JP2009260234A - 波長変換部材およびその製造方法 - Google Patents
波長変換部材およびその製造方法 Download PDFInfo
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Classifications
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C12/00—Powdered glass; Bead compositions
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/06—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B32/00—Thermal after-treatment of glass products not provided for in groups C03B19/00, C03B25/00 - C03B31/00 or C03B37/00, e.g. crystallisation, eliminating gas inclusions or other impurities; Hot-pressing vitrified, non-porous, shaped glass products
- C03B32/005—Hot-pressing vitrified, non-porous, shaped glass products
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/006—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of microcrystallites, e.g. of optically or electrically active material
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- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/16—Silica-free oxide glass compositions containing phosphorus
- C03C3/19—Silica-free oxide glass compositions containing phosphorus containing boron
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
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- C03B2201/70—Silica-free oxide glasses containing phosphorus
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
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- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
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Abstract
【解決手段】ガラス粉末と無機蛍光体粉末を含む混合粉末からなる予備成型体を加熱処理して粉末焼結物を得る工程、および、金型を用いて粉末焼結物をリプレス成型する工程を含む波長変換部材の製造方法。
【選択図】図4
Description
モル%で、SnO 62%、P2O5 22%、B2O3 11%、Al2O3 2%、MgO 3%の組成になるようバッチを作製し、1000℃で2時間のガラス溶融を行った。得られた溶融ガラスを、一部はロール成形によりフィルム状に成形し、残りはカーボン枠内に流し出しブロック状の塊を得た。
予備成型体の加熱処理(焼結)雰囲気を大気中に変更した以外は、実施例1と同様の方法にて波長変換部材を作製し、全光束値を測定した。結果を表2に示す。
金型の平均表面粗さRaを0.65μmに変更した以外は、実施例1と同様の方法にて波長変換部材を作製し、全光束値を測定した。結果を表2に示す。
金型の材質を熱膨張係数が40×10−7/℃のタングステンカーバイト製に変更した以外は、実施例1と同様の方法にて波長変換部材を作製し、全光束値を測定した。結果を表2に示す。なお、本実施例では、リプレス成型後、波長変換部材が金型に密着して取り外すことが困難であった。
実施例1で得られた波長変換部材の凹形状部に、波長変換部材に用いたガラス粉末より軟化点の低い低融点ガラスブロックを設置し、軟化点付近で軟化変形させ、波長変換部材と密着させた。ついで、当該波長変換部材を励起用青色LED(20mA駆動)上に接着し、LEDデバイスを作製した。得られたLEDデバイスについて、実施例1と同様の方法により、全光束値を測定した。結果を表2に示す。
実施例1で得られた波長変換部材の凹形状部に何も充填せずに励起用青色LED(20mA駆動)上に接着し、LEDデバイスを作製した。得られたLEDデバイスについて、実施例1と同様の方法により、全光束値を測定した。結果を表2に示す。
実施例1におけるリプレス前駆体をダイヤモンドスラリー(粒径3μm)を用いて表面を研磨した。研磨後のリプレス前駆体の厚さは1.00mmであった。その後、精密ガラスプレス装置を用いて、窒素雰囲気下にて360℃で板状にリプレス成型を行い、厚さ0.8mmの波長変換部材を得た。得られた波長変換部材には深さ0.1mm以上の凹形状部は存在していなかった。なお、金型はステンレス製で熱膨張係数が120×10−7/℃、平均表面粗さRaが0.02μmのものを用いた。
実施例1における粉末焼結物をダイヤモンドスラリー(粒径3μm)を用いて鏡面に研磨し、厚さ0.8mmの板状の波長変換部材を得た。
リプレス成型後の波長変換部材の表面に対して、2%硫酸水溶液により1分間エッチング処理を施した以外は、実施例1と同様の方法にて波長変換部材を作製した。得られた波長変換部材の全光束値を測定したところ、1.93lmであった。
1’ 凹形状部
2 透明樹脂または低融点ガラス
3 LEDチップ
4 LED基板
D 線状溝の深さ
d 凹形状部の深さ
Claims (22)
- ガラス粉末と無機蛍光体粉末を含む混合粉末からなる予備成型体を加熱処理して粉末焼結物を得る工程、および、金型を用いて粉末焼結物をリプレス成型する工程を含む波長変換部材の製造方法。
- 600℃以下でリプレス成型することを特徴とする請求項1に記載の波長変換部材の製造方法。
- リプレス成型を中性雰囲気または還元雰囲気下で行うことを特徴とする請求項1または2に記載の波長変換部材の製造方法。
- 金型の平均表面粗さRaが0.5μm以下であることを特徴とする請求項1〜3のいずれかに記載の波長変換部材の製造方法。
- 金型と粉末焼結物の熱膨張係数差が50×10−7/℃以下であることを特徴とする請求項1〜4のいずれかに記載の波長変換部材の製造方法。
- 予備成型体に対する加熱処理を1気圧未満の減圧雰囲気下で行うことを特徴とする請求項1〜5のいずれかに記載の波長変換部材の製造方法。
- 予備成型体に対する加熱処理を600℃以下で行うことを特徴とする請求項1〜6のいずれかに記載の波長変換部材の製造方法。
- 請求項1〜7のいずれかに記載の方法により製造されてなる波長変換部材。
- ガラス粉末と無機蛍光体粉末を含む混合粉末の粉末焼結物のリプレス成型体からなる波長変換部材
- 表面に存在する長さ30μm以上かつ深さ0.05μm以上の線状溝が、1辺0.5mmの正方形あたり平均100本以下であることを特徴とする請求項9に記載の波長変換部材。
- 波長550nm、厚さ1mmにおける全光線透過率が10%以上であることを特徴とする請求項9または10に記載の波長変換部材。
- 表面に深さ0.1mm以上の凹形状部を有することを特徴とする請求項9〜11のいずれかに記載の波長変換部材。
- 凹形状部に透明樹脂または低融点ガラスが充填されてなることを特徴とする請求項12に記載の波長変換部材。
- 透明樹脂および低融点ガラスの屈折率ndが1.4〜2.0であることを特徴とする請求項13に記載の波長変換部材。
- 透明樹脂がシリコーン樹脂であることを特徴とする請求項13または14に記載の波長変換部材。
- ガラス粉末の屈折率ndと透明樹脂または低融点ガラスの屈折率ndの差が0.7以下であることを特徴とする請求項13〜15のいずれかに記載の波長変換部材。
- ガラス粉末の屈折率ndが1.5〜2.1であることを特徴とする請求項9〜16のいずれかに記載の波長変換部材。
- ガラス粉末の軟化点が600℃以下であることを特徴とする請求項9〜17のいずれかに記載の波長変換部材。
- ガラス粉末がSnO−P2O5−B2O3系ガラスであることを特徴とする請求項9〜18のいずれかに記載の波長変換部材。
- ガラス粉末が、モル%で、SnO 35〜80%、P2O5 5〜40%、B2O3 1〜30%の組成を含有することを特徴とする請求項19に記載の波長変換部材。
- ガラス粉末が、モル%で、さらにAl2O3 0〜10%、SiO2 0〜10%、Li2O 0〜10%、Na2O 0〜10%、K2O 0〜10%、Li2O+Na2O+K2O 0〜10%、MgO 0〜10%、CaO 0〜10%、SrO 0〜10%、BaO 0〜10%、MgO+CaO+SrO+BaO 0〜10%の組成を含有することを特徴とする請求項20に記載の波長変換部材。
- 請求項9〜21のいずれかに記載の波長変換部材を備えてなるLEDデバイス。
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US8344404B2 (en) | 2013-01-01 |
EP2264790A1 (en) | 2010-12-22 |
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