JP2011061144A - 被加工物の支持シート - Google Patents
被加工物の支持シート Download PDFInfo
- Publication number
- JP2011061144A JP2011061144A JP2009211897A JP2009211897A JP2011061144A JP 2011061144 A JP2011061144 A JP 2011061144A JP 2009211897 A JP2009211897 A JP 2009211897A JP 2009211897 A JP2009211897 A JP 2009211897A JP 2011061144 A JP2011061144 A JP 2011061144A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- support sheet
- workpiece
- semiconductor wafer
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 230000003014 reinforcing effect Effects 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- -1 polyethylene terephthalate Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 230000001965 increasing effect Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 68
- 239000004065 semiconductor Substances 0.000 description 46
- 238000005520 cutting process Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Images
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- Adhesive Tapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】 被加工物の一面に接着されて被加工物を支持する被加工物の支持シートであって、シート基材と、該シート基材上に形成され被加工物に接着する糊層と、該シート基材の外周側で該シート基材と一体化された環状補強部材と、を具備したことを特徴とする。
【選択図】図3
Description
4 糊層
6,8,10 環状補強部材
11 半導体ウエーハ
23〜23C 支持シート
Claims (3)
- 被加工物の一面に接着されて被加工物を支持する被加工物の支持シートであって、
シート基材と、
該シート基材上に形成され被加工物に接着する糊層と、
該シート基材の外周側で該シート基材と一体化された環状補強部材と、
を具備したことを特徴とする被加工物の支持シート。 - 前記環状補強部材の外形サイズと被加工物の外形サイズとが同等である請求項1記載の被加工物の支持シート。
- 前記シート基材は、ポリオレフィン、ポリ塩化ビニル及びポリエチレンテレフタレートからなる群から選択され、
前記糊層は外的刺激によって粘着力が低下する糊層から構成され、
前記環状補強部材は、針金、プラスチック及びカーボンからなる群から選択される請求項1又は2記載の被加工物の支持シート。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009211897A JP5441579B2 (ja) | 2009-09-14 | 2009-09-14 | 被加工物の支持シート |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009211897A JP5441579B2 (ja) | 2009-09-14 | 2009-09-14 | 被加工物の支持シート |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011061144A true JP2011061144A (ja) | 2011-03-24 |
JP5441579B2 JP5441579B2 (ja) | 2014-03-12 |
Family
ID=43948389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009211897A Active JP5441579B2 (ja) | 2009-09-14 | 2009-09-14 | 被加工物の支持シート |
Country Status (1)
Country | Link |
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JP (1) | JP5441579B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7079549B2 (ja) | 2018-01-18 | 2022-06-02 | 大阪シーリング印刷株式会社 | ラベル連続体、ロータリーダイカット装置およびそれを用いた切断方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002100589A (ja) * | 2000-09-21 | 2002-04-05 | Hitachi Ltd | 半導体装置製造方法 |
JP2006196705A (ja) * | 2005-01-13 | 2006-07-27 | Tokyo Ohka Kogyo Co Ltd | 回路素子の形成方法および多層回路素子 |
JP2007048958A (ja) * | 2005-08-10 | 2007-02-22 | Renesas Technology Corp | 半導体装置の製造方法および半導体装置 |
JP2008041985A (ja) * | 2006-08-08 | 2008-02-21 | Tokyo Ohka Kogyo Co Ltd | サポートプレート |
-
2009
- 2009-09-14 JP JP2009211897A patent/JP5441579B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002100589A (ja) * | 2000-09-21 | 2002-04-05 | Hitachi Ltd | 半導体装置製造方法 |
JP2006196705A (ja) * | 2005-01-13 | 2006-07-27 | Tokyo Ohka Kogyo Co Ltd | 回路素子の形成方法および多層回路素子 |
JP2007048958A (ja) * | 2005-08-10 | 2007-02-22 | Renesas Technology Corp | 半導体装置の製造方法および半導体装置 |
JP2008041985A (ja) * | 2006-08-08 | 2008-02-21 | Tokyo Ohka Kogyo Co Ltd | サポートプレート |
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JP5441579B2 (ja) | 2014-03-12 |
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