JP2011216755A - パワーモジュール、およびパワーモジュールを備えた電力変換装置 - Google Patents
パワーモジュール、およびパワーモジュールを備えた電力変換装置 Download PDFInfo
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- JP2011216755A JP2011216755A JP2010084780A JP2010084780A JP2011216755A JP 2011216755 A JP2011216755 A JP 2011216755A JP 2010084780 A JP2010084780 A JP 2010084780A JP 2010084780 A JP2010084780 A JP 2010084780A JP 2011216755 A JP2011216755 A JP 2011216755A
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Abstract
【解決手段】半導体チップと、一方の主面が前記半導体チップの一方の主面と接続される第1の接続導体と、一方の主面が前記半導体チップの他方の主面と接続される第2の接続導体と、直流電源から電力が供給される接続端子と、前記半導体チップを封止する樹脂材を有し、前記樹脂材は、前記第1及び第2の接続導体が対向して形成された空間から突出した突出部を有し、前記接続端子は前記突出部に固定され、前記第1又は第2の接続導体の少なくとも一方は、所定の温度で溶断する金属材を介して前記接続端子に接続されるようにパワーモジュール300aを作成する。
【選択図】図6
Description
直流電源から電力が供給される接続端子と、前記半導体チップを封止する樹脂材を有し、前記樹脂材は、前記第1及び第2の接続導体が対向して形成された空間から突出した突出部を有し、前記接続端子は前記突出部に固定され、前記第1又は第2の接続導体の少なくとも一方は、所定の温度で溶断する金属材を介して前記接続端子に接続されることを特徴とするパワーモジュール。
304 モジュールケース
305 フィン
306 挿入口
307 放熱ベース
315B 直流正極端子
319B 直流負極端子
321 交流端子
325L,325U 外部信号端子
600 補助モールド体
Claims (10)
- 半導体チップと、
一方の主面が前記半導体チップの一方の主面と接続される第1の接続導体と、
一方の主面が前記半導体チップの他方の主面と接続される第2の接続導体と、
直流電源から電力が供給される接続端子と、
前記半導体チップを封止する樹脂材を有し、
前記樹脂材は、前記第1及び第2の接続導体が対向して形成された空間から突出した突出部を有し、
前記接続端子は前記突出部に固定され、
前記第1又は第2の接続導体の少なくとも一方は、所定の温度で溶断する金属材を介して前記接続端子に接続されることを特徴とするパワーモジュール。 - 請求項1に記載のパワーモジュールであって、
開口部を備える有底の構造で、かつ第1の冷却面および当該第1の冷却面と対向する第2の冷却面を有する冷却器を備え、
前記第1の接続導体における他方の主面は前記第1の冷却面と対向して配置され、
前記第2の接続導体における他方の主面は前記第2の冷却面と対向して配置され、
前記突出部は前記開口部から前記冷却器の外部に突出しており、
前記金属材は前記開口部から突出した前記突出部に配置されることを特徴とするパワーモジュール。 - 請求項2に記載のパワーモジュールであって、
前記第1の接続導体における他方の主面と、前記第1の冷却面との間に配置されている第1の絶縁部材と、
前記第2の接続導体における他方の主面と、前記第2の冷却面との間に配置されている第2の絶縁部材を有することを特徴とするパワーモジュール。 - 請求項2乃至3に記載のいずれかのパワーモジュールであって、
前記半導体チップはIGBTから構成され、かつ、前記IGBTの一方の主面はコレクタ電極を形成し、前記IGBTの他方の主面はエミッタ電極を形成し、
前記接続端子は、第1の接続導体を介して前記IGBTのコレクタ電極に電気的に接続される正極接続端子と、第2の接続導体を介して前記IGBTのエミッタ電極に電気的に接続される負極接続端子と、を含んで構成され、
前記第2の接続導体は、前記金属材を介して前記負極接続端子と接続されることを特徴とするパワーモジュール。 - 半導体チップと、前記半導体チップの主面に接続される板状導体と、直流電源に電気的に接続される接続端子と、前記板状導体を封止する樹脂材を有するパワーモジュールと、
冷却媒体が流れる流路を有する流路形成体と、を有し、
前記流路形成体は、所定の面に前記流路と接続される開口を有し、
前記パワーモジュールは前記開口から前記流路内に浸漬され、
前記樹脂材は、前記開口から突出する突出部を有し、
前記接続端子は前記突出部に固定され、
前記板状導体の一部は所定の温度で溶断する金属材を介して前記接続端子と接続されることを特徴とする電力変換装置。 - 請求項5に記載の電力変換装置であって、
第1の冷却面と当該第1の冷却面と対向する第2の冷却面を有し、かつ、開口部を有する有底の冷却器を備え、
前記冷却器は前記パワーモジュールを収納し、
前記板状導体は、前記半導体チップの一方の主面と対向して配置される第1の板状導体と、前記半導体チップの他方の主面と対向して配置される第2の板状導体から構成され、かつ、当該第1の板状導体は第1の絶縁部材を介して前記第1の冷却面と対向して配置され、当該第2の板状導体は第2の絶縁部材を介して前記第2の冷却面と対向して配置されることを特徴とする電力変換装置。 - 請求項6に記載の電力変換装置であって、
前記冷却器は、前記開口部が形成された当該冷却器の一面にフランジ部を有し、
前記フランジ部の前記開口部が形成された面とは反対側の当該フランジ部の面が流路形成体に固定されることを特徴とする電力変換装置。 - 請求項6乃至7に記載のいずれかの電力変換装置であって、
コンデンサセルと、当該コンデンサセルを収納するコンデンサケースを有するコンデンサモジュールを備え、
前記コンデンサケースは孔が形成されたフランジ部を有し、
前記パワーモジュールの前記接続端子は前記コンデンサケースの孔を貫通し、
前記金属材は前記冷却器のフランジ部と前記コンデンサケースのフランジ部が対向して形成された空間に配置されていることを特徴とする電力変換装置。 - 請求項5乃至8のいずれかに記載の電力変換装置であって、
前記半導体チップを駆動するドライバ回路基板を備え、
前記接続端子は、当該接続端子の端部が前記流路形成体の前記開口から遠ざかる方向に延び、
前記ドライバ回路基板の主面が前記開口と対向し、かつ、当該ドライバ回路基板は前記接続端子の端部より上方に配置されることを特徴とする電力変換装置。 - 請求項5乃至8のいずれかに記載の電力変換装置であって、
前記半導体チップを制御するための制御信号を生成する制御回路基板と、
前記制御回路基板を保持する金属ベースを有し、
前記金属ベースは、前記流路形成体と前記制御回路基板の間に配置されることを特徴とする電力変換装置。
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JP2012139041A (ja) * | 2010-12-27 | 2012-07-19 | Hitachi Automotive Systems Ltd | 電力変換装置 |
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Also Published As
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EP2562811B1 (en) | 2019-02-27 |
CN102822967A (zh) | 2012-12-12 |
JP5618595B2 (ja) | 2014-11-05 |
US20130062724A1 (en) | 2013-03-14 |
WO2011125780A1 (ja) | 2011-10-13 |
EP2562811A4 (en) | 2018-01-17 |
CN102822967B (zh) | 2015-12-09 |
US9000553B2 (en) | 2015-04-07 |
EP2562811A1 (en) | 2013-02-27 |
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