓋体である。本発明の電子部品収納用パッケージは、これら基体１，枠体２，同軸コネクタ３，回路基板４および載置用基台５で構成されている。また、本発明の電子装置は、上記の電子部品収納用パッケージに、電子部品７を搭載実装し、枠体２の上面に蓋体８を接合することにより、回路基板４および電子部品７を気密封止してなる。   FIG. 1A is a plan view showing an example of an embodiment as seen from above through a lid of an electronic device using the electronic component storage package of the present invention. FIG.1 (b) is sectional drawing which shows an example of the cross section cut | disconnected by the XX line of Fig.1 (a). In FIGS. 1A and 1B, reference numeral 1 denotes a base body that forms the bottom surface of an electronic component housing package body that houses electronic components 7, 2 denotes a frame body for the side wall of the electronic component housing package body, and 2a denotes a frame. A through-hole 2b formed on the side of the body 2 and into which the coaxial connector 3 is fitted is a protruding portion that protrudes from the inner surface below the through-hole 2a of the frame 2 to the mounting base 5 side. Reference numeral 3 denotes a coaxial connector which is an input / output terminal for high-frequency signals, and includes an outer peripheral conductor 3a, an insulator 3b, and a central conductor 3c. Reference numeral 4 denotes a circuit board for impedance matching. A signal line conductor 4 a is formed on the upper surface of the circuit board 4, and a ground conductor 4 b is formed on the upper and lower surfaces of the circuit board 4. The ground conductors 4b formed on the upper and lower surfaces of the circuit board 4 are electrically connected through the through conductors 4c. Reference numeral 5 denotes a mounting base that is mounted on the mounting portion 1a on the upper surface of the base 1 and to which the circuit board 4 is mounted and joined. 6 is a conductive bonding material for bonding the end surface of the protruding portion 2b and the side surface of the mounting base 5 on the coaxial connector 3 side. Reference numeral 7 denotes an electronic component such as an LN modulation element mounted and mounted on the substrate 1, and 8 denotes a lid that is bonded to the upper surface of the frame body 2 and hermetically seals the circuit board 4 and the electronic component 7. The electronic component storage package of the present invention includes the base body 1, the frame body 2, the coaxial connector 3, the circuit board 4 and the mounting base 5. Further, the electronic device of the present invention mounts and mounts the electronic component 7 on the above-described electronic component storage package, and joins the lid body 8 to the upper surface of the frame body 2, so that the circuit board 4 and the electronic component 7 are removed. It is hermetically sealed.

また、本発明の電子部品収納用パッケージは、高周波信号の周波数が10ＧＨｚ以上、特に30ＧＨｚ以上の高い周波数帯域において有効であり、従来反射損失が発生していたのを抑制し、高周波信号を効率よく伝送させることができる。   In addition, the electronic component storage package of the present invention is effective in a high frequency band where the frequency of the high frequency signal is 10 GHz or higher, particularly 30 GHz or higher, and suppresses the occurrence of reflection loss in the past, and efficiently transmits the high frequency signal. Can be transmitted.

また、電子装置における電気的接続は、同軸コネクタ３の中心導体３ｃの一端が、回路基板４の上面の信号線路導体４ａに接合され、電子部品７と信号線路導体４ａとがボンディングワイヤ９で電気的接続されて、高周波信号の伝播が行なわれる。   Also, in the electrical connection in the electronic device, one end of the center conductor 3c of the coaxial connector 3 is joined to the signal line conductor 4a on the upper surface of the circuit board 4, and the electronic component 7 and the signal line conductor 4a are electrically connected by the bonding wire 9. The high frequency signal is propagated.

本発明の電子部品収納用パッケージは、図１（ａ），（ｂ）に示す例のように、上面に電子部品７が搭載される基体１と、該基体１の上面の載置部１ａに載置された載置用基台５と、上面に信号線路導体４ａが形成され、下面に接地導体４ｂが形成されているとともに載置用基台５の上面に載置された回路基板４と、載置部１ａを囲繞するように基体１の上面に取着されているとともに側部に貫通孔２ａが形成された枠体２と、貫通孔２ａに嵌着されて回路基板４に電気的に接続された同軸コネクタ３とを具備した電子部品収納用パ
ッケージにおいて、枠体２は、貫通孔２ａの下の内面から載置用基台５側に突出した突出部２ｂを有し、該突出部２ｂの端面と載置用基台５の同軸コネクタ３側の側面とが接合されていることを特徴とするものである。このような構成としたことから、接地電位（グランド）が、図１（ｂ）の破線矢印のように、同軸コネクタ３の下面の外周導体３ａから、突出部５ａの上面を経由して、回路基板４の下面に形成された接地導体４ｂに伝わるという経路を辿る。このように、接地電位の伝搬経路が、従来の電子部品収納用パッケージに比べて短くなることにより、この接地電位の経路長と、同軸コネクタ３の中心導体３ｃから回路基板４の信号線路導体４ａを伝搬する信号線の経路長との差を小さくすることができる。その結果、インピーダンスの不整合を小さくすることができ、高周波信号の反射損失が小さくなり、高周波信号を効率よく伝送させることが可能となる。特に図１（ｂ）に示す例のように、突出部２ｂが貫通孔２ａの直下の枠体２の内面からまっすぐに突出して載置用基台５の上部に接合され、突出部２ｂの上面と載置用基台５の上面とが同じ位置で面一となっている場合は、接地電位（グランド）が、同軸コネクタ３の下面の外周導体３ａから、突出部５ａの上面を経由して、回路基板４の下面に形成された接地導体４ｂに一直線状に伝わることとなり、接地電位の経路長と、信号線の経路長とがほぼ等しくなる。その結果、インピーダンスの不整合を小さくすることができ、高周波信号を効率よく伝送させることが可能となる。 As shown in FIGS. 1A and 1B, an electronic component storage package according to the present invention has a base 1 on which an electronic component 7 is mounted on an upper surface and a mounting portion 1a on the upper surface of the base 1. A mounting base 5 mounted thereon, a signal line conductor 4a formed on the top surface, a ground conductor 4b formed on the bottom surface, and a circuit board 4 mounted on the top surface of the mounting base 5; The frame 2 is attached to the upper surface of the base body 1 so as to surround the mounting portion 1a, and the through hole 2a is formed on the side, and the circuit board 4 is electrically connected to the through hole 2a. In the electronic component storage package including the coaxial connector 3 connected to the frame 2, the frame body 2 has a protruding portion 2 b protruding from the inner surface below the through hole 2 a toward the mounting base 5, The end face of the portion 2b and the side face on the coaxial connector 3 side of the mounting base 5 are joined together A. With this configuration, the ground potential (ground) is changed from the outer peripheral conductor 3a on the lower surface of the coaxial connector 3 via the upper surface of the protruding portion 5a as shown by the broken line arrow in FIG. The route is to be transmitted to the ground conductor 4b formed on the lower surface of the substrate 4. As described above, the propagation path of the ground potential is shorter than that of the conventional electronic component storage package, so that the path length of the ground potential and the signal line conductor 4a of the circuit board 4 from the central conductor 3c of the coaxial connector 3 are reduced. The difference from the path length of the signal line propagating through can be reduced. As a result, the impedance mismatch can be reduced, the reflection loss of the high-frequency signal is reduced, and the high-frequency signal can be transmitted efficiently. In particular, as in the example shown in FIG. 1B, the protruding portion 2b protrudes straight from the inner surface of the frame 2 directly below the through hole 2a and is joined to the upper portion of the mounting base 5, and the upper surface of the protruding portion 2b. And the upper surface of the mounting base 5 are flush with each other at the same position, the ground potential (ground) is passed from the outer peripheral conductor 3a on the lower surface of the coaxial connector 3 via the upper surface of the protruding portion 5a. Thus, the signal is transmitted in a straight line to the ground conductor 4b formed on the lower surface of the circuit board 4, and the path length of the ground potential is substantially equal to the path length of the signal line. As a result, impedance mismatch can be reduced, and high-frequency signals can be transmitted efficiently.

本発明の電子部品収納用パッケージは、具体的には、図１（ａ）に平面図で示す例のように、回路基板４の上面には、同軸コネクタ３の中心導体３ｃが接続される信号線路導体４ａと、接地導体４ｂとが形成されている。図１（ｂ）は、図１（ａ）のＸ−Ｘ線で切断した断面の一例を示す断面図であり、回路基板４の下面には、接地導体４ｂが形成されており、この回路基板４の下面に形成された接地導体４ｂは、回路基板４の上面に形成された接地導体４ｂに貫通導体４ｃを介して電気的に接続されている。   Specifically, the electronic component storage package of the present invention is a signal in which the central conductor 3c of the coaxial connector 3 is connected to the upper surface of the circuit board 4 as shown in the plan view of FIG. A line conductor 4a and a ground conductor 4b are formed. FIG. 1B is a cross-sectional view showing an example of a cross section taken along line XX of FIG. 1A. A ground conductor 4b is formed on the lower surface of the circuit board 4, and this circuit board is shown in FIG. The ground conductor 4b formed on the lower surface of 4 is electrically connected to the ground conductor 4b formed on the upper surface of the circuit board 4 through the through conductor 4c.

信号線は、同軸コネクタ３の中心導体３ｃを経由し、回路基板４の上面に形成された信号線路導体４ａに伝播し、また接地電位（グランド）は、同軸コネクタ３の外周導体３ａの外周面から、載置用基台５の突出部５ａの上面を経由して、回路基板４の下面に形成された接地導体４ｂに伝播する。   The signal line propagates to the signal line conductor 4a formed on the upper surface of the circuit board 4 via the central conductor 3c of the coaxial connector 3, and the ground potential (ground) is the outer peripheral surface of the outer peripheral conductor 3a of the coaxial connector 3. Then, the light propagates to the ground conductor 4b formed on the lower surface of the circuit board 4 via the upper surface of the protruding portion 5a of the mounting base 5.

基体１は、電子部品７を支持するための支持部材として機能する。基体１の上面には、回路基板４が載置用基台５を介して載置される載置部１ａを有しており、この載置部１ａに、載置用基台５がＡｕ−Ｓｎ半田等の低融点ろう材を介して接着固定されている。   The base body 1 functions as a support member for supporting the electronic component 7. On the upper surface of the base body 1, a circuit board 4 is provided with a mounting portion 1 a on which the mounting base 1 is placed via a mounting base 5. It is bonded and fixed via a low melting point brazing material such as Sn solder.

基体１は、Ｆｅ−Ｎｉ−Ｃｒ合金(ＪＩＳ規格のＳＵＳ304、ＳＵＳ310等)やＦｅ-Ｎｉ-Ｃｒ-Ｍｏ合金(ＪＩＳ規格のＳＵＳ303、ＳＵＳ316等)等のステンレス鋼や、Ｆｅ−Ｎｉ
−Ｃｏ合金や、Ｃｕ−Ｚｎ合金等の金属材料から成る。 The substrate 1 is made of stainless steel such as Fe-Ni-Cr alloy (JIS standard SUS304, SUS310, etc.) or Fe-Ni-Cr-Mo alloy (JIS standard SUS303, SUS316, etc.), Fe-Ni, etc.
-It consists of metal materials, such as Co alloy and Cu-Zn alloy.

例えば、基体１の上面に載置実装される電子部品７が、強誘電体素子であるＬＮ(ニオ
ブ酸リチウム)による変調素子（以下、ＬＮ素子という）の場合、ＬＮ素子の熱膨張係数15.4×10-６／℃と近似しているＳＵＳ303(熱膨張係数14.6×10-6／℃)、ＳＵＳ304(熱膨
張係数17.3×10-6／℃)、ＳＵＳ310(熱膨張係数15.8×10-6／℃)、ＳＵＳ316(熱膨張係数16.0×10-6／℃)等のＦｅ−Ｎｉ−Ｃｒ合金やＦｅ−Ｎｉ−Ｃｒ−Ｍｏ合金の金属材料を
用いて、基体１を作製することが好ましい。この場合、基体１の上面にＬＮ素子を載置実装して電子装置とした場合、基体１と電子部品７との熱膨張係数が近似しているため、電子部品７が作動した際に発生する熱や、電子部品７を基体１へろう材を介して実装するための加熱により、熱膨張係数の差に起因する応力で、電子部品７が基体１から剥がれたりすることがなくなるので好ましい。 For example, when the electronic component 7 placed and mounted on the upper surface of the substrate 1 is a modulation element (hereinafter referred to as an LN element) made of a ferroelectric element LN (lithium niobate), the thermal expansion coefficient of the LN element is 15.4 × 10 -6 / ° C. and in which SUS303 (thermal expansion coefficient of 14.6 × 10 -6 / ℃) which approximates, SUS304 (thermal expansion coefficient of 17.3 × 10 -6 / ℃), SUS310 ( thermal expansion coefficient of 15.8 × 10 -6 / ℃ ), SUS316 (thermal expansion coefficient 16.0 × 10 −6 / ° C.) or the like, it is preferable to produce the substrate 1 using a metal material such as Fe—Ni—Cr alloy or Fe—Ni—Cr—Mo alloy. In this case, when an electronic device is mounted by mounting an LN element on the upper surface of the base body 1, the thermal expansion coefficient of the base body 1 and the electronic component 7 is approximated. It is preferable that the electronic component 7 is not peeled off from the base body 1 due to heat or heat for mounting the electronic component 7 on the base body 1 through the brazing material due to a stress caused by a difference in thermal expansion coefficient.

また、基体１は、基体１を形成する金属材料のインゴットに圧延加工や打ち抜き加工等
の従来周知の金属加工法を施すことによって所定の形状に製作される。また、その表面に耐蝕性に優れ、かつ、ろう材との濡れ性に優れる金属を被着させておくことが好ましい。具体的には厚さ0.5〜９μｍのＮｉ層と厚さ0.5〜９μｍのＡｕ層を順次めっき法により被着させておくのがよく、基体１が酸化腐食するのを有効に防止するとともに、基体１の上面に回路基板４を載置するための載置用基台５を強固に接着固定させることができる。 The base body 1 is manufactured in a predetermined shape by applying a conventionally known metal processing method such as rolling or punching to an ingot of a metal material forming the base body 1. Further, it is preferable to deposit a metal having excellent corrosion resistance and excellent wettability with the brazing material on the surface. Specifically, a Ni layer having a thickness of 0.5 to 9 μm and an Au layer having a thickness of 0.5 to 9 μm are preferably sequentially deposited by a plating method, effectively preventing the substrate 1 from being oxidatively corroded and The mounting base 5 for mounting the circuit board 4 on the upper surface of 1 can be firmly bonded and fixed.

枠体２は、電子部品収納用パッケージ外部との電磁的遮蔽を行なうとともに、貫通孔２ａに同軸コネクタ３が嵌着接合される。枠体２は、基体１との接合における熱歪みを小さくし接合を強固なものとするために、基体１の熱膨張係数に近似する金属材料が用いられる。この枠体２は、基体１と同様に、その材料のインゴットに圧延加工や打ち抜き加工等の従来周知の金属加工法を施すことにより所定の形状に製作される。そして、基体１と同様に、その表面に耐蝕性に優れ、かつ、ろう材との濡れ性に優れる金属を被着させておくことが好ましい。具体的には厚さ0.5〜９μｍのＮｉ層と厚さ0.5〜９μｍのＡｕ層を順次めっき法により被着させておくのがよく、枠体２が酸化腐食するのを有効に防止するとともに貫通孔２ａに同軸コネクタ３を強固に接合できる。   The frame 2 performs electromagnetic shielding from the outside of the electronic component storage package, and the coaxial connector 3 is fitted and joined to the through hole 2a. For the frame body 2, a metal material that approximates the thermal expansion coefficient of the base body 1 is used in order to reduce thermal distortion in joining to the base body 1 and to strengthen the joining. Similar to the base body 1, the frame body 2 is manufactured in a predetermined shape by subjecting an ingot of the material to a conventionally known metal processing method such as rolling or punching. And like the base | substrate 1, it is preferable to make the surface adhere | attach the metal which is excellent in corrosion resistance and is excellent in wettability with a brazing material. Specifically, a Ni layer having a thickness of 0.5 to 9 μm and an Au layer having a thickness of 0.5 to 9 μm are preferably sequentially deposited by plating, which effectively prevents the frame body 2 from being oxidized and corroded. The coaxial connector 3 can be firmly joined to the hole 2a.

枠体２は、貫通孔２ａの下の枠体２の内面から載置用基台５側に突出した突出部２ｂが形成されている。この突出部２ｂの端面と、載置用基台５の同軸コネクタ３側の側面とが接合されて、接地電位（グランド）の伝播経路となる。この接地電位の伝搬経路が、枠体２の内面および基体１の表面ならびに載置用基台５の側面を介することなく、従来の電子部品収納用パッケージに比べて短くなることにより、接地電位の経路長と、同軸コネクタ３の中心導体３ｃから回路基板４の信号線路導体４ａを伝搬する信号線の経路長とをほぼ等しくすることができるので、インピーダンスの不整合を小さくすることができ、高周波信号の反射損失が小さくなり、高周波信号を効率よく伝送させることが可能となる。   The frame body 2 is formed with a protruding portion 2b that protrudes from the inner surface of the frame body 2 below the through hole 2a to the mounting base 5 side. The end surface of the projecting portion 2b and the side surface of the mounting base 5 on the coaxial connector 3 side are joined to form a propagation path for ground potential (ground). The propagation path of the ground potential is shorter than the conventional electronic component storage package without passing through the inner surface of the frame 2, the surface of the base body 1, and the side surface of the mounting base 5. Since the path length and the path length of the signal line propagating from the center conductor 3c of the coaxial connector 3 to the signal line conductor 4a of the circuit board 4 can be made substantially equal, impedance mismatch can be reduced, and high frequency Signal reflection loss is reduced, and high-frequency signals can be transmitted efficiently.

枠体２は、図２に示す例のように、突出部２ｂの端面の下部から載置用基台５の側面に向けて突起部２ｃを設けることが好ましい。このような構成により、突出部２ｂの端面と載置用基台５の側面との間に、突起部２ｃを底面とする凹部が形成され、この凹部に導電性接合材６が溜まるようになるので接合が容易になるとともに、導電性接合材６が流れ落ちて接合にあずかる導電性接合材６の量が減少することがなくなる。その結果、枠体２と載置用基台５とが強固に接合し、枠体２と載置用基台５との接合信頼性が向上するので好ましい。   As shown in the example shown in FIG. 2, the frame body 2 is preferably provided with a protruding portion 2 c from the lower portion of the end surface of the protruding portion 2 b toward the side surface of the mounting base 5. With such a configuration, a recess having the projection 2c as a bottom surface is formed between the end surface of the protruding portion 2b and the side surface of the mounting base 5, and the conductive bonding material 6 accumulates in the recess. As a result, the joining becomes easy and the amount of the conductive bonding material 6 that flows into the bonding due to the flow of the conductive bonding material 6 does not decrease. As a result, the frame 2 and the mounting base 5 are firmly bonded, and the bonding reliability between the frame 2 and the mounting base 5 is improved, which is preferable.

突出部２ｂは、図１（ａ）に示す例のように、枠体２の幅全体と同じ幅で突出して形成されていてもよく、図３に示す例のように、中心導体３ｃの下のみに形成されていてもよい。図３に示す例の場合は、突出部２ｂの端面が載置用基台５の側面に接合する面積が小さくなるので、枠体２と載置用基台５との熱膨張係数の差に起因して突出部２ｂの端面と載置用基台５の側面との間の接合部に発生する応力が減少し、接合の信頼性が向上するのでより好ましい。   The protruding portion 2b may be formed to protrude with the same width as the entire width of the frame body 2 as in the example shown in FIG. 1A, and below the center conductor 3c as in the example shown in FIG. It may be formed only. In the case of the example shown in FIG. 3, since the area where the end surface of the projecting portion 2 b is joined to the side surface of the mounting base 5 becomes small, the difference in the thermal expansion coefficient between the frame 2 and the mounting base 5 This is more preferable because the stress generated at the joint between the end face of the protruding portion 2b and the side surface of the mounting base 5 is reduced, and the joining reliability is improved.

枠体２は、基体１と同じ金属材料を用いて、基体１と枠体２とを一体成形することが好ましい。この一体成形の方法としては、上述したＦｅ−Ｎｉ−Ｃｒ合金やＦｅ−Ｎｉ−Ｃｒ−Ｍｏ合金等の金属材料のインゴットに切削加工や放電加工等の従来周知の金属加工法を施すことにより所定の形状に製作することができる。基体１と枠体２とを一体成形した場合は、組み立て時の接合ずれを生じるという不具合が発生することがなくなるので好ましい。突出部２ｂの形成方法としては、その周辺部を研削したり、別に加工した突出部２ｂ部の形状の部品を枠体２の側面に金属ろう材等で接合することで作製することができる。   The frame body 2 is preferably formed by integrally forming the base body 1 and the frame body 2 using the same metal material as the base body 1. As this integral molding method, the metal material ingot such as Fe-Ni-Cr alloy or Fe-Ni-Cr-Mo alloy described above is subjected to a conventionally known metal working method such as cutting or electric discharge machining. It can be manufactured in the shape of When the base body 1 and the frame body 2 are integrally molded, it is preferable that the problem of joining displacement during assembly does not occur. As a method of forming the protruding portion 2b, the protruding portion 2b can be manufactured by grinding the peripheral portion thereof or joining a separately processed component having the shape of the protruding portion 2b to the side surface of the frame body 2 with a metal brazing material or the like.

同軸コネクタ３は、外部電気回路（図示せず）と電子部品７とを電気的に接続する機能
を有するとともに、電子部品収納用パッケージ内部を塞ぐ機能を有し、外周導体３ａ，絶縁体３ｂおよび中心導体３ｃからなる。外周導体３ａは、筒状であり、Ｆｅ−Ｎｉ−Ｃｏ合金等の金属材料からなり、絶縁体３ｂは、外周導体３ａの貫通孔に充填されたホウケイ酸ガラス等の絶縁材料からなる。中心導体３ｃは、外周導体３ａの中心軸部分に絶縁体３ｂを介して装着され電子部品収納用パッケージ内外を導通させるものであり、両端部が絶縁体３ｂから突出している。貫通孔２ａへの同軸コネクタ３の嵌着接合は、貫通孔２ａに同軸コネクタ３を挿入するとともに、リング状のＡｕ−Ｓｎ合金等の低融点ろう材を外周導体３ａと貫通孔２ａの内周面との間に挿入保持させ、しかる後、低融点ろう材を加熱溶融させて貫通孔２ａの内周面と外周導体３ａとの間の隙間が全周にわたりＡｕ−Ｓｎ合金等の封着材によって充填されることによって行なわれる。 The coaxial connector 3 has a function of electrically connecting an external electric circuit (not shown) and the electronic component 7 and a function of closing the inside of the electronic component storage package, and includes an outer conductor 3a, an insulator 3b, and It consists of a center conductor 3c. The outer peripheral conductor 3a is cylindrical and is made of a metal material such as Fe—Ni—Co alloy, and the insulator 3b is made of an insulating material such as borosilicate glass filled in the through hole of the outer peripheral conductor 3a. The central conductor 3c is attached to the central axis portion of the outer peripheral conductor 3a via the insulator 3b and conducts the inside and outside of the electronic component storage package, and both ends protrude from the insulator 3b. The coaxial connector 3 is fitted and joined to the through hole 2a by inserting the coaxial connector 3 into the through hole 2a and using a low melting point brazing material such as a ring-shaped Au—Sn alloy as the inner periphery of the outer conductor 3a and the through hole 2a. Then, the low melting point brazing material is heated and melted so that the gap between the inner peripheral surface of the through hole 2a and the outer peripheral conductor 3a is entirely covered with a sealing material such as an Au-Sn alloy. It is done by filling with.

また、同軸コネクタ３は、高周波信号が伝送される中心導体３ｃと、それを取り囲む部位、すなわち金属材料からなる外周導体３ａおよび貫通孔２ａ内周面部とが、高周波信号伝送時のインピーダンスの整合が可能な同軸構造をなしている。   Further, the coaxial connector 3 has impedance matching at the time of high-frequency signal transmission between the central conductor 3c through which the high-frequency signal is transmitted and the portion surrounding it, that is, the outer peripheral conductor 3a made of a metal material and the inner peripheral surface portion of the through hole 2a. It has a possible coaxial structure.

また、同軸コネクタ３の形状は、円柱状または角柱状であり、枠体２に形成された貫通孔２ａの内周面に嵌着接合して電子部品収納用パッケージ内部を塞ぐような形状であればよい。例えば、同軸コネクタ３が円柱状の場合は、同軸コネクタ３の外周導体３ａの外周面を貫通孔２ａの円状の内周面に嵌着接合する。また、同軸コネクタ３が角柱状の場合は、同軸コネクタ３の外周導体３ａの外周面に平坦面を形成し、貫通孔２ａの内面にも平坦面を形成しておき、外周導体３ａの外周面に形成された平坦面と、貫通孔２ａの内面に形成された平坦面とを接合して、貫通孔２ａ内に同軸コネクタ３を嵌着接合する。   The shape of the coaxial connector 3 may be a columnar shape or a prismatic shape, and may be a shape that fits and joins the inner peripheral surface of the through hole 2a formed in the frame body 2 to close the inside of the electronic component storage package. That's fine. For example, when the coaxial connector 3 is cylindrical, the outer peripheral surface of the outer peripheral conductor 3a of the coaxial connector 3 is fitted and joined to the circular inner peripheral surface of the through hole 2a. When the coaxial connector 3 is prismatic, a flat surface is formed on the outer peripheral surface of the outer peripheral conductor 3a of the coaxial connector 3, and a flat surface is formed on the inner surface of the through hole 2a. The flat surface formed on the inner surface of the through hole 2a is joined to the flat surface formed on the inner surface of the through hole 2a, and the coaxial connector 3 is fitted into the through hole 2a.

回路基板４は、アルミナ（Ａｌ２Ｏ３）セラミックスまたは窒化アルミニウム（ＡｌＮ）セラミックス等のセラミックスから成り、インピーダンス整合用の基板として機能する。回路基板４は、図１（ａ）,（ｂ）に示す例のように、その上面に高周波信号の伝送線
路としての信号線路導体４ａが形成されている。回路基板４の上面および下面には、接地導体４ｂが形成され、回路基板４の上面および下面に形成された接地導体４ｂは、ビア導体４ｃを介して電気的に接続されている。回路基板４の下面に形成された接地導体４ｂは、Ａｕ−Ｓｎ合金等の低融点ろう材を介して載置用基台５の上面に接合している。信号線路導体４ａは、同軸コネクタ３の中心導体３ｃのインピーダンスと同じになるように形成されたグランド付きコープレナー線路であり、その一端側は電子部品７とボンディングワイヤ９を介して接続され、他端側は中心導体３ｃの先端部に接合される。そして、中心導体３ｃと電子部品７とを電気的に接続することにより、同軸コネクタ３と電子部品７とが電気的に接続される。また、接地電位（グランド）は、同軸コネクタ３の下面の外周導体３ａから、突出部２ｂの上面を経由して、回路基板４の下面に形成された接地導体４ｂに接続され、貫通導体４ｃを介して回路基板４の上面に形成された接地導体４ｂに接続され、電子部品７にボンディングワイヤ９を介して電気的に接続される。 The circuit board 4 is made of ceramics such as alumina (Al 2 O 3 ) ceramics or aluminum nitride (AlN) ceramics, and functions as an impedance matching board. As in the example shown in FIGS. 1A and 1B, the circuit board 4 has a signal line conductor 4a as a high-frequency signal transmission line formed on the upper surface thereof. Ground conductors 4b are formed on the upper and lower surfaces of the circuit board 4, and the ground conductors 4b formed on the upper and lower surfaces of the circuit board 4 are electrically connected via via conductors 4c. The ground conductor 4b formed on the lower surface of the circuit board 4 is joined to the upper surface of the mounting base 5 via a low melting point brazing material such as an Au—Sn alloy. The signal line conductor 4a is a coplanar line with a ground formed so as to have the same impedance as that of the center conductor 3c of the coaxial connector 3. One end side of the signal line conductor 4a is connected to the electronic component 7 via a bonding wire 9, and the like. The end side is joined to the tip of the center conductor 3c. And the coaxial connector 3 and the electronic component 7 are electrically connected by electrically connecting the center conductor 3c and the electronic component 7. FIG. The ground potential (ground) is connected from the outer peripheral conductor 3a on the lower surface of the coaxial connector 3 to the ground conductor 4b formed on the lower surface of the circuit board 4 via the upper surface of the protruding portion 2b. To the ground conductor 4 b formed on the upper surface of the circuit board 4 and electrically connected to the electronic component 7 via the bonding wire 9.

回路基板４は、例えばアルミナセラミックスからなる場合であれば、酸化アルミニウム，酸化マグネシウム，酸化カルシウム等の原料粉末に適当な有機バインダ，可塑剤，および溶剤を添加混合して得た泥漿物に、従来周知のドクターブレード法やカレンダーロール法を採用することによってセラミックグリーンシート（セラミック生シート）を形成し、次にこのセラミックグリーンシートに適当な打ち抜き加工を施して所定形状となすとともに、必要に応じて複数枚を積層して成形体となし、しかる後、この成形体を約1,600℃の
温度で焼成することによって製作される。この焼成後の回路基板４は、厚みが約0.15〜0.2ｍｍであり、インダクタンスを50Ωに整合させるために薄く製作される。 If the circuit board 4 is made of, for example, alumina ceramics, it is conventionally applied to a slurry obtained by adding and mixing an appropriate organic binder, plasticizer, and solvent to raw powders such as aluminum oxide, magnesium oxide, and calcium oxide. A ceramic green sheet (ceramic raw sheet) is formed by adopting a well-known doctor blade method or calendar roll method, and then the ceramic green sheet is appropriately punched into a predetermined shape. A plurality of sheets are laminated to form a molded body, and then the molded body is manufactured by firing at a temperature of about 1,600 ° C. The fired circuit board 4 has a thickness of about 0.15 to 0.2 mm, and is manufactured thin in order to match the inductance to 50Ω.

信号線路導体４ａ、接地導体４ｂ、貫通導体４ｃは、タングステン，モリブデン，マンガン，銅，銀，パラジウム，白金，金等の金属材料からなる。   The signal line conductor 4a, the ground conductor 4b, and the through conductor 4c are made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, or gold.

信号線路導体４ａ、接地導体４ｂ、貫通導体４ｃは、例えばタングステンからなる場合であれば、タングステンの粉末に有機溶剤，バインダを添加混練して金属ペーストを作製する。信号線路導体４ａおよび接地導体４ｂを形成する場合は、回路基板４となるセラミックグリーンシートに金属ペーストを所定の配線パターンとなるように、従来周知のスクリーン印刷法を用いて印刷することによって形成する。また、貫通導体４ｃを形成する場合は、回路基板４を作製する際にセラミックグリーンシートに打ち抜き加工やレーザ加工等によって貫通孔を形成しておき、この貫通孔に金属ペーストを充填することによって形成する。   If the signal line conductor 4a, the ground conductor 4b, and the through conductor 4c are made of, for example, tungsten, an organic solvent and a binder are added to and kneaded with tungsten powder to produce a metal paste. In the case of forming the signal line conductor 4a and the ground conductor 4b, the metal paste is formed on the ceramic green sheet to be the circuit board 4 by using a conventionally known screen printing method so as to form a predetermined wiring pattern. . When the through conductor 4c is formed, a through hole is formed in the ceramic green sheet by punching or laser processing when the circuit board 4 is manufactured, and the through hole is filled with a metal paste. To do.

信号線路導体４ａ、接地導体４ｂ、貫通導体４ｃは、薄膜加工で作製することもできる。信号線路導体４ａ、接地導体４ｂ、貫通導体４ｃを薄膜加工で作製することにより、信号線路導体４ａ、接地導体４ｂ、貫通導体４ｃを密着金属層、拡散防止層および主導体層が順次積層された３層構造の導体層とすることができ、高精度なパターンを形成できるので好ましい。   The signal line conductor 4a, the ground conductor 4b, and the through conductor 4c can be manufactured by thin film processing. The signal line conductor 4a, the ground conductor 4b, and the through conductor 4c are manufactured by thin film processing, and the signal line conductor 4a, the ground conductor 4b, and the through conductor 4c are sequentially laminated with an adhesion metal layer, a diffusion prevention layer, and a main conductor layer. A conductive layer having a three-layer structure is preferable, and a highly accurate pattern can be formed, which is preferable.

信号線路導体４ａ、接地導体４ｂ、貫通導体４ｃは、例えば以下のようにして薄膜加工で作製される。   The signal line conductor 4a, the ground conductor 4b, and the through conductor 4c are produced by thin film processing as follows, for example.

焼成後の回路基板４にレーザ加工やサンドブラストのような従来周知の加工法によって、貫通孔を形成し、蒸着法，スパッタリング法，イオンプレーティング法等の薄膜形成法によって信号線路導体４ａ、接地導体４ｂ、貫通導体４ｃとなる各層（密着金属層、拡散防止層および主導体層が順次積層された３層構造の導体層）を形成する。その後レジスト膜を形成し、フォトリソ加工、エッチング等の薄膜加工によって信号線路導体４ａ、接地導体４ｂ、貫通導体４ｃを形成する。   A through hole is formed in the fired circuit board 4 by a conventionally known processing method such as laser processing or sandblasting, and the signal line conductor 4a and the ground conductor are formed by a thin film forming method such as vapor deposition, sputtering, or ion plating. 4b and each layer (a conductor layer having a three-layer structure in which an adhesion metal layer, a diffusion prevention layer, and a main conductor layer are sequentially laminated) to be the through conductor 4c are formed. Thereafter, a resist film is formed, and the signal line conductor 4a, the ground conductor 4b, and the through conductor 4c are formed by thin film processing such as photolithography and etching.

載置用基台５は、基体１の上面の載置部１ａにＡｕ−Ｓｎ合金等の低融点ろう材を介して接合しており、載置用基台５の上面には、回路基板４がＡｕ−Ｓｎ合金等の低融点ろう材を介して載置接合している。また、載置用基台５は、基体１の熱膨張係数と、回路基板４の熱膨張係数との中間の熱膨張係数を持つＦｅ−Ｎｉ合金等の金属から成り、温度変化によって、上面に載置する回路基板４に大きな応力が働いて割れたりすることがないようにするための緩衝材としての中継基台として機能する。すなわち、ＬＮ素子の熱膨張係数に合わせた基体１に、直接、回路基板４を載置すると、基体１の熱膨張係数と回路基板４の熱膨張係数との違いによる応力で、回路基板４が割れてしまうことがあるために、基体１の上面の載置部１ａに載置用基台５を載置し、この載置用基台５の上面に回路基板４を載置するという本発明の構成としている。   The mounting base 5 is joined to the mounting portion 1 a on the upper surface of the base 1 via a low melting point brazing material such as an Au—Sn alloy, and the circuit board 4 is mounted on the upper surface of the mounting base 5. Are placed and bonded via a low melting point brazing material such as an Au-Sn alloy. The mounting base 5 is made of a metal such as an Fe—Ni alloy having a thermal expansion coefficient intermediate between the thermal expansion coefficient of the base 1 and the thermal expansion coefficient of the circuit board 4, and is placed on the upper surface due to a temperature change. It functions as a relay base as a buffer material for preventing the circuit board 4 to be placed from cracking due to large stress. That is, when the circuit board 4 is placed directly on the base body 1 in accordance with the thermal expansion coefficient of the LN element, the circuit board 4 is caused by stress due to the difference between the thermal expansion coefficient of the base body 1 and the thermal expansion coefficient of the circuit board 4. In order to break, the mounting base 5 is mounted on the mounting portion 1 a on the upper surface of the base 1, and the circuit board 4 is mounted on the upper surface of the mounting base 5. The configuration is as follows.

載置用基台５は、例えば基体１がＳＵＳ304（熱膨張係数17.3×10-6／℃）で、回路基
板４がアルミナセラミックス（熱膨張係数6.5×10-6／℃）の場合は、基体１および回路
基板４の中間の熱膨張係数を持つＦｅ−50Ｎｉ合金（熱膨張係数9.9×10-6／℃）の金属
材料からなることが好ましい。この場合、載置用基台５が、基体１および回路基板４の中間の熱膨張係数を持つことで、熱膨張係数の差によって発生する応力が回路基板４に加わることを低減し、回路基板４が割れてしまうことがなくなるので好ましい。 For example, when the substrate 1 is SUS304 (thermal expansion coefficient 17.3 × 10 −6 / ° C.) and the circuit board 4 is alumina ceramics (thermal expansion coefficient 6.5 × 10 −6 / ° C.) Preferably, it is made of a metal material of an Fe-50Ni alloy (thermal expansion coefficient 9.9 × 10 −6 / ° C.) having a thermal expansion coefficient intermediate between 1 and the circuit board 4. In this case, since the mounting base 5 has an intermediate thermal expansion coefficient between the base 1 and the circuit board 4, it is possible to reduce the stress generated by the difference in the thermal expansion coefficient from being applied to the circuit board 4. 4 is preferable because it does not break.

載置用基台５は、その材料のインゴットに圧延加工や打ち抜き加工等の従来周知の金属加工法を施すことで形成できる。   The mounting base 5 can be formed by applying a conventionally known metal processing method such as rolling or punching to the ingot of the material.

導電性接合材６は、枠体２の段部２ｂと載置用基台５の突出部５ａとを接合する機能を有する。導電性接合材６は、Ａｕ−Ｓｎ合金やＳｎ−Ａｇ合金等の低融点ろう材が用いられる。   The conductive bonding material 6 has a function of bonding the step portion 2 b of the frame body 2 and the protruding portion 5 a of the mounting base 5. As the conductive bonding material 6, a low melting point brazing material such as an Au—Sn alloy or a Sn—Ag alloy is used.

枠体２の突出部２ｂの端面と載置用基台５の同軸コネクタ３側の側面とを導電性接合材６を介して接合する方法としては、ペースト状の導電性接合材６を従来周知のディスペンス法で、突出部２ｂの端面と載置用基台５の同軸コネクタ３側の側面との隙間に注入して充填し、または箔状または板状の導電性接合材６を突出部２ｂの端面と載置用基台５の同軸コネクタ３側の側面との隙間に挿入し挟み込んで、その後、導電性接合材６を加熱溶融し、固化させることにより、枠体２と載置用基台５とを接合することができる。   As a method for joining the end face of the projecting portion 2b of the frame body 2 and the side face of the mounting base 5 on the coaxial connector 3 side via the conductive joining material 6, the pasty conductive joining material 6 is conventionally known. In this dispensing method, the gap between the end surface of the protruding portion 2b and the side surface of the mounting base 5 on the coaxial connector 3 side is injected and filled, or the conductive bonding material 6 in the form of foil or plate is filled with the protruding portion 2b. The frame 2 and the mounting base are inserted into a gap between the end surface of the mounting base 5 and the side surface of the mounting base 5 on the side of the coaxial connector 3 and then heated and melted and solidified. The stand 5 can be joined.

蓋体８は、図１（ｂ）に示す例のように、枠体２の上面に接合され、電子部品７を電子部品収納用パッケージの中に気密封止するものである。蓋体８の材料は、Ｆｅ−Ｎｉ−Ｃｏ合金等の金属材料やアルミナセラミックス等のセラミックスから成り、枠体２上面にＡｕ−Ｓｎ合金等の低融点ろう材を介して接合したり、シーム溶接等の溶接により接合することで、電子部品７を電子部品収納用パッケージ内に封止する。   The lid body 8 is joined to the upper surface of the frame body 2 and hermetically seals the electronic component 7 in the electronic component storage package as in the example shown in FIG. The material of the lid 8 is made of a metal material such as Fe—Ni—Co alloy or ceramics such as alumina ceramics, and is joined to the upper surface of the frame 2 via a low melting point brazing material such as Au—Sn alloy or seam welding. The electronic component 7 is sealed in the electronic component storage package by bonding by welding or the like.

本発明の電子部品収納用パッケージは、図４（ａ）,（ｂ）に示す例のように、上記構
成において、載置用基台５は、該載置用基台５の同軸コネクタ３側の側面から同軸コネクタ３側に突出した段部５ａを有し、該段部５ａの上面と突出部２ｂの下面とが接合されていることが好ましい。このような構成としたときには、枠体２と載置用基台５との接合において、突出部２ｂの端面と載置用基台５の同軸コネクタ３側の側面とに加えて、段部５ａの上面と突出部２ｂの下面とが接合されることにより、枠体２と載置用基台５との接合面積が増加して、枠体２と載置用基台５とをより強固に接合することが可能となる。 The electronic component storage package according to the present invention has the above-described configuration, as shown in FIGS. 4A and 4B, in which the mounting base 5 is located on the coaxial connector 3 side of the mounting base 5. It is preferable that a step portion 5a protruding from the side surface of the step portion 5 toward the coaxial connector 3 is provided, and the upper surface of the step portion 5a and the lower surface of the protrusion portion 2b are joined. In such a configuration, in joining the frame body 2 and the mounting base 5, in addition to the end surface of the projecting portion 2 b and the side surface of the mounting base 5 on the coaxial connector 3 side, the stepped portion 5 a. By joining the upper surface and the lower surface of the protruding portion 2b, the bonding area between the frame body 2 and the mounting base 5 increases, and the frame body 2 and the mounting base 5 become stronger. It becomes possible to join.

段部５ａは、載置用基台５の同軸コネクタ３側の側面から同軸コネクタ３側に突出して形成されている。段部５ａの側面は、枠体２の内面に接触していないことが好ましい。具体的には、段部５ａの側面と枠体２の内面との間に空間10を有することが好ましく、この場合は、枠体２と載置用基台５との熱膨張係数の差に起因して枠体２と載置用基台５との間に発生する応力を空間10で吸収できるので好ましい。   The step portion 5a is formed so as to protrude from the side surface of the mounting base 5 on the coaxial connector 3 side to the coaxial connector 3 side. It is preferable that the side surface of the stepped portion 5 a is not in contact with the inner surface of the frame body 2. Specifically, it is preferable to have a space 10 between the side surface of the stepped portion 5a and the inner surface of the frame body 2. In this case, the difference in thermal expansion coefficient between the frame body 2 and the mounting base 5 is caused. This is preferable because the space 10 can absorb the stress generated between the frame 2 and the mounting base 5.

段部５ａは、図４（ｂ）に示す例のように、載置用基台５の同軸コネクタ３側の側面の下側全体に形成されていてもよく、図５に示す例のように、載置用基台５の同軸コネクタ３側の側面の下側の一部に形成されていてもよい。図５に示す例のような場合は、枠体２と載置用基台５との熱膨張係数の差に起因して段部５ａの上面と突出部２ｂの下面との間の接合部に発生する応力を、載置用基台５の同軸コネクタ３側の側面の下側の一部に形成された段部５ａで効率よく吸収できるのでより好ましい。   The step portion 5a may be formed on the entire lower side of the side surface on the coaxial connector 3 side of the mounting base 5 as in the example shown in FIG. 4B, as in the example shown in FIG. Further, it may be formed on a part of the lower side surface of the mounting base 5 on the coaxial connector 3 side. In the case of the example shown in FIG. 5, due to the difference in thermal expansion coefficient between the frame body 2 and the mounting base 5, the joint between the upper surface of the stepped portion 5 a and the lower surface of the protruding portion 2 b is formed. It is more preferable because the generated stress can be efficiently absorbed by the step portion 5a formed on the lower part of the side surface of the mounting base 5 on the coaxial connector 3 side.

段部５ａは、従来周知の金属加工法を用いて載置用基台５を作製する際に、段部５ａの周辺部を研削したり、別に加工した段部５ａ部の形状の部品を載置用基台５の側面に金属ろう材等で接合することで作製される。   The step portion 5a is formed by grinding a peripheral portion of the step portion 5a when mounting the mounting base 5 using a conventionally well-known metal processing method, or mounting a part having the shape of the step portion 5a portion processed separately. It is manufactured by joining the side surface of the mounting base 5 with a metal brazing material or the like.

図６に示す例は、段部５ａの上面に突部５ｂを設けた例である。このように、段部５ａに突部５ｂを設けることにより、載置用基台５の段部５ａの上面に凹部が形成され、この凹部が導電性接合材６を溜めるダムの機能を有するものとなる。このような形状により、段部５ａの上面と突出部２ｂの下面とを導電性接合材６を介して接合する際、溶融した導電性接合材６が段部５ａの側面に流れ出して接合にあずかる導電性接合材６の量が少なくなることを有効に防止することができるので好ましい。図６に示す例のような場合は、段部５ａの上面の突部５ｂにより形成された凹部に導電性接合材６を注入して充填し、または凹部内に箔状または板状の導電性接合材６を挿入し挟み込んでおき、段部５ａの突部５ｂの上面に、枠体２に形成された突出部２ｂを当接させ、その後、導電性接合材６を加熱溶融し、固化させることにより、枠体２と載置用基台５とを接合することができる。   The example shown in FIG. 6 is an example in which a protrusion 5b is provided on the upper surface of the stepped portion 5a. Thus, by providing the protrusion 5b on the step 5a, a recess is formed on the upper surface of the step 5a of the mounting base 5, and this recess has the function of a dam that accumulates the conductive bonding material 6. It becomes. With such a shape, when the upper surface of the stepped portion 5a and the lower surface of the protruding portion 2b are bonded via the conductive bonding material 6, the molten conductive bonding material 6 flows out to the side surface of the stepped portion 5a and participates in bonding. It is preferable because the amount of the conductive bonding material 6 can be effectively prevented from decreasing. In the case of the example shown in FIG. 6, the conductive bonding material 6 is injected and filled into the recess formed by the protrusion 5b on the upper surface of the stepped portion 5a, or the foil-like or plate-like conductivity is filled in the recess. The bonding material 6 is inserted and sandwiched, and the protrusion 2b formed on the frame body 2 is brought into contact with the upper surface of the protrusion 5b of the stepped portion 5a, and then the conductive bonding material 6 is heated and melted to be solidified. Thereby, the frame 2 and the mounting base 5 can be joined.

図７に示す例のように、突出部２ｂの上面を貫通孔２ａの下側の内面よりも上に位置させ、突出部２ｂの上面を中心導体３ｃに近づけることが好ましい。この場合は、中心導体３ｃの枠体２から突出した回路基板４までの部分では、周りの誘電体が誘電率の小さい空気となるので、この部分でのインピーダンスの不整合が発生しにくくなるので好ましい。さらに、図７に示す例のように、枠体２の内側に貫通孔２ａと連続してつながるように、貫通孔２ａよりも小径の貫通孔２ｄを形成することがより好ましく、この場合は、貫通孔２ｄの部分は中心導体３ｃの周りの誘電体が空気である、いわゆるエア同軸構造となり、この部分でのインピーダンスの不整合が発生しにくくなるのでより好ましい。また小径の貫通孔２ｄを有した形状とすることで、同軸コネクタ３を貫通孔２ａ内に嵌着させる際に、同軸コネクタ３を貫通孔２ａの内周面に突き当てることによって、同軸コネクタ３の位置決めが容易にできる点でも好ましい。また、図１〜図６に示す例においても、枠体２に形成する貫通孔の形状を図７に示す例のような小径の貫通孔２ｄを有した形状とすることで、上述したようなエア同軸構造および同軸コネクタ３の位置決めの容易性において、上述した効果と同様の効果が得られるものとなる。例えば、中心導体３ｃの直径が0.25ｍｍである場合には、貫通孔２ｄの直径を0.58ｍｍとし、中心導体３ｃと突出部２ｂの上面との間隔を0.29ｍｍとすることで、同軸コネクタ３から回路基板４にかけてインピーダンスを50Ωに整合させることができ、高周波信号を効率よく伝送させることが可能となる。   As in the example shown in FIG. 7, it is preferable that the upper surface of the protruding portion 2b is positioned above the lower inner surface of the through hole 2a, and the upper surface of the protruding portion 2b is close to the central conductor 3c. In this case, in the portion from the frame body 2 of the central conductor 3c to the circuit board 4 that protrudes, the surrounding dielectric is air having a low dielectric constant, so that impedance mismatching in this portion is less likely to occur. preferable. Furthermore, as in the example shown in FIG. 7, it is more preferable to form a through hole 2d having a smaller diameter than the through hole 2a so as to be continuously connected to the inside of the frame 2 with the through hole 2a. The portion of the through hole 2d is more preferable because it has a so-called air coaxial structure in which the dielectric around the central conductor 3c is air, and impedance mismatching is unlikely to occur in this portion. Moreover, when the coaxial connector 3 is fitted into the through hole 2a by having a shape having the small-diameter through hole 2d, the coaxial connector 3 is abutted against the inner peripheral surface of the through hole 2a. It is also preferable in that it can be easily positioned. Moreover, also in the example shown in FIGS. 1-6, by making the shape of the through-hole formed in the frame 2 into the shape which has the small-diameter through-hole 2d like the example shown in FIG. In the ease of positioning of the air coaxial structure and the coaxial connector 3, the same effect as described above can be obtained. For example, when the diameter of the center conductor 3c is 0.25 mm, the diameter of the through hole 2d is 0.58 mm, and the distance between the center conductor 3c and the upper surface of the protruding portion 2b is 0.29 mm. Impedance can be matched to 50Ω across the circuit board 4, and high-frequency signals can be transmitted efficiently.

本発明の電子装置は、図１（ｂ）に示す例のように、基体１の載置部１ａに載置用基台５および電子部品７が接合され、そして、電子部品７の電極と電気的に接続する信号線路導体４ａを有する回路基板４を載置用基台５の上面に載置して接合し、信号線路導体４ａと中心導体３ｃとを半田を介して電気的に接合するとともに電子部品７と信号線路導体４ａとをボンディングワイヤ９で電気的に接続する。しかる後、枠体２の上面に蓋体８を半田付け法やシーム溶接法により接合することにより構成される。そして、同軸コネクタ３と同軸ケーブル（図示せず）とを接続することにより、電子部品７が外部電気回路に電気的に接続されることとなる。   In the electronic device of the present invention, as shown in the example shown in FIG. 1B, the mounting base 5 and the electronic component 7 are joined to the mounting portion 1a of the base 1, and the electrodes of the electronic component 7 and the electric component are electrically connected. The circuit board 4 having the signal line conductor 4a to be connected is placed on the upper surface of the mounting base 5 and joined, and the signal line conductor 4a and the center conductor 3c are electrically joined via solder. The electronic component 7 and the signal line conductor 4a are electrically connected by a bonding wire 9. Thereafter, the lid body 8 is joined to the upper surface of the frame body 2 by soldering or seam welding. And the electronic component 7 will be electrically connected to an external electric circuit by connecting the coaxial connector 3 and a coaxial cable (not shown).

なお、本発明は、上述した最良の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の変更を行なうことは何ら差し支えない。例えば、本実施形態では、電子部品７をＬＮ素子の例として回路基板４をグランド付きコープレナー構造としたが、電子部品７の入出力端子形状や素子形状によって、回路基板４をマイクロストリップ構造の基板としてもよい。   The present invention is not limited to the above-described best mode, and various modifications can be made without departing from the gist of the present invention. For example, in this embodiment, the electronic component 7 is an example of an LN element, and the circuit board 4 is a coplanar structure with a ground. However, depending on the input / output terminal shape and element shape of the electronic component 7, the circuit board 4 has a microstrip structure. It may be a substrate.

１・・・・・基体
１ａ・・・・載置部
２・・・・・枠体
２ａ・・・・貫通孔
２ｂ・・・・突出部
２ｃ・・・・突起部
２ｄ・・・・小径の貫通孔
３・・・・・同軸コネクタ
３ａ・・・・外周導体
３ｂ・・・・絶縁体
３ｃ・・・・中心導体
４・・・・・回路基板
４ａ・・・・信号線路導体
４ｂ・・・・接地導体
４ｃ・・・・貫通導体
５・・・・・載置用基台
５ａ・・・・突出部
５ｂ・・・・突部
６・・・・・導電性接合材
７・・・・・電子部品
８・・・・・蓋体
９・・・・・ボンディングワイヤ
10・・・・・空間 DESCRIPTION OF SYMBOLS 1 ... Base 1a ... Mounting part 2 ... Frame body 2a ... Through-hole 2b ... Projection part 2c ... Projection part 2d ... Small diameter Through-hole 3... Coaxial connector 3 a... Outer peripheral conductor 3 b... Insulator 3 c... Center conductor 4 ... circuit board 4 a. ... Grounding conductor 4c ... Penetration conductor 5 ... Mounting base 5a ... Projection 5b ... Projection 6 ... Conductive bonding material 7 ... ... Electronic components 8 ... Cover body 9 ... Bonding wire
10 ... space

Claims (3)

上面に電子部品が搭載される基体と、該基体の上面の載置部に載置された載置用基台と、上面に信号線路導体が形成され、下面に接地導体が形成されているとともに前記載置用基台の上面に載置された回路基板と、前記載置部を囲繞するように前記基体の上面に取着されているとともに側部に貫通孔が形成された枠体と、前記貫通孔に嵌着されて前記回路基板に電気的に接続された同軸コネクタとを具備した電子部品収納用パッケージにおいて、前記枠体は、前記貫通孔の下の前記枠体の内面から前記載置用基台側に突出した突出部を有し、該突出部の端面と前記載置用基台の前記同軸コネクタ側の側面とが接合されていることを特徴とする電子部品収納用パッケージ。 A base on which electronic components are mounted on the upper surface, a mounting base mounted on a mounting portion on the upper surface of the base, a signal line conductor is formed on the upper surface, and a ground conductor is formed on the lower surface A circuit board placed on the upper surface of the mounting base, a frame body attached to the upper surface of the base so as to surround the mounting portion and having a through-hole formed on a side portion; In the electronic component storage package including the coaxial connector that is fitted into the through hole and electrically connected to the circuit board, the frame body is described above from the inner surface of the frame body under the through hole. An electronic component storage package comprising: a protruding portion protruding toward the mounting base; and an end surface of the protruding portion and a side surface of the mounting base on the coaxial connector side being joined. 前記載置用基台は、該載置用基台の前記同軸コネクタ側の側面から前記同軸コネクタ側に突出した段部を有し、該段部の上面と前記突出部の下面とが接合されていることを特徴とする請求項１記載の電子部品収納用パッケージ。 The mounting base includes a step portion protruding from the side surface of the mounting base on the coaxial connector side toward the coaxial connector side, and the upper surface of the step portion and the lower surface of the protruding portion are joined. The electronic component storage package according to claim 1, wherein the electronic component storage package is provided. 請求項１または請求項２に記載の電子部品収納用パッケージと、該電子部品収納用パッケージの前記基体に搭載されているとともに前記回路基板の前記信号線路導体に電気的に接続された電子部品と、前記枠体の上面に接合された蓋体とを具備していることを特徴とする電子装置。 An electronic component storage package according to claim 1 or 2, and an electronic component mounted on the base of the electronic component storage package and electrically connected to the signal line conductor of the circuit board An electronic device comprising: a lid joined to the upper surface of the frame.
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JP2006086146A (en) * 2004-09-14 2006-03-30 Kyocera Corp Package for housing electronic component and electronic device
JP2006128323A (en) * 2004-10-27 2006-05-18 Kyocera Corp Semiconductor device and storing package thereof
JP2012151232A (en) * 2011-01-18 2012-08-09 Kyocera Corp Package for housing electronic component, and electronic device
JP2012178427A (en) * 2011-02-25 2012-09-13 Kyocera Corp Electronic component accommodation package and electronic apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012244002A (en) * 2011-05-20 2012-12-10 Kyocera Corp Package for housing electronic component and electronic device

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