JP2009272472A - Substrate storage container - Google Patents

Substrate storage container Download PDF

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JP2009272472A
JP2009272472A JP2008122055A JP2008122055A JP2009272472A JP 2009272472 A JP2009272472 A JP 2009272472A JP 2008122055 A JP2008122055 A JP 2008122055A JP 2008122055 A JP2008122055 A JP 2008122055A JP 2009272472 A JP2009272472 A JP 2009272472A
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semiconductor wafer
support
container body
substrate storage
storage container
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JP5160298B2 (en
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Satoshi Odajima
智 小田嶋
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Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
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Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate storage container such that a support piece is brought into contact with an internal area except a circumferential edge of a reverse surface of a semiconductor wafer of ≥450 mm in diameter, and no adverse influence on moldability of the support piece is exerted. <P>SOLUTION: A container body 10 which contains a plurality of semiconductor wafers 1 of ≥450 mm in diameter is molded in a front open box type whose front portion is open, and support pieces 15 for the semiconductor wafers 1 are provided on both inner sides of the container body 10 opposite each other, respectively. Notches 16 are formed at front and rear parts of each support piece 15, and each notch 16 has a support pin 17 for contacting from below provided afterward in an internal area 3 excluding the circumferential edge 2 of the reverse surface of the semiconductor wafer 1. With this configuration, the support pin 17 is suitably brought into contact with the internal area 3 excluding the circumferential edge 2 of the reverse surface of the semiconductor wafer 1. Further, the support pin 17 is provided afterward to the molded support pin 15, so that there is no hindrance to integral molding of the container body 10 and support pieces 15. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、φ４５０ｍｍ以上の半導体ウェーハを収納する基板収納容器に関するものである。   The present invention relates to a substrate storage container for storing a semiconductor wafer having a diameter of 450 mm or more.

薄く丸い半導体ウェーハは、φ２００ｍｍや３００ｍｍが主流であるが、多数のＩＣチップを得る観点からφ４５０ｍｍの開発が検討され、これに伴い、φ４５０ｍｍ用の基板収納容器についても世界中で議論され、規格化・標準化が進行しつつある。   For thin and round semiconductor wafers, φ200mm and 300mm are the mainstream. However, development of φ450mm was studied from the viewpoint of obtaining a large number of IC chips, and accordingly, substrate storage containers for φ450mm were also discussed and standardized around the world.・ Standardization is progressing.

係るφ４５０ｍｍの半導体ウェーハを収納する基板収納容器は、φ３００ｍｍの半導体ウェーハを収納するタイプ（特許文献１、２参照）に準じ、容器本体の正面部が開口したフロントオープンボックスに成形され、容器本体の内部両側には、半導体ウェーハ用の支持片が複数対設されるが、各支持片が半導体ウェーハを支持する際、半導体ウェーハ裏面の周縁部ではなく、半導体ウェーハ裏面の周縁部を除く内側領域に接触することが求められる。
特開２００６‐３２４３２７号公報 特開平０８‐７８３７１号公報 The substrate storage container for storing the φ450 mm semiconductor wafer is formed into a front open box in which the front portion of the container body is opened in accordance with the type (see Patent Documents 1 and 2) that stores the φ300 mm semiconductor wafer. A plurality of support pieces for semiconductor wafers are provided on both sides of the inside, but when each support piece supports a semiconductor wafer, it is not in the peripheral part on the back surface of the semiconductor wafer but in the inner region excluding the peripheral part on the back surface of the semiconductor wafer. Contact is required.
JP 2006-324327 A Japanese Patent Laid-Open No. 08-78371

φ４５０ｍｍの半導体ウェーハ用の基板収納容器は、以上のように、支持片に、半導体ウェーハ裏面の周縁部を除く内側領域に接触することが求められるので、φ３００ｍｍの半導体ウェーハを収納するタイプをそのまま流用することができず、何らかの解決手段が求められる。また、容器本体と支持片とは通常一体成形されるので、解決手段には、支持片の成形性に悪影響を及ぼさないこと、具体的にはアンダーカット等の問題が生じないことが望まれる。   As described above, since the substrate storage container for a φ450 mm semiconductor wafer is required to contact the inner side of the backside of the semiconductor wafer except for the peripheral portion of the semiconductor wafer, the type that stores the φ300 mm semiconductor wafer can be used as it is. It cannot be done, and some solution is required. In addition, since the container body and the support piece are usually integrally formed, it is desirable that the solution means that the formability of the support piece is not adversely affected, and specifically, problems such as undercut do not occur.

本発明は上記に鑑みなされたもので、直径が４５０ｍｍ以上の半導体ウェーハの裏面の周縁部を除く内側領域に支持片を接触させることができ、支持片が成形される場合に成形性に悪影響を及ぼすことのない基板収納容器を提供することを目的としている。   The present invention has been made in view of the above, and the support piece can be brought into contact with the inner region excluding the peripheral edge of the back surface of the semiconductor wafer having a diameter of 450 mm or more, and when the support piece is molded, the moldability is adversely affected. It aims at providing the substrate storage container which does not exert.

本発明においては上記課題を解決するため、直径が４５０ｍｍ以上の半導体ウェーハを収納する容器本体を、正面部が開口したフロントオープンボックスに構成し、この容器本体の内部両側に、半導体ウェーハ用の支持片をそれぞれ設けたものであって、
支持片に切り欠きを形成し、この切り欠きに、半導体ウェーハの裏面の周縁部を除く内側領域に接触する支持ピンを後から取り付けたことを特徴としている。 In the present invention, in order to solve the above-mentioned problems, a container main body that accommodates a semiconductor wafer having a diameter of 450 mm or more is configured as a front open box having an open front portion. Each with a piece,
A cutout is formed in the support piece, and a support pin that comes into contact with an inner region excluding the peripheral edge portion of the back surface of the semiconductor wafer is attached to the cutout later.

なお、容器本体の開口した正面部に嵌合される蓋体を備え、この蓋体の半導体ウェーハに対向する対向面に、半導体ウェーハの周縁部を接触保持するリテーナを設けることができる。
また、容器本体の内部背面に、半導体ウェーハの周縁部後端に接触する弾性片を取り付けることができる。 In addition, it is possible to provide a retainer that includes a lid fitted to the opened front portion of the container body, and that holds the peripheral edge of the semiconductor wafer in contact with the opposing surface of the lid facing the semiconductor wafer.
Moreover, the elastic piece which contacts the peripheral part rear end of a semiconductor wafer can be attached to the inner back surface of a container main body.

また、容器本体の内部両側の後方に、半導体ウェーハ用の突き当て壁を設けることができる。
また、突き当て壁の半導体ウェーハに接触する接触部には、半導体ウェーハを支持する複数の凹凸を配列することが可能である。 In addition, abutting walls for semiconductor wafers can be provided behind both sides of the inside of the container body.
Moreover, it is possible to arrange the several unevenness | corrugation which supports a semiconductor wafer in the contact part which contacts the semiconductor wafer of an abutting wall.

ここで、特許請求の範囲における半導体ウェーハは、容器本体に単数複数の必要枚数が収納される。この容器本体は、必要に応じ、透明、半透明、不透明に構成される。また、容器本体と支持片とは、樹脂を含む成形材料を用いて一体成形されるのが一般的である。弾性片は、板バネが主ではあるが、樹脂製やゴム製のリテーナ等でも良い。   Here, the required number of semiconductor wafers is stored in the container main body in the claims. The container body is configured to be transparent, translucent, or opaque as required. Further, the container body and the support piece are generally integrally molded using a molding material containing a resin. The elastic piece is mainly a leaf spring, but may be a resin or rubber retainer.

本発明によれば、直径が４５０ｍｍ以上の半導体ウェーハの裏面の周縁部を除く内側領域に、支持片の切り欠きに後付けされた支持ピンが接触することにより半導体ウェーハを支持する。   According to the present invention, the semiconductor wafer is supported by contacting the support pins retrofitted to the notches of the support piece with the inner region excluding the peripheral edge of the back surface of the semiconductor wafer having a diameter of 450 mm or more.

本発明によれば、支持片に切り欠きを形成し、この切り欠きに、半導体ウェーハの裏面の周縁部を除く内側領域に接触する支持ピンを後付けするので、直径が４５０ｍｍ以上の半導体ウェーハの裏面の周縁部を除く内側領域に支持片を接触させることができ、例え支持片が成形される場合にも、成形性に悪影響を及ぼすことが少ないという効果がある。   According to the present invention, a notch is formed in the support piece, and the support pin that comes into contact with the inner region excluding the peripheral edge of the back surface of the semiconductor wafer is retrofitted to the notch, so that the back surface of the semiconductor wafer having a diameter of 450 mm or more is provided. The support piece can be brought into contact with the inner region excluding the peripheral edge of the sheet, and even when the support piece is molded, there is an effect that the moldability is hardly adversely affected.

また、容器本体の内部背面に、半導体ウェーハの周縁部後端に接触する弾性片を取り付ければ、この弾性片により、半導体ウェーハを容器本体の正面部方向に付勢することができるので、半導体ウェーハの容器本体との接触に伴う不具合を防ぐことができる。
さらに、容器本体の内部両側の後方に、半導体ウェーハ用の突き当て壁を設ければ、半導体ウェーハと突き当て壁との接触により、半導体ウェーハの前後方向への位置ずれを抑制することができる。 In addition, if an elastic piece that contacts the rear end of the peripheral edge of the semiconductor wafer is attached to the inner back surface of the container body, the semiconductor wafer can be biased toward the front portion of the container body by the elastic piece. The trouble accompanying the contact with the container body can be prevented.
Furthermore, if a semiconductor wafer abutment wall is provided behind both sides of the inside of the container main body, positional displacement of the semiconductor wafer in the front-rear direction can be suppressed by contact between the semiconductor wafer and the abutment wall.

以下、図面を参照して本発明に係る基板収納容器の好ましい実施形態を説明すると、本実施形態における基板収納容器は、図１ないし図９に示すように、φ４５０ｍｍの半導体ウェーハ１を収納するフロントオープンボックスの容器本体１０と、この容器本体１０の開口した正面部に着脱自在に嵌合される蓋体３０とを備え、容器本体１０の内部に、半導体ウェーハ１用の支持片１５をそれぞれ対設し、各支持片１５に切り欠き１６を形成して切り欠き１６には、半導体ウェーハ１裏面の周縁部２を除く内側領域３に接触する支持ピン１７を後付けするようにしている。   Hereinafter, a preferred embodiment of a substrate storage container according to the present invention will be described with reference to the drawings. The substrate storage container in this embodiment is a front for storing a semiconductor wafer 1 having a diameter of 450 mm as shown in FIGS. An open box container main body 10 and a lid 30 that is detachably fitted to the open front portion of the container main body 10 are provided, and support pieces 15 for the semiconductor wafer 1 are respectively paired inside the container main body 10. A notch 16 is formed in each support piece 15, and a support pin 17 that comes into contact with the inner region 3 excluding the peripheral edge 2 on the back surface of the semiconductor wafer 1 is retrofitted to the notch 16.

半導体ウェーハ１は、図６や図７に示すように、例えば薄く丸いφ４５０ｍｍのシリコンタイプからなり、周縁部２に位置合わせや識別用のノッチが平面略半円形に選択的に形成される。この半導体ウェーハ１は、図示しない専用のロボットにより、容器本体１０に水平に挿入して収納されたり、取り出される。   As shown in FIGS. 6 and 7, the semiconductor wafer 1 is made of, for example, a thin and round silicon type of φ450 mm, and a notch for alignment and identification is selectively formed in a substantially semicircular plane on the peripheral edge 2. The semiconductor wafer 1 is horizontally inserted into the container body 10 and stored or taken out by a dedicated robot (not shown).

容器本体１０は、図１、図２、図６ないし図８に示すように、成形用の金型に所定の樹脂を含む成形材料が射出されることにより、２５枚の半導体ウェーハ１を上下に並べて整列収納するフロントオープンボックスタイプに射出成形され、開口した正面部に同形の蓋体３０がエンドレスのガスケットを介し着脱自在に嵌合されており、必要に応じて搬送用の嵌合保持体１１に着脱自在に嵌合される。   As shown in FIGS. 1, 2, 6 to 8, the container body 10 is formed by injecting a molding material containing a predetermined resin into a molding die so that 25 semiconductor wafers 1 are moved up and down. It is injection-molded into a front open box type that is arranged and stored side by side, and a lid 30 of the same shape is detachably fitted to the open front portion through an endless gasket. It is detachably fitted to.

容器本体１０を成形する成形材料の所定の樹脂としては、例えば力学的性質、耐熱性、寸法安定性等に優れるポリカーボネート、ポリエーテルイミド、ポリエーテルエーテルケトン、ポリブチレンテレフタレート等があげられる。これらの樹脂には、必要なカーボン、カーボン繊維、金属繊維、カーボンナノチューブ、帯電防止剤、難燃剤等が選択的に添加される。   Examples of the predetermined resin of the molding material for molding the container body 10 include polycarbonate, polyetherimide, polyetheretherketone, polybutylene terephthalate and the like which are excellent in mechanical properties, heat resistance, dimensional stability, and the like. Necessary carbon, carbon fiber, metal fiber, carbon nanotube, antistatic agent, flame retardant and the like are selectively added to these resins.

容器本体１０の内部背面の略中央には図７や図８に示すように、半導体ウェーハ１の周縁部後端に弾接する複数の板バネ１２が棒形の取付片１３を介し上下方向に並べて装着され、この可撓性を有する複数の板バネ１２が容器本体１０から蓋体３０が取り外された際に半導体ウェーハ１を容器本体１０の正面部前方に突出付勢したり、半導体ウェーハ１の容器本体１０との直接接触に伴う欠けや割れ等の不具合を防止するよう機能する。各板バネ１２は、上下方向に指向する取付片１３から水平方向に伸びる細長い線条に形成され、先端部には半導体ウェーハ１の周縁部後端を保持する保持部１４が一体形成される。   As shown in FIG. 7 and FIG. 8, a plurality of leaf springs 12 elastically contacting the rear end of the peripheral edge of the semiconductor wafer 1 are arranged in the vertical direction through rod-shaped attachment pieces 13 at the center of the inner back surface of the container body 10. When the lid 30 is removed from the container main body 10, the plurality of flexible leaf springs 12 are attached to the semiconductor wafer 1 so as to project and urge the front of the front portion of the container main body 10. It functions to prevent defects such as chipping and cracking due to direct contact with the container body 10. Each leaf spring 12 is formed in an elongated line extending in the horizontal direction from the mounting piece 13 oriented in the vertical direction, and a holding portion 14 that holds the rear end of the peripheral edge of the semiconductor wafer 1 is integrally formed at the tip.

容器本体１０の内部、具体的には相対向する内部両側には図７ないし図９に示すように、半導体ウェーハ１の周縁部側方に下方向から対向する一対の支持片１５が水平に対設され、この一対の支持片１５が容器本体１０の上下方向に間隔をおいて複数配列される。各支持片１５は、同図に示すように、内側が平面略半円弧形に湾曲した平坦な板形に形成され、内側の前後部に平面半円形あるいは半楕円形等の切り欠き１６がそれぞれ切り欠き形成される。   As shown in FIG. 7 to FIG. 9, a pair of support pieces 15 facing from the lower side to the side of the peripheral edge of the semiconductor wafer 1 are horizontally opposed to the inside of the container body 10, specifically, the opposite inner sides. A plurality of the pair of support pieces 15 are arranged at intervals in the vertical direction of the container body 10. As shown in the figure, each support piece 15 is formed in a flat plate shape whose inside is curved in a substantially semicircular arc shape, and a notch 16 such as a plane semicircular shape or a semi-elliptical shape is formed in the front and rear portions inside. Each is notched.

各切り欠き１６には、半導体ウェーハ１裏面の周縁部２を除く内側領域３に下方から点接触する支持ピン１７が所定の方法、例えば超音波融着法やカシメ等の方法により後から一体化される。各支持ピン１７は、図９に示すように、例えばポリエーテルエーテルケトン等からなる成形材料を用い、上部が丸まった短いピン形や断面略茸形に成形されており、半導体ウェーハ１の裏面に上部が点接触して半導体ウェーハ１を水平に支持するよう機能する。   In each notch 16, support pins 17 that make point contact from below on the inner region 3 excluding the peripheral edge 2 on the back surface of the semiconductor wafer 1 are integrated later by a predetermined method, for example, an ultrasonic fusion method or a caulking method. Is done. As shown in FIG. 9, each support pin 17 is formed of a molding material made of, for example, polyetheretherketone or the like, and is formed into a short pin shape with a rounded upper part or a substantially bowl-shaped cross section. The upper part functions as a point contact and supports the semiconductor wafer 1 horizontally.

容器本体１０の内部両側の後方には図７に示すように、支持片１５の後方に位置する半導体ウェーハ１用の突き当て壁１８がそれぞれ一体成形され、各突き当て壁１８の平面視で先細りの先端部が半導体ウェーハ１の周縁部側方に接触する接触部１９に形成される。この接触部１９には、半導体ウェーハ１の周縁部側方を支持する複数の凹凸２０が間隔をおいて上下方向に配列形成され、この複数の凹凸２０が半導体ウェーハ１の撓みにかかわらず、半導体ウェーハ１を確実に保持したり、半導体ウェーハ１の上下方向へのがたつきを有効に規制する。   As shown in FIG. 7, the abutting walls 18 for the semiconductor wafer 1 located behind the support pieces 15 are integrally formed on the rear sides of both sides of the container main body 10, and taper in a plan view of each abutting wall 18. Is formed at the contact portion 19 that contacts the side of the peripheral edge of the semiconductor wafer 1. In the contact portion 19, a plurality of projections and depressions 20 that support the side of the peripheral edge of the semiconductor wafer 1 are arranged in an up-down direction at intervals, and the plurality of projections and depressions 20 are formed regardless of the bending of the semiconductor wafer 1. The wafer 1 is securely held, and the rattling of the semiconductor wafer 1 in the vertical direction is effectively regulated.

複数の凹凸２０は、例えば縦一列や千鳥形等に並べられ、凹部を上下から挟む複数の凸部がブロック形、円錐台形、角錐台形、半球形、半楕球形等に形成される。また、容器本体１０の底面には、断面略Ｖ字形の位置決め具２１が間隔をおいて複数配設され、この複数の位置決め具２１が図示しない半導体加工装置の位置決めピンに上方から嵌合して容器本体１０を位置決めする。   The plurality of irregularities 20 are arranged in, for example, a vertical row or a staggered pattern, and a plurality of convex portions sandwiching the concave portions from above and below are formed in a block shape, a truncated cone shape, a truncated pyramid shape, a hemispherical shape, a semi-elliptical shape, and the like. A plurality of positioning tools 21 having a substantially V-shaped cross section are disposed on the bottom surface of the container body 10 at intervals. The plurality of positioning tools 21 are fitted to positioning pins of a semiconductor processing apparatus (not shown) from above. The container body 10 is positioned.

蓋体３０は、図１、図２、図６に示すように、容器本体１０の開口した正面部に着脱自在に嵌合される筐体３１と、この筐体３１の開口した表面を覆う表面プレート３２とを備え、筐体３１の中央部には、収納された半導体ウェーハ１の周縁部前端を接触保持するフロントリテーナ３３が設けられる。筐体３１の周縁部あるいは裏面周縁部には、容器本体１０の正面部内に圧接する弾性変形可能なガスケットが嵌合される。   As shown in FIGS. 1, 2, and 6, the lid 30 includes a housing 31 that is detachably fitted to the opened front portion of the container body 10, and a surface that covers the opened surface of the housing 31. A front retainer 33 is provided in the central portion of the housing 31 to contact and hold the front end of the peripheral edge of the stored semiconductor wafer 1. An elastically deformable gasket that is pressed into the front portion of the container main body 10 is fitted to the peripheral portion or the rear peripheral portion of the casing 31.

上記によれば、支持片１５に支持ピン１７が一体化されるので、半導体ウェーハ１裏面の内側領域３に複数の支持ピン１７を適切に接触させることができ、φ４５０ｍｍ用の基板収納容器の規格化・標準化の要件を満たすことができる。また、支持片１５と支持ピン１７とが一体成形されるのではなく、成形後の支持片１５に支持ピン１７が後から設けられるので、容器本体１０と支持片１５の成形の自由度が向上し、これらの一体成形に何ら支障を来たすことがない。   According to the above, since the support pins 17 are integrated with the support piece 15, the plurality of support pins 17 can be appropriately brought into contact with the inner region 3 on the back surface of the semiconductor wafer 1, and the standard of the substrate storage container for φ450 mm Can meet the requirements of standardization and standardization. Further, since the support piece 15 and the support pin 17 are not integrally molded, but the support pin 17 is provided on the molded support piece 15 later, the degree of freedom in molding the container body 10 and the support piece 15 is improved. However, there is no hindrance to these integral moldings.

また、支持ピン１７の後付けにより、支持ピン１７の材料選定の自由度が著しく高まり、しかも、支持ピン１７の高さを個別、かつ容易に調整してロボットの作業を円滑化することができる。さらに、左右の支持片１５の後方に突き当て壁１８がそれぞれ位置するので、簡易な構成で半導体ウェーハ１の前後方向へのがたつきや位置ずれを抑制防止することができる。   Further, the retrofit of the support pins 17 remarkably increases the degree of freedom in selecting the material of the support pins 17, and the height of the support pins 17 can be adjusted individually and easily to facilitate the work of the robot. Furthermore, since the abutting walls 18 are respectively located behind the left and right support pieces 15, it is possible to suppress and prevent rattling and displacement in the front-rear direction of the semiconductor wafer 1 with a simple configuration.

なお、上記実施形態ではφ４５０ｍｍの半導体ウェーハ１を示したが、何らこれに限定されるものではない。例えば、φ４５０ｍｍを超える大きさの半導体ウェーハ１でも良い。また、容器本体１０の天井には、搬送用の複数の螺子孔を穿孔したり、搬送用のフランジを着脱自在に取り付けても良い。また、内側が平面略半円弧形の支持片１５を示したが、支持片１５を平面視で略雲形定規形等に形成しても良い。さらに、蓋体３０には、容器本体１０に嵌合した蓋体３０を施錠する外部操作可能な施錠機構を内蔵することができる。   Although the semiconductor wafer 1 having a diameter of 450 mm is shown in the above embodiment, the present invention is not limited to this. For example, the semiconductor wafer 1 having a size exceeding φ450 mm may be used. Further, a plurality of screw holes for conveyance may be drilled in the ceiling of the container body 10 or a flange for conveyance may be detachably attached. In addition, although the support piece 15 having a substantially semicircular arc shape on the inside is shown, the support piece 15 may be formed in a substantially cloud-shaped ruler shape or the like in plan view. Further, the lid 30 can incorporate a locking mechanism that can be externally operated to lock the lid 30 fitted to the container body 10.

本発明に係る基板収納容器の実施形態を模式的に示す全体斜視説明図である。It is a whole perspective explanatory view showing typically an embodiment of a substrate storage container concerning the present invention. 本発明に係る基板収納容器の実施形態を模式的に示す正面説明図である。It is front explanatory drawing which shows typically embodiment of the substrate storage container which concerns on this invention. 本発明に係る基板収納容器の実施形態を模式的に示す側面説明図である。It is side explanatory drawing which shows typically embodiment of the board | substrate storage container which concerns on this invention. 本発明に係る基板収納容器の実施形態を模式的に示す背面説明図である。It is back explanatory drawing which shows typically embodiment of the board | substrate storage container which concerns on this invention. 本発明に係る基板収納容器の実施形態を模式的に示す底面説明図である。It is bottom explanatory drawing which shows typically embodiment of the substrate storage container which concerns on this invention. 本発明に係る基板収納容器の実施形態を模式的に示す断面説明図である。It is a section explanatory view showing typically an embodiment of a substrate storage container concerning the present invention. 本発明に係る基板収納容器の実施形態における容器本体を模式的に示す断面平面図である。It is a section top view showing typically a container main part in an embodiment of a substrate storage container concerning the present invention. 本発明に係る基板収納容器の実施形態における容器本体を模式的に示す正面説明図である。It is front explanatory drawing which shows typically the container main body in embodiment of the substrate storage container which concerns on this invention. 本発明に係る基板収納容器の実施形態を模式的に示す要部説明図である。It is principal part explanatory drawing which shows typically embodiment of the board | substrate storage container which concerns on this invention.

符号の説明Explanation of symbols

１ 半導体ウェーハ
２ 周縁部
３ 内側領域
１０ 容器本体
１２ 板バネ（弾性片）
１５ 支持片
１６ 切り欠き
１７ 支持ピン
１８ 突き当て壁
１９ 接触部
２０ 凹凸
３０ 蓋体
３３ フロントリテーナ DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 2 Peripheral part 3 Inner area | region 10 Container main body 12 Leaf spring (elastic piece)
15 Supporting piece 16 Notch 17 Supporting pin 18 Abutting wall 19 Contact part 20 Concavity and convexity 30 Lid 33 Front retainer

Claims (3)

直径が４５０ｍｍ以上の半導体ウェーハを収納する容器本体を、正面部が開口したフロントオープンボックスに構成し、この容器本体の内部両側に、半導体ウェーハ用の支持片をそれぞれ設けた基板収納容器であって、
支持片に切り欠きを形成し、この切り欠きに、半導体ウェーハの裏面の周縁部を除く内側領域に接触する支持ピンを後から取り付けたことを特徴とする基板収納容器。 A substrate storage container in which a container body for storing a semiconductor wafer having a diameter of 450 mm or more is configured as a front open box having an open front portion, and support pieces for semiconductor wafers are provided on both sides of the container body. ,
A substrate storage container, wherein a notch is formed in a support piece, and a support pin that comes into contact with an inner region excluding the peripheral edge of the back surface of the semiconductor wafer is attached to the notch. 容器本体の内部背面に、半導体ウェーハの周縁部後端に接触する弾性片を取り付けた請求項１記載の基板収納容器。   The substrate storage container according to claim 1, wherein an elastic piece that contacts the rear end of the peripheral edge of the semiconductor wafer is attached to the inner back surface of the container body. 容器本体の内部両側の後方に、半導体ウェーハ用の突き当て壁を設けた請求項１又は２記載の基板収納容器。   The substrate storage container according to claim 1 or 2, wherein abutting walls for semiconductor wafers are provided behind both sides of the inside of the container body.
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JPH0662542U (en) * 1993-01-29 1994-09-02 信越半導体株式会社 Waha cassette
JPH07263520A (en) * 1994-03-17 1995-10-13 Dainippon Screen Mfg Co Ltd Apparatus for conveying/accomodating substrate
JPH0817753A (en) * 1994-06-28 1996-01-19 Tokyo Electron Ltd Mounting jig for heat treatment of semiconductor wafer, and its heat treatment equipment
JPH0992702A (en) * 1995-09-27 1997-04-04 Dainippon Screen Mfg Co Ltd Substrate cassette, interface mechanism and substrate processing system
JP2000091409A (en) * 1998-09-08 2000-03-31 Shin Etsu Polymer Co Ltd Precise-substrate housing container and method for assembling the same
JP2002353301A (en) * 2001-05-30 2002-12-06 Shin Etsu Polymer Co Ltd Vessel for storing precision substrate and its presser member
JP2006324327A (en) * 2005-05-17 2006-11-30 Shin Etsu Polymer Co Ltd Substrate accommodating container and its manufacturing method
JP2006332261A (en) * 2005-05-25 2006-12-07 Shin Etsu Polymer Co Ltd Substrate storage container
JP2007220823A (en) * 2006-02-15 2007-08-30 Miraial Kk Thin plate container

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06216229A (en) * 1993-01-18 1994-08-05 Hitachi Ltd Wafer carrier
JPH0662542U (en) * 1993-01-29 1994-09-02 信越半導体株式会社 Waha cassette
JPH07263520A (en) * 1994-03-17 1995-10-13 Dainippon Screen Mfg Co Ltd Apparatus for conveying/accomodating substrate
JPH0817753A (en) * 1994-06-28 1996-01-19 Tokyo Electron Ltd Mounting jig for heat treatment of semiconductor wafer, and its heat treatment equipment
JPH0992702A (en) * 1995-09-27 1997-04-04 Dainippon Screen Mfg Co Ltd Substrate cassette, interface mechanism and substrate processing system
JP2000091409A (en) * 1998-09-08 2000-03-31 Shin Etsu Polymer Co Ltd Precise-substrate housing container and method for assembling the same
JP2002353301A (en) * 2001-05-30 2002-12-06 Shin Etsu Polymer Co Ltd Vessel for storing precision substrate and its presser member
JP2006324327A (en) * 2005-05-17 2006-11-30 Shin Etsu Polymer Co Ltd Substrate accommodating container and its manufacturing method
JP2006332261A (en) * 2005-05-25 2006-12-07 Shin Etsu Polymer Co Ltd Substrate storage container
JP2007220823A (en) * 2006-02-15 2007-08-30 Miraial Kk Thin plate container

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