JP2009302190A - プリント基板および画像処理装置 - Google Patents
プリント基板および画像処理装置 Download PDFInfo
- Publication number
- JP2009302190A JP2009302190A JP2008153003A JP2008153003A JP2009302190A JP 2009302190 A JP2009302190 A JP 2009302190A JP 2008153003 A JP2008153003 A JP 2008153003A JP 2008153003 A JP2008153003 A JP 2008153003A JP 2009302190 A JP2009302190 A JP 2009302190A
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- JP
- Japan
- Prior art keywords
- capacitor
- printed circuit
- input
- control board
- output terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09336—Signal conductors in same plane as power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
電磁ノイズの輻射を抑える新たな部品を加えることなく、プリント基板上の特定の位置にコンデンサが配置されるようにして、プリント基板に接続されるワイヤーハーネスからの不要な電磁波ノイズの輻射を抑えることができるプリント基板および画像処理装置を提供する。
【解決手段】
制御基板19において、画像形成装置内の各構成部と接続されるワイヤーハーネス10のコネクタ11からの信号ラインと接地面との間に、ワイヤーハーネス10からの電磁波輻射を抑制するためのコンデンサを配置する導体パターン13を有する。
【選択図】 図3
Description
10 ワイヤーハーネス
11 コネクタ
12 スルーホール
13 導体パターン
15 コンデンサ
16 信号ライン
17 ASIC
18 プリント基板
19 制御基板
Claims (5)
- 画像形成装置内の各構成部とケーブルで接続する入出力端子を有するとともに、前記各構成部を制御する制御回路が搭載されたプリント基板であって、
前記入出力端子の近傍で、前記入出力端子からの信号ラインと接地面との間に、前記ケーブルからの電磁波輻射を抑制するためのコンデンサを配置する導体パターンを有する
プリント基板。 - 画像形成装置内の各構成部とケーブルで接続する入出力端子を有するとともに、前記各構成部を制御する制御回路が搭載されたプリント基板であって、
前記入出力端子からの信号ラインと接地面との間に、前記ケーブルからの電磁波輻射を抑制するためのコンデンサを配置する導体パターンを有し、前記信号ライン上の前記コンデンサが接続される接点と前記入出力端子との間には他の接点が存在しない
プリント基板。 - 前記導体パターン上にコンデンサが配置された
請求項1または2記載のプリント基板。 - ケーブルが接続される入出力端子を有するプリント基板であって、
前記入出力端子の近傍で、前記入出力端子からの信号ラインと接地面との間に、前記ケーブルからの電磁波輻射を抑制するためのコンデンサを配置する導体パターンを有する
プリント基板。 - ケーブルが接続される第1の入出力端子を有し、画像形成装置内の各構成部を構成するプリント基板であって、前記第1の入出力端子の近傍で、前記入出力端子からの信号ラインと接地面との間に、前記ケーブルからの電磁波輻射を抑制するためのコンデンサを配置する第1の導体パターンを有する複数の第1のプリント基板と、
前記複数の第1のプリント基板と前記ケーブルで接続される第2の入出力端子を有するとともに、前記各構成部を制御する制御回路が搭載された第2のプリント基板であって、前記第2の入出力端子の近傍で、前記第2の入出力端子からの信号ラインと接地面との間に、前記ケーブルからの電磁波輻射を抑制するためのコンデンサを配置する第2の導体パターンを有する第2の基板と
を有する画像処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008153003A JP4735670B2 (ja) | 2008-06-11 | 2008-06-11 | プリント基板および画像処理装置 |
US12/410,747 US8208271B2 (en) | 2008-06-11 | 2009-03-25 | Printed board and image formation apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008153003A JP4735670B2 (ja) | 2008-06-11 | 2008-06-11 | プリント基板および画像処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009302190A true JP2009302190A (ja) | 2009-12-24 |
JP4735670B2 JP4735670B2 (ja) | 2011-07-27 |
Family
ID=41413731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008153003A Expired - Fee Related JP4735670B2 (ja) | 2008-06-11 | 2008-06-11 | プリント基板および画像処理装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8208271B2 (ja) |
JP (1) | JP4735670B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012148008A (ja) * | 2011-01-20 | 2012-08-09 | Terumo Corp | 輸液ポンプ |
JP2018166978A (ja) * | 2017-03-30 | 2018-11-01 | 京楽産業.株式会社 | 遊技機 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5448797B2 (ja) * | 2009-12-25 | 2014-03-19 | 三菱重工業株式会社 | 制御基板、インバータ装置およびインバータ一体型電動圧縮機 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0420295A (ja) * | 1989-08-14 | 1992-01-23 | Gist Brocades Nv | ヒトインターロイキン―3の変異体 |
JP2001326432A (ja) * | 2000-05-12 | 2001-11-22 | Canon Inc | プリント配線板とケーブルの接続構造及び電子機器 |
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Cited By (2)
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JP2012148008A (ja) * | 2011-01-20 | 2012-08-09 | Terumo Corp | 輸液ポンプ |
JP2018166978A (ja) * | 2017-03-30 | 2018-11-01 | 京楽産業.株式会社 | 遊技機 |
Also Published As
Publication number | Publication date |
---|---|
JP4735670B2 (ja) | 2011-07-27 |
US8208271B2 (en) | 2012-06-26 |
US20090308648A1 (en) | 2009-12-17 |
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