JP2008203089A - マルチチップ半導体装置およびその検査方法ならびに該マルチチップ半導体装置を組み込んだ電子機器 - Google Patents
マルチチップ半導体装置およびその検査方法ならびに該マルチチップ半導体装置を組み込んだ電子機器 Download PDFInfo
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Abstract
【解決手段】マルチチップ半導体装置に実装する半導体チップ11,12は、第1および第2接続用パッドを含む複数の接続用パッド15A,15B,15C,15Dと、第1接続用パッド15A,15Cに印加された信号と、半導体チップの出力信号を入力し、テストモード信号により一方を第2接続用パッド15B,15Dに出力する切換回路21A,21Bを備え、第1接続用パッド15A、15Cは外部端子14Aおよび他の半導体チップ12の第2接続用パッド15Bに接続され、第2接続用パッド15Dは外部端子14Bに接続するようにし、各半導体チップ11,12に接続されているテストモード信号を個別に操作することにより半導体チップ毎の個別の検査と、チップ間接続(18)の状態検査を可能にした。
【選択図】図1
Description
(a)請求項1記載の発明では、複数の半導体チップを内蔵したマルチチップ半導体装置に実装する半導体チップは、第1および第2接続用パッドを含む複数の接続用パッドと、前記第1接続用パッドに印加された信号と、出力信号を入力し、どちらか一方をテストモード信号に応じて切り換え、前記第2接続用パッドに出力する切換回路を1つ以上備えるようにした。
図1は、本発明の第1の実施例を示すマルチチップ半導体装置の模式図である。なお、図1では説明の都合上半導体チップを図5の如く平面に並べて記載しているが、もちろん図4の如く厚み方向に上下に重ねて実装した場合も同様である。
通常動作時には切換回路21A、21Bの制御入力には第1および第2テストモード信号を印加しない。すると、第1半導体チップ11の第2接続用パッド15Bからは第1半導体チップ11の出力信号1が出力され、第2半導体チップ12の第1接続用パッド15Cに入力され、第2半導体チップ12の内部回路へ送られる。また、第2半導体チップ12の第2接続用パッド15Dからは第2半導体チップ12の出力信号2が出力される。
第1半導体チップ11だけを検査する場合は、第1半導体チップ11内の切換回路21Aの制御入力には第1テストモード信号を印加せず、第2半導体チップ12内の切換回路21Bの制御入力には第2テストモード信号を印加する。
第2半導体チップ12だけを検査する場合は、第1半導体チップ11内の切換回路21Aの制御入力に第1テストモード信号を印加し、第2半導体チップ12内の切換回路21Bの制御入力には第2テストモード信号を印加しない。
第1接続用パッドと第2接続用パッド間を接続しているチップ間ワイヤー配線18の接続状態を検査する場合は、切換回路21Aと21Bに第1テストモード信号と第2テストモード信号をそれぞれ印加する。
図2は、本発明の第2の実施例を示すマルチチップ半導体装置の模式図である。図1と同様に、説明の便宜上半導体チップは図5のように平面に並べて記載しているが、第1の実施例と同様に図4のように厚み方向に上下に重なっていても構わない。なお、図1と同じ構成要素には同一の参照符号を付してある。
通常動作時には切換回路21Aから21Dの制御入力には第1および第2テストモード信号を印加しない。すると、各切換回路21Aから21Dの出力からはそれぞれ出力信号1から出力信号4が出力され、第1および第2半導体チップ11、12は連携した動作を行うことができ、その入出力信号は外部端子に14Aから14Dに接続されているので半導体装置10全体の検査が可能となる。
第1半導体チップ11だけを検査する場合は、第1半導体チップ11内の切換回路21Aと21Cの制御入力には第1テストモード信号を印加せず、第2半導体チップ12内の切換回路21Bと21Dの制御入力には第2テストモード信号を印加する。
第2半導体チップ12だけを検査する場合は、第1半導体チップ11内の切換回路21Aと21Cの制御入力に第1テストモード信号を印加し、第2半導体チップ12内の切換回路21Bと21Dの制御入力には第2テストモード信号を印加しない。すると、説明を省略するが第1半導体チップ11を検査する場合と同様の動作により、第1半導体チップ11の影響を受けることなく第2半導体チップ12の検査が可能となる。
第1接続用パッドと第2接続用パッド間を接続しているチップ間ワイヤー配線18Aと18Bの接続状態を検査する場合は、第1半導体チップの切換回路21Aと21Cに第1テストモード信号を、第2半導体チップの切換回路21Bと21Dに第2テストモード信号を印加する。
図3は、本発明の第3の実施例を示すマルチチップ半導体装置の模式図である。図1と同様に、説明の便宜上半導体チップは平面に並べて記載しているがもちろん厚み方向に上下に重なっていても構わない。なお、図1と同じ構成要素には同一の参照符号を付してある。
通常動作時には切換回路21Aから21Cの制御入力には第1から第3テストモード信号を印加しない。すると、各切換回路21Aから21Cの出力からはそれぞれ出力信号1から出力信号3が出力されるとともに、第1半導体チップ11の出力信号1が第3の半導体チップ23に入力され、第3半導体チップ23の出力信号3が第2半導体チップ12に入力され、これによって第1半導体チップ11、第3半導体チップ23、第2半導体チップ12は連携した動作を行うことができ、その入出力信号は外部端子14Aと14Bに接続されているので半導体装置10全体の検査が可能となる。
第1半導体チップ11だけを検査する場合は、第1半導体チップ11内の切換回路21Aの制御入力には第1テストモード信号を印加せず、第2および第3半導体チップ12、23内の切換回路21Bと21Cの制御入力には第2テストモード信号および第3テストモード信号をそれぞれ印加する。
第2半導体チップ12だけを検査する場合は、第1および第3半導体チップ11、23内の切換回路21Aと21Cの制御入力にそれぞれ第1および第3テストモード信号を印加し、第2半導体チップ12内の切換回路21Bの制御入力には第2テストモード信号を印加しない。
第3半導体チップ23だけを検査する場合は、第1および第2半導体チップ11、12内の切換回路21Aと21Bの制御入力にそれぞれ第1および第2テストモード信号を印加し、第3半導体チップ23内の切換回路21Cの制御入力には第3テストモード信号を印加しない。
第1接続用パッドと第2接続用パッド間を接続しているチップ間ワイヤー配線18A,18Bの接続状態を検査する場合は、第1から第3半導体チップ11,12,23の切換回路21Aから21Cの各々に第1から第3テストモード信号を印加する。
上述した第3の実施例では、第1の実施例において、第1半導体チップの第2接続用パッド15Bと、第2半導体チップの第1接続用パッド15Cの間に第3半導体チップを挿入する構成であるが、第4の実施例として、第2の実施例において、第1半導体チップの第2接続用パッド15Bと、第2半導体チップの第1接続用パッド15Cの間に第3半導体チップを挿入するような構成も可能である。
11:第1半導体チップ
12:第2半導体チップ
13:再配線基板
14A,14B,14C,14D:外部端子
15A,15C,15E,15G:第1接続用パッド
15B,15D,15F,15H:第2接続用パッド
18,18A,18B:チップ間ワイヤー配線
21A,21B,21C,21D:切換回路
23:第3半導体チップ
Claims (8)
- 複数の半導体チップを内蔵したマルチチップ半導体装置において、
前記半導体チップは、第1および第2接続用パッドを含む複数の接続用パッドと、前記第1接続用パッドに印加された信号と半導体チップの出力信号を入力し、テストモード信号に応じてどちらか一方の信号を前記第2接続用パッドに出力する1つ以上の切換回路を備えたことを特徴とするマルチチップ半導体装置。 - 請求項1に記載のマルチチップ半導体装置であって、
前記第1接続用パッドは前記半導体装置の外部端子もしくは他の前記半導体チップの前記第2接続用パッドに接続され、
前記第2接続用パッドは前記半導体装置の外部端子もしくは他の前記半導体チップの前記第1接続用パッドに接続されたことを特徴とするマルチチップ半導体装置。 - 請求項1または2に記載のマルチチップ半導体装置であって、
異なる前記半導体チップ間が前記第1および第2接続用パッドにより接続されており、該第1および第2接続用パッドは、前記半導体装置の外部端子には接続されていないことを特徴とするマルチチップ半導体装置。 - 請求項1から3のいずれかに記載のマルチチップ半導体装置であって、
前記半導体チップの前記第1接続用パッドは信号入力用パッドを兼用し、
前記第2接続用パッドは信号出力用パッドを兼用していることを特徴とするマルチチップ半導体装置。 - 請求項1から4のいずれかに記載のマルチチップ半導体装置を検査する検査方法であって、
前記マルチチップ半導体装置全体を検査する場合は、前記テストモード信号により、該半導体装置に内蔵されている全ての前記半導体チップ内にある前記切換回路の出力を当該半導体チップの出力信号にするようにしたことを特徴とするマルチチップ半導体装置の検査方法。 - 請求項1から4のいずれかに記載のマルチチップ半導体装置を検査する検査方法であって、
前記半導体置内の特定の半導体チップだけを検査する場合は、前記特定の半導体チップ内にある前記切換回路の出力を、前記特定の半導体チップのテストモード信号により、前記半導体チップの出力信号にするとともに、他の前記半導体チップ内にある前記切換回路の出力を、当該他の前記半導体チップのテストモード信号により、前記第1接続用パッドに印加された信号にしたことを特徴とするマルチチップ半導体装置の検査方法。 - 請求項1から4のいずれかに記載のマルチチップ半導体装置を検査する検査方法であって、
前記半導体置内の半導体チップ間の接続状態を検査する場合は、前記半導体装置に内蔵されている全ての半導体チップ内にある前記切換回路の出力を、前記テストモード信号により、前記半導体チップの第1接続用パッドに印加された信号にしたことを特徴とするマルチチップ半導体装置の検査方法。 - 請求項1から4のいずれかに記載のマルチチップ半導体装置を組み込んだことを特徴とする電子機器。
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JP2017026463A (ja) * | 2015-07-22 | 2017-02-02 | ローム株式会社 | 半導体装置 |
WO2023037531A1 (ja) * | 2021-09-13 | 2023-03-16 | サンケン電気株式会社 | 半導体集積回路およびデータ送受信方法 |
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US8648615B2 (en) * | 2010-06-28 | 2014-02-11 | Xilinx, Inc. | Testing die-to-die bonding and rework |
US11054461B1 (en) * | 2019-03-12 | 2021-07-06 | Xilinx, Inc. | Test circuits for testing a die stack |
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JP2005109086A (ja) * | 2003-09-30 | 2005-04-21 | Matsushita Electric Ind Co Ltd | 半導体装置 |
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JPS60147659A (ja) * | 1984-01-13 | 1985-08-03 | Hitachi Ltd | 論理構造 |
JPH04250644A (ja) * | 1991-01-25 | 1992-09-07 | Nec Corp | マルチチップ実装ic |
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JP2017026463A (ja) * | 2015-07-22 | 2017-02-02 | ローム株式会社 | 半導体装置 |
WO2023037531A1 (ja) * | 2021-09-13 | 2023-03-16 | サンケン電気株式会社 | 半導体集積回路およびデータ送受信方法 |
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