JP2010247078A - 液体吐出装置 - Google Patents
液体吐出装置 Download PDFInfo
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- JP2010247078A JP2010247078A JP2009099669A JP2009099669A JP2010247078A JP 2010247078 A JP2010247078 A JP 2010247078A JP 2009099669 A JP2009099669 A JP 2009099669A JP 2009099669 A JP2009099669 A JP 2009099669A JP 2010247078 A JP2010247078 A JP 2010247078A
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- 239000007788 liquid Substances 0.000 title claims abstract description 223
- 238000007599 discharging Methods 0.000 title abstract description 14
- 238000003860 storage Methods 0.000 claims abstract description 142
- 230000009466 transformation Effects 0.000 claims description 18
- 238000013459 approach Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 20
- 239000012530 fluid Substances 0.000 abstract 3
- 230000008569 process Effects 0.000 description 19
- 238000009423 ventilation Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0283—Flat jet coaters, i.e. apparatus in which the liquid or other fluent material is projected from the outlet as a cohesive flat jet in direction of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
- B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
- B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
- B05C5/0258—Coating heads with slot-shaped outlet flow controlled, e.g. by a valve
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
- B05B1/3013—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the controlling element being a lift valve
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Nozzles (AREA)
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
【解決手段】液体吐出装置は、処理液を貯留する貯留部20と、処理液を吐出するスリット状の開口部41と、スリット状の断面を有して貯留部20とスリット状の開口部41とを接続する接続通路42とを備える。液体吐出装置は、貯留部20内において接続通路42の流路断面を覆うとともに、貯留部20の下壁43とで隙間22を形成してその隙間22から処理液を接続通路42へ流入させる弁体部50と、貯留部20の下壁43の表面と接続通路42の内壁面とを滑らかに接続する貯留部20側に凸の第1曲面部と、弁体部50に設けられて第1曲面部と同じ側に凸であり同第1曲面部に対向する第2曲面部とを備える。
【選択図】 図1
Description
Claims (8)
- 液体を貯留する貯留部と、前記液体を吐出するスリット状の開口部と、スリット状の断面を有して前記貯留部と前記スリット状の開口部とを接続する接続通路とを備える液体吐出装置であって、
前記貯留部内において前記接続通路の流路断面を覆うとともに、前記貯留部の内壁とで隙間を形成してその隙間から前記液体を前記接続通路へ流入させる変流部材と、
前記貯留部の内壁面と前記接続通路の内壁面とを滑らかに接続する前記貯留部側に凸の第1曲面部と、
前記変流部材に設けられて前記第1曲面部と同じ側に凸であり同第1曲面部に対向する第2曲面部と
を備えることを特徴とする液体吐出装置。 - 前記第2曲面部の曲率半径は、前記第1曲面部の曲率半径よりも大きく設定されていることを特徴とする請求項1に記載の液体吐出装置。
- 前記液体の流れ方向において、前記第2曲面部の長さは、前記第1曲面部の長さよりも長く設定されていることを特徴とする請求項1又は2に記載の液体吐出装置。
- 前記液体の流れ方向において、前記第2曲面部は、前記第1曲面部よりも下流側まで設けられていることを特徴とする請求項1〜3のいずれか1項に記載の液体吐出装置。
- 前記貯留部の内壁と前記変流部材とが相対移動可能であり、この相対移動に基づいて同貯留部の内壁と同変流部材との隙間をシール可能であることを特徴とする請求項1〜4のいずれか1項に記載の液体吐出装置。
- 前記貯留部の下部に前記接続通路が接続されるとともに、前記貯留部の内壁と前記変流部材との隙間が水平に配置され、
前記液体の自重により生じる圧力によって前記スリット状の開口部から同液体を吐出することを特徴とする請求項1〜5のいずれか1項に記載の液体吐出装置。 - 前記第1曲面部は、前記スリット状の断面を有する前記接続通路の内壁面に沿って環状に設けられており、
前記貯留部の内壁と前記変流部材とが相対移動可能であり、この相対移動に基づいて同貯留部の内壁と同変流部材との隙間を、前記第1曲面部から等距離の位置において環状にシール可能であることを特徴とする請求項6に記載の液体吐出装置。 - 前記貯留部の内壁面が前記接続通路に近付くほど低くなるように傾斜していることを特徴とする請求項6又は7に記載の液体吐出装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009099669A JP4668330B2 (ja) | 2009-04-16 | 2009-04-16 | 液体吐出装置 |
PCT/JP2010/056871 WO2010119961A1 (ja) | 2009-04-16 | 2010-04-16 | 液体吐出装置 |
US13/264,742 US8840049B2 (en) | 2009-04-16 | 2010-04-16 | Liquid ejecting apparatus |
TW099112043A TWI523697B (zh) | 2009-04-16 | 2010-04-16 | Liquid discharge device |
KR1020117027169A KR101140040B1 (ko) | 2009-04-16 | 2010-04-16 | 액체 토출 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009099669A JP4668330B2 (ja) | 2009-04-16 | 2009-04-16 | 液体吐出装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010247078A true JP2010247078A (ja) | 2010-11-04 |
JP4668330B2 JP4668330B2 (ja) | 2011-04-13 |
Family
ID=42982618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009099669A Expired - Fee Related JP4668330B2 (ja) | 2009-04-16 | 2009-04-16 | 液体吐出装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8840049B2 (ja) |
JP (1) | JP4668330B2 (ja) |
KR (1) | KR101140040B1 (ja) |
TW (1) | TWI523697B (ja) |
WO (1) | WO2010119961A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012098730A1 (ja) | 2011-01-19 | 2012-07-26 | シーケーディ株式会社 | 液体気化器 |
KR101892758B1 (ko) | 2011-09-30 | 2018-10-04 | 시케이디 가부시키가이샤 | 액체 제어 장치 |
JP5989944B2 (ja) * | 2011-09-30 | 2016-09-07 | Ckd株式会社 | 液体制御装置 |
JP6055280B2 (ja) * | 2012-11-11 | 2016-12-27 | 平田機工株式会社 | 塗布液充填方法 |
US20180030678A1 (en) * | 2016-08-01 | 2018-02-01 | Specialized Pavement Marking, Inc. | Striping apparatus |
KR102502732B1 (ko) * | 2020-12-18 | 2023-02-23 | 주식회사 동우전자 | Led용 렌즈 공급기의 접착제 도포장치 |
CN112635645B (zh) * | 2021-01-14 | 2021-08-27 | 深圳市科润光电股份有限公司 | 一种具有高散热功能的led封装结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4614776B1 (ja) * | 1966-05-30 | 1971-04-20 | ||
JPS56138571A (en) * | 1980-03-28 | 1981-10-29 | Toshiba Corp | Steam control valve |
JP2002361151A (ja) * | 2001-06-10 | 2002-12-17 | Mikuni Denshi Kk | 液状体の吐出塗布方法と吐出塗布装置 |
JP2003024854A (ja) * | 2001-07-16 | 2003-01-28 | Kawakami Tekkosho:Kk | コーティング装置 |
JP2003245583A (ja) * | 2002-02-25 | 2003-09-02 | Hirata Corp | 液体塗布装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3630453A (en) * | 1970-02-20 | 1971-12-28 | United States Steel Corp | Adjustable elongated spray nozzle |
US3938468A (en) * | 1970-04-29 | 1976-02-17 | Wheeling-Pittsburgh Steel Corporation | Apparatus for wiping liquid from a strip |
US3942723A (en) * | 1974-04-24 | 1976-03-09 | Beloit Corporation | Twin chambered gas distribution system for melt blown microfiber production |
JP3879994B2 (ja) * | 2002-03-08 | 2007-02-14 | ソニー株式会社 | 電極の製造装置および製造方法 |
JP4315787B2 (ja) | 2003-11-18 | 2009-08-19 | 大日本スクリーン製造株式会社 | 基板処理装置、並びに被充填体における液体充填度および気体混入度判定構造 |
ITTO20040091A1 (it) * | 2004-02-17 | 2004-05-17 | Itw Automotive Italia S R L | Spruzzatore multifunzionale lavacristallo con getto orientabile, in particolare per veicoli |
-
2009
- 2009-04-16 JP JP2009099669A patent/JP4668330B2/ja not_active Expired - Fee Related
-
2010
- 2010-04-16 TW TW099112043A patent/TWI523697B/zh active
- 2010-04-16 WO PCT/JP2010/056871 patent/WO2010119961A1/ja active Application Filing
- 2010-04-16 KR KR1020117027169A patent/KR101140040B1/ko active IP Right Grant
- 2010-04-16 US US13/264,742 patent/US8840049B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4614776B1 (ja) * | 1966-05-30 | 1971-04-20 | ||
JPS56138571A (en) * | 1980-03-28 | 1981-10-29 | Toshiba Corp | Steam control valve |
JP2002361151A (ja) * | 2001-06-10 | 2002-12-17 | Mikuni Denshi Kk | 液状体の吐出塗布方法と吐出塗布装置 |
JP2003024854A (ja) * | 2001-07-16 | 2003-01-28 | Kawakami Tekkosho:Kk | コーティング装置 |
JP2003245583A (ja) * | 2002-02-25 | 2003-09-02 | Hirata Corp | 液体塗布装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2010119961A1 (ja) | 2010-10-21 |
US8840049B2 (en) | 2014-09-23 |
US20120024989A1 (en) | 2012-02-02 |
KR101140040B1 (ko) | 2012-05-02 |
JP4668330B2 (ja) | 2011-04-13 |
TWI523697B (zh) | 2016-03-01 |
KR20110129986A (ko) | 2011-12-02 |
TW201103637A (en) | 2011-02-01 |
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