JP2009510776A - 不連続コンベヤーシステム - Google Patents
不連続コンベヤーシステム Download PDFInfo
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- JP2009510776A JP2009510776A JP2008533437A JP2008533437A JP2009510776A JP 2009510776 A JP2009510776 A JP 2009510776A JP 2008533437 A JP2008533437 A JP 2008533437A JP 2008533437 A JP2008533437 A JP 2008533437A JP 2009510776 A JP2009510776 A JP 2009510776A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】本発明の輸送システムは、一般的に、容器をベイ間コンベヤーから第2のツールベイに向けて輸送するための第1の容器輸送システムと、容器を第1のツールベイから遠くへ移動させるための第2の容器輸送システムと、容器を第1及び第2の容器輸送システムとロードポートとの間で移動するためのツールローディングデバイスと、を含む。また、容器を第2の容器輸送システムとベイ間コンベヤーとの間で容器を輸送するための合流リターンコンベヤーを含むのがよい。
【選択図】図5
Description
102a、104a、106a、108a、110a 加工ツール
118a 入力コンベヤースタブ
122a 出口コンベヤースタブ
152 ツールローディング機構
154 トラック
156、160、162 アーム
158 グリッパ
164 エルボージョイント
A、B、P 位置
Claims (27)
- ロードポートをもった少なくとも一つの加工ツールを有するツールベイ内で容器を移動させるためのベイ間輸送システムであって、
容器を材料輸送システムから受けることができるようになっている第1の容器輸送システムと、
第2の容器輸送システムと、
容器を第1の容器輸送システムと第2の容器輸送システムとツールベイに配置された加工ツールのロードポートとの間を移動させるためのツールローディングデバイスと、
を含み,
ツールローディングデバイスは、共通の垂直平面内で実質的に垂直及び水平運動だけの組合せによって容器を第1の容器輸送システムと第2の容器輸送システムとロードポートとの間を移動させる、
ことを特徴とするベイ間輸送システム。 - 第1の容器輸送システムは、複数の容器を同時に保管する、請求項1に記載のベイ間輸送システム。
- 第2の容器輸送システムは、複数の容器を同時に保管する、請求項1に記載のベイ間輸送システム。
- ツールローディングデバイスは、複数の容器のいずれか一つにアクセスする、請求項2に記載のベイ間輸送システム。
- 容器を受けることができるようになっている少なくとも一つの保管棚を更に含む、請求項1に記載のベイ間輸送システム。
- 第1の容器輸送システム及び第2の容器輸送システムは、各々、単一の双方向コンベヤーを含む、請求項1に記載のベイ間輸送システム。
- 第1の容器輸送システムの少なくとも一部分は、ツールベイに配置された各ロードポートに整合される、請求項1に記載のベイ間輸送システム。
- ツールローディングデバイスは、直線トラックに沿って移動する本体を含む、請求項1に記載のベイ間輸送システム。
- トラックは、第1及び第2の容器輸送システムの垂直高さよりも低い垂直高さに配置される、請求項8に記載のベイ間輸送システム。
- 第1の容器輸送システムに保管された容器及び、加工ツールのロードポートに保管された容器は、実質的に共通の垂直平面内で整合される、請求項1に記載のベイ間輸送システム。
- 第1の容器輸送システムは、多段コンベヤーを含む、請求項1に記載のベイ間輸送システム。
- 第1の容器輸送システムを作動するための制御システムを更に含み、該制御システムは、第1の容器輸送システムに配置された容器の詰込み密度を最適化することができるようになっている、請求項1に記載のベイ間輸送システム。
- 制御システムが第1の容器輸送システムに配置された各容器の位置を決定するように第1の容器輸送システムに複数のセンサを更に含む、請求項12に記載のベイ間輸送システム。
- 材料輸送システムは、ベイ間輸送機構を含む、請求項1に記載のベイ間輸送システム。
- ベイ間輸送システムは、コンベヤーを含む、請求項14に記載のベイ間輸送システム。
- ベイ間輸送システムは、頭上コンベヤーを含む、請求項14に記載のベイ間輸送システム。
- 材料輸送システムは、ストッカーを含む、請求項1に記載のベイ間輸送システム。
- 第1の材料輸送システムによって容器をツールベイの中に輸送し且つ第2の材料輸送システムによって容器をツールベイの外に輸送するための輸送システムにおいて、
ツールベイは、床と、ロードポートを有する少なくとも一つの加工ツールと、ツールローディングデバイスと、を含み、
ツールローディングデバイスは、
第1の端及び第2の端を有するトラックと、
容器を第1の輸送システムと、ロードポートと、第2の輸送システムとの間を移動させるための容器輸送デバイスと、
を有し、
容器輸送デバイスは、
トラックの第1の端と第2の端との間を移動することができ
るようになっている本体と、
容器を固定及び解放するためのグリッパと、
本体に回動自在に取付けられ、実質的に共通の垂直平面内でZ方向運動とX方向運動の組合せだけによりグリッパを移動させることができるようになっている、アーム組立体と、
を含む、ことを特徴とするツールローディングデバイス。 - ツールベイ床から測定した、トラックの垂直高さは、第1の材料輸送システムか、第2の材料輸送システムのいずれかの垂直高さよりも低い、請求項18に記載のツールローディングデバイス。
- アーム組立体は、第1のリンクと第2のリンクとを含む、請求項18に記載のツールローディングデバイス。
- グリッパは、第2のリンクに回動自在に取付けられる、請求項20に記載のツールローディングデバイス。
- 第1のリンクは、第2のリンクと実質的に同じ長さである、請求項20に記載のツールローディングデバイス。
- 第1のリンクは、容器輸送デバイスの本体に回動自在に取付けられる、請求項18に記載のツールローディングデバイス。
- 容器輸送デバイスは、アーム組立体又はグリッパの特定の距離内で人間オペレータの存在を感知することができる、請求項18に記載のツールローディングデバイス。
- 第2のリンクの運動は、第1のリンクの運動に依存する、請求項20に記載のツールローディングデバイス。
- トラックは、第1の材料輸送システム及び第2の材料輸送システムの両方から、Y方向に、オフセットされる、請求項18に記載のツールローディングデバイス。
- トラックは、第1の材料輸送システム及び第2の材料輸送システムの両方と、Y方向に、実質的に整合される、請求項18に記載のツールローディングデバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/238,030 US7661919B2 (en) | 2005-09-28 | 2005-09-28 | Discontinuous conveyor system |
PCT/US2006/036521 WO2007038096A2 (en) | 2005-09-28 | 2006-09-19 | Discontinuous conveyor system |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009510776A true JP2009510776A (ja) | 2009-03-12 |
Family
ID=37467485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008533437A Pending JP2009510776A (ja) | 2005-09-28 | 2006-09-19 | 不連続コンベヤーシステム |
Country Status (4)
Country | Link |
---|---|
US (1) | US7661919B2 (ja) |
JP (1) | JP2009510776A (ja) |
TW (1) | TW200725789A (ja) |
WO (1) | WO2007038096A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020095571A1 (ja) * | 2018-11-06 | 2020-05-14 | 村田機械株式会社 | 天井吊下棚 |
WO2020095570A1 (ja) * | 2018-11-06 | 2020-05-14 | 村田機械株式会社 | 天井搬送車 |
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US7578650B2 (en) * | 2004-07-29 | 2009-08-25 | Kla-Tencor Technologies Corporation | Quick swap load port |
US7604449B1 (en) * | 2005-06-27 | 2009-10-20 | Kla-Tencor Technologies Corporation | Equipment front end module |
US20100310351A1 (en) * | 2006-03-30 | 2010-12-09 | Tokyo Electron Limited | Method for handling and transferring a wafer case, and holding part used therefor |
US20070289843A1 (en) * | 2006-04-18 | 2007-12-20 | Barry Kitazumi | Conveyor System Including Offset Section |
CN101578700B (zh) * | 2006-08-18 | 2012-11-14 | 布鲁克斯自动化公司 | 容量减少的载物台,传送,装载端口,缓冲*** |
US20080050208A1 (en) * | 2006-08-25 | 2008-02-28 | Barry Kitazumi | High speed transporter including horizontal belt |
WO2009043369A1 (en) * | 2007-10-01 | 2009-04-09 | Abb Technology Ab | A method for controlling a plurality of axes in an industrial robot system and an industrial robot system |
US7992734B2 (en) * | 2008-01-11 | 2011-08-09 | International Business Machines Corporation | Semiconductor automation buffer storage identification system and method |
KR101015225B1 (ko) * | 2008-07-07 | 2011-02-18 | 세메스 주식회사 | 기판 처리장치 및 이의 기판 이송 방법 |
JP5212165B2 (ja) | 2009-02-20 | 2013-06-19 | 東京エレクトロン株式会社 | 基板処理装置 |
IT1393300B1 (it) * | 2009-03-24 | 2012-04-20 | Marchesini Group Spa | Sistema e metodo per l'accumulo di articoli contenitori che si identificano in flaconi o siringhe |
TWI496732B (zh) * | 2009-07-31 | 2015-08-21 | Murata Machinery Ltd | 供工具利用之緩衝儲存和運輸裝置 |
JP5673806B2 (ja) * | 2011-05-02 | 2015-02-18 | 村田機械株式会社 | 自動倉庫 |
CN103811378B (zh) * | 2012-11-14 | 2016-08-03 | 沈阳芯源微电子设备有限公司 | 一种半导体制造设备的自动移动装置 |
TW201422501A (zh) * | 2012-12-04 | 2014-06-16 | Tian-Sing Huang | 晶圓承載裝置及其應用 |
DE102013222900B4 (de) | 2013-11-11 | 2017-04-06 | Fabmatics Gmbh | Flexibles Purge-Management System |
WO2016081948A1 (en) * | 2014-11-22 | 2016-05-26 | Miller Kenneth C | Suspended automation system |
US12023801B2 (en) | 2014-11-22 | 2024-07-02 | Kenneth C. Miller | Suspended automation system |
US9875921B2 (en) * | 2015-05-07 | 2018-01-23 | Fabmatics Gmbh | Flexible purge management system |
CN107851594B (zh) * | 2015-08-28 | 2021-06-22 | 株式会社国际电气 | 基板处理装置以及半导体装置的制造方法 |
US9698036B2 (en) * | 2015-11-05 | 2017-07-04 | Lam Research Corporation | Stacked wafer cassette loading system |
US11239102B2 (en) * | 2018-03-22 | 2022-02-01 | Murata Machinery, Ltd. | Stocker system |
CA3014976A1 (en) * | 2018-08-20 | 2020-02-20 | Cube Automation Inc. | A method for handling a catch from a fishing boat |
WO2020137225A1 (ja) * | 2018-12-26 | 2020-07-02 | 村田機械株式会社 | 保管システム |
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-
2005
- 2005-09-28 US US11/238,030 patent/US7661919B2/en not_active Expired - Fee Related
-
2006
- 2006-09-19 JP JP2008533437A patent/JP2009510776A/ja active Pending
- 2006-09-19 WO PCT/US2006/036521 patent/WO2007038096A2/en active Application Filing
- 2006-09-27 TW TW095135834A patent/TW200725789A/zh unknown
Patent Citations (4)
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JP2002532362A (ja) * | 1998-12-18 | 2002-10-02 | アシスト テクノロジーズ インコーポレイテッド | 統合イントラベイ移送・貯蔵・配送システム |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020095571A1 (ja) * | 2018-11-06 | 2020-05-14 | 村田機械株式会社 | 天井吊下棚 |
WO2020095570A1 (ja) * | 2018-11-06 | 2020-05-14 | 村田機械株式会社 | 天井搬送車 |
KR20210040126A (ko) * | 2018-11-06 | 2021-04-12 | 무라다기카이가부시끼가이샤 | 천장 반송차 |
KR20210042379A (ko) * | 2018-11-06 | 2021-04-19 | 무라다기카이가부시끼가이샤 | 천장 매달림 선반 |
CN112930312A (zh) * | 2018-11-06 | 2021-06-08 | 村田机械株式会社 | 桥式输送车 |
JPWO2020095571A1 (ja) * | 2018-11-06 | 2021-09-24 | 村田機械株式会社 | 天井吊下棚 |
JPWO2020095570A1 (ja) * | 2018-11-06 | 2021-12-02 | 村田機械株式会社 | 天井搬送車 |
JP7054460B2 (ja) | 2018-11-06 | 2022-04-14 | 村田機械株式会社 | 天井搬送車 |
JP7095750B2 (ja) | 2018-11-06 | 2022-07-05 | 村田機械株式会社 | 天井吊下棚 |
KR102441814B1 (ko) * | 2018-11-06 | 2022-09-08 | 무라다기카이가부시끼가이샤 | 천장 반송차 |
KR102480674B1 (ko) | 2018-11-06 | 2022-12-23 | 무라다기카이가부시끼가이샤 | 천장 매달림 선반 |
US11876009B2 (en) | 2018-11-06 | 2024-01-16 | Murata Machinery, Ltd. | Overhead transport vehicle |
Also Published As
Publication number | Publication date |
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US7661919B2 (en) | 2010-02-16 |
US20070081879A1 (en) | 2007-04-12 |
TW200725789A (en) | 2007-07-01 |
WO2007038096A2 (en) | 2007-04-05 |
WO2007038096A3 (en) | 2007-06-14 |
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