JP2010062205A - ダイシング・ダイボンドフィルムの製造方法 - Google Patents
ダイシング・ダイボンドフィルムの製造方法 Download PDFInfo
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- JP2010062205A JP2010062205A JP2008223742A JP2008223742A JP2010062205A JP 2010062205 A JP2010062205 A JP 2010062205A JP 2008223742 A JP2008223742 A JP 2008223742A JP 2008223742 A JP2008223742 A JP 2008223742A JP 2010062205 A JP2010062205 A JP 2010062205A
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- adhesive layer
- bonding
- pressure
- film
- dicing die
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- H—ELECTRICITY
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C09J7/00—Adhesives in the form of films or foils
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Abstract
【解決手段】 基材上に粘着剤層及び接着剤層が順次積層されたダイシング・ダイボンドフィルムの製造方法であって、離型フィルム上に、無機充填剤を含み、算術平均粗さRaが0.015〜1μmであり、表面が凹凸状の前記接着剤層を形成する工程と、前記基材上に設けられた粘着剤層と前記接着剤層を、温度30〜50℃、圧力0.1〜0.6MPaの条件下で貼り合わせ、粘着剤層と接着剤層との接触面積を貼り合わせ面積に対し35〜90%の範囲とする工程とを有する。
【選択図】 図1
Description
基材上に粘着剤層及び接着剤層が順次積層されたダイシング・ダイボンドフィルムを例にして、本実施の形態に係るダイシング・ダイボンドフィルムの製造方法を以下に説明する。
図1(a)に示すように、ダイシング・ダイボンドフィルム10は、基材1上に粘着剤層2及び接着剤層3が順次積層された構成である。また、図2に示すように、ワーク貼り付け部分にのみ接着剤層3’を形成した構成であってもよい。
本発明のダイシング・ダイボンドフィルム10、12は、接着剤層3、3’上に任意に設けられた離型フィルムを適宜に剥離して、次の様に使用される。以下では、図を参照しながらダイシング・ダイボンドフィルム10を用いた場合を例にして説明する。
前記基板等上に半導体素子を3次元実装する場合、半導体素子の回路が形成される面側には、バッファーコート膜が形成されている。当該バッファーコート膜としては、例えば窒化珪素膜やポリイミド樹脂等の耐熱樹脂からなるものが挙げられる。
ブチルアクリレートを主成分としたポリマー(根上工業(株)製、パラクロンSN−710)100部に対して、イソシアネート系架橋剤(コロネートHX、日本ポリウレタン)3部、エポキシ樹脂(ジャパンエポキシレジン(株)製、エピコート1003)12部、フェノール樹脂(三井化学(株)製、ミレックスXLC−CC)7部、無機充填剤として球状シリカ(平均粒径:0.5μm、アドマテックス(株)製:SS0−25R)50部をメチルエチルケトンに溶解させ、濃度20重量%の接着剤組成物溶液を調製した。
紫外線(UV)照射装置:高圧水銀灯
紫外線照射積算光量:500mJ/cm2
出力:75W
照射強度150mW/cm2
尚、紫外線照射は粘着剤層前駆体に対し直接照射した。
アクリル酸2−エチルヘキシル70部、アクリル酸n−ブチル25部、アクリル酸5部を構成モノマーとするアクリル系共重合体を調製し、更に、イソシアネート系架橋剤(コロネートHX、日本ポリウレタン)3部、無機充填剤としての二酸化珪素(平均粒径0.5μm、日本触媒社製)30部をメチルエチルケトンに溶解させ、濃度20重量%の接着剤組成物溶液を調製した
ブチルアクリレートを主成分としたポリマー(根上工業(株)製、パラクロンSN−710)100部に対して、イソシアネート系架橋剤(コロネートHX、日本ポリウレタン)3部、エポキシ樹脂(ジャパンエポキシレジン(株)製、エピコート1003)12部、フェノール樹脂(三井化学(株)製、ミレックスXLC−CC)7部、無機充填剤として球状シリカ(平均粒径:0.5μm、アドマテックス(株)製:SS0−25R)50部をメチルエチルケトンに溶解させ、濃度20重量%の接着剤組成物溶液を調製した。
本比較例においては、接着剤組成物溶液の調製の際に無機充填剤を添加しなかったこと以外は、実施例1と同様にして、本比較例1に係るダイシング・ダイボンドフィルムを作製した。尚、粘着剤層との貼り合わせ前の接着剤層における算術平均粗さRaは0.026μmであった。
本比較例においては、接着剤組成物溶液の調製の際に添加した無機充填剤の配合量を85部にしたこと以外は、前記実施例2と同様にして、本比較例1に係るダイシング・ダイボンドフィルムを作製した。尚、粘着剤層との貼り合わせ前における接着剤層表面の算術平均粗さRaは、1.5μmであった。
各実施例及び比較例で得られたダイシング・ダイボンドフィルムにおける接着剤層と粘着剤層の間の接着面積は、次の通りにして測定した。
即ち、Nikon(株)製の光学顕微鏡ECLIPSE ME600とOLYMPUS(株)製E−410カメラを用いて、接着剤層と粘着剤層の間の接着面を観察した。得られた画像を市販ソフトWinroof((株)三谷商事)を用いて、2値化処理し、接着剤層が粘着剤層と接触していない領域の分布状態及び面積比率を算出した。画像解析は3箇所の任意の領域を測定し、平均した値を接触面積とした。結果を下記表1に示す。
各実施例及び比較例で得られたダイシング・ダイボンドフィルムを、ウエハー(直径8インチ、厚さ75μm)の裏面に、50℃で貼り付けた。ダイシング・ダイボンドフィルム側の貼り合わせ面は接着剤層とした。
各実施例及び比較例で得られたダイシング・ダイボンドフィルムを、ウエハー(直径8インチ、厚さ75μm)の裏面に、50℃で貼り付けた。ダイシング・ダイボンドフィルム側の貼り合わせ面は接着剤層とした。
表1から明らかな通り、実施例1〜2のダイシング・ダイボンドフィルムに於いては、ダイシング時のチップ飛びが発生せず、また良好なピックアップ性を示した。即ち、本実施例のダイシング・ダイボンドフィルムであると、歩留まりを向上させて半導体装置の製造が可能であることが示された。
2 粘着剤層
3、3’ 接着剤層
5 半導体チップ(半導体素子)
6 被着体
7 ボンディングワイヤー
8 封止樹脂
9 スペーサ
10、11 ダイシング・ダイボンドフィルム
13、21 接着剤層
15 半導体チップ(半導体素子)
Claims (10)
- 基材上に粘着剤層及び接着剤層が順次積層されたダイシング・ダイボンドフィルムの製造方法であって、
離型フィルム上に、無機充填剤を含み、算術平均粗さRaが0.015〜1μmであり、表面が凹凸状の前記接着剤層を形成する工程と、
前記基材上に設けられた粘着剤層と前記接着剤層を、温度30〜50℃、圧力0.1〜0.6MPaの条件下で貼り合わせ、粘着剤層と接着剤層との接触面積を貼り合わせ面積に対し35〜90%の範囲とする工程とを有するダイシング・ダイボンドフィルムの製造方法。 - 前記接着剤層を形成する工程は、
前記離型フィルム上に、前記無機充填剤を含む接着剤組成物溶液を塗工して塗布層を形成する工程と、
前記塗布層に、風量5〜20m/minの乾燥風を、乾燥温度70〜160℃、乾燥時間1〜5minの条件下で吹き付けて乾燥させる工程とを含む請求項1に記載のダイシング・ダイボンドフィルムの製造方法。 - 前記無機充填剤の配合量は、前記接着剤層における有機樹脂成分100重量部に対し20〜80重量部である請求項2に記載のダイシング・ダイボンドフィルムの製造方法。
- 前記無機充填剤として、その平均粒径が0.1〜5μmのものを使用する請求項2又は3に記載のダイシング・ダイボンドフィルムの製造方法。
- 前記塗布層の乾燥は、乾燥時間の経過と共に、乾燥温度を段階的に上昇させて行う請求項2〜4の何れか1項に記載のダイシング・ダイボンドフィルムの製造方法。
- 前記粘着剤層の算術平均粗さRaは、前記接着剤層との貼り合わせ前において、0.015〜0.5μmの範囲である請求項1〜5の何れか1項に記載のダイシング・ダイボンドフィルムの製造方法。
- 基材上に粘着剤層及び接着剤層が順次積層されたダイシング・ダイボンドフィルムであって、
前記接着剤層は無機充填剤を含み、前記粘着剤層との貼り合わせ前における貼り合わせ面が凹凸状で、算術平均粗さRaが0.015〜1μmであり、
前記貼り合わせ面の接触面積は、貼り合わせ面積に対し35〜90%の範囲であるダイシング・ダイボンドフィルム。 - 前記無機充填剤の配合量は、前記接着剤層における有機樹脂成分100重量部に対し20〜80重量部である請求項7に記載のダイシング・ダイボンドフィルム。
- 前記無機充填剤として、その平均粒径が0.1〜5μmのものを使用する請求項7又は8に記載のダイシング・ダイボンドフィルム。
- 前記粘着剤層の算術平均粗さRaは、前記接着剤層との貼り合わせ前において、0.015〜0.5μmの範囲である請求項7〜9の何れか1項に記載のダイシング・ダイボンドフィルム。
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JP2008223742A JP4801127B2 (ja) | 2008-09-01 | 2008-09-01 | ダイシング・ダイボンドフィルムの製造方法 |
KR1020107011032A KR20100065401A (ko) | 2008-09-01 | 2009-08-12 | 다이싱ㆍ다이 본드 필름의 제조 방법 |
US12/744,113 US20100304092A1 (en) | 2008-09-01 | 2009-08-12 | Method of manufacturing dicing die-bonding film |
PCT/JP2009/064238 WO2010024121A1 (ja) | 2008-09-01 | 2009-08-12 | ダイシング・ダイボンドフィルムの製造方法 |
KR1020107025459A KR20110036698A (ko) | 2008-09-01 | 2009-08-12 | 다이싱ㆍ다이 본드 필름의 제조 방법 |
TW101114556A TW201241142A (en) | 2008-09-01 | 2009-08-28 | Dicing and die-bonding film |
TW098129119A TWI369390B (en) | 2008-09-01 | 2009-08-28 | Method for manufacturing dicing and die-bonding film |
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JP2015103580A (ja) * | 2013-11-21 | 2015-06-04 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、熱硬化型ダイボンドフィルムの製造方法、及び、半導体装置の製造方法 |
JP2017130598A (ja) * | 2016-01-22 | 2017-07-27 | 株式会社ディスコ | ウエーハの加工方法 |
WO2021005661A1 (ja) * | 2019-07-05 | 2021-01-14 | 昭和電工マテリアルズ株式会社 | ダイシング・ダイボンディング一体型フィルム、ダイボンディングフィルム、及び半導体装置の製造方法 |
WO2021006158A1 (ja) * | 2019-07-05 | 2021-01-14 | 昭和電工マテリアルズ株式会社 | ダイシング・ダイボンディング一体型フィルム、ダイボンディングフィルム、及び半導体装置の製造方法 |
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TW201014894A (en) | 2010-04-16 |
TWI369390B (en) | 2012-08-01 |
KR20100065401A (ko) | 2010-06-16 |
WO2010024121A1 (ja) | 2010-03-04 |
KR20110036698A (ko) | 2011-04-08 |
TW201241142A (en) | 2012-10-16 |
JP4801127B2 (ja) | 2011-10-26 |
US20100304092A1 (en) | 2010-12-02 |
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