JP2008512864A - 電気的な構成要素を準備するためのウエハテーブル及び構成要素を基板に装着するための装置 - Google Patents
電気的な構成要素を準備するためのウエハテーブル及び構成要素を基板に装着するための装置 Download PDFInfo
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- JP2008512864A JP2008512864A JP2007530723A JP2007530723A JP2008512864A JP 2008512864 A JP2008512864 A JP 2008512864A JP 2007530723 A JP2007530723 A JP 2007530723A JP 2007530723 A JP2007530723 A JP 2007530723A JP 2008512864 A JP2008512864 A JP 2008512864A
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- 239000000758 substrate Substances 0.000 title claims description 20
- 238000009434 installation Methods 0.000 claims description 8
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
- Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53478—Means to assemble or disassemble with magazine supply
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
図1は、本発明に基づくウエハテーブルを備えた実装装置の側面図であり、
図2は、図1のII−II線に沿った断面図である。
回転円板26は、ウエハ25に対して垂直な回転軸を有していて、回転駆動部(図示省略)に連結されており、回転駆動部は回転円板26の回動を小さな回転量(ステップ角)で可能にするものである。回転円板26は、往復台20上に支承されており、該往復台(キャリッジ[carriage])は定位置のリニアガイド11に移動可能に配置されていて、直線駆動部(図示省略)によって微細に精度良く移動させられるようになっている。
Claims (6)
- ウエハ(25)の電気的な構成要素(2)を準備するためのウエハテーブル(21)であって、ウエハはウエハテーブル(21)の回転円板(26)上に載せられるようになっており、回転円板(26)は、構成要素(2)を所定の取り出し位置に到達させるために、ウエハ平面に対して平行に不連続のステップで運動させられるようになっており、前記取り出し位置に対応して少なくとも1つの補助装置を定位置に設けてある形式のものにおいて、回転円板(26)は微動操作可能な第1の回転駆動部によって回動させられるようになっており、回転円板(26)は、定位置のリニアガイド(11)に沿って移動可能な往復台(20)に支承されており、往復台は微動操作可能な直線駆動部によってウエハ(25)に対して平行に移動させられるようになっており、前記第1の回転駆動部と前記直線駆動部とは、各構成要素(2)を所定の取り出し位置に到達させるように位置決めされていることを特徴とする、電気的な構成要素を準備するためのウエハテーブル。
- 補助装置は、構成要素をウエハ(25)の支持シートから分離するためのエジェクタ(28)として形成されていて、かつロータ(29)を有しており、ロータ(29)はウエハ平面に対して垂直な回転軸を有し、かつ構成要素(2)のための互いに離間された少なくとも2つの押し出しニードル(27)を備えており、ロータ(29)は回転円板の角度位置に相応して微動回転させられるようになっている請求項1に記載のウエハテーブル。
- 取り出し位置に別の補助装置を設けてあり、該補助装置は、構成要素(2)の受容及び反転のための定位置の反転装置(16)として形成されている請求項1又は2に記載のウエハテーブル。
- 基板(1)に、請求項1、2又は3に記載のウエハテーブル上に準備された電気的な構成要素を実装ヘッド(3)によって装着するための装置であって、前記実装ヘッドは、基板(1)に対して平行に移動させられるようになっていて、かつ構成要素(2)のための少なくとも1つのグリッパ(7)を備えており、基板(1)は第1の座標軸Xの方向で該装置を通して搬送されるようになっている形式のものにおいて、グリッパ(7)は微動操作可能な第2の回転駆動部に連結されており、往復台(20)は第1の座標軸(x)に対して実質的に垂直な第2の座標軸(y)の方向で移動させられるようになっていることを特徴とする、構成要素を基板に装着するための装置。
- 構成要素を基板に装着するための装置は、グリッパ(7)における構成要素(2)の位置の検出のためのカメラ(19)を備えている請求項4に記載の装置。
- 実装ヘッド(3)のアクセス領域(24)内でウエハテーブル(21)に並べて、異なる形式の供給装置(15)のための設置箇所を設けてある請求項4又は5に記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005003454 | 2005-01-25 | ||
PCT/EP2006/050058 WO2006079577A2 (de) | 2005-01-25 | 2006-01-05 | Wafertisch zum bereitstellen von elektrischen bauelementen und vorrichtung zum bestücken von substraten mit den bauelementen |
Publications (2)
Publication Number | Publication Date |
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JP2008512864A true JP2008512864A (ja) | 2008-04-24 |
JP4518513B2 JP4518513B2 (ja) | 2010-08-04 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007530723A Active JP4518513B2 (ja) | 2005-01-25 | 2006-01-05 | 電気的な構成要素を準備するためのウエハテーブル及び構成要素を基板に装着するための装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7913380B2 (ja) |
EP (1) | EP1771877B1 (ja) |
JP (1) | JP4518513B2 (ja) |
KR (1) | KR100853887B1 (ja) |
CN (1) | CN100461999C (ja) |
AT (1) | ATE388486T1 (ja) |
DE (1) | DE502006000431D1 (ja) |
WO (1) | WO2006079577A2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20110248738A1 (en) * | 2010-04-12 | 2011-10-13 | Sze Chak Tong | Testing apparatus for electronic devices |
CN106064305B (zh) * | 2016-07-20 | 2023-10-27 | 梁启明 | 单翼片静脉针组装机 |
DE102018128616A1 (de) * | 2018-06-24 | 2019-12-24 | Besi Switzerland Ag | Vorrichtung und Verfahren zum Ablösen eines Chips von einer Klebefolie |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06169002A (ja) * | 1992-11-30 | 1994-06-14 | Shibuya Kogyo Co Ltd | ボンダにおけるウエハからのチップ供給装置 |
JP2002111289A (ja) * | 2000-09-27 | 2002-04-12 | Matsushita Electric Ind Co Ltd | チップの供給装置および実装方法 |
JP2003318225A (ja) * | 2002-04-22 | 2003-11-07 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
Family Cites Families (11)
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JPS60207349A (ja) * | 1984-03-31 | 1985-10-18 | Toshiba Seiki Kk | ペレツトの選別摘出装置 |
JP2725702B2 (ja) * | 1988-08-22 | 1998-03-11 | 松下電器産業株式会社 | 電子部品実装方法 |
JP3529820B2 (ja) * | 1994-02-02 | 2004-05-24 | 株式会社東芝 | 半導体ペレットのピックアップ方法 |
JP3132353B2 (ja) * | 1995-08-24 | 2001-02-05 | 松下電器産業株式会社 | チップの搭載装置および搭載方法 |
WO1998044521A1 (fr) * | 1997-03-28 | 1998-10-08 | Migaku Takahashi | Procede de fabrication d'un element a magnetoresistance |
EP0971390A1 (de) * | 1998-07-07 | 2000-01-12 | ESEC Management SA | Einrichtung zum Transportieren von integrierten Schaltungen |
JP4469503B2 (ja) | 1998-09-01 | 2010-05-26 | パナソニック株式会社 | バンプ接合判定装置及び方法、並びに半導体部品製造装置及び方法 |
US6839959B1 (en) * | 1999-05-06 | 2005-01-11 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus |
US6543513B1 (en) * | 2000-11-27 | 2003-04-08 | Asm Assembly Automation Ltd. | Wafer table for die bonding apparatus |
JP2004103923A (ja) * | 2002-09-11 | 2004-04-02 | Tdk Corp | 電子部品の実装装置および実装方法 |
JP2004203923A (ja) * | 2002-12-24 | 2004-07-22 | Nof Corp | シリコーン樹脂組成物および用途 |
-
2006
- 2006-01-05 AT AT06700043T patent/ATE388486T1/de not_active IP Right Cessation
- 2006-01-05 US US11/662,038 patent/US7913380B2/en not_active Expired - Fee Related
- 2006-01-05 EP EP06700043A patent/EP1771877B1/de active Active
- 2006-01-05 WO PCT/EP2006/050058 patent/WO2006079577A2/de active IP Right Grant
- 2006-01-05 JP JP2007530723A patent/JP4518513B2/ja active Active
- 2006-01-05 KR KR1020077004951A patent/KR100853887B1/ko active IP Right Grant
- 2006-01-05 DE DE502006000431T patent/DE502006000431D1/de active Active
- 2006-01-05 CN CNB200680000795XA patent/CN100461999C/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06169002A (ja) * | 1992-11-30 | 1994-06-14 | Shibuya Kogyo Co Ltd | ボンダにおけるウエハからのチップ供給装置 |
JP2002111289A (ja) * | 2000-09-27 | 2002-04-12 | Matsushita Electric Ind Co Ltd | チップの供給装置および実装方法 |
JP2003318225A (ja) * | 2002-04-22 | 2003-11-07 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
Also Published As
Publication number | Publication date |
---|---|
US20080089762A1 (en) | 2008-04-17 |
KR20070088500A (ko) | 2007-08-29 |
CN101019477A (zh) | 2007-08-15 |
JP4518513B2 (ja) | 2010-08-04 |
DE502006000431D1 (de) | 2008-04-17 |
EP1771877A2 (de) | 2007-04-11 |
CN100461999C (zh) | 2009-02-11 |
WO2006079577A3 (de) | 2007-01-18 |
ATE388486T1 (de) | 2008-03-15 |
WO2006079577A2 (de) | 2006-08-03 |
US7913380B2 (en) | 2011-03-29 |
EP1771877B1 (de) | 2008-03-05 |
KR100853887B1 (ko) | 2008-08-25 |
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