JP2010248402A5 - - Google Patents

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Publication number
JP2010248402A5
JP2010248402A5 JP2009100678A JP2009100678A JP2010248402A5 JP 2010248402 A5 JP2010248402 A5 JP 2010248402A5 JP 2009100678 A JP2009100678 A JP 2009100678A JP 2009100678 A JP2009100678 A JP 2009100678A JP 2010248402 A5 JP2010248402 A5 JP 2010248402A5
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Prior art keywords
polyamide
component
resin composition
polyamide resin
mass
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JP2009100678A
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Japanese (ja)
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JP2010248402A (en
JP5400456B2 (en
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Priority to JP2009100678A priority Critical patent/JP5400456B2/en
Priority claimed from JP2009100678A external-priority patent/JP5400456B2/en
Publication of JP2010248402A publication Critical patent/JP2010248402A/en
Publication of JP2010248402A5 publication Critical patent/JP2010248402A5/ja
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Publication of JP5400456B2 publication Critical patent/JP5400456B2/en
Expired - Fee Related legal-status Critical Current
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Claims (9)

(A)ヘキサメチレンジアミンとアジピン酸から得られるヘキサメチレンアジパミド単位(N66)70〜85質量%と、ヘキサメチレンジアミンとイソフタル酸から得られるヘキサメチレンイソフタルアミド単位(N6I)15〜30質量%と、からなる、共重合ポリアミド樹脂と、
(B)含有する窒素原子数に対する炭素原子数の比(C/N)が7以上12以下であり、アミノカルボン酸及び/又はジアミンとジカルボン酸の組み合わせから得られる、脂肪族ポリアミド樹脂と、
(C)ガラス繊維と、を含み、
前記(A)成分と前記(B)成分の質量比(A/B)が40/60〜60/40であり、
前記(A)成分と前記(B)成分との合計100質量部に対して、前記(C)成分20〜250質量部を含む、ポリアミド樹脂組成物。
(A) Hexamethylene adipamide unit (N66) obtained from hexamethylene diamine and adipic acid (N66) 70 to 85% by mass, Hexamethylene isophthalamide unit (N6I) obtained from hexamethylene diamine and isophthalic acid 15 to 30% by mass A copolymerized polyamide resin comprising:
(B) the ratio of the number of carbon atoms to the number of nitrogen atoms contained (C / N) is 7 or more and 12 or less, and an aliphatic polyamide resin obtained from a combination of aminocarboxylic acid and / or diamine and dicarboxylic acid;
(C) glass fiber,
The mass ratio (A / B) of the component (A) and the component (B) is 40/60 to 60/40,
A polyamide resin composition comprising 20 to 250 parts by mass of the component (C) with respect to 100 parts by mass in total of the component (A) and the component (B).
JIS K 6810に準じた98%硫酸中濃度1%、25℃で測定された、前記(B)成分の相対粘度(ηr)が、2.0〜2.5である、請求項1に記載のポリアミド樹脂組成物。   The relative viscosity (ηr) of the component (B) measured at 25 ° C. in 98% sulfuric acid concentration 1% according to JIS K 6810 is 2.0 to 2.5. Polyamide resin composition. 前記(B)成分が、ポリアミド610、ポリアミド612、ポリアミド11、ポリアミド12、これらのうち少なくとも2種類の異なったポリアミド形成成分を含むポリアミド共重合体、又はこれらの混合物である、請求項1又は2に記載のポリアミド樹脂組成物。The component (B) is polyamide 610, polyamide 612, polyamide 11, polyamide 12, a polyamide copolymer containing at least two different polyamide forming components, or a mixture thereof. The polyamide resin composition described in 1. 前記(B)成分が、ポリアミド612、又はポリアミド12である、請求項1又は2に記載のポリアミド樹脂組成物。The polyamide resin composition according to claim 1 or 2, wherein the component (B) is polyamide 612 or polyamide 12. 前記(B)成分が、ポリアミド612である、請求項1又は2に記載のポリアミド樹脂組成物。   The polyamide resin composition according to claim 1 or 2, wherein the component (B) is polyamide 612. (D)前記(A)成分と前記(B)成分からなる3元共重合体を、更に含む、請求項1〜のいずれか一項に記載のポリアミド樹脂組成物。 (D) wherein (A) said its component terpolymer comprising the component (B), further comprising, a polyamide resin composition according to any one of claims 1-5. 前記(B)成分が、ポリアミド612であり、
前記(D)成分が、N66単位、N6I単位及びポリアミド612単位からなる3元共重合体である、請求項に記載のポリアミド樹脂組成物。
The component (B) is polyamide 612,
The polyamide resin composition according to claim 6 , wherein the component (D) is a terpolymer comprising N66 units, N6I units and polyamide 612 units.
硫化亜鉛を、更に含む、請求項1〜のいずれか一項に記載のポリアミド樹脂組成物。 The polyamide resin composition according to any one of claims 1 to 7 , further comprising zinc sulfide. 請求項1〜のいずれか一項に記載のポリアミド樹脂組成物からなる成型体。 The molded object which consists of a polyamide resin composition as described in any one of Claims 1-8 .
JP2009100678A 2009-04-17 2009-04-17 Polyamide resin composition and molded body comprising the same Expired - Fee Related JP5400456B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009100678A JP5400456B2 (en) 2009-04-17 2009-04-17 Polyamide resin composition and molded body comprising the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009100678A JP5400456B2 (en) 2009-04-17 2009-04-17 Polyamide resin composition and molded body comprising the same

Publications (3)

Publication Number Publication Date
JP2010248402A JP2010248402A (en) 2010-11-04
JP2010248402A5 true JP2010248402A5 (en) 2012-02-02
JP5400456B2 JP5400456B2 (en) 2014-01-29

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Family Applications (1)

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JP2009100678A Expired - Fee Related JP5400456B2 (en) 2009-04-17 2009-04-17 Polyamide resin composition and molded body comprising the same

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5400457B2 (en) * 2009-04-17 2014-01-29 旭化成ケミカルズ株式会社 Polyamide resin composition and molded body
CN102933638B (en) * 2010-06-11 2015-06-24 旭化成化学株式会社 Polyamide and polyamide composition
JP6050937B2 (en) * 2011-12-08 2016-12-21 旭化成株式会社 Polyamide resin composition and molded product
JP2014019791A (en) * 2012-07-18 2014-02-03 Asahi Kasei Chemicals Corp Plastic hook compact comprising polyamide resin composition
EP3006507B1 (en) * 2014-10-10 2018-12-19 Ems-Patent Ag Reinforced polyamide moulding material and injection moulding parts made from the same
CN114773841A (en) 2017-03-30 2022-07-22 旭化成株式会社 Polyamide composition and molded article
JP6937226B2 (en) * 2017-11-13 2021-09-22 旭化成株式会社 Polyamide composition and molded product

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3175889B2 (en) * 1993-06-21 2001-06-11 旭化成株式会社 Polyamide resin composition and insulating material for slide switch comprising the same
JP3155648B2 (en) * 1993-06-30 2001-04-16 旭化成株式会社 Polyamide resin composition
JP4140995B2 (en) * 1997-10-28 2008-08-27 旭化成ケミカルズ株式会社 Polyamide resin composition
JP4278223B2 (en) * 1999-03-24 2009-06-10 旭化成ケミカルズ株式会社 Black colored polyamide resin composition
JP4265835B2 (en) * 1999-03-24 2009-05-20 旭化成ケミカルズ株式会社 Black colored polyamide resin composition
JP4236063B2 (en) * 1999-03-24 2009-03-11 旭化成ケミカルズ株式会社 Polyamide resin composition and injection molded article
JP4868699B2 (en) * 2003-05-23 2012-02-01 三菱エンジニアリングプラスチックス株式会社 Thermoplastic polyamide resin composition
DE102004048876A1 (en) * 2004-09-13 2006-03-30 Bayer Ag Halogen-free flame-retardant thermoplastic molding compounds based on polyamide with increased glow wire resistance
JP4949913B2 (en) * 2007-04-12 2012-06-13 旭化成ケミカルズ株式会社 Long glass fiber reinforced polyamide resin pellets and molded articles thereof

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