JP2009235352A5 - - Google Patents

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JP2009235352A5
JP2009235352A5 JP2008086788A JP2008086788A JP2009235352A5 JP 2009235352 A5 JP2009235352 A5 JP 2009235352A5 JP 2008086788 A JP2008086788 A JP 2008086788A JP 2008086788 A JP2008086788 A JP 2008086788A JP 2009235352 A5 JP2009235352 A5 JP 2009235352A5
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polyamide resin
resin composition
composition according
ppm
weight
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JP2008086788A
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JP5309649B2 (en
JP2009235352A (en
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Claims (11)

ペンタメチレンジアミンとジカルボン酸とを主な単量体成分として用いる重縮合反応により得られるポリアミド樹脂とハロゲン化第一銅とを含み、当該単量体成分中の硫黄の合計含有量が１．２重量ｐｐｍ以下であることを特徴とするポリアミド樹脂組成物。   A polyamide resin obtained by a polycondensation reaction using pentamethylenediamine and dicarboxylic acid as main monomer components and cuprous halide are included, and the total content of sulfur in the monomer components is 1.2. A polyamide resin composition having a weight ppm or less. 前記単量体成分中のアミノ酸の合計含有量が１００重量ｐｐｍ以下であることを特徴とする請求項１に記載のポリアミド樹脂組成物。 2. The polyamide resin composition according to claim 1, wherein the total content of amino acids in the monomer component is 100 ppm by weight or less. 前記単量体成分中のメチオニンの合計含有量が５重量ｐｐｍ以下であることを特徴とする請求項１又は２に記載のポリアミド樹脂組成物。 3. The polyamide resin composition according to claim 1, wherein a total content of methionine in the monomer component is 5 ppm by weight or less. 前記単量体成分の一つであるジカルボン酸が、アジピン酸であることを特徴とする請求項１乃至３のいずれか１項に記載のポリアミド樹脂組成物。 The polyamide resin composition according to any one of claims 1 to 3, wherein the dicarboxylic acid that is one of the monomer components is adipic acid. 前記単量体成分の一つであるペンタメチレンジアミンは、リジン脱炭酸酵素、リジン脱炭酸酵素活性の向上した組み換え微生物又はリジン脱炭酸酵素を産生する細胞または当該細胞の処理物を使用し、リジンから産出されたものであることを特徴とする請求項１乃至４のいずれか１項に記載のポリアミド樹脂組成物。 The pentamethylene diamine, which is one of the monomer components, using lysine decarboxylase, treatment of cells or the cells producing the recombinant microorganism or lysine decarboxylase improved lysine decarboxylase activity, lysine The polyamide resin composition according to any one of claims 1 to 4, wherein the polyamide resin composition is produced from 前記リジンは、グルコースを発酵させて得られたものであることを特徴とする請求項５に記載のポリアミド樹脂組成物。 The polyamide resin composition according to claim 5, wherein the lysine is obtained by fermenting glucose. ハロゲン化第一銅に由来する銅の含有量が５重量ｐｐｍ〜５００重量ｐｐｍであることを特徴とする請求項１乃至６のいずれか１項に記載のポリアミド樹脂組成物。   The polyamide resin composition according to any one of claims 1 to 6, wherein the content of copper derived from cuprous halide is 5 ppm by weight to 500 ppm by weight. ハロゲン化第一銅に由来する銅の含有量と前記単量体成分中の硫黄の含有量との比（銅含有量／硫黄含有量）が３０を超えることを特徴とする請求項１乃至７のいずれか１項に記載のポリアミド樹脂組成物。 It claims 1 to 7 ratio of content of copper from a cuprous halide and the content of sulfur in the monomer component (copper content / sulfur content) is equal to or greater than 30 The polyamide resin composition according to any one of the above. ポリアミド樹脂を得る重縮合反応の重縮合触媒として燐含有化合物を用い、且つ当該燐含有化合物に由来する燐の含有量が１重量ｐｐｍ〜９０重量ｐｐｍであることを特徴とする請求項１乃至８のいずれか１項に記載のポリアミド樹脂組成物。 Using phosphorus-containing compound as a polycondensation catalyst for polycondensation reaction to obtain a polyamide resin, and 1 to claim, wherein the amount of phosphorus derived from those phosphorescent-containing compound is 1 wt ppm~90 wt ppm 9. The polyamide resin composition according to any one of 8 above. 請求項１乃至９のいずれか１項に記載のポリアミド樹脂組成物において当該ポリアミド樹脂組成物のポリアミド樹脂１００重量部に対し、強化材５重量部〜１５０重量部をさらに含むことを特徴とするポリアミド樹脂組成物。   The polyamide resin composition according to any one of claims 1 to 9, further comprising 5 to 150 parts by weight of a reinforcing material with respect to 100 parts by weight of the polyamide resin of the polyamide resin composition. Resin composition. 前記強化材が、ガラス繊維であることを特徴とする請求項１０に記載のポリアミド樹脂組成物。   The polyamide resin composition according to claim 10, wherein the reinforcing material is glass fiber.
JP2008086788A 2008-03-28 2008-03-28 Method for producing pentamethylenediamine dicarboxylate Active JP5309649B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008086788A JP5309649B2 (en) 2008-03-28 2008-03-28 Method for producing pentamethylenediamine dicarboxylate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008086788A JP5309649B2 (en) 2008-03-28 2008-03-28 Method for producing pentamethylenediamine dicarboxylate

Publications (3)

Publication Number Publication Date
JP2009235352A JP2009235352A (en) 2009-10-15
JP2009235352A5 true JP2009235352A5 (en) 2011-03-10
JP5309649B2 JP5309649B2 (en) 2013-10-09

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Family Applications (1)

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JP2008086788A Active JP5309649B2 (en) 2008-03-28 2008-03-28 Method for producing pentamethylenediamine dicarboxylate

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JP (1) JP5309649B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6322663B2 (en) 2016-03-28 2018-05-09 株式会社Ｓｕｂａｒｕ Bonding structure of molded resin composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4165106B2 (en) * 2002-04-04 2008-10-15 東レ株式会社 Polypentamethylene adipamide resin and process for producing the same
JP4305011B2 (en) * 2003-03-07 2009-07-29 東レ株式会社 Welded joint members and molded products
JP4595668B2 (en) * 2004-05-21 2010-12-08 三菱化学株式会社 Polyamide resin
JP4621648B2 (en) * 2005-11-15 2011-01-26 旭化成ケミカルズ株式会社 Heat resistant resin composition
JP5282371B2 (en) * 2006-05-16 2013-09-04 三菱化学株式会社 Copolymer polyamide resin
JP5644037B2 (en) * 2008-02-14 2014-12-24 三菱化学株式会社 Polyamide resin composition

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