JP2008274019A - 異方導電性フィルム及び接続構造体 - Google Patents
異方導電性フィルム及び接続構造体 Download PDFInfo
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- JP2008274019A JP2008274019A JP2007115929A JP2007115929A JP2008274019A JP 2008274019 A JP2008274019 A JP 2008274019A JP 2007115929 A JP2007115929 A JP 2007115929A JP 2007115929 A JP2007115929 A JP 2007115929A JP 2008274019 A JP2008274019 A JP 2008274019A
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- conductive film
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- 229920000058 polyacrylate Polymers 0.000 claims abstract description 49
- 229920000800 acrylic rubber Polymers 0.000 claims abstract description 48
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 46
- 239000010419 fine particle Substances 0.000 claims abstract description 36
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 35
- 239000000203 mixture Substances 0.000 claims abstract description 28
- 239000002245 particle Substances 0.000 claims abstract description 18
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 16
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 16
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 16
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- -1 acrylic ester Chemical class 0.000 claims description 24
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 19
- 239000011574 phosphorus Substances 0.000 claims description 19
- 229910052698 phosphorus Inorganic materials 0.000 claims description 19
- 239000013034 phenoxy resin Substances 0.000 claims description 10
- 229920006287 phenoxy resin Polymers 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 32
- 230000001070 adhesive effect Effects 0.000 description 32
- 230000000052 comparative effect Effects 0.000 description 13
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 11
- 239000003999 initiator Substances 0.000 description 7
- 150000002978 peroxides Chemical class 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 125000005396 acrylic acid ester group Chemical group 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- AGKBXKFWMQLFGZ-UHFFFAOYSA-N (4-methylbenzoyl) 4-methylbenzenecarboperoxoate Chemical compound C1=CC(C)=CC=C1C(=O)OOC(=O)C1=CC=C(C)C=C1 AGKBXKFWMQLFGZ-UHFFFAOYSA-N 0.000 description 1
- TVWBTVJBDFTVOW-UHFFFAOYSA-N 2-methyl-1-(2-methylpropylperoxy)propane Chemical compound CC(C)COOCC(C)C TVWBTVJBDFTVOW-UHFFFAOYSA-N 0.000 description 1
- KFGFVPMRLOQXNB-UHFFFAOYSA-N 3,5,5-trimethylhexanoyl 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOC(=O)CC(C)CC(C)(C)C KFGFVPMRLOQXNB-UHFFFAOYSA-N 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
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- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/066—Copolymers with monomers not covered by C08L33/06 containing -OH groups
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/254—Polymeric or resinous material
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Abstract
【解決手段】 熱硬化型アクリル樹脂組成物からなる異方導電性フィルムにおいて、当該組成物が、少なくとも(A)熱硬化剤、(B)熱硬化性成分、(C)水酸基を含有するアクリルゴム、(D)有機微粒子、及び(E)導電性粒子を含み、上記(B)熱硬化性成分には、(b1)リン含有アクリル酸エステルを含み、上記(C)水酸基を含有するアクリルゴムの重量平均分子量が100万以上であり、上記(D)有機微粒子には、(d1)ポリブタジエン系微粒子を含む。
【選択図】 図1
Description
表1により配合した組成物を目視で評価した。水酸基を含有するアクリルゴムが溶解し、完全に分散された状態を○、水酸基を含有するアクリルゴムが一部溶解しない場合を△、水酸基を含有するアクリルゴムが不溶の場合を×とした。
表1の配合比からなる異方導電性フィルムを各々0.7mm厚のガラスにITO膜を付けたITOガラスに仮設置した。続けて50μmピッチのFPC(フレキシブルプリント配線板)と上述のITOガラスを、異方導電性フィルムを介して接着させ、加熱・加圧圧着させた(ツール温度:160℃、圧力:4MPa、圧着時間:4秒)。圧着させたFPCを幅10mmに切断し、FPCの端部をITOガラス面に対して90°方向に引張り試験機(テンシオロン、オリエンテック社製)を用いて引き上げ、接着強度を測定した。接着強度については、表1に示す。
Claims (4)
- 熱硬化型アクリル樹脂組成物からなる異方導電性フィルムにおいて、当該組成物が、少なくとも(A)熱硬化剤、(B)熱硬化性成分、(C)水酸基を含有するアクリルゴム、(D)有機微粒子、及び(E)導電性粒子を含み、
上記(B)熱硬化性成分には、(b1)リン含有アクリル酸エステルを含み、
上記(C)水酸基を含有するアクリルゴムの重量平均分子量が100万以上であり、
上記(D)有機微粒子には、(d1)ポリブタジエン系微粒子を含む異方導電性フィルム。 - 上記(C)水酸基を含有するアクリルゴム、上記(b1)リン含有アクリル酸エステル、及び上記(d1)ポリブタジエン系微粒子の重量を、それぞれX,Y,及びZとした場合に、それら3成分の重量比が、X:Y:Z=2:0.05:10〜8:0.05:16である請求項1記載の異方導電性フィルム。
- さらに、(F)フェノキシ樹脂を含む請求項1に記載の異方導電性フィルム。
- 請求項1乃至請求項3のいずれか1項に記載の異方導電性フィルムにより、電極パターンが形成された基板と、電子部品とを接続してなる接続構造体。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007115929A JP5222490B2 (ja) | 2007-04-25 | 2007-04-25 | 異方導電性フィルム及び接続構造体 |
TW97112609A TWI388645B (zh) | 2007-04-25 | 2008-04-08 | An anisotropic conductive film and a connecting structure |
CN2008800004109A CN101542845B (zh) | 2007-04-25 | 2008-04-22 | 各向异性导电性膜及连接结构体 |
PCT/JP2008/057780 WO2008133253A1 (ja) | 2007-04-25 | 2008-04-22 | 異方導電性フィルム及び接続構造体 |
KR1020087029741A KR101434688B1 (ko) | 2007-04-25 | 2008-04-22 | 이방 도전성 필름 및 접속 구조체 |
US12/302,640 US8361614B2 (en) | 2007-04-25 | 2008-04-22 | Anisotropic electrically conductive film and connection structure |
HK09111729A HK1134378A1 (en) | 2007-04-25 | 2009-12-14 | Anisotropic conductive film and connection structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007115929A JP5222490B2 (ja) | 2007-04-25 | 2007-04-25 | 異方導電性フィルム及び接続構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008274019A true JP2008274019A (ja) | 2008-11-13 |
JP5222490B2 JP5222490B2 (ja) | 2013-06-26 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007115929A Active JP5222490B2 (ja) | 2007-04-25 | 2007-04-25 | 異方導電性フィルム及び接続構造体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8361614B2 (ja) |
JP (1) | JP5222490B2 (ja) |
KR (1) | KR101434688B1 (ja) |
CN (1) | CN101542845B (ja) |
HK (1) | HK1134378A1 (ja) |
TW (1) | TWI388645B (ja) |
WO (1) | WO2008133253A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014201657A (ja) * | 2013-04-04 | 2014-10-27 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
WO2018055890A1 (ja) * | 2016-09-20 | 2018-03-29 | 大阪有機化学工業株式会社 | (メタ)アクリル系導電性材料 |
KR20190060810A (ko) | 2016-10-03 | 2019-06-03 | 히타치가세이가부시끼가이샤 | 도전성 필름, 권회체, 접속 구조체 및 접속 구조체의 제조 방법 |
JP2019104869A (ja) * | 2017-12-14 | 2019-06-27 | 日立化成株式会社 | 回路接続用接着剤組成物及び回路接続構造体 |
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KR101154565B1 (ko) * | 2006-02-14 | 2012-06-08 | 엘지이노텍 주식회사 | 다층 연성회로기판 및 그 제조 방법 |
US8384114B2 (en) | 2009-06-27 | 2013-02-26 | Cooledge Lighting Inc. | High efficiency LEDs and LED lamps |
CN102686690A (zh) * | 2009-11-17 | 2012-09-19 | 日立化成工业株式会社 | 电路连接材料、使用其的连接结构体以及临时压接方法 |
US9480133B2 (en) | 2010-01-04 | 2016-10-25 | Cooledge Lighting Inc. | Light-emitting element repair in array-based lighting devices |
US8653539B2 (en) | 2010-01-04 | 2014-02-18 | Cooledge Lighting, Inc. | Failure mitigation in arrays of light-emitting devices |
KR101372084B1 (ko) | 2010-06-29 | 2014-03-07 | 쿨레지 라이팅 인크. | 항복형 기판을 갖는 전자 장치 |
JP5773782B2 (ja) * | 2011-07-03 | 2015-09-02 | 日本化薬株式会社 | 新規(メタ)アクリル樹脂及びそれを用いた樹脂組成物 |
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JPWO2018055890A1 (ja) * | 2016-09-20 | 2019-07-04 | 大阪有機化学工業株式会社 | (メタ)アクリル系導電性材料 |
KR20190060810A (ko) | 2016-10-03 | 2019-06-03 | 히타치가세이가부시끼가이샤 | 도전성 필름, 권회체, 접속 구조체 및 접속 구조체의 제조 방법 |
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US11667817B2 (en) | 2016-10-03 | 2023-06-06 | Showa Denko Materials Co., Ltd. | Electroconductive film, roll, connected structure, and process for producing connected structure |
KR20230148853A (ko) | 2016-10-03 | 2023-10-25 | 가부시끼가이샤 레조낙 | 도전성 필름, 권회체, 접속 구조체 및 접속 구조체의 제조 방법 |
JP2019104869A (ja) * | 2017-12-14 | 2019-06-27 | 日立化成株式会社 | 回路接続用接着剤組成物及び回路接続構造体 |
JP7039984B2 (ja) | 2017-12-14 | 2022-03-23 | 昭和電工マテリアルズ株式会社 | 回路接続用接着剤組成物及び回路接続構造体 |
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WO2008133253A1 (ja) | 2008-11-06 |
KR20100014076A (ko) | 2010-02-10 |
CN101542845A (zh) | 2009-09-23 |
US20090178834A1 (en) | 2009-07-16 |
JP5222490B2 (ja) | 2013-06-26 |
TWI388645B (zh) | 2013-03-11 |
HK1134378A1 (en) | 2010-04-23 |
KR101434688B1 (ko) | 2014-08-26 |
TW200904932A (en) | 2009-02-01 |
US8361614B2 (en) | 2013-01-29 |
CN101542845B (zh) | 2011-12-14 |
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