JP2012049512A - 発光素子搭載用基板とその製造方法および発光装置 - Google Patents
発光素子搭載用基板とその製造方法および発光装置 Download PDFInfo
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- 239000011521 glass Substances 0.000 claims abstract description 137
- 239000010410 layer Substances 0.000 claims abstract description 126
- 239000011241 protective layer Substances 0.000 claims abstract description 116
- 229910052709 silver Inorganic materials 0.000 claims abstract description 106
- 239000004332 silver Substances 0.000 claims abstract description 106
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 80
- 239000000945 filler Substances 0.000 claims abstract description 61
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 57
- -1 silver ions Chemical class 0.000 claims abstract description 31
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- 239000002243 precursor Substances 0.000 claims description 16
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- 239000006112 glass ceramic composition Substances 0.000 claims description 13
- 229920002050 silicone resin Polymers 0.000 claims description 13
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 12
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 10
- 229910052708 sodium Inorganic materials 0.000 claims description 8
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- 239000002245 particle Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
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- 239000000463 material Substances 0.000 description 12
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- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 229910018068 Li 2 O Inorganic materials 0.000 description 6
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- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
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- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 description 2
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- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000006060 molten glass Substances 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
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- 238000005486 sulfidation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
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- 239000010931 gold Substances 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】基板本体2と、基板本体2に形成された銀または銀合金を主体とする銀反射層6と、銀反射層6の全面を覆うように形成されたガラスを含む保護層を有する発光素子搭載用基板1であって、保護層7がアルミナ系フィラーを含有しており、かつ保護層7を構成するガラス中に銀が拡散された状態で含有されている発光素子搭載用基板1である。保護層7のガラス中に含まれる銀イオン濃度は0.5質量%以上5.0質量%以下であることが好ましい。
【選択図】図1
Description
まず、保護層用のガラスセラミックス組成物を調製した。すなわち、SiO2、B2O3、Al2O3、CaO、Na2OおよびK2Oの各成分が表1に示す組成(モル%)となるように、ガラス原料を調合、混合し、この原料混合物を白金ルツボに入れて1500〜1600℃で60分間溶融させた後、溶融状態のガラスを流し出し冷却した。得られたガラスを、アルミナ製ボールミルにより20〜60時間粉砕してガラス粉末を得た。なお、粉砕時の溶媒にはエチルアルコールを用いた。
Claims (11)
- 発光素子が搭載される搭載面を有する基板本体と、
前記基板本体の前記搭載面に形成された銀または銀合金を主体とする反射層と、
前記反射層の全面を覆うように形成されたガラスを含む保護層を有する発光素子搭載用基板であって、
前記保護層は、アルミナ系フィラーを含有しており、かつ銀イオンが拡散された状態で含まれたガラスを含有することを特徴とする発光素子搭載用基板。 - 前記ガラス中に含まれる銀イオンの濃度が、Ag2Oの濃度に換算して0.5質量%以上5.0質量%以下である請求項1記載の発光素子搭載用基板。
- 前記保護層に含まれるアルミナ系フィラーの含有量が、5質量%以上70質量%以下である請求項1または2記載の発光素子搭載用基板。
- 前記保護層に含まれるアルミナ系フィラーの含有量が、3体積%以上60体積%以下である請求項1または2記載の発光素子搭載用基板。
- 前記保護層は、少なくともSiO2、Al2O3およびCaOを構成成分とするガラスを含有する請求項1乃至4のいずれか1項記載の発光素子搭載用基板。
- 前記ガラスは、酸化物基準のモル%表示で、SiO2を40〜70%、Al2O3を1〜20%、B2O3を5〜25%、CaOを5〜40%、Li2O、Na2OおよびK2Oからなる群から選ばれる少なくとも1種を0〜8%含有するガラス粉末を焼成してなるものである請求項5記載の発光素子搭載用基板。
- 請求項1乃至6のいずれか1項記載の発光素子搭載用基板を製造する方法であって、
前記基板本体を形成するための第1のグリーンシートを作製する工程と、
前記第1のグリーンシートの前記搭載面となる面に、前記反射層を形成するための反射層用ペースト層を形成する工程と、
前記反射層用ペースト層の全面を覆うように、前記保護層を形成するための前駆体の層を形成する工程と、
前記工程で得られた未焼結発光素子搭載用基板を焼成する工程
を有する発光素子搭載用基板の製造方法。 - 前記前駆体の層を形成する工程は、前記ガラス粉末と前記アルミナ系フィラーとを含むガラスセラミックスペーストを印刷する工程を有する、請求項7記載の発光素子搭載用基板の製造方法。
- 前記前駆体の層を形成する工程は、前記ガラス粉末と前記アルミナ系フィラーとを含むガラスセラミックス組成物により作製された第2のグリーンシートを積層する工程を有する、請求項7記載の発光素子搭載用基板の製造方法。
- 請求項1乃至6のいずれか1項記載の発光素子搭載用基板と、
前記発光素子搭載用基板の搭載部に搭載される発光素子と
を有することを特徴とする発光装置。 - 前記保護層の表面の一部または全部が白金触媒を含むシリコーン樹脂により封止されてなる請求項10記載の発光装置。
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JP2011156025A JP5720454B2 (ja) | 2010-07-26 | 2011-07-14 | 発光素子搭載用基板とその製造方法および発光装置 |
CN2011102178772A CN102347426A (zh) | 2010-07-26 | 2011-07-22 | 发光元件搭载用基板、其制造方法及发光装置 |
TW100125999A TW201214793A (en) | 2010-07-26 | 2011-07-22 | Substrate for mounting light emitting element, method for manufacturing the same and light emitting device |
US13/190,156 US9054287B2 (en) | 2010-07-26 | 2011-07-25 | Substrate for mounting light-emitting element, production process thereof and light-emitting device |
KR1020110073566A KR20120010970A (ko) | 2010-07-26 | 2011-07-25 | 발광 소자 탑재용 기판과 그 제조 방법 및 발광 장치 |
EP11006130A EP2413390A3 (en) | 2010-07-26 | 2011-07-26 | Substrate for mounting light-emitting element, production process thereof and light-emitting device |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013239546A (ja) * | 2012-05-15 | 2013-11-28 | Asahi Glass Co Ltd | 発光素子搭載用基板および発光装置 |
WO2014083714A1 (ja) * | 2012-11-27 | 2014-06-05 | シチズン電子株式会社 | 実装基板及びこの実装基板を用いた発光装置 |
WO2016052392A1 (ja) * | 2014-09-30 | 2016-04-07 | 三菱マテリアル株式会社 | Ag下地層付パワーモジュール用基板及びパワーモジュール |
WO2016063590A1 (ja) * | 2014-10-22 | 2016-04-28 | 株式会社村田製作所 | 実装基板 |
US9941235B2 (en) | 2014-09-30 | 2018-04-10 | Mitsubishi Materials Corporation | Power module substrate with Ag underlayer and power module |
WO2022045013A1 (ja) * | 2020-08-28 | 2022-03-03 | デンカ株式会社 | 蛍光体基板、発光基板及び照明装置 |
JP7523550B2 (ja) | 2020-08-28 | 2024-07-26 | デンカ株式会社 | 蛍光体基板、発光基板及び照明装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPWO2016063590A1 (ja) * | 2014-10-22 | 2017-04-27 | 株式会社村田製作所 | 実装基板 |
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JP7523550B2 (ja) | 2020-08-28 | 2024-07-26 | デンカ株式会社 | 蛍光体基板、発光基板及び照明装置 |
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