JP2011146708A - 発光素子、バックライトユニット - Google Patents
発光素子、バックライトユニット Download PDFInfo
- Publication number
- JP2011146708A JP2011146708A JP2011004102A JP2011004102A JP2011146708A JP 2011146708 A JP2011146708 A JP 2011146708A JP 2011004102 A JP2011004102 A JP 2011004102A JP 2011004102 A JP2011004102 A JP 2011004102A JP 2011146708 A JP2011146708 A JP 2011146708A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- cavity
- electrode
- light
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims abstract description 24
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 19
- 239000000463 material Substances 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000007769 metal material Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- -1 for example Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000004954 Polyphthalamide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000006089 photosensitive glass Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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Abstract
【解決手段】本発明に従う発光素子は、上部が開放されるように形成されたキャビティーを含み、上記キャビティーの側壁は上記キャビティーの底面に対して第1角度に傾斜した胴体と、上記胴体に形成され、少なくとも一部分が上記キャビティーの側壁に沿って形成された第1電極及び第2電極と、上記第1電極、上記第2電極、及び上記キャビティーの底面のうち、いずれか1つの上に載置された発光チップと、一端は上記発光チップの上面にボンディングされ、他端は上記キャビティーの側壁に形成された上記第1電極及び第2電極のうち、少なくとも1つにボンディングされる少なくとも1つのワイヤと、上記キャビティーの内に形成されて上記発光チップを覆うモールディング部材と、を含む。
【選択図】図1
Description
Claims (15)
- 上部が開放されるように形成されたキャビティーを含み、前記キャビティーの側壁は前記キャビティーの底面に対して傾斜した胴体と、
前記胴体に形成され、少なくとも一部分が前記キャビティーの側壁に沿って形成された第1電極及び第2電極と、
前記第1電極、前記第2電極、及び前記キャビティーの底面のうち、いずれか1つの上に載置された発光チップと、
一端は前記発光チップの上面にボンディングされ、他端は前記第1電極または第2電極の前記キャビティーの側壁の上の一部分にボンディングされる少なくとも1つのワイヤと、
前記キャビティーの内に形成されて前記発光チップを覆うモールディング部材と、
を含むことを特徴とする発光素子。 - 前記キャビティー側壁の傾斜した角度は30゜乃至60゜であることを特徴とする請求項1に記載の発光素子。
- 前記キャビティーの底面の幅は前記発光チップの幅の1倍乃至2倍であることを特徴とする請求項1に記載の発光素子。
- 前記発光チップの上には電極パッドが形成され、前記ワイヤは前記電極パッドにボンディングされることを特徴とする請求項1に記載の発光素子。
- 前記モールディング部材は少なくとも1種の蛍光体を含むことを特徴とする請求項1に記載の発光素子。
- 前記発光チップは、少なくとも1つの発光ダイオードを含むことを特徴とする請求項1に記載の発光素子。
- 前記胴体の上面は、四角形、多角形、または円形の形状を有することを特徴とする請求項1に記載の発光素子。
- 前記第1電極及び前記第2電極は、前記キャビティーの側壁の上から前記胴体の外壁に延びることを特徴とする請求項1に記載の発光素子。
- 前記キャビティーの底面の幅は前記発光チップの幅の1倍乃至1.5倍であることを特徴とする請求項8に記載の発光素子。
- 前記発光素子は2つの前記ワイヤを含み、
第1ワイヤは前記発光チップの第1電極パッドと前記キャビティーの側壁の上の前記第1電極とを連結し、
第2ワイヤは前記発光チップの第2電極パッドと前記キャビティーの側壁の上の前記第2電極とを連結することを特徴とする請求項8に記載の発光素子。 - 前記ワイヤは、Au、Sn、Ni、Cu、Tiのうち、少なくとも1つを含む金属で形成されていることを特徴とする請求項1に記載の発光素子。
- 前記ワイヤの両端の高さが同一であることを特徴とする請求項1に記載の発光素子。
- ボトムカバーと、
前記ボトムカバーの内に配置された導光板と、
前記導光板の少なくとも一側面または下面に配置され、基板及び前記基板に載置された複数の発光素子を含む発光モジュール部と、を含み、
前記発光素子は、前記請求項1乃至12のうちのいずれか1つに記載の発光素子であることを特徴とするバックライトユニット。 - 前記バックライトユニットは、前記導光板の上面に配置される表示パネルに光を提供することを特徴とする請求項13に記載のバックライトユニット。
- 前記キャビティー側壁の傾斜した角度は30゜乃至60゜であることを特徴とする請求項13に記載のバックライトユニット。
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JP2013105547A (ja) * | 2011-11-10 | 2013-05-30 | Zi-You Liao | Led照明器具用セラミック熱伝導片とled発光子の結合構造とその作製方法 |
US10290603B2 (en) | 2016-11-10 | 2019-05-14 | Mitsubishi Electric Corporation | High-frequency circuit |
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JP2014209091A (ja) * | 2013-03-25 | 2014-11-06 | ローム株式会社 | 半導体装置 |
CN103411143A (zh) * | 2013-07-09 | 2013-11-27 | 南通亚浦照明电器制造有限公司 | 一种光效提升及降低光衰的led灯具 |
KR102221599B1 (ko) * | 2014-06-18 | 2021-03-02 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
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Also Published As
Publication number | Publication date |
---|---|
KR101055081B1 (ko) | 2011-08-08 |
CN102185077A (zh) | 2011-09-14 |
EP2346103A2 (en) | 2011-07-20 |
US8476662B2 (en) | 2013-07-02 |
US20110194273A1 (en) | 2011-08-11 |
EP2346103A3 (en) | 2014-04-23 |
KR20110084055A (ko) | 2011-07-21 |
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