CN102185077A - 发光器件、用于制造发光器件的方法、以及背光单元 - Google Patents

发光器件、用于制造发光器件的方法、以及背光单元 Download PDF

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Publication number
CN102185077A
CN102185077A CN2011100225800A CN201110022580A CN102185077A CN 102185077 A CN102185077 A CN 102185077A CN 2011100225800 A CN2011100225800 A CN 2011100225800A CN 201110022580 A CN201110022580 A CN 201110022580A CN 102185077 A CN102185077 A CN 102185077A
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electrode
cavity
luminescent device
luminescence chip
light
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CN2011100225800A
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朴东昱
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LG Innotek Co Ltd
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LG Innotek Co Ltd
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    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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Abstract

公开了一种发光器件、制造该发光器件的方法、以及背光单元。该发光器件包括：主体，该主体包括腔体，以使该主体的上部是敞口的，其中，所述腔体具有相对于该腔体的底表面以第一角度倾斜的侧壁；第一电极和第二电极，该第一电极和第二电极形成在主体中，其中该第一电极和第二电极的至少一部分沿着所述腔体的侧壁形成；发光芯片，该发光芯片位于第一电极、第二电极以及所述腔体的底表面上方；至少一根电线，该至少一根电线的一端结合到发光芯片的顶表面，该至少一根电线的另一端结合到第一电极和第二电极的位于所述腔体的侧壁上的部分；以及成型构件，该成型构件形成在所述腔体中，以密封所述发光芯片。

Description

发光器件、用于制造发光器件的方法、以及背光单元
相关申请的交叉引用
本申请要求(于2010年1月15日提交的)韩国专利申请No.10-2010-0004104的优先权，该韩国申请的全部内容在此通过引用的方式并入。
技术领域
实施例涉及发光器件、制造该发光器件的方法、以及背光单元。
背景技术
发光二极管(LED)是一种将电能转换为光的半导体器件。与诸如荧光灯或辉光灯的传统光源相比，LED在功耗、寿命、响应速度、安全性及环保要求方面是有利的。为此，已经进行了各种研究来用LED替代传统光源。LED正日益用作诸如各种灯的照明装置、液晶显示器、电子标识牌、以及街灯的光源。
发明内容
实施例提供一种具有新颖结构的发光器件、制造该发光器件的方法、以及背光单元。
实施例提供了一种能够减少色差的发光器件和制造该发光器件的方法。
根据实施例，发光器件包括：主体，该主体包括腔体，以使该主体的上部是敞口的，其中，该腔体具有相对于其底表面以第一角度倾斜的侧壁；第一电极和第二电极，该第一电极和第二电极形成在所述主体中，其中该第一电极和第二电极的至少一部分沿着所述腔体的侧壁形成；发光芯片，该发光芯片位于所述腔体的底表面、第一电极以及第二电极上方；至少一根电线，该电线的一端结合到发光芯片的顶表面，该电线的另一端结合到第一电极和第二电极的位于所述腔体的侧壁上的部分；以及成型构件，该成型构件形成在所述腔体中，以密封所述发光芯片。
根据实施例，制造发光器件的方法包括下述步骤：制备主体，该主体包括用于使其上部敞口的腔体，其中该腔体具有相对于其底表面以第一角度倾斜的侧壁；形成第一电极和第二电极，该第一电极和第二电极形成在所述主体中，其中第一电极和第二电极的至少一部分沿着腔体的侧壁形成；将所述主体布置在支撑框架上；将发光芯片安装在所述主体、第一电极以及第二电极中的一个的上方；将至少一根电线的一端结合在发光芯片的顶表面上；在支撑框架已经以第一角度倾斜之后，将所述至少一根电线的另一端结合到在所述腔体的侧壁上方的第一电极和第二电极中的一个；以及，在支撑框架与水平表面对应地倾斜之后，在所述腔体中形成成型构件。
根据实施例，背光单元包括：底盖；导光板，该导光板设置在底盖中；以及发光模块，该发光模块设置在导光板的底表面或至少一个横向表面上，并且该发光模块包括基板和多个发光器件，所述多个发光器件安装在基板上，其中，所述发光器件包括：主体，该主体包括腔体，以使该主体的上部是敞口的，其中，所述腔体具有相对于其底表面以第一角度倾斜的侧壁；第一电极和第二电极，该第一电极和第二电极形成在主体中，其中该第一电极和第二电极的至少一部分沿着所述腔体的侧壁形成；发光芯片，该发光芯片位于腔体的底表面、第一电极以及第二电极上方；至少一根电线，该至少一根电线的一端结合到发光芯片的顶表面，该至少一根电线的另一端结合到第一电极和第二电极的位于该腔体的侧壁上的部分；以及成型构件，该成型构件形成在所述腔体中，以密封所述发光芯片。
实施例能够提供一种具有新颖结构的发光器件和制造该发光器件的方法。
实施例能够提供一种能够减少色差的发光器件和制造该发光器件的方法。
附图说明
图1是示出根据一实施例的发光器件的侧截面图；
图2至图7是示出根据该实施例的制造发光器件的方法的视图；
图8是示出根据本公开的另一实施例的发光器件的侧截面图；
图9是示出采用根据该实施例的发光器件的背光单元的视图；并且
图10是示出采用根据该实施例的发光器件的照明***的视图。
具体实施方式
在实施例的描述中，应当理解，当一个层(或膜)、区域、图案或结构被称为在另一基板、另一层(或膜)、另一区域、另一垫、或者另一图案“上”或“下”时，它可以“直接”或“间接”位于另一基板、层(或膜)、区域、垫或图案上方，或者也可以存在右一个或多个中间层。已经参考附图描述了层的这种位置。
为了方便或清楚起见，附图所示的每一层的厚度和尺寸可以被夸大、省略或示意性绘制。另外，元件的尺寸没有完全反映真实尺寸。
在下文中，将参考附图来描述根据实施例的发光器件和制造该发光器件的方法。
图1是示出根据实施例的发光器件1的侧截面图。
参考图1，发光器件1包括主体10、第一电极31和第二电极32、发光芯片20、至少一根电线40、以及成型构件50。
主体10可以包括如下材料中的至少一种：诸如PPA(聚邻苯二甲酰胺)的树脂材料、Si、陶瓷材料、金属材料、PSG(光敏玻璃)、蓝宝石(Al2O3)、以及PCB(印制电路板)。
如果主体10包括具有导电性的材料，则还可以在主体10的表面上形成有绝缘层(未示出)，以防止主体10与电极31、32电短路。
根据发光器件1的用途和设计，主体10的顶表面可以具有各种形状，例如矩形形状、多边形形状、以及圆形形状。
主体10内可以设置有腔体15，从而主体10具有敞口的上部。腔体15可以具有杯子形状或者凹形容器形状。另外，当在平面图中观察时，腔体15可以具有圆形形状、矩形形状、多边形形状、或者椭圆形形状。
腔体15的侧壁16可以相对于该腔体15的底表面以第一角度θ倾斜。例如，第一角度θ可以在大约30°至60°的范围内。该第一角度θ可以根据腔体15的深度、发光芯片20的高度h以及光分布特性而变化。
另外，如果成型构件50含有磷光体，则腔体15的底表面的宽度w可以是发光芯片20的宽度的一倍或两倍。由于腔体15的底表面的宽度w相对狭窄，所以能够最小化从发光芯片20发出的光的色差，下面将描述其详情。
第一电极31和第二电极32可以形成在主体10中。第一电极31和第二电极32可以相互电绝缘，并且可以电连接到外部电极和发光芯片20，以将电力供应到发光芯片20。
第一电极31和第二电极32可以包括金属材料，例如，从由以下项组成的组中选择的至少一种金属：Ti、Cu、Ni、Au、Cr、Ta、Pt、Sn、Ag、以及P。第一电极31和第二电极32可以具有单层结构或多层结构，但本实施例不限于此。
同时，第一电极31和第二电极32的至少一部分可以沿着主体10的腔体15的侧壁16形成。根据该实施例，如果腔体15的底表面的宽度w是发光芯片20的宽度的一倍或两倍，则电线40不能结合到形成在腔体15的底表面上的第一电极31或者第二电极32。因此，不得不对形成在腔体15的侧壁16上的第二电极32或第一电极31执行引线键合。
发光芯片20可以安装在第一电极31、第二电极32、以及主体10的腔体15的底表面中的一个上。
例如，发光芯片20可以包括至少一个发光二极管(LED)，并且该LED可以包括发射红色光、绿色光、蓝色光或白色光的彩色LED和发射UV光的UV(紫外线)LED，但本实施例不限于此。
至少一根电线40可以将发光芯片20与第一电极31及第二电极32中的至少一个电连接。该至少一根电线40可以包括呈现优秀的结合强度的金属材料，该金属材料包括Au、Sn、Ni、Cu、以及Ti中的至少一种，但本实施例不限于此。
在这种情况下，该至少一根电线40的一端可以结合到发光芯片20的顶表面，而该至少一根电线40的另一端可以结合到形成在腔体15的侧壁16处的第一电极31和第二电极32中的一个。
然而，如上所述，因为腔体15的侧壁16以第一角度θ倾斜，所以当该至少一根电线40通过典型的结合方案结合时可能出现缺陷。
因此，根据该实施例，在主体10已经以第一角度θ倾斜之后，将至少一根电线40结合到在腔体15的侧壁16上形成的第一电极31和第二电极32中的一个，从而能够确保引线键合方案的可靠性。在关于根据该实施例的制造发光器件1的方法的以下描述中，将进行其详细描述。
成型构件50可以形成在主体10的腔体15中，以密封发光芯片20，从而能够保护发光芯片20。
成型构件50可以包括透光式树脂材料或透光式硅材料，但本实施例不限于此。
成型构件50可以包括磷光体。在这种情况下，通过磷光体的泵光束来改变从发光芯片20发射的光的波长。例如，如果发光芯片20包括蓝光LED，并且该磷光体包括用于发射黄色泵光束的黄色磷光体，则从发光芯片20发射的蓝光与从黄色磷光体发射的黄光混合，从而产生白光。
同时，通常，如果该成型构件包括磷光体，则能够以多条路径反射、折射、或散射从发光芯片20发射的光。因此，发光器件1的输出光(光线)由于光路差异而呈现色差，从而可能会降低输出光的质量。
然而，根据该实施例，由于主体10的腔体15的底表面的宽度w是发光芯片20的宽度的一倍至两倍，所以形成在发光芯片20上的成型构件50具有相对均匀的厚度。因此，能够减少发光器件1的输出光的光路差异，从而能够产生呈现低色差的高质量的光。
然而，如果如上所述限制腔体15的底表面的宽度w，则不能充分确保对形成在腔体15的底表面上的第一电极31和第二电极32执行引线键合的面积。因此，对形成在腔体15的侧壁16上的第一电极31和第二电极32执行引线键合。
在下文中，将详细描述制造根据实施例的发光器件1的方法。
图2至图7是示出制造根据实施例的发光器件1的方法的截面图。
参考图2，制备具有第一电极31和第二电极32的主体10。在这种情况下，主体10固定到支撑框架12上，以有助于发光器件1的制造工艺。
参考图3，发光芯片10可以安装在主体10以及第一电极31和第二电极32中的一个上。
尽管未示出，但是在发光芯片20下面可以形成结合层(未示出)。该结合层可以包括呈现优秀的粘附性能的诸如环氧树脂的树脂材料、诸如AuSn的金属材料、或者具有导电填充物的树脂材料，但本实施例不限于此。
参考图4，在***有电线40的毛细管25已经移动到发光芯片20上之后，电线40的一端可以结合到发光芯片20。
为了结合该电线40，在发光芯片20上可以形成有电极焊盘(未示出)，该电极焊盘包括呈现优秀的粘附性能的金属材料，该金属材料包括Au、Ti、Sn、Cu、以及Ni中的至少一种，并且在该电极焊盘(未示出)上形成有植球，从而电线40可以结合到发光芯片20上，但本实施例不限于此。
参考图5，在使支撑框架12以第一角度θ倾斜之后，将毛细管25移动到形成在腔体15的侧壁16上的第一电极31和第二电极32之一，从而电线40的另一端可以结合到第一电极31和第二电极32之一。
当通过毛细管25执行引线键合时，如果对倾斜表面而不是对水平表面执行引线键合，则引线键合可能失败或者电线可能频繁断开，从而可能降低该发光器件的可靠性。
因此，根据制造实施例的发光器件的方法，在使支撑框架12以第一角度θ倾斜之后，通过毛细管25来执行引线键合，从而电极40可以稳定地结合到在倾斜表面上形成的电极31和32上。
参考图6，在电线40的另一端已经结合到第一电极31和第二电极32之后，将毛细管25提升并且与电线40断开，从而能够完成引线键合工艺。
参考图7，在已经将支撑框架12放置在水平面上之后，形成成型构件150以密封所述腔体15中的发光芯片20，从而能够保护发光芯片20。因此，能够提供根据该实施例的发光器件1。
在硅或树脂材料填充在腔体15中之后，通过使该硅或树脂材料硬化，可以形成成型构件150。
另外，在成型构件50中可以含有至少一种磷光体。
图8是示出根据本公开的另一实施例的发光器件的侧截面图。
参考图8，根据实施例的发光器件1包括主体10、第一电极31、第二电极32、发光芯片20、两根电线40、以及成型构件50。
在主体10中可以形成腔体15，从而该主体10的上部可以是敞口的。腔体15的侧壁16可以相对于腔体15的底表面以第一角度θ倾斜。例如，第一角度θ可以在大约30°至大约60°的范围内。然而，第一角度θ可以根据腔体15的深度、发光芯片20的高度h、以及发光芯片20的光分布特性而变化，但本实施例不限于此。
另外，如果成型构件50含有磷光体，则腔体15的底表面的宽度w可以是发光芯片20的宽度的1至1.2倍。腔体15的底表面的宽度w相对狭窄，从而能够最小化从发光芯片20发射的光的色差，下面将给出其详情。
第一电极31和第二电极32可以形成在主体10中。第一电极31和第二电极32可以相互电绝缘，并且可以电连接到外部电极和发光芯片20，以将电力供应到发光芯片20。
第一电极31和第二电极32的至少一部分可以沿着主体10的腔体15的侧壁16形成。
发光芯片20可以安装在主体10的腔体15的底表面上。
例如，发光芯片20可以包括至少一个LED，并且该LED可以包括发射红色光、绿色光、蓝色光或白色光的彩色LED和发射UV光的UV(紫外线)LED，但本实施例不限于此。
两根电线40和41可以将发光芯片20分别电连接到第一电极31和第二电极32。两根电线40和41的第一端结合到发光芯片20，并且两根电线40和41的第二端分别结合到形成在腔体15的侧壁16上的第一电极31和第二电极32。
然而，如上所述，因为腔体15的侧壁16以第一角度θ倾斜，所以当通过典型的结合方案结合两根电线40和41时，可能出现缺陷。
因此，根据实施例，在主体10已经以第一角度θ倾斜之后，将两根电线40、41结合到形成在腔体15的侧壁16上的第一电极31和第二电极32，从而能够确保引线键合方案的可靠性。
在这种情况下，电线40两端的高度可以与电线41两端的高度相同。
成型构件50密封所述主体10的腔体15中的发光芯片20，从而能够保护发光芯片20。
成型构件50可以包括透光式树脂材料或透光式硅材料，但本实施例不限于此。
成型构件50可以包括磷光体。在这种情况下，通过磷光体的泵光束来改变从发光芯片20发射的光的波长。例如，如果发光芯片20包括蓝光LED，并且该磷光体包括用于发射黄色泵光束的黄色磷光体，则从发光芯片20发射的蓝光可以与从黄色磷光体发射的黄光混合，从而产生白光。
同时，通常，如果该成型构件包括磷光体，则以多条路径反射、折射、或者散射从发光芯片发射的光。因此，该发光器件的输出光(光线)由于光路差异而呈现色差，从而可能会降低输出光的质量。
然而，根据该实施例，由于主体10的腔体15的底表面的宽度w是发光芯片20的宽度的一倍至两倍，所以形成在发光芯片20上的成型构件50具有相对均匀的厚度。因此，能够减少该发光器件的输出光的光路差异，从而能够产生呈现低色差的高质量的光。
然而，如果如上所述地限制腔体15的底表面的宽度w，则可以对形成在腔体15的侧壁16上的第一电极31和第二电极32执行引线键合。
图9是示出采用根据实施例的发光器件1的背光单元的视图。
参考图9，该背光单元包括：底盖140；导光板110，该导光板110设置在底盖140中；以及发光模块120，该发光模块120安装在导光板110的一侧或底表面上。另外，在导光板110的下面可以设置反射片130。
底盖140具有盒形形状，该盒形形状具有敞口的顶表面，以将导光板110、发光模块120以及反射片130容纳在其内。另外，底盖140可以包括金属材料或树脂材料，但本实施例不限于此。
发光模块120包括基板121和根据该实施例的多个发光器件1，所述多个发光器件1安装在基板121上。
基板121包括：普通的PCB(印制电路板)、MCPCB(金属芯PCB)、FPCB(柔性PCB)、或者陶瓷PCB，但本实施例不限于此。
发光器件1安装在基板121的第一表面上，并且布置成阵列的形式。
如图9所示，发光模块120可以设置在底盖140的至少一个内侧横向表面上，以朝着导光板110的至少一个横向表面供应光。
发光模块120设置在底盖140的底表面上，以朝着导光板110的底表面供应光。这种布置可以根据背光单元1100的设计而进行各种改变，并且本实施例不限于此。
导光板110可以安装在底盖140中。导光板110将发光模块120发射的光转换为表面光，以朝着显示面板(未示出)引导该表面光。
导光板110可以包括从由以下项组成的组中选择的一个：诸如PMMA(聚甲基丙烯酸甲酯)的丙烯醛基树脂、PET(聚对苯二甲酸乙二醇酯)、PC(聚碳酸酯)、COC或者PEN(聚萘二甲酸二乙酯)。例如，可以通过挤压成型来形成导光板110。
反射片130可以设置在导光板110下方。反射片130把穿过导光板110的底表面向下指向的光朝着导光板110的出光表面反射。
反射片130可以包括呈现优秀的反射率的材料，例如PET、PC或者PVC树脂，但本实施例不限于此。
图10是包括根据本公开的发光器件的照明***1200。图10所示的照明***1200是一个示例，但本公开不限于此。
参考图10，照明***1200包括：壳体1210、安装在壳体1210中的发光模块1230、以及安装在壳体1210中以从外部电源接收电力的连接端子1220。
优选地，壳体1210包括具有优异的散热性能的材料。例如，壳体1210包括金属材料或树脂材料。
发光模块1230可以包括基板700和安装在基板700上的至少一个发光器件600。
基板700包括印有电路图案的绝缘构件。例如，基板700包括：普通PCB(印刷电路板)、MCPCB(金属芯PCB)、FPCB(柔性PCB)、或者陶瓷PCB。
另外，基板700可以包括有效反射光的材料。基板700的表面可以涂覆有诸如白色或银色的颜色，以有效反射光。
在基板700上可以安装有至少一个发光器件600。
每个发光器件600可以包括至少一个LED(发光二极管)。该LED可以包括发射红色光、绿色光、蓝色光或白色光的彩色LED和发射UV光的UV(紫外线)LED。
发光模块1230的发光器件可以进行多种布置，以提供多种颜色和亮度。例如，可以布置白光发光器件、红光发光器件以及绿光发光器件的组合，以实现高显色指数(CRI)。另外，在从发光模块1230发射的光的路径中可以设置有荧光片，以改变从发光模块1230发射的光的波长。例如，如果从发光模块1230发射的光具有蓝光的波长带，则该荧光片可以包括黄色冷光材料。在这种情况下，从发光模块1230发射的光穿过该荧光片，从而该光看起来为白光。
连接端子1220电连接至发光模块1230，以将电力供应给发光模块1230。参考图10，连接端子1220具有与外部电源螺纹联接的插座形状，但本实施例不限于此。例如，连接端子1220可以制备成***到外部电源中的插头的形式，或者制备成通过电线连接至外部电源的形式。
根据上述照明***，在从发光模块发射的光的路径中设置有导光构件、漫射片、聚光片、亮度增强片以及荧光片中的至少一种，从而能够实现期望的光学效果。
在本说明书中对于“一个实施例”、“一实施例”、“示例性实施例”等的任何引用均意味着结合该实施例描述的特定特征、结构或特性被包括在本发明的至少一个实施例中。在说明书中各处出现的这类短语不必都表示同一实施例。此外，当结合任何实施例描述特定特征、结构或特性时，认为结合这些实施例中的其它实施例来实现这种特征、结构或特性也是本领域技术人员所能够想到的。
虽然已经参照本发明的多个示例性实施例描述了实施例，但应当理解，本领域的技术人员可以构思出许多将落入本公开原理的精神和范围内的其它修改和实施例。更特别地，在本公开、附图和所附权利要求的范围内，主题组合布置结构的组成部件和/或布置结构方面的各种变化和修改都是可能的。对于本领域的技术人员来说，除了组成部件和/或布置结构方面的变化和修改之外，替代用途也将是显而易见的。

Claims (15)

1.一种发光器件，包括：
主体，所述主体包括腔体，以使所述主体的上部是敞口的，所述腔体具有相对于所述腔体的底表面倾斜的侧壁；
第一电极和第二电极，所述第一电极和第二电极形成在所述主体中，所述第一电极和所述第二电极的至少一部分沿着所述腔体的侧壁形成；
发光芯片，所述发光芯片位于所述腔体的底表面、所述第一电极以及所述第二电极上；
至少一根电线，所述至少一根电线的一端结合到所述发光芯片的顶表面，所述至少一根电线的另一端结合到所述第一电极或所述第二电极的位于所述腔体的侧壁上的部分；以及
成型构件，所述成型构件形成在所述腔体中，以密封所述发光芯片。
2.根据权利要求1所述的发光器件，其中，所述腔体的侧壁以大约30°至大约60°的角度倾斜。
3.根据权利要求1所述的发光器件，其中，所述腔体的底表面的宽度是所述发光芯片的宽度的一倍至两倍。
4.根据权利要求1所述的发光器件，还包括位于所述发光芯片上的电极焊盘，其中，所述电线结合到所述电极焊盘。
5.根据权利要求1所述的发光器件，其中，所述成型构件包括至少一种磷光体。
6.根据权利要求1所述的发光器件，其中，所述发光芯片包括至少一个发光二极管。
7.根据权利要求1所述的发光器件，其中，所述主体具有顶表面，所述顶表面具有矩形形状、多边形形状、或者圆形形状。
8.根据权利要求1所述的发光器件，其中，所述第一电极和所述第二电极从所述腔体的侧壁的上部延伸到所述主体的外壁。
9.根据权利要求8所述的发光器件，其中，所述腔体的底表面的宽度是所述发光芯片的宽度的一倍至一倍半。
10.根据权利要求8所述的发光器件，其中，设置有两根电线，一根电线将所述发光芯片的第一电极焊盘连接到在所述腔体的侧壁上的所述第一电极，并且，余下的一根电线将所述发光芯片的第二电极焊盘连接到在所述腔体的侧壁上的所述第二电极。
11.根据权利要求1所述的发光器件，其中，所述电线包括金属，所述金属包括从由以下项组成的组中选择的至少一种：Au、Sn、Ni、Cu、以及Ti。
12.根据权利要求1所述的发光器件，其中，所述电线的两端具有相同高度。
13.一种背光单元，包括：
底盖；
导光板，所述导光板设置在所述底盖中；以及
发光模块，所述发光模块设置在所述导光板的底表面或至少一个横向表面上，并且所述发光模块包括基板和多个发光器件，所述多个发光器件安装在所述基板上，其中，所述发光器件包括根据权利要求1至12中的任一项所述的发光器件。
14.根据权利要求13所述的背光单元，其中，所述背光单元将光供应到显示面板，所述显示面板设置在所述导光板的顶表面上。
15.根据权利要求13所述的背光单元，其中，所述腔体的侧壁以大约30°至大约60°的角度倾斜。
CN2011100225800A 2010-01-15 2011-01-17 发光器件、用于制造发光器件的方法、以及背光单元 Pending CN102185077A (zh)

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