JP2008277340A - 配線金属板 - Google Patents
配線金属板 Download PDFInfo
- Publication number
- JP2008277340A JP2008277340A JP2007115902A JP2007115902A JP2008277340A JP 2008277340 A JP2008277340 A JP 2008277340A JP 2007115902 A JP2007115902 A JP 2007115902A JP 2007115902 A JP2007115902 A JP 2007115902A JP 2008277340 A JP2008277340 A JP 2008277340A
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- JP
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- Prior art keywords
- wiring
- soldering
- metal plate
- acceleration sensor
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2081—Compound repelling a metal, e.g. solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
【解決手段】本発明の加速度センサ装置1は、加速度センサ素子100と、コンデンサ101、102と、コネクタターミナル105〜108と、ターミナル109、110とを備えている。コネクタターミナル107及びターミナル109、110は、はんだ付け部107a、107b、109a、110aと、配線部107c、109b、110bとを備えている。はんだ付け部に隣接する部分には、はんだ付け部より幅の狭い狭幅部107d、107e、109c、110cが形成されている。コンデンサ101、102は、はんだ付け部にはんだ付けされている。そのため、狭幅部によって、溶融したはんだの流れを抑えることができる。従って、ソルダレジスト層を形成することなく、コンデンサを確実にはんだ付けすることができ、コストを抑えられる。
【選択図】図2
Description
まず、図1及び図2を参照して加速度センサ装置の構成について説明する。ここで、図1は、第1実施形態における加速度センサ装置の断面図である。図2は、リッドを外した状態での加速度センサ装置の背面図である。
次に、第2実施形態の加速度センサ装置について説明する。第2実施形態の加速度センサ装置は、第1実施形態の加速度センサ装置に対して、狭幅部を壁部に変更したものである。
次に、第3実施形態の加速度センサ装置について説明する。第3実施形態の加速度センサ装置は、第1実施形態の加速度センサ装置に対して、狭幅部を溝部に変更したものである。
次に、第4実施形態の加速度センサ装置について説明する。第4実施形態の加速度センサ装置は、第1実施形態の加速度センサ装置に対して、狭幅部を、はんだ付け部の材質に比べはんだ流れの悪い材質からなるめっき層に変更にしたものである。
Claims (6)
- 電子部品をはんだ付けするはんだ付け部と、前記はんだ付け部から延在し、はんだ付けされた前記電子部品を配線する配線部とからなる配線金属板において、
前記配線部は、前記はんだ付け部に隣接する部分に、前記はんだ付け部に比べ幅の狭い狭幅部を有することを特徴とする配線金属板。 - 前記狭幅部は、前記配線部に切欠き及び貫通孔の少なくともいずれかを設けることによって形成されていることを特徴とする請求項1に記載の配線金属板。
- 電子部品をはんだ付けするはんだ付け部と、前記はんだ付け部から延在し、はんだ付けされた前記電子部品を配線する配線部とからなる配線金属板において、
前記配線部は、前記はんだ付け部に隣接する部分に立設された、前記はんだ付け部に比べ高さの高い壁部を有することを特徴とする配線金属板。 - 前記壁部は、前記配線部を屈曲して形成されていることを特徴とする請求項3に記載の配線金属板。
- 電子部品をはんだ付けするはんだ付け部と、前記はんだ付け部から延在し、はんだ付けされた前記電子部品を配線する配線部とからなる配線金属板において、
前記配線部は、前記はんだ付け部に隣接する部分に、溝部を有することを特徴とする配線金属板。 - 電子部品をはんだ付けするはんだ付け部と、前記はんだ付け部から延在し、はんだ付けされた前記電子部品を配線する配線部とからなる配線金属板において、
前記配線部は、前記はんだ付け部に隣接する部分の表面に、前記はんだ付け部の材質に比べはんだ流れの悪い材質からなるめっき層を有することを特徴とする配線金属板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007115902A JP2008277340A (ja) | 2007-04-25 | 2007-04-25 | 配線金属板 |
EP08007115.2A EP1986478B1 (en) | 2007-04-25 | 2008-04-10 | Metal wiring plate |
US12/148,804 US8053685B2 (en) | 2007-04-25 | 2008-04-22 | Metal wiring plate |
CNA2008100946395A CN101295820A (zh) | 2007-04-25 | 2008-04-24 | 金属布线板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007115902A JP2008277340A (ja) | 2007-04-25 | 2007-04-25 | 配線金属板 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009093083A Division JP4569704B2 (ja) | 2009-04-07 | 2009-04-07 | 配線金属板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008277340A true JP2008277340A (ja) | 2008-11-13 |
Family
ID=39650939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007115902A Abandoned JP2008277340A (ja) | 2007-04-25 | 2007-04-25 | 配線金属板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8053685B2 (ja) |
EP (1) | EP1986478B1 (ja) |
JP (1) | JP2008277340A (ja) |
CN (1) | CN101295820A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014216560A (ja) * | 2013-04-26 | 2014-11-17 | 株式会社デンソー | 多層基板およびこれを用いた電子装置 |
WO2015087692A1 (ja) * | 2013-12-09 | 2015-06-18 | 株式会社 豊田自動織機 | 電子部品実装用基板 |
JP2015181269A (ja) * | 2015-05-21 | 2015-10-15 | 京セラクリスタルデバイス株式会社 | 圧電装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014060211A (ja) * | 2012-09-14 | 2014-04-03 | Omron Corp | 基板構造、半導体チップの実装方法及びソリッドステートリレー |
JP5516696B2 (ja) | 2012-11-01 | 2014-06-11 | 株式会社豊田自動織機 | 基板 |
DE102013101315A1 (de) | 2013-02-11 | 2014-08-14 | Endress + Hauser Gmbh + Co. Kg | Verfahren zur Verlötung eines Anschlusselement |
KR20150026053A (ko) * | 2013-08-30 | 2015-03-11 | 삼성전자주식회사 | 수동 소자를 구비한 반도체 패키지 및 그 제조방법 |
EP3232751B1 (de) * | 2016-04-12 | 2018-07-18 | MD Elektronik GmbH | Elektrische steckkupplungsvorrichtung |
JP7456977B2 (ja) * | 2021-06-30 | 2024-03-27 | 矢崎総業株式会社 | フレキシブルプリント配線板 |
DE102022107337A1 (de) * | 2022-03-29 | 2023-10-05 | Kiekert Aktiengesellschaft | Kraftfahrzeug-technische elektrische Bauelementanordnung |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1416671A (en) * | 1973-02-14 | 1975-12-03 | Siemens Ag | Layer circuits |
US4210926A (en) * | 1977-12-07 | 1980-07-01 | Siemens Aktiengesellschaft | Intermediate member for mounting and contacting a semiconductor body |
JPS54111756A (en) | 1978-02-22 | 1979-09-01 | Hitachi Ltd | Forming method of fluorescent film for color with black matrix |
JPS54161069A (en) | 1978-06-12 | 1979-12-20 | Fujitsu Ltd | Antiifluidization method of solder |
JPS5936268A (ja) | 1982-08-23 | 1984-02-28 | Konishiroku Photo Ind Co Ltd | トナ−受入れ装置 |
JPS5996869A (ja) | 1982-11-24 | 1984-06-04 | M Syst Giken:Kk | 三相交流負荷の制御装置 |
JPS59107769A (ja) | 1982-12-10 | 1984-06-22 | Fujitsu Ltd | 半田流れ防止域の形成方法 |
JPS5996869U (ja) * | 1982-12-20 | 1984-06-30 | 三洋電機株式会社 | チツプ状回路部品の取付装置 |
JPS60116273A (ja) | 1983-11-28 | 1985-06-22 | Fuji Xerox Co Ltd | カラ−画像読取装置 |
JPS6280321A (ja) | 1985-10-01 | 1987-04-13 | Tsubakimoto Chain Co | 歯付ベルト |
JPH05167234A (ja) | 1991-12-13 | 1993-07-02 | Nippondenso Co Ltd | 回路構成電子部品 |
US6828668B2 (en) * | 1994-07-07 | 2004-12-07 | Tessera, Inc. | Flexible lead structures and methods of making same |
JP3843514B2 (ja) * | 1995-12-15 | 2006-11-08 | イビデン株式会社 | 電子部品搭載用基板及びその製造方法 |
FR2748105B1 (fr) * | 1996-04-25 | 1998-05-29 | Siemens Automotive Sa | Capteur magnetique et procede de realisation d'un tel capteur |
US5804880A (en) * | 1996-11-04 | 1998-09-08 | National Semiconductor Corporation | Solder isolating lead frame |
US6324754B1 (en) * | 1998-03-25 | 2001-12-04 | Tessera, Inc. | Method for fabricating microelectronic assemblies |
US6409073B1 (en) * | 1998-07-15 | 2002-06-25 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Method for transfering solder to a device and/or testing the device |
JP2003124416A (ja) | 2001-10-16 | 2003-04-25 | Yazaki Corp | チップ部品のバスバーへの接合構造 |
JP2004140226A (ja) * | 2002-10-18 | 2004-05-13 | Yazaki Corp | チップ部品のバスバーへの接合構造 |
JP2004200464A (ja) | 2002-12-19 | 2004-07-15 | Anden | 金属配線板 |
JP2004363488A (ja) * | 2003-06-06 | 2004-12-24 | Yazaki Corp | 金属同士の半田接続構造 |
-
2007
- 2007-04-25 JP JP2007115902A patent/JP2008277340A/ja not_active Abandoned
-
2008
- 2008-04-10 EP EP08007115.2A patent/EP1986478B1/en not_active Expired - Fee Related
- 2008-04-22 US US12/148,804 patent/US8053685B2/en not_active Expired - Fee Related
- 2008-04-24 CN CNA2008100946395A patent/CN101295820A/zh active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014216560A (ja) * | 2013-04-26 | 2014-11-17 | 株式会社デンソー | 多層基板およびこれを用いた電子装置 |
WO2015087692A1 (ja) * | 2013-12-09 | 2015-06-18 | 株式会社 豊田自動織機 | 電子部品実装用基板 |
JP2015181269A (ja) * | 2015-05-21 | 2015-10-15 | 京セラクリスタルデバイス株式会社 | 圧電装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1986478B1 (en) | 2015-12-09 |
CN101295820A (zh) | 2008-10-29 |
US8053685B2 (en) | 2011-11-08 |
EP1986478A3 (en) | 2009-12-30 |
US20080264683A1 (en) | 2008-10-30 |
EP1986478A2 (en) | 2008-10-29 |
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