JP2011258918A - 表示装置およびその製造方法 - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000003990 capacitor Substances 0.000 claims description 43
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 20
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 20
- 238000000137 annealing Methods 0.000 claims description 14
- 239000004973 liquid crystal related substance Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 10
- 238000000059 patterning Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 164
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- 239000010409 thin film Substances 0.000 description 32
- 239000012535 impurity Substances 0.000 description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 238000002425 crystallisation Methods 0.000 description 7
- 230000008025 crystallization Effects 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
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- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NPNMHHNXCILFEF-UHFFFAOYSA-N [F].[Sn]=O Chemical compound [F].[Sn]=O NPNMHHNXCILFEF-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007715 excimer laser crystallization Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
【解決手段】本発明の実施形態に係る表示装置は、基板111と、前記基板上に形成された半導体層133と、前記半導体層上に形成された有機絶縁膜170と、前記有機絶縁膜上に形成された複数の導電配線184,185,187,188,189と、前記複数の導電配線の間で前記有機絶縁膜に形成されたオープングルーブ7080とを含む。
【選択図】図3
Description
70 有機発光素子、
90 キャパシタ、
101,102,103 表示装置、
111 基板、
120 バッファ層、
133,136 半導体層、
139 第1キャパシタ電極、
140 ゲート絶縁膜、
153,156 ゲート電極、
160 有機絶縁膜、
170 無機絶縁膜、
184,187 ソース電極、
185,188 ドレイン電極、
190 画素定義膜、
710 画素電極、
720 有機発光層、
730 共通電極、
910,920 駆動回路、
DA 表示領域、
NA 非表示領域、
PE 画素領域。
Claims (24)
- 基板と、
前記基板上に形成された半導体層と、
前記半導体層上に形成された有機絶縁膜と、
前記有機絶縁膜上に形成された複数の導電配線と、
前記複数の導電配線の間で前記有機絶縁膜に形成されたオープングルーブと、
を含む、表示装置。 - 前記複数の導電配線は、前記オープングルーブを間において互いに離隔される、請求項1に記載の表示装置。
- 前記半導体層上に形成されたゲート電極と、前記ゲート電極と前記半導体層の間に配置されたゲート絶縁膜とをさらに含む、請求項1または2に記載の表示装置。
- 前記有機絶縁膜と前記ゲート電極の間に配置された無機絶縁膜をさらに含む、請求項3に記載の表示装置。
- 前記オープングルーブは、前記有機絶縁膜と共に前記無機絶縁膜にも形成される、請求項4に記載の表示装置。
- 前記無機絶縁膜は、水素を含む窒化シリコン膜を含む、請求項4または5に記載の表示装置。
- 前記半導体層は、多結晶シリコン膜をパターニングして形成される、請求項1〜6のいずれか一項に記載の表示装置。
- 前記複数の導電配線は、ソース電極およびドレイン電極を含む、請求項1〜7のいずれか一項に記載の表示装置。
- 前記半導体層と同じ層に形成された第1キャパシタ電極と、前記ソース電極および前記ドレイン電極と同じ層に形成されて前記複数の導電配線の一部である第2キャパシタ電極とをさらに含む、請求項8に記載の表示装置。
- 前記ドレイン電極と連結した画素電極と、前記画素電極上に形成された有機発光層と、
前記有機発光層上に形成された共通電極と、をさらに含む、請求項8または9に記載の表示装置。 - 前記ゲート電極は、ゲート透明層と前記ゲート透明層上に形成されたゲート金属層を含む二重層で形成され、
前記画素電極は、前記ゲート電極のゲート透明層と同じ層に同じ素材で形成される、請求項10に記載の表示装置。 - 前記ドレイン電極と連結した画素電極と、前記画素電極上に形成された液晶層と、前記液晶層上に形成された共通電極とをさらに含む、請求項8または9に記載の表示装置。
- 基板を設ける段階と、
前記基板に半導体層を形成する段階と、
前記半導体層上に有機絶縁膜を形成する段階と、
前記有機絶縁膜をパターニングしてオープングルーブを形成する段階と、
前記有機絶縁膜上に複数の導電配線を形成する段階と、
を含み、
前記複数の導電配線は、前記オープングルーブを間において互いに離隔される、表示装置の製造方法。 - 前記半導体層上にゲート絶縁膜を形成する段階と、前記ゲート絶縁膜上にゲート電極を形成する段階とをさらに含み、
前記有機絶縁膜は、前記ゲート電極上に形成される、請求項13に記載の表示装置の製造方法。 - 前記複数の導電配線は、ソース電極およびドレイン電極を含む、請求項13または14に記載の表示装置の製造方法。
- 前記半導体層と同じ層に形成された第1キャパシタ電極と、前記ソース電極および前記ドレイン電極と同じ層に形成されて前記複数の導電配線の一部である第2キャパシタ電極とをさらに含む、請求項15に記載の表示装置の製造方法。
- 前記ゲート電極と前記有機絶縁膜の間に無機絶縁膜を形成する段階をさらに含む、請求項14〜16のいずれか一項に記載の表示装置の製造方法。
- 前記有機絶縁膜、前記無機絶縁膜、および前記ゲート絶縁膜は、共に前記半導体層の一部を露出する複数の接触孔を有し、
前記複数の接触孔は、前記オープングルーブと共に形成される、請求項17に記載の表示装置の製造方法。 - 前記複数の接触孔と前記オープングルーブは、
前記半導体層上にゲート絶縁膜を形成する段階と、
前記ゲート絶縁膜上に前記無機絶縁膜を形成する段階と、
前記無機絶縁膜上に前記有機絶縁膜を形成する段階と、
ハーフトーン露光を利用したフォトエッチング工程によって、前記複数の接触孔が形成される位置の前記有機絶縁膜と前記無機絶縁膜を除去し、前記オープングルーブが形成される位置の前記有機絶縁膜の一部を除去する段階と、
エッチング工程によって、前記複数の接触孔が形成される位置のゲート絶縁膜を除去して半導体層を露出する段階と、
前記オープングルーブが形成される位置に残存する前記有機絶縁膜の残りの一部を除去する段階と、
によって形成される、請求項18に記載の表示装置の製造方法。 - 前記オープングルーブは、前記有機絶縁膜と前記無機絶縁膜を共にパターニングして形成される、請求項17〜19のいずれか一項に記載の表示装置の製造方法。
- 前記無機絶縁膜は、窒化シリコン膜および酸化シリコン膜のうちの1つ以上を含む、請求項17〜20のいずれか一項に記載の表示装置の製造方法。
- 前記無機絶縁膜は、シラン、アンモニア、および水素を用いるプラズマ化学気相蒸着法によって形成される窒化シリコン膜を含む、請求項17〜21のいずれか一項に記載の表示装置の製造方法。
- 前記ゲート電極上に前記無機絶縁膜を形成した後、アニーリング工程を進める段階をさらに含む、請求項17〜22のうちのいずれか一項に記載の表示装置の製造方法。
- 前記アニーリング工程は、摂氏250度以上の温度で熱処理する過程を含む、請求項23に記載の表示装置の製造方法。
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KR10-2010-0054407 | 2010-06-09 | ||
KR1020100054407A KR101233348B1 (ko) | 2010-06-09 | 2010-06-09 | 표시 장치 및 그 제조 방법 |
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JP (1) | JP5722604B2 (ja) |
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CN (1) | CN102280445B (ja) |
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JP2016525780A (ja) * | 2013-08-19 | 2016-08-25 | 深▲せん▼市華星光電技術有限公司Shenzhen China Star Optoelectronics Technology Co., Ltd. | 有機発光ダイオードの表示デバイスにおける金属配線の短絡を防止する方法 |
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CN102280445B (zh) | 2014-03-26 |
US8481998B2 (en) | 2013-07-09 |
TW201220489A (en) | 2012-05-16 |
US20110303922A1 (en) | 2011-12-15 |
CN102280445A (zh) | 2011-12-14 |
TWI446530B (zh) | 2014-07-21 |
JP5722604B2 (ja) | 2015-05-20 |
KR101233348B1 (ko) | 2013-02-14 |
KR20110134687A (ko) | 2011-12-15 |
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