JP2009026817A - Pad structure of wiring board, wiring board, and attaching structure of electrode portion - Google Patents

Pad structure of wiring board, wiring board, and attaching structure of electrode portion Download PDF

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JP2009026817A
JP2009026817A JP2007185970A JP2007185970A JP2009026817A JP 2009026817 A JP2009026817 A JP 2009026817A JP 2007185970 A JP2007185970 A JP 2007185970A JP 2007185970 A JP2007185970 A JP 2007185970A JP 2009026817 A JP2009026817 A JP 2009026817A
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wiring board
electrode
solder
pad
electronic component
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Hiroe Suzuki
浩江 鈴木
Takayuki Arafuka
貴幸 荒深
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Yazaki Corp
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Yazaki Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a pad structure of a wiring board whereby such proper soldering of an electronic component as to correspond to its external shape can be performed. <P>SOLUTION: In the pad structure, a connective pad 11 provided in a printed wiring board 1 is so formed for the right-edge portion of its top surface as to become a placing surface 13 whereon an electrode portion 21 of an electronic component 2. The placing surface 13 has the form of a flat surface whose area is nearly equal to the one the electrode portion 21, and is extended from the right edge of the connective pad 11 to its left-edge side. In the vicinity of the left-edge portion of the connective pad 11, two punch-through portions 14 so formed that any metal foil is not formed or is not left therein when forming the connective pad 11 are provided. Further, the peripheral portion of the left side of the electrode portion 21 and 22 whose left side-surface rises from the placing surface 13 is separated by a predetermined distance from the right-side edge portion of the punch-through portion 14. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、実装部品を搭載するプリント配線基板等の配線基板のパッド構造、及び該パッド構造を備える配線基板並びに電極部の取付構造に関する。   The present invention relates to a pad structure of a wiring board such as a printed wiring board on which a mounting component is mounted, a wiring board having the pad structure, and an electrode part mounting structure.

従来、電子部品は、半田ペーストが印刷されたパッドに電子部品の電極部を載置し、パッド上の半田ペーストを溶融させて半田付けすることにより、配線基板に実装されている。電子部品には厚さ寸法が異なるものがあるが、一般的に、半田ペーストは電子部品の厚さに関わらず一様の厚さでパッドに印刷される。このため、厚みのある電子部品では、十分な接続強度を得られる厚さの半田フィレットを、パッドの接続領域と電子部品との接続部に形成できなくなることがある。   Conventionally, an electronic component is mounted on a wiring board by placing an electrode portion of the electronic component on a pad on which a solder paste is printed, and melting and soldering the solder paste on the pad. Although some electronic components have different thickness dimensions, generally, the solder paste is printed on the pad with a uniform thickness regardless of the thickness of the electronic component. For this reason, in a thick electronic component, it may be impossible to form a solder fillet having a thickness sufficient to obtain sufficient connection strength at the connection portion between the pad connection region and the electronic component.

このような課題を解決するために、下記の特許文献１には、プリント配線基板の部品搭載用電極が開示されている。この部品搭載用電極では、中央部が中空にされたクリーム半田供給用領域が、電子部品が備える外部端子の搭載領域と一体となって設けられている。外部端子の半田付けの際には、クリーム半田供給用領域の中空部上で溶融した半田が、外部端子と搭載領域との接続部で溶融した半田に吸い寄せられて供給される。このため、外部端子と搭載領域との接続に、多くの半田を用いることができる。   In order to solve such problems, the following Patent Document 1 discloses a component mounting electrode of a printed wiring board. In this component mounting electrode, a cream solder supply region having a hollow central portion is provided integrally with a mounting region of an external terminal included in the electronic component. When soldering the external terminal, the molten solder on the cream solder supply region hollow portion is sucked and supplied to the molten solder at the connection portion between the external terminal and the mounting region. For this reason, a lot of solder can be used for the connection between the external terminal and the mounting area.

特開２００３−４５５５０号公報JP 2003-45550 A

しかしながら、上記従来の部品搭載用電極では、パッドの形成面積が制限されてクリーム半田供給用領域の中空部の面積を十分に採れないときには、十分な厚さを有する半田フィレットを形成できない虞があった。また、中空部上で溶融した半田を外部端子と搭載領域との接続部に吸い寄せて、外部端子とパッドとの接続に用いる半田の量を増やすだけでは、電子部品には様々な外形を有したものがあることから、半田フィレットを適切な形状に形成できずに、十分な接続強度を得られない虞があった。   However, in the conventional component mounting electrode, if the pad formation area is limited and the area of the hollow portion of the cream solder supply area cannot be sufficiently taken, there is a possibility that a solder fillet having a sufficient thickness cannot be formed. It was. Moreover, the electronic component has various external shapes only by sucking the molten solder on the hollow portion to the connection portion between the external terminal and the mounting area and increasing the amount of solder used for connecting the external terminal and the pad. Since there is a thing, there exists a possibility that a solder fillet cannot be formed in an appropriate shape and sufficient connection strength cannot be obtained.

本発明は、上記した点に鑑み、電子部品の外形に応じた適切な半田付けを行うことのできる配線基板のパッド構造、配線基板、及び電極部の取付構造を提供することを目的とする。   In view of the above, the present invention has an object to provide a pad structure of a wiring board, a wiring board, and an electrode part mounting structure capable of performing appropriate soldering according to the outer shape of the electronic component.

この欄の記載は特許請求の範囲の記載に応じて変更されます。
このような目的を達成するために、本発明の配線基板のパッド構造は、実装部品の備える電極部が半田付けされる、配線基板のパッド構造であって、半田付け用の金属箔を備えていない抜き部を、前記電極部が載置される載置面から所定距離離れた位置に、前記載置面の周縁に沿って延設したことを特徴とする。
また、本発明の配線基板のパッド構造は、前記抜き部は、前記電極部の厚さＨに対して、前記載置面の周縁から前記載置面の外側に向けて距離Ｋ＝Ｈｔａｎ２５°〜Ｈｔａｎ４５°の範囲の中の何れかの距離だけ離れた位置に、前記載置面側の縁部を位置させていることを特徴とする。
また、本発明の配線基板のパッド構造は、前記抜き部を、前記載置面の周縁に沿って複数設けたことを特徴とする。
また、本発明の配線基板は、上記配線基板のパッド構造を備えたことを特徴とする。
また、本発明の電極部の取付構造は、上記配線基板のパッド構造を用いて、実装部品の電極部を配線基板に半田付けして取り付けた電極部の取付構造であって、前記電極部を前記配線基板に接続した半田フィレットの表面が、前記電極部の載置面に垂直な方向に対して２５°〜４５°の何れかの角度で、前記電極部の上端部から前記抜き部側に向けて下降傾斜していることを特徴とする。 The description in this column will be changed according to the claims.
In order to achieve such an object, the pad structure of the wiring board according to the present invention is a pad structure of the wiring board in which the electrode part included in the mounting component is soldered, and includes a metal foil for soldering. The non-extracted portion is characterized by extending along the periphery of the mounting surface at a position away from the mounting surface on which the electrode unit is mounted by a predetermined distance.
Further, in the pad structure of the wiring board according to the present invention, with respect to the thickness H of the electrode portion, the punched portion has a distance K = Htan25 ° to the outer side of the mounting surface from the periphery of the mounting surface. The edge portion on the mounting surface side is positioned at a position separated by any distance within the range of Htan 45 °.
Moreover, the pad structure of the wiring board according to the present invention is characterized in that a plurality of the punched portions are provided along the periphery of the mounting surface.
According to another aspect of the present invention, there is provided a wiring board comprising the above-mentioned wiring board pad structure.
Further, the electrode part mounting structure of the present invention is an electrode part mounting structure in which the electrode part of the mounting component is soldered to the wiring board using the pad structure of the wiring board. The surface of the solder fillet connected to the wiring board is at an angle of 25 ° to 45 ° with respect to the direction perpendicular to the mounting surface of the electrode portion, from the upper end portion of the electrode portion to the extraction portion side. It is characterized by being inclined downward.

本発明によれば、電子部品の外形に応じた適切な半田付けを行うことができる。 ADVANTAGE OF THE INVENTION According to this invention, appropriate soldering according to the external shape of an electronic component can be performed.

以下、図面を参照して、本発明の最良の形態を説明する。
図１は、本実施形態のプリント配線基板１が備える接続パッド１１，１２の構成の概略を示す図であり、（ａ）は平面図、（ｂ）は（ａ）のＡ−Ａ線断面図である。図２は、接続パッド１１，１２に電子部品２の電極部２１，２２が半田付けされる状態を示す図である。なお、以下の説明で用いる前後，左右，上下の各方向は説明に用いる各図に示している。この前後，左右，上下は説明のために記載したもので、実際の配置と異なってよいことはもちろんである。 Hereinafter, the best mode of the present invention will be described with reference to the drawings.
1A and 1B are diagrams schematically illustrating the configuration of connection pads 11 and 12 included in a printed wiring board 1 according to the present embodiment. FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along line AA in FIG. It is. FIG. 2 is a diagram illustrating a state in which the electrode portions 21 and 22 of the electronic component 2 are soldered to the connection pads 11 and 12. It should be noted that the front, rear, left, and right directions used in the following description are shown in the drawings used for the description. The front, rear, left and right, and the top and bottom are described for the purpose of explanation, and of course may be different from the actual arrangement.

図１に示すように、プリント配線基板１は、その一主面に実装される電子部品２との電気的及び機械的接続に用いられる接続パッド１１，１２を備えている。本実施形態では、プリント配線基板１に実装される電子部品２が、図１に２点差線で示すように四角箱状の外観形状を有しており、その右側部及び左側部の周面を電極部２１，２２として構成されているので、プリント配線基板１上には、２つの接続パッド１１，１２が備えられている。接続パッド１１，１２を備えるプリント配線基板１の一主面には、図示しない配線パターンが形成されており、接続パッド１１，１２はこの配線パターンに電気的に接続されている。図２（ａ）に示すように、接続パッド１１，１２のクリーム半田の層３上に電子部品２の電極部２１，２２が載置された状態で、クリーム半田の層３が溶融することにより、図２（ｂ）に示すように、半田フィレット３１が形成される。同図に示すように、半田フィレット３１は、電極部２１，２２の側面から徐々に肉薄になる略三角形の断面形状を有している。   As shown in FIG. 1, the printed wiring board 1 includes connection pads 11 and 12 used for electrical and mechanical connection with an electronic component 2 mounted on one main surface thereof. In this embodiment, the electronic component 2 mounted on the printed wiring board 1 has a square box-like appearance as shown by a two-dot chain line in FIG. Since the electrode portions 21 and 22 are configured, two connection pads 11 and 12 are provided on the printed wiring board 1. A wiring pattern (not shown) is formed on one main surface of the printed wiring board 1 including the connection pads 11 and 12, and the connection pads 11 and 12 are electrically connected to the wiring pattern. As shown in FIG. 2A, the cream solder layer 3 is melted in a state where the electrode parts 21 and 22 of the electronic component 2 are placed on the cream solder layer 3 of the connection pads 11 and 12. As shown in FIG. 2B, a solder fillet 31 is formed. As shown in the figure, the solder fillet 31 has a substantially triangular cross-sectional shape that gradually becomes thinner from the side surfaces of the electrode portions 21 and 22.

接続パッド１１は、半田付け用の銅等の金属箔から形成されており、プリント配線基板１の一主面にエッチング処理又はめっき処理を施すこと等により、配線パターンと共に形成されている。図１（ａ）に示すように、電子部品２の左側の電極部２１が載置される接続パッド１１は、角部が丸みを帯びた略四角形の平面形状を有しており、その右辺部の上面が電極部２１の載置される載置面１３となっている。同図に破線で示すように、載置面１３は、電極部２１とほぼ等しい平面形状を呈して、接続パッド１１の右辺から左辺側に延びている。図１（ｂ）に示すように、接続パッド１１の上面には、ペースト状のクリーム半田の層３が印刷されている。   The connection pad 11 is formed of a metal foil such as copper for soldering, and is formed together with a wiring pattern by performing an etching process or a plating process on one main surface of the printed wiring board 1. As shown in FIG. 1A, the connection pad 11 on which the left electrode portion 21 of the electronic component 2 is placed has a substantially rectangular planar shape with rounded corners, and the right side portion thereof. The upper surface is a mounting surface 13 on which the electrode unit 21 is mounted. As indicated by a broken line in the figure, the mounting surface 13 has a planar shape substantially equal to the electrode portion 21 and extends from the right side of the connection pad 11 to the left side. As shown in FIG. 1 (b), a paste-like cream solder layer 3 is printed on the upper surface of the connection pad 11.

また、図１（ａ），（ｂ）に示すように、接続パッド１１の左辺部の近傍には、エッチング処理の際に金属箔を除去することにより、又は、めっき処理の際に金属箔を形成しないこと等により形成された抜き部１４が設けられている。   Further, as shown in FIGS. 1A and 1B, in the vicinity of the left side portion of the connection pad 11, the metal foil is removed by removing the metal foil during the etching process or during the plating process. A punching portion 14 formed by not forming the hole is provided.

半田フィレット３１は、電極部２１の側面に沿って延びる上端が、電極部２１の上端近くまで延びて、抜き部１４側に向けて下降傾斜して延びる上面の傾斜角度θ（図２（ｂ）参照）が、抜き部１４に向かい合う電極部２１の側面の延設方向（載置面１３に垂直な方向）に対して２０°〜４５°の範囲に収まる形状を有していることが、電極部２１と接続パッド１１との接続強度を高める上で好ましい。詳述すると、電極部２１の厚さＨが１ｍｍよりも低い場合には３０°〜４５°の範囲に、厚さＨが１ｍｍ以上の場合には２５°〜３０°の範囲に、上記傾斜角度θを設定することが、電極部２１と接続パッド１１との接続強度を高める上で好ましい。このため、抜き部１４の面積と電極部２１と向き合う縁部の位置とは、このような形状の半田フィレット３１が形成されるように設定されている。なお、図２（ｂ）に示すように、電極部２１と載置面１３との間には半田が位置しているが、この半田の厚さは電極部２１の厚さＨに比べて極めて小さな値であるため、以下の説明では、電極部２１の厚さＨと、載置面１３からの電極部２１の上端部の高さとがほぼ等しいものとして説明を行う。   The solder fillet 31 has an upper surface extending along the side surface of the electrode portion 21, extending near the upper end of the electrode portion 21, and descending toward the extraction portion 14, and an upper surface inclined angle θ (FIG. 2B). The reference electrode) has a shape that falls within a range of 20 ° to 45 ° with respect to the extending direction of the side surface of the electrode portion 21 facing the extraction portion 14 (the direction perpendicular to the mounting surface 13). This is preferable for increasing the connection strength between the portion 21 and the connection pad 11. More specifically, when the thickness H of the electrode part 21 is lower than 1 mm, the inclination angle is in the range of 30 ° to 45 °, and when the thickness H is 1 mm or more, the inclination angle is in the range of 25 ° to 30 °. Setting θ is preferable for increasing the connection strength between the electrode portion 21 and the connection pad 11. For this reason, the area of the punched portion 14 and the position of the edge portion facing the electrode portion 21 are set so that the solder fillet 31 having such a shape is formed. As shown in FIG. 2B, solder is located between the electrode portion 21 and the mounting surface 13, but the thickness of this solder is much larger than the thickness H of the electrode portion 21. Since it is a small value, the following description will be made assuming that the thickness H of the electrode portion 21 is substantially equal to the height of the upper end portion of the electrode portion 21 from the placement surface 13.

具体的には、電極部２１の左側面が上方に立ち上がる載置面１３の左側の周縁部から、抜き部１４の右側の縁部までの距離Ｋは、電子部品２が備える電極部２１の厚さＨ及び所望とする傾斜角度θに対して、Ｋ＝Ｈｔａｎθの関係を満たすように設定されている。これにより、載置面１３上の電極部２１の上端部から傾斜角度θで抜き部１４の右側の縁部に向けて表面が下降傾斜する半田フィレット３１を形成することが可能となる。   Specifically, the distance K from the peripheral edge on the left side of the mounting surface 13 where the left side surface of the electrode part 21 rises upward to the right side edge part of the extraction part 14 is the thickness of the electrode part 21 included in the electronic component 2. The height H and the desired inclination angle θ are set so as to satisfy the relationship K = H tan θ. As a result, it is possible to form the solder fillet 31 whose surface is inclined downward from the upper end portion of the electrode portion 21 on the mounting surface 13 toward the right edge portion of the punched portion 14 at an inclination angle θ.

以下、配線基板に実装される多くの電子部品が備える厚さＨ＝０．６ｍｍ〜１．２５ｍｍの電極部２１を半田付けする場合の距離Ｋの設定方法を例示する。例えば、電極部２１の厚さＨ＝０．６ｍｍであるときは傾斜角度θを３０°として、距離Ｋ＝Ｈｔａｎ３０°（ｔａｎ３０°＝約０．５８（以下同じ））＝０．３４ｍｍに設定することができる。また、傾斜角度θを４５°として、距離Ｋ＝Ｈｔａｎ４５°（ｔａｎ４５°＝１）＝０．６ｍｍに設定することができる。また、電極部２１の厚さＨ＝０．８ｍｍであるときは傾斜角度θを３０°として、距離Ｋ＝Ｈｔａｎ３０°＝０．４６４ｍｍに設定することができる。また、傾斜角度θを４５°として、距離Ｋ＝Ｈｔａｎ４５°＝０．８ｍｍに設定することができる。また、電極部２１の厚さＨ＝０．８５ｍｍであるときは傾斜角度θを３０°として、距離Ｋ＝Ｈｔａｎ３０°＝０．４９３ｍｍに設定することができる。また、傾斜角度θを４５°として、距離Ｋ＝Ｈｔａｎ４５°＝０．８５ｍｍに設定することができる。   Hereinafter, a method of setting the distance K when soldering the electrode portion 21 having a thickness H = 0.6 mm to 1.25 mm included in many electronic components mounted on the wiring board will be exemplified. For example, when the thickness H of the electrode portion 21 is 0.6 mm, the inclination angle θ is set to 30 °, and the distance K = H tan 30 ° (tan 30 ° = about 0.58 (hereinafter the same)) = 0.34 mm. be able to. Further, the inclination angle θ can be set to 45 °, and the distance K = H tan 45 ° (tan 45 ° = 1) = 0.6 mm can be set. Further, when the thickness H of the electrode portion 21 is 0.8 mm, the inclination angle θ can be set to 30 °, and the distance K = Htan30 ° = 0.464 mm can be set. Further, the inclination angle θ can be set to 45 °, and the distance K = H tan 45 ° = 0.8 mm can be set. Further, when the thickness H of the electrode portion 21 is 0.85 mm, the inclination angle θ can be set to 30 °, and the distance K = Htan30 ° = 0.493 mm can be set. Further, the inclination angle θ can be set to 45 °, and the distance K = H tan 45 ° = 0.85 mm can be set.

また、電極部２１の厚さＨ＝１．１５ｍｍであるときは傾斜角度θを３０°として、距離Ｋ＝Ｈｔａｎ３０°＝０．６６７ｍｍに設定することができる。また、傾斜角度θを２５°として、距離Ｋ＝Ｈｔａｎ２５°（ｔａｎ２５°＝約０．４６６（以下同じ））＝０．５３６ｍｍに設定することができる。また、傾斜角度θを２０°として、距離Ｋ＝Ｈｔａｎ２０°（ｔａｎ２０°＝約０．３６４（以下同じ））＝０．４１８６ｍｍに設定することができる。また、電極部２１の厚さＨ＝１．２５ｍｍであるときは傾斜角度θを３０°として、距離Ｋ＝Ｈｔａｎ３０°＝０．７２５ｍｍに設定することができる。また、傾斜角度θを２５°として、距離Ｋ＝Ｈｔａｎ２５°＝０．５８３ｍｍに設定することができる。また、傾斜角度θを２０°として、距離Ｋ＝Ｈｔａｎ２０°＝０．４５５ｍｍに設定することができる。   Further, when the thickness H of the electrode portion 21 is 1.15 mm, the inclination angle θ can be set to 30 °, and the distance K = Htan30 ° = 0.667 mm can be set. Further, the inclination angle θ is 25 °, and the distance K = H tan 25 ° (tan 25 ° = about 0.466 (hereinafter the same)) = 0.536 mm can be set. Further, the inclination angle θ can be set to 20 °, and the distance K = H tan 20 ° (tan 20 ° = about 0.364 (hereinafter the same)) can be set to 0.4186 mm. Further, when the thickness H of the electrode portion 21 is 1.25 mm, the inclination angle θ can be set to 30 °, and the distance K = Htan30 ° = 0.725 mm can be set. Further, the inclination angle θ can be set to 25 °, and the distance K = H tan 25 ° = 0.583 mm can be set. Further, the inclination angle θ can be set to 20 °, and the distance K = Htan20 ° = 0.455 mm can be set.

また、各抜き部１４の幅Ｗ及び長さＬは、抜き部１４の右側の縁部までの延出距離Ｋが上述のように設定された半田フィレット３１の傾斜角度θが、２５°〜３０°の範囲内に収まる量の半田を供給できる値に設定されている。   Further, the width W and the length L of each punched portion 14 are such that the inclination angle θ of the solder fillet 31 in which the extension distance K to the right edge of the punched portion 14 is set as described above is 25 ° to 30 °. It is set to a value that can supply an amount of solder that falls within the range of °.

但し、各抜き部１４の幅Ｗは、狭すぎると溶融半田で抜き部１４の上面が覆われて、半田フィレット３１の形成に用いられる半田量がその分少なくなり、また、接続パッド１１の形成時に抜き部１４を設けるのが難しくなる。一方、幅Ｗが広くなりすぎると、クリーム半田の層３を構成する印刷半田ペーストが抜き部１４に落ち込んだり、抜き部１４を挟んで電極部２１側と反対側に位置する溶融半田や抜き部１４上の溶融半田を、溶融半田の表面張力によって抜き部１４よりも電極部２１側に十分に吸い寄せることができずに、抜き部１４上等に半田が残り易くなる。このため、電極部２１の厚さＨ＝０．６ｍｍ〜１．２５ｍｍの範囲にあるときには、幅Ｗは０．１ｍｍ〜０．３ｍｍに設定するのが好ましい。   However, if the width W of each extraction portion 14 is too small, the upper surface of the extraction portion 14 is covered with molten solder, and the amount of solder used for forming the solder fillet 31 is reduced accordingly, and the formation of the connection pad 11 is also achieved. Sometimes it becomes difficult to provide the cutout 14. On the other hand, if the width W becomes too large, the printed solder paste constituting the cream solder layer 3 falls into the punched portion 14, or the molten solder or the punched portion located on the opposite side of the electrode portion 21 side across the punched portion 14. The molten solder on 14 cannot be sufficiently sucked closer to the electrode portion 21 side than the extracted portion 14 due to the surface tension of the molten solder, and the solder tends to remain on the extracted portion 14 and the like. For this reason, when the thickness H of the electrode portion 21 is in the range of 0.6 mm to 1.25 mm, the width W is preferably set to 0.1 mm to 0.3 mm.

また、抜き部１４の長さＬは、短くなる程半田フィレット３１の形成に用いられる半田量が少なくなり、長くなる程抜き部１４を挟んだ電極部２１の反対側に位置する溶融半田の電極部２１側への移動が妨げられて、抜き部１４を挟んだ電極部２１の反対側に半田が残り易くなる。このため、長さＬは０．２ｍｍ〜０．８ｍｍに設定するのが好ましい。また、接続パッド１１全体として備える抜き部１４の長さＬが同じであるのならば、抜き部１４を挟んだ電極部２１の反対側に位置する溶融半田が電極部２１側へ移動する流通路となる間隙を備える様に抜き部１４が複数に分割されていることが好ましい。   Further, as the length L of the extracted portion 14 becomes shorter, the amount of solder used for forming the solder fillet 31 becomes smaller. As the length L becomes longer, the molten solder electrode located on the opposite side of the electrode portion 21 with the extracted portion 14 interposed therebetween. The movement toward the portion 21 side is hindered, and the solder tends to remain on the opposite side of the electrode portion 21 with the punched portion 14 interposed therebetween. For this reason, the length L is preferably set to 0.2 mm to 0.8 mm. Further, if the length L of the extracted portion 14 provided as a whole of the connection pad 11 is the same, the flow path through which the molten solder located on the opposite side of the electrode portion 21 across the extracted portion 14 moves to the electrode portion 21 side. It is preferable that the punching part 14 is divided into a plurality of parts so as to have a gap.

両抜き部１４の間の間隔Ｓは、長くなる程半田フィレット３１の形成に用いられる半田量が少なくなり、短くなる程抜き部１４を挟んだ電極部２１の反対側に位置する溶融半田の電極部２１側への移動が制限され易くなり、しかも、接続パッド１１を形成する際に両抜き部１４が繋がる虞が大きくなる。このため、間隔Ｓは０．１ｍｍ〜０．４ｍｍに設定することが好ましい。このことは、各抜き部１４の長さ方向の端部と接続パッド１１の縁部との間隔についても同様であり、この間隔も抜き部１４同士の間隔Ｓと同様の条件で設定されている。   As the distance S between the two extracted portions 14 becomes longer, the amount of solder used to form the solder fillet 31 decreases, and as the interval S becomes shorter, the molten solder electrode located on the opposite side of the electrode portion 21 with the extracted portion 14 interposed therebetween. Movement toward the portion 21 side is likely to be restricted, and there is a high possibility that the both punched portions 14 are connected when the connection pad 11 is formed. For this reason, it is preferable to set the space | interval S to 0.1 mm-0.4 mm. This also applies to the distance between the end in the length direction of each extraction portion 14 and the edge of the connection pad 11, and this interval is also set under the same conditions as the interval S between the extraction portions 14. .

本実施形態では、電極部２１の厚さＨが１．２５ｍｍであることから、望ましい２０°〜３０°の傾斜角度θに含まれる、傾斜角度θ＝２５°〜３０°の半田フィレット３１が形成されるように距離Ｋ，幅Ｗ，長さＬ，間隔Ｓが設定されている。具体的には、距離Ｋ＝Ｈｔａｎ２５°（０．５３６ｍｍ）とほぼ等しい０．５５ｍｍ〜Ｈｔａｎ３０°（０．６６７ｍｍ）とほぼ等しい０．６５ｍｍの何れかに設定されている。また、幅Ｗ＝０．２ｍｍに設定されている。また、長さＬ＝０．４ｍｍに設定された抜き部１４を２つ備える構成となっている。また、間隔Ｓは０．２ｍｍに設定されている。また、図示しないが、各抜き部１４の長さ方向の端部と接続パッド１１の縁部との間隔も、間隔Ｓと同様に０．２ｍｍに設定されている。   In the present embodiment, since the thickness H of the electrode portion 21 is 1.25 mm, the solder fillet 31 having the inclination angle θ = 25 ° to 30 ° included in the desired inclination angle θ of 20 ° to 30 ° is formed. The distance K, the width W, the length L, and the interval S are set as described above. Specifically, the distance K is set to any of 0.55 mm substantially equal to Htan25 ° (0.536 mm) to 0.65 mm substantially equal to Htan30 ° (0.667 mm). The width W is set to 0.2 mm. Moreover, it is the structure provided with the two extraction parts 14 set to length L = 0.4mm. The interval S is set to 0.2 mm. Further, although not shown in the drawing, the distance between the end portion in the length direction of each punched portion 14 and the edge portion of the connection pad 11 is set to 0.2 mm as with the distance S.

電子部品２の右側の電極部２２が載置される接続パッド１２は、図１（ａ）に示すように、接続パッド１２と左右を対称にした平面形状を呈しており、接続パッド１１と同様の構成を有している。また、各抜き部１４の幅Ｗ及び長さＬと、両抜き部１４の間隔Ｓと、電極部２１と向き合う抜き部１４の縁部の電極部２１からの距離Ｋも、接続パッド１１と同様の条件で設定されている。また、接続パッド１１と接続パッド１２とは、電子部品２が備える電極部２１と電極部２２との間の距離とほぼ等しい距離だけ間隔を置いて、互いに向き合って配置されている。   As shown in FIG. 1A, the connection pad 12 on which the right electrode portion 22 of the electronic component 2 is placed has a planar shape symmetric with the connection pad 12, and is the same as the connection pad 11. It has the composition of. Further, the width W and length L of each punched portion 14, the distance S between both the punched portions 14, and the distance K from the electrode portion 21 at the edge of the punched portion 14 facing the electrode portion 21 are the same as those of the connection pad 11. It is set in the condition of. In addition, the connection pad 11 and the connection pad 12 are arranged to face each other with a distance substantially equal to the distance between the electrode part 21 and the electrode part 22 included in the electronic component 2.

次に、このような構成を有するプリント配線基板１への電子部品２の実装方法について説明する。まず、図２（ａ）に示すように、接続パッド１１，１２の載置面１３上に電子部品２の電極部２１，２２をそれぞれ載置する。そして、赤外線や熱風を用いて接続パッド１１，１２を備えたプリント配線基板１の一主面を加熱し、接続パッド１１，１２の上面に塗布されたクリーム半田の層３を溶融させる。溶融した半田は、電極部２１，２２と接続パッド１１，１２との接続部で溶融した半田の表面張力によって電極部２１，２２側に吸い寄せられ、図２（ｂ）に示すように、電極部２１，２２の側面から電極部２１，２２の側方に位置する抜き部１４側にかけて徐々に肉薄になる溶融半田の層、つまり半田フィレット３１を、接続パッド１１，１２上で形成する。   Next, a method for mounting the electronic component 2 on the printed wiring board 1 having such a configuration will be described. First, as shown in FIG. 2A, the electrode portions 21 and 22 of the electronic component 2 are placed on the placement surfaces 13 of the connection pads 11 and 12, respectively. Then, one main surface of the printed wiring board 1 provided with the connection pads 11 and 12 is heated using infrared rays or hot air to melt the cream solder layer 3 applied to the upper surfaces of the connection pads 11 and 12. The melted solder is sucked to the electrode parts 21 and 22 side by the surface tension of the solder melted at the connection part between the electrode parts 21 and 22 and the connection pads 11 and 12, and as shown in FIG. A layer of molten solder, that is, a solder fillet 31 that gradually decreases in thickness from the side surfaces of 21 and 22 to the side of the cutout portion 14 located on the side of the electrode portions 21 and 22 is formed on the connection pads 11 and 12.

抜き部１４上で溶融したクリーム半田も、電極部２１，２２と接続パッド１１，１２との接続部で溶融した半田の表面張力により電極部２１，２２側に吸い寄せられ、接続パッド１１，１２の金属箔上で溶融した半田と共に、半田フィレット３１を形成する。このようにして電極部２１，２２側に吸い寄せられ、半田フィレット３１を形成している溶融半田は、冷却されて固化すると、接続パッド１１，１２と電極部２１，２２とを固着させ、両者を電気的及び機械的に接続する。   The cream solder melted on the extraction part 14 is also sucked to the electrode parts 21 and 22 side by the surface tension of the solder melted at the connection part between the electrode parts 21 and 22 and the connection pads 11 and 12. A solder fillet 31 is formed together with the solder melted on the metal foil. In this way, when the molten solder that is attracted to the electrode portions 21 and 22 and forms the solder fillet 31 is cooled and solidified, the connection pads 11 and 12 and the electrode portions 21 and 22 are fixed to each other. Connect electrically and mechanically.

このように、本実施形態のプリント配線基板１によれば、接続パッド１１，１２と電極部２１，２２とを固着する半田フィレット３１を形成する半田の大半が、抜き部１４よりも電極部２１，２２側の接続パッド１１，１２上、及び抜き部１４上で溶融した半田から構成されるので、接続パッド１１，１２上での抜き部１４の形成位置及び形状に応じた量の半田を半田フィレット３１の形成に用いることができる。また、電極部２１，２２の側面から抜き部１４の電極部２１，２２側の縁部にかけて距離Ｋと等しい長さの半田フィレット３１が形成されることから、抜き部１４の形成位置に応じた形状の半田フィレット３１を形成することができる。   As described above, according to the printed wiring board 1 of the present embodiment, most of the solder forming the solder fillet 31 that fixes the connection pads 11 and 12 and the electrode portions 21 and 22 to the electrode portion 21 rather than the extracted portion 14. , 22 side connection pads 11, 12 and the melted solder on the extraction part 14, so that an amount of solder corresponding to the formation position and shape of the extraction part 14 on the connection pad 11, 12 is soldered. It can be used to form the fillet 31. Further, since the solder fillet 31 having a length equal to the distance K is formed from the side surfaces of the electrode portions 21 and 22 to the edge portion of the extraction portion 14 on the electrode portions 21 and 22 side, it corresponds to the formation position of the extraction portion 14. A shaped solder fillet 31 can be formed.

このため、電子部品２が備える電極部２１，２２の形状に応じて、上述した長さＬ，幅Ｗ，間隔Ｓ，距離Ｋの各条件のうち、少なくともＫを満たす配置位置及び形状の抜き部１４を設定することにより、電子部品２が備える電極部２１，２２の形状に応じて、傾斜角度θが２５°〜３０°の範囲に収まる条件を満たす適切な形状の半田フィレット３１を形成して、接続パッド１１，１２と電極部２１，２２との接続強度を高めることが可能となる。しかも、必要とする半田フィレット３１の形状に応じた適切な位置に抜き部１４を形成することにより、接続に用いる半田量を最小限に抑えつつ、接続強度を高められることから、接続パッド１１，１２の形成面積が制限されて抜き部１４の面積を十分に採れない場合でも、その条件に応じた適切な半田付けを行うことが可能となる。   For this reason, according to the shape of the electrode parts 21 and 22 with which the electronic component 2 is provided, the arrangement | positioning position and shape extraction part which satisfy | fill at least K among each conditions of length L, width W, space | interval S, and distance K mentioned above. By setting 14, the solder fillet 31 having an appropriate shape that satisfies the condition that the inclination angle θ falls within the range of 25 ° to 30 ° is formed according to the shape of the electrode portions 21 and 22 included in the electronic component 2. The connection strength between the connection pads 11 and 12 and the electrode portions 21 and 22 can be increased. In addition, by forming the punched portion 14 at an appropriate position according to the required shape of the solder fillet 31, it is possible to increase the connection strength while minimizing the amount of solder used for the connection. Even when the formation area of 12 is limited and the area of the extraction part 14 cannot be taken sufficiently, it is possible to perform appropriate soldering according to the conditions.

また、接続パッド１１，１２が、互いに所定間隔を置いて配置された複数（上述した例では２個）の抜き部１４を、載置面１３の周縁に沿って備えていることから、各抜き部１４の間に位置した金属泊の形成箇所が、抜き部１４を挟んだ電極部２１の反対側に位置する溶融半田が電極部２１側へ移動する流通路となるため、両抜き部１４同士が接続されている場合に比べ、半田付けに用いる半田量を増やすことができる。   Further, each of the connection pads 11 and 12 includes a plurality of (two in the above example) extraction portions 14 arranged at predetermined intervals along the peripheral edge of the mounting surface 13. Since the place where the metal stay located between the portions 14 is formed becomes a flow path where the molten solder located on the opposite side of the electrode portion 21 across the extracted portion 14 moves to the electrode portion 21 side, The amount of solder used for soldering can be increased as compared with the case where is connected.

上記実施形態の説明では、接続パッド１１，１２の備える各抜き部１４が、電極部２１，２２の載置面１３の一辺部に沿って、直線状に延設されていた場合について説明した。しかしながら、電子部品２が備える電極部２１，２２の載置面１３から所定距離離れた位置に、載置面１３の周縁に沿って抜き部１４が延びているのであれば、接続パッド１１，１２の構成は任意である。例えば、図３に示すように、電極部２１，２２の抜き部１４側の一辺部を挟んだ角部の周縁に沿う位置まで各抜き部１４が延びる構成としてもよい。このような構成によれば、抜き部１４の長さが長くなった分、半田フィレット３１の形成に用いる半田量を増やすことができる。   In the description of the above-described embodiment, a case has been described in which each extraction portion 14 included in the connection pads 11 and 12 extends linearly along one side portion of the placement surface 13 of the electrode portions 21 and 22. However, if the extracted portion 14 extends along the periphery of the mounting surface 13 at a position away from the mounting surface 13 of the electrode portions 21 and 22 of the electronic component 2, the connection pads 11 and 12 are provided. The configuration of is arbitrary. For example, as shown in FIG. 3, each extraction portion 14 may extend to a position along the peripheral edge of a corner portion sandwiching one side portion of the electrode portions 21 and 22 on the extraction portion 14 side. According to such a configuration, the amount of solder used for forming the solder fillet 31 can be increased by the length of the punched portion 14.

また、接続パッド１１，１２が備える抜き部１４の数量は任意であり、例えば、図１や図３に示す各抜き部１４をそれぞれ２等分した形状の４つの抜き部１４を、接続パッド１１，１２がそれぞれ備える構成としてもよい。   Further, the number of the cutouts 14 included in the connection pads 11 and 12 is arbitrary. For example, four cutouts 14 having a shape obtained by dividing each of the cutouts 14 shown in FIGS. , 12 may be provided.

上記実施形態の説明では、四角箱状の外観形状を有した電子部品２が、その右側部及び左側部の周面を電極部２１，２２として構成されていたので、各接続パッド１１，１２が右辺側又は左辺側にそれぞれ載置面１３を備えていたが、接続パッド１１，１２上での載置面１３の配置は任意であり、例えば、接続パッド１１，１２の中心部に載置面１３を備えている構成としてもよい。   In the description of the above embodiment, since the electronic component 2 having a rectangular box-like appearance is configured with the right and left peripheral surfaces as electrode portions 21 and 22, each connection pad 11 and 12 is Although the placement surface 13 is provided on each of the right side and the left side, the placement surface 13 is arbitrarily arranged on the connection pads 11 and 12. For example, the placement surface is provided at the center of the connection pads 11 and 12. 13 may be provided.

上記実施形態の説明では、四角箱状の外観形状を有した電子部品２が、２つの電極部２１，２２を備えていたので、これらの電極部２１，２２の接続に用いる２つの接続パッド１１，１２をプリント配線基板１が備える場合について説明した。しかしながら、接続パッド１１，１２の数量は、電子部品２が備える電極部２１，２２の数量に応じて適宜設定することができる。   In the description of the above embodiment, since the electronic component 2 having a square box-like appearance has the two electrode portions 21 and 22, the two connection pads 11 used to connect the electrode portions 21 and 22. , 12 has been described for the case where the printed wiring board 1 is provided. However, the number of the connection pads 11 and 12 can be appropriately set according to the number of the electrode portions 21 and 22 included in the electronic component 2.

以下、電子部品２の電極部２１，２２を接続パッド１１，１２に半田付けする際に形成される半田フィレット３１と抜き部１４の形成位置との関係、つまり、電子部品２の適切な半田付けを行うことのできる抜き部１４の形成位置について説明する。   Hereinafter, the relationship between the solder fillet 31 formed when the electrode portions 21 and 22 of the electronic component 2 are soldered to the connection pads 11 and 12 and the formation position of the punched portion 14, that is, appropriate soldering of the electronic component 2. The formation position of the punching portion 14 that can be performed will be described.

まず、半田付けにより形成された半田フィレット３１でのクラック発生位置と、発生したクラックが半田フィレット３１を貫通するまでの残存率との関係を説明する。ここで、残存率は、発生したクラックが半田フィレットを貫通するまでに通過すると予想される予想経路長に対する、予想経路長から実際のクラックの経路長を差し引いた経路長の割合、つまり、残存した予想経路長の割合である。残存率が低いほど、クラックが半田フィレット３１を貫通するのに要する時間が短いこと、つまり、クラックの進行速度が速いこととなる。   First, the relationship between the crack generation position in the solder fillet 31 formed by soldering and the remaining rate until the generated crack penetrates the solder fillet 31 will be described. Here, the residual ratio is the ratio of the path length obtained by subtracting the actual crack path length from the expected path length to the expected path length that the generated crack is expected to pass before penetrating the solder fillet, that is, the remaining ratio. This is the ratio of the expected path length. The lower the residual ratio, the shorter the time required for the crack to penetrate the solder fillet 31, that is, the faster the crack progress rate.

図４は、半田フィレット３１でのクラック発生位置と残存率との関係を説明する図であり、クラック発生位置が電極部２１，２２沿いの場合と、接続パッド１１，１２沿いの場合とでの関係が示されている。ここで、接続パッド１１，１２沿いには、接続パッド１１，１２の延設方向に沿ったものだけでなく、電極部２１，２２沿いではない半田フィレット３１中の他の箇所も含まれる。   FIG. 4 is a diagram for explaining the relationship between the crack occurrence position and the remaining rate in the solder fillet 31, in the case where the crack occurrence position is along the electrode portions 21 and 22 and the case where the crack is along the connection pads 11 and 12. The relationship is shown. Here, along the connection pads 11 and 12, not only along the extending direction of the connection pads 11 and 12 but also other portions in the solder fillet 31 not along the electrode portions 21 and 22 are included.

図４に示す比較は、厚さ１．１５ｍｍ，幅１．２５ｍｍの電極部２１，２２を備える電子部品２を用いて行っている。また、抜き部１４は、載置面１３の左側周縁部から右側縁部までの距離Ｋ＝０．５５ｍｍ，延設長さＬ＝０．４ｍｍ，幅Ｗ＝０．２ｍｍ，抜き部１４間の距離Ｓ＝０．２ｍｍに設定してある。また、クリーム半田の印刷厚さは１５０μｍに設定してある。そして、−４０℃に冷却した環境に３０分おいた後に加熱して１２５℃の環境に３０分おき、再び−４０℃まで冷却する温度サイクルを３０００回加える熱ストレスを与えている。   The comparison shown in FIG. 4 is performed using the electronic component 2 including the electrode portions 21 and 22 having a thickness of 1.15 mm and a width of 1.25 mm. Further, the extracted portion 14 has a distance K = 0.55 mm from the left peripheral edge portion to the right edge portion of the mounting surface 13, an extended length L = 0.4 mm, a width W = 0.2 mm, and between the extracted portions 14. The distance S is set to 0.2 mm. The printing thickness of the cream solder is set to 150 μm. Then, after being placed in an environment cooled to −40 ° C. for 30 minutes, heating is performed for 30 minutes in an environment at 125 ° C., and a thermal stress is applied to apply a temperature cycle of 3000 times to cool down to −40 ° C. again.

図４に示す比較結果は、縦軸に残存率、横軸にクラック発生位置を示している。同図に示すように、接続パッド１１，１２沿いに発生したクラックは、電極部２１，２２沿いに発生したクラックに比べて、高い残存率を有していることが確認できる。これは、電極部２１，２２沿いの方が、接続パッド１１，１２沿いに比べてクラックの進行速度が速く、接続パッド１１，１２沿いに発生した場合に比べて短い時間でクラックが半田フィレット３１を貫通することを表している。つまり、電極部２１，２２沿いにクラックが生じた場合には、電極部２１，２２と接続パッド１１，１２との接続が解けて接触不良が生じやすくなることを表している。このことから、電極部２１，２２沿いでのクラックの発生を防止すること、つまり、電極部２１，２２沿いでクラックが発生しにくい形状の半田フィレット３１を形成することにより、接触不良が効果的に防止されることが確認できる。   The comparison result shown in FIG. 4 shows the remaining rate on the vertical axis and the crack occurrence position on the horizontal axis. As shown in the figure, it can be confirmed that the cracks generated along the connection pads 11 and 12 have a higher residual rate than the cracks generated along the electrode portions 21 and 22. This is because the crack progressing speed is faster along the electrode portions 21 and 22 than along the connection pads 11 and 12, and the crack fills in the solder fillet 31 in a shorter time than when it occurs along the connection pads 11 and 12. It represents that it penetrates. That is, when a crack occurs along the electrode portions 21 and 22, the connection between the electrode portions 21 and 22 and the connection pads 11 and 12 is released, and contact failure is likely to occur. Therefore, contact failure is effectively prevented by preventing the occurrence of cracks along the electrode portions 21 and 22, that is, by forming the solder fillet 31 having a shape that does not easily generate cracks along the electrode portions 21 and 22. Can be confirmed.

次に、上記比較結果を得るために用いた条件の中で、載置面１３の周縁部から抜き部１４の側縁部までの距離Ｋを変えて半田付けを行った場合、具体的には、半田フィレット３１の長さを０．２５ｍｍ〜０．７５ｍｍまで０．１ｍｍ間隔で変化させた場合の、半田量割合と半田フィレット３１の長さとの関係と、クラック発生位置との関係を説明する。   Next, in the conditions used for obtaining the comparison result, when the soldering is performed by changing the distance K from the peripheral edge of the mounting surface 13 to the side edge of the extraction part 14, specifically, The relationship between the solder amount ratio and the length of the solder fillet 31 and the relationship between the crack occurrence position when the length of the solder fillet 31 is changed from 0.25 mm to 0.75 mm at intervals of 0.1 mm will be described. .

図５は、半田量割合と半田フィレット３１の長さとの関係と、クラック発生位置との関係を説明する図である。図５に示す比較結果は、縦軸に半田量割合、横軸に半田フィレット３１の長さを示している。なお、半田量割合とは、半田フィレット３１の延伸長さに対する半田量の割合、ここでは、電極部２１，２２の側面に沿って延びる半田フィレット３１の最も肉厚な部分の厚さを表している。半田量割合１００％は、半田フィレット３１の厚さと延伸長さとが等しいことを表しており、半田量割合が小さくなるにつれて、半田フィレット３１が薄くなって、電極部２１，２２側からの下降傾斜が緩やかになることを表している。また、クラック発生位置は、図４にその結果を示す比較と同様にして熱ストレスを加えたときのクラック発生位置を示している。   FIG. 5 is a diagram for explaining the relationship between the solder amount ratio and the length of the solder fillet 31, and the relationship between the crack occurrence positions. In the comparison result shown in FIG. 5, the vertical axis represents the solder amount ratio, and the horizontal axis represents the length of the solder fillet 31. The solder amount ratio is the ratio of the solder amount to the extension length of the solder fillet 31, and here represents the thickness of the thickest part of the solder fillet 31 extending along the side surfaces of the electrode portions 21 and 22. Yes. The solder amount ratio of 100% indicates that the thickness of the solder fillet 31 is equal to the extension length, and as the solder amount ratio decreases, the solder fillet 31 becomes thinner and descends from the electrode portions 21 and 22 side. Represents a gradual decrease. Further, the crack generation position indicates the crack generation position when thermal stress is applied in the same manner as the comparison whose result is shown in FIG.

図５に示すように、半田フィレット３１の長さが短い程半田量割合が大きくなっていることが確認できる。これは、半田フィレット３１の長さを短くする程、半田フィレット３１が肉厚になり、接続パッド１１，１２の上面に対する傾斜角度が大きくなることを表している。また、半田フィレット３１の長さが０．２５ｍｍ〜０．４５ｍｍ，及び０．７５ｍｍでは、接続パッド１１，１２沿い及び電極部２１，２２沿いの何れにもクラックが発生しているが、０．５５ｍｍ及び０．６５ｍｍでは、電極部２１，２２沿いにクラックが発生せず、接続パッド１１，１２沿いのみにクラックが発生している。   As shown in FIG. 5, it can be confirmed that the solder amount ratio increases as the length of the solder fillet 31 decreases. This indicates that as the length of the solder fillet 31 is shortened, the solder fillet 31 becomes thicker and the inclination angle with respect to the upper surfaces of the connection pads 11 and 12 becomes larger. Further, when the length of the solder fillet 31 is 0.25 mm to 0.45 mm and 0.75 mm, cracks are generated along the connection pads 11 and 12 and along the electrode portions 21 and 22. At 55 mm and 0.65 mm, cracks do not occur along the electrode portions 21 and 22, and cracks occur only along the connection pads 11 and 12.

図６は、電極（電極部２１，２２）沿いのクラックの発生割合と、半田フィレット３１の長さとの関係を説明する図である。図６に示す比較結果は、電極沿いクラック発生割合を縦軸、半田フィレット３１の長さを横軸に示している。同図に示すように、半田フィレット３１の長さＫが０．２５ｍｍでは発生したクラックの約９０％が電極沿いとなっている。そして、半田フィレット３１の長さが０．３５ｍｍ，０．４５ｍｍと長くなるにつれて電極沿いクラックの発生割合は小さくなり、半田フィレット３１の長さ０．５５ｍｍ及び０．６５ｍｍでは、電極沿いクラックが発生していない。つまり、半田フィレット３１の長さ０．５５ｍｍ〜０．６５ｍｍの間では、電極沿いクラックの発生を確認できていない。また、半田フィレット３１の長さが０．６５ｍｍを越えて０．７５ｍｍになると再び電極沿いクラックが５０％の割合で発生している。   FIG. 6 is a diagram for explaining the relationship between the rate of occurrence of cracks along the electrodes (electrode portions 21 and 22) and the length of the solder fillet 31. FIG. The comparison results shown in FIG. 6 show the crack generation rate along the electrode on the vertical axis and the length of the solder fillet 31 on the horizontal axis. As shown in the figure, when the length K of the solder fillet 31 is 0.25 mm, about 90% of the generated cracks are along the electrodes. As the length of the solder fillet 31 is increased to 0.35 mm and 0.45 mm, the rate of occurrence of cracks along the electrode decreases, and when the length of the solder fillet 31 is 0.55 mm and 0.65 mm, cracks along the electrode are generated. Not done. That is, the occurrence of cracks along the electrode is not confirmed when the length of the solder fillet 31 is between 0.55 mm and 0.65 mm. Moreover, when the length of the solder fillet 31 exceeds 0.75 mm beyond 0.65 mm, cracks along the electrodes again occur at a rate of 50%.

このように、上述した条件の下では、半田フィレット３１の長さ、つまり、載置面１３の周縁部から抜き部１４の側縁部までの距離Ｋを０．５５ｍｍ〜０．６５ｍｍの何れかに設定することにより、電極部２１，２２沿いクラックの発生し難い断面形状の半田フィレット３１を形成できることが確認できる。従って、上述した条件を有する電子部品２及び接続パッド１１，１２においては、載置面１３の周縁部から抜き部１４の側縁部までの距離Ｋを０．５５ｍｍ〜０．６５ｍｍの何れかに設定することにより、電子部品２の電極部２１，２２を適切に半田付けできることが確認された。   Thus, under the above-described conditions, the length of the solder fillet 31, that is, the distance K from the peripheral edge of the mounting surface 13 to the side edge of the extraction part 14 is any of 0.55 mm to 0.65 mm. It can be confirmed that the solder fillet 31 having a cross-sectional shape in which cracks hardly occur along the electrode portions 21 and 22 can be formed. Therefore, in the electronic component 2 and the connection pads 11 and 12 having the above-described conditions, the distance K from the peripheral edge portion of the mounting surface 13 to the side edge portion of the extraction portion 14 is any of 0.55 mm to 0.65 mm. It was confirmed that the electrode parts 21 and 22 of the electronic component 2 can be appropriately soldered by setting.

従って、電極部２１の厚さＨ＝１．１５ｍｍであるときは傾斜角度θが２０°〜３０°の範囲に収まるように、距離Ｋ＝Ｈｔａｎ２５°＝０．５３６（約０．５５）ｍｍ〜Ｈｔａｎ３０°＝０．６６７（約０．６５）ｍｍの何れかに設定することにより、電子部品２の電極部２１，２２を適切に半田付けできることが明らかになった。   Therefore, when the thickness H of the electrode portion 21 is 1.15 mm, the distance K = H tan 25 ° = 0.536 (about 0.55) mm so that the inclination angle θ falls within the range of 20 ° to 30 °. It has been clarified that the electrode portions 21 and 22 of the electronic component 2 can be appropriately soldered by setting any one of Htan30 ° = 0.667 (about 0.65) mm.

本発明の一実施形態のプリント配線基板が備える接続パッドの構成の概略を示す図である。It is a figure which shows the outline of a structure of the connection pad with which the printed wiring board of one Embodiment of this invention is provided. 図１に示す接続パッドに電子部品の電極部が半田付けされる状態を説明する図である。It is a figure explaining the state by which the electrode part of an electronic component is soldered to the connection pad shown in FIG. 接続パッドの構成の変形例を示す図である。It is a figure which shows the modification of a structure of a connection pad. 半田フィレットでのクラック発生位置と残存率との関係を説明する図である。It is a figure explaining the relationship between the crack generation position and residual rate in a solder fillet. 半田量割合と半田フィレットの長さとの関係と、クラック発生位置との関係を説明する図である。It is a figure explaining the relationship between a solder amount ratio and the length of a solder fillet, and a relationship with a crack generation position. 電極部沿いのクラックの発生割合と、半田フィレットの長さとの関係を説明する図である。It is a figure explaining the relationship between the generation rate of the crack along an electrode part, and the length of a solder fillet.

符号の説明Explanation of symbols

１ プリント配線基板
１１，１２ 接続パッド
２ 電子部品
２１，２２ 電極部
２３ 載置面
２４ 抜き部
３ クリーム半田の層
３１ 半田フィレット DESCRIPTION OF SYMBOLS 1 Printed wiring board 11 and 12 Connection pad 2 Electronic component 21 and 22 Electrode part 23 Mounting surface 24 Extraction part 3 Cream solder layer 31 Solder fillet

Claims (5)

実装部品の備える電極部が半田付けされる、配線基板のパッド構造であって、
半田付け用の金属箔を備えていない抜き部を、前記電極部が載置される載置面から所定距離離れた位置に、前記載置面の周縁に沿って延設したことを特徴とする配線基板のパッド構造。 A wiring board pad structure to which the electrode part of the mounting component is soldered,
The extraction part not provided with the metal foil for soldering is extended along the peripheral edge of the mounting surface described above at a position away from the mounting surface on which the electrode part is mounted. Wiring board pad structure. 前記抜き部は、前記電極部の厚さＨに対して、前記載置面の周縁から前記載置面の外側に向けて距離Ｋ＝Ｈｔａｎ２５°〜Ｈｔａｎ４５°の範囲の中の何れかの距離だけ離れた位置に、前記載置面側の縁部を位置させていることを特徴とする請求項１に記載の配線基板のパッド構造。   The punched portion is a distance K = Htan25 ° to Htan45 ° from the periphery of the mounting surface to the outside of the mounting surface with respect to the thickness H of the electrode portion. 2. The pad structure for a wiring board according to claim 1, wherein an edge portion on the mounting surface side is located at a distant position. 前記抜き部を、前記載置面の周縁に沿って複数設けたことを特徴とする請求項１又は請求項２に記載の配線基板のパッド構造。   The pad structure of the wiring board according to claim 1, wherein a plurality of the extracted portions are provided along a peripheral edge of the placement surface. 請求項１から請求項３の何れかに記載の配線基板のパッド構造を備えたことを特徴とする配線基板。   A wiring board comprising the pad structure of the wiring board according to any one of claims 1 to 3. 請求項１から請求項３の何れかに記載の配線基板のパッド構造を用いて、実装部品の電極部を配線基板に半田付けして取り付けた電極部の取付構造であって、
前記電極部を前記配線基板に接続した半田フィレットの表面が、前記電極部の載置面に垂直な方向に対して２５°〜４５°の何れかの角度で、前記電極部の上端部から前記抜き部側に向けて下降傾斜していることを特徴とする電極部の取付構造。 Using the wiring board pad structure according to any one of claims 1 to 3, an electrode part mounting structure in which an electrode part of a mounting component is soldered to a wiring board.
The surface of the solder fillet connecting the electrode part to the wiring board is at an angle of 25 ° to 45 ° with respect to the direction perpendicular to the mounting surface of the electrode part from the upper end of the electrode part. An electrode part mounting structure characterized by being inclined downward toward the extraction part side.
JP2007185970A 2007-07-17 2007-07-17 Pad structure of wiring board, wiring board, and attaching structure of electrode portion Pending JP2009026817A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015087692A1 (en) * 2013-12-09 2015-06-18 株式会社 豊田自動織機 Substrate onto which to mount electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015087692A1 (en) * 2013-12-09 2015-06-18 株式会社 豊田自動織機 Substrate onto which to mount electronic component

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