JP2008168475A - Minute molding mold - Google Patents

Minute molding mold Download PDF

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JP2008168475A
JP2008168475A JP2007002127A JP2007002127A JP2008168475A JP 2008168475 A JP2008168475 A JP 2008168475A JP 2007002127 A JP2007002127 A JP 2007002127A JP 2007002127 A JP2007002127 A JP 2007002127A JP 2008168475 A JP2008168475 A JP 2008168475A
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film
light
molding
forming
shielding
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Atsuo Hattori
敦夫 服部
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Yamaha Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To improve the demoldability of a minute molding mold in order to transfer/mold minute unevenness high in aspect ratio. <P>SOLUTION: The minute molding mold for molding a negative type photosensitive film to be molded has a molding surface having a projection 161, a light transmitting part ranging from the back of the molding surface to the molding surface, and a shading part forming a projection region which includes the tip of the projection and protrudes from the tip of the projection in the negative type photosensitive film to be molded. The projection is taper-shaped. The profile of the base end of the projection falls on the profile of the shading part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は微細成形モールドに関する。   The present invention relates to a fine mold.

従来、微細な転写成形技術の一つとして光インプリントが知られている。光インプリントは、微細成形モールド（以下、スタンパともいうものとする。）を圧着した光硬化性樹脂を露光して硬化させることにより、光硬化性樹脂にスタンパの成形面の形状を転写する技術である。光インプリントでは、光硬化性樹脂が塗布される支持基板とスタンパの凸部との間に残る残膜は、離型後のエッチング工程において除去される。特許文献１には光インプリントにおける離型後のエッチング工程を不要とする技術が開示されている。   Conventionally, optical imprinting is known as one of fine transfer molding techniques. Optical imprinting is a technique for transferring the shape of the molding surface of a stamper to the photocurable resin by exposing and curing the photocurable resin to which a fine molding mold (hereinafter also referred to as a stamper) is pressure-bonded. It is. In the optical imprint, the remaining film remaining between the support substrate to which the photocurable resin is applied and the convex portion of the stamper is removed in an etching process after mold release. Patent Document 1 discloses a technique that eliminates an etching process after mold release in optical imprinting.

特開２００４−３０４０９７号公報JP 2004-304097 A

ところで、インプリント技術では離型工程における成形体の変形が課題となっている。特に、アスペクト比の高い凸部を成型しようとするときには、スタンパの凹部にはまりこんで硬化している成形体の凸部に大きな応力が離型時に加わり、凸部を損傷してしまうという問題がある。   By the way, in the imprint technique, deformation of the molded body in the mold release process is a problem. In particular, when a convex part having a high aspect ratio is to be molded, there is a problem in that a large stress is applied to the convex part of the molded body that is stuck in the concave part of the stamper and hardened, and the convex part is damaged. .

本発明は、この問題を解決するために創作されたものであって、アスペクト比の高い微細な凹凸を転写成形するために微細成形モールドの離型性を向上させることを目的とする。   The present invention was created to solve this problem, and an object of the present invention is to improve the releasability of a fine mold in order to transfer and form fine irregularities having a high aspect ratio.

（１）上記目的を達成するための微細成形モールドは、ネガ型感光性成形対象膜を成形するための微細成形モールドであって、凸部を有する成形面と、前記成形面の裏面から前記成形面に至る透光部と、前記凸部の先端を内包し前記凸部の先端からはみ出す投影領域を前記ネガ型感光性成形対象膜に形成する遮光部と、を備える。   (1) A fine molding mold for achieving the above object is a fine molding mold for molding a negative photosensitive molding target film, wherein the molding is performed from a molding surface having a convex portion and a back surface of the molding surface. A translucent part that reaches the surface, and a light shielding part that includes a tip of the convex part and forms a projection region that protrudes from the tip of the convex part on the negative photosensitive molding target film.

この微細成形モールドをネガ型感光性成形対象膜に圧着し、成形面の裏側から成形対象膜を露光すると、成形面の凸部を内包する投影領域が遮光部によって形成される。遮光部によって形成される投影領域においては感光性成形対象膜が硬化しないため、成形面の凸部側面と硬化した成形対象膜とが固着することはない。一方、遮光部の投影領域の成形面の凸部からはみ出している領域では感光成形対象膜が硬化しないためにこの微細成形モールドの成形面の形状がそのまま転写されることはない。しかし、成形面の凸部から遮光部の投影領域がはみ出す領域の幅を適度に小さく設定することにより、成形面の形状をほぼ感光性成形対象膜に転写しつつ、離型性を高めることができる。尚、成形面の凸部から遮光部の投影領域がはみ出す領域の幅は、露光波長が最小値の目安となる。   When this fine molding mold is pressure-bonded to the negative photosensitive molding target film and the molding target film is exposed from the back side of the molding surface, a projection region including the convex portion of the molding surface is formed by the light shielding portion. In the projection region formed by the light shielding portion, the photosensitive molding target film is not cured, and thus the convex side surface of the molding surface and the cured molding target film are not fixed. On the other hand, since the photosensitive molding target film is not cured in the region protruding from the convex portion of the molding surface of the projection region of the light shielding portion, the shape of the molding surface of the fine molding mold is not transferred as it is. However, by setting the width of the area where the projection area of the light-shielding part protrudes from the convex part of the molding surface to a moderately small size, it is possible to improve the mold release property while transferring the shape of the molding surface to the photosensitive molding target film. it can. Note that the width of the region where the projection region of the light shielding portion protrudes from the convex portion of the molding surface is a guideline for the minimum value of the exposure wavelength.

本明細書において、成形面は成形対象物との界面に相当するモールドの面をいう。また表裏は相対的な位置関係の概念であり、ある物について裏側というときには、その物について表面と称する面の裏側を意味する。また透光性や遮光性という用語が物について用いられるときは、その物を介して露光する工程において用いられる波長の光に対する透光性または遮光性を意味する。また透光性や遮光性は、透光率または遮光率という階調をともなう概念であり、露光される感光性材料の現像時の溶解特性に実質的な差を生じさせる程度に、物が透明または不透明であることを意味する。   In the present specification, the molding surface refers to the surface of the mold corresponding to the interface with the molding object. Further, the front and back are concepts of relative positional relationship, and when a certain object is referred to as the back side, it means the back side of the surface referred to as the surface of the object. Further, when the terms “light-transmitting property” and “light-shielding property” are used for an object, it means light-transmitting property or light-shielding property for light having a wavelength used in the step of exposing through the object. Translucency and light-shielding are concepts that have a gradation of translucency or light-shielding, and objects are transparent enough to cause a substantial difference in the dissolution characteristics of the exposed photosensitive material during development. Or it means opaque.

（２）上記目的を達成するための微細成形モールドにおいて、前記凸部はテーパー形状であってもよい。
成形面の凸部がテーパー形状である場合、離型性がさらに向上する。 (2) In the fine mold for achieving the above object, the convex portion may be tapered.
When the convex part of a molding surface is a taper shape, mold release property further improves.

（３）上記目的を達成するための微細成形モールドにおいて、前記凸部の基端の輪郭は前記遮光部の輪郭に重なってもよい。
この場合、離型性を損ねることなく、現像により除去される領域を小さくすることが出来る。すなわち、成形のスループットを向上させることが出来る。 (3) In the fine mold for achieving the above object, the contour of the base end of the convex portion may overlap the contour of the light shielding portion.
In this case, the area removed by development can be reduced without impairing the releasability. That is, the molding throughput can be improved.

（４）上記目的を達成するための微細成形モールドにおいて、柱状の芯と、前記芯の外側に接合されているテーパー形状の側壁部と、を備えてもよい。
このような構造の微細成形モールドは、成形面の凸部から遮光部の投影領域がはみ出す領域の幅を均一にすることが容易である。 (4) A fine mold for achieving the above object may include a columnar core and a tapered side wall portion joined to the outside of the core.
In the fine molding mold having such a structure, it is easy to make uniform the width of the region where the projection region of the light shielding portion protrudes from the convex portion of the molding surface.

（５）上記目的を達成するための微細成形モールドにおいて、前記凸部の基端の輪郭は前記遮光部の輪郭に内包されてもよい。   (5) In the fine mold for achieving the above object, the contour of the base end of the convex portion may be included in the contour of the light shielding portion.

（６）上記目的を達成するための微細成形モールドにおいて、少なくとも一部が前記透光部の一部を構成する透光性基板と、少なくとも一部が前記透光部の一部を構成し表面が前記成形面の一部を構成し前記透光性基板に接合している透光性膜と、前記遮光部の少なくとも一部を構成し前記透光性基板に接合している遮光性膜と、前記凸部の少なくとも一部を構成し前記遮光性膜に接合している膜と、を備え、かつ、前記遮光性膜の開口部は前記透光性膜で埋められててもよい。
遮光性膜の開口部に成形対象膜が入り込む構成の場合、成形対象膜に形成される凸部の先端部側面は遮光性膜の開口側面に固着することになる。しかし、遮光性膜の開口部が透光性膜で埋められていれば、成形対象膜に形成される凸部の先端部側面が遮光性膜の開口側面に固着することもない。 (6) In the fine molding mold for achieving the above object, at least a part of the translucent substrate constituting a part of the translucent part, and at least a part of the translucent part constituting a surface A translucent film that forms part of the molding surface and is bonded to the translucent substrate; and a light-shielding film that forms at least a part of the light shielding part and is bonded to the translucent substrate; And a film that forms at least a part of the convex portion and is bonded to the light-shielding film, and an opening of the light-shielding film may be filled with the light-transmitting film.
In the case where the molding target film enters the opening of the light shielding film, the side surface of the tip of the convex portion formed on the molding target film is fixed to the opening side surface of the light shielding film. However, if the opening of the light-shielding film is filled with the light-transmitting film, the side surface of the tip of the convex portion formed on the molding target film does not adhere to the opening side of the light-shielding film.

（７）上記目的を達成するための微細成形モールドの製造方法は、透光性基板の表面上に遮光性膜を形成し、前記遮光性膜の表面上に成形面の凸部を形成するための膜を形成し、前記凸部を形成するための膜の表面上に保護膜を形成し、前記保護膜にテーパー形状の開口部または凹部を形成し、前記保護膜もろともに異方性エッチングすることにより前記凸部を形成するための膜にテーパー形状の開口部を形成し、前記凸部を形成するための膜の開口部から露出した前記遮光性膜に異方性エッチングによって開口部を形成する、ことを含む。   (7) A method for producing a fine mold for achieving the above object is to form a light-shielding film on the surface of a light-transmitting substrate and form a convex portion of the molding surface on the surface of the light-shielding film. A protective film is formed on the surface of the film for forming the convex part, a tapered opening or a concave part is formed in the protective film, and the protective film is anisotropically etched together As a result, a taper-shaped opening is formed in the film for forming the protrusion, and the opening is formed by anisotropic etching in the light-shielding film exposed from the opening of the film for forming the protrusion. Including.

この方法によると、透光性基板と遮光性膜と成形面の凸部を形成するための膜とを備える微細成形モールドが製造される。そして成形面の凸部は、テーパー形状の開口部を有する保護膜もろともに異方性エッチングされることによってテーパー形状になる。またこの方法によって製造された微細成形モールドの成形面の裏側から成形対象膜を露光すると、成形面の凸部の先端は遮光性膜の投影領域に内包される。したがって、成形対象膜がネガ型感光性材料からなるのであれば遮光性膜の投影領域は硬化しないため、この方法によって製造された微細成形モールドの凸部側面と、硬化した成形対象膜とが固着することはない。すなわち、この方法によって製造される微細成形モールドは、ネガ型感光性成形対象膜との離型性がよく、アスペクト比が高い微細な凹凸を転写成形できるものになる。   According to this method, a fine molding mold including a translucent substrate, a light-shielding film, and a film for forming a convex portion of the molding surface is manufactured. And the convex part of a molding surface becomes a taper shape by anisotropically etching together with the protective film which has a taper-shaped opening part. Further, when the film to be molded is exposed from the back side of the molding surface of the fine molding mold manufactured by this method, the tip of the convex portion of the molding surface is included in the projection region of the light shielding film. Therefore, if the film to be molded is made of a negative photosensitive material, the projection area of the light-shielding film is not cured, so the side surface of the convex part of the fine molding mold manufactured by this method and the cured film to be molded are fixed. Never do. That is, the fine molding mold produced by this method has good releasability from the negative photosensitive molding target film, and can transfer and mold fine irregularities with a high aspect ratio.

（８）上記目的を達成するための微細成形モールドの製造方法は、透光性基板の表面上に遮光性膜を形成し、前記遮光性膜の表面上に成形面の凸部を形成するための膜を形成し、前記凸部を形成するための膜の表面上に保護膜を形成し、前記保護膜に開口部を形成し、前記保護膜の開口部から露出した前記凸部を形成するための膜に異方性エッチングにより開口部を形成し、前記凸部を形成するための膜の開口部から露出した前記遮光性膜に異方性エッチングによって開口部を形成した後に、前記凸部を形成するための膜を等方性エッチングする、ことを含む。   (8) A method for producing a fine mold for achieving the above object is to form a light-shielding film on the surface of a light-transmitting substrate and form a convex portion of the molding surface on the surface of the light-shielding film. A protective film is formed on the surface of the film for forming the convex portion, an opening is formed in the protective film, and the convex portion exposed from the opening of the protective film is formed. Forming an opening by anisotropic etching in the film for forming the protrusion, and forming the opening by anisotropic etching in the light-shielding film exposed from the opening of the film for forming the protrusion. And isotropically etching the film for forming the film.

この方法によると、透光性基板と遮光性膜と成形面の凸部を形成するための膜とを備える微細成形モールドが製造される。そして成形面の凸部は、等方性エッチングによってテーパー形状になる。またこの方法によって製造された微細成形モールドの成形面の裏側から成形対象膜を露光すると、成形面の凸部の先端は遮光性膜の投影領域に内包される。したがって、成形対象膜がネガ型感光性材料からなるのであれば遮光性膜の投影領域は硬化しないため、この方法によって製造された微細成形モールドの凸部側面と、硬化した成形対象膜とが固着することはない。すなわち、この方法によって製造される微細成形モールドは、ネガ型感光性成形対象膜との離型性がよく、アスペクト比が高い微細な凹凸を転写成形できるものになる。   According to this method, a fine molding mold including a translucent substrate, a light-shielding film, and a film for forming a convex portion of the molding surface is manufactured. And the convex part of a molding surface becomes a taper shape by isotropic etching. Further, when the film to be molded is exposed from the back side of the molding surface of the fine molding mold manufactured by this method, the tip of the convex portion of the molding surface is included in the projection region of the light shielding film. Therefore, if the film to be molded is made of a negative photosensitive material, the projection area of the light-shielding film is not cured, so the side surface of the convex part of the fine molding mold manufactured by this method and the cured film to be molded are fixed. Never do. That is, the fine molding mold produced by this method has good releasability from the negative photosensitive molding target film, and can transfer and mold fine irregularities with a high aspect ratio.

（９）上記目的を達成するための微細成形モールドの製造方法は、透光性基板の表面上に遮光性膜を形成し、前記遮光性膜の表面上に成形面の凸部の芯を形成するための膜を形成し、前記凸部の芯を形成するための膜の表面上に保護膜を形成し、前記保護膜に開口部を形成し、前記保護膜の開口部から露出した前記凸部の芯を形成するための膜に異方性エッチングにより開口部を形成し、前記凸部の芯を形成するための膜の表面上と前記遮光性膜との表面上とに、前記凸部の側壁部を形成するための膜を形成し、前記凸部の側壁部を形成するための膜の異方性エッチングにより、前記凸部の側壁部をテーパー形状に成形するとともに前記凸部の側壁部を形成するための膜に開口部を形成し、前記凸部の側壁部を形成するための膜の開口部から露出した前記遮光性膜に異方性エッチングによって開口部を形成する、ことを含む。   (9) A method for manufacturing a fine mold for achieving the above object is to form a light-shielding film on the surface of a light-transmitting substrate and form a core of a convex portion of the molding surface on the surface of the light-shielding film. Forming a protective film on the surface of the film for forming the core of the convex portion, forming an opening in the protective film, and exposing the convex exposed from the opening of the protective film An opening is formed in the film for forming the core of the part by anisotropic etching, and the convex part is formed on the surface of the film for forming the core of the convex part and on the surface of the light-shielding film. Forming a film for forming the side wall of the protrusion, forming the side wall of the protrusion into a tapered shape by anisotropic etching of the film for forming the side wall of the protrusion, and forming the side wall of the protrusion Forming an opening in the film for forming the portion, and from the opening of the film for forming the side wall of the convex portion Forming an opening by anisotropically etching the light-shielding film that issued involves.

この方法によると、透光性基板と遮光性膜と成形面の凸部とを備える微細成形モールドが製造される。成形面の凸部は、その芯を形成するための膜と、その側壁部を形成するための膜とを構成要素とし、側壁部がテーパー形状になるために凸部全体としてもテーパー形状になる。またこの方法によって製造された微細成形モールドの成形面の裏側から成形対象膜を露光すると、成形面の凸部の先端は遮光性膜の投影領域に内包される。したがって、成形対象膜がネガ型感光性材料からなるのであれば遮光性膜の投影領域は硬化しないため、この方法によって製造された微細成形モールドの凸部側面と、硬化した成形対象膜とが固着することはない。すなわち、この方法によって製造される微細成形モールドは、ネガ型感光性成形対象膜との離型性がよく、アスペクト比が高い微細な凹凸を転写成形できるものになる。また、異方性エッチングにより形成される成形面の凸部の側壁部の厚さが均一になる結果、成形面の凸部の芯は成形面の凸部の中央に位置するようになる。遮光性膜は成形面の凸部の側壁部が保護膜となって異方性エッチングされるため、成形面の凸部基端の輪郭と遮光性膜の輪郭とが重なるとともに、ネガ型感光性成形対象膜の露光・現像によって除去される領域が厚さが均一になる。すなわち、この製造方法では、ネガ型感光性成形対象膜の露光・現像によって除去される領域が厚さが均一になるゆえに成形精度が高くなる微細成形モールドを製造することが出来る。   According to this method, a fine molding mold including a translucent substrate, a light-shielding film, and a convex portion of the molding surface is manufactured. The convex part of the molding surface is composed of a film for forming the core and a film for forming the side wall part, and the side wall part is tapered so that the whole convex part is also tapered. . Further, when the film to be molded is exposed from the back side of the molding surface of the fine molding mold manufactured by this method, the tip of the convex portion of the molding surface is included in the projection region of the light shielding film. Therefore, if the film to be molded is made of a negative photosensitive material, the projection area of the light-shielding film is not cured, so the side surface of the convex part of the fine molding mold manufactured by this method and the cured film to be molded are fixed. Never do. That is, the fine molding mold produced by this method has good releasability from the negative photosensitive molding target film, and can transfer and mold fine irregularities with a high aspect ratio. In addition, as a result of uniform thickness of the side wall of the convex portion of the molding surface formed by anisotropic etching, the core of the convex portion of the molding surface is positioned at the center of the convex portion of the molding surface. Since the light-shielding film is anisotropically etched with the side wall of the convex part of the molding surface as a protective film, the contour of the base of the convex part of the molding surface and the contour of the light-shielding film overlap, and negative photosensitive The thickness of the region removed by exposure / development of the film to be formed becomes uniform. In other words, this manufacturing method can manufacture a fine molding mold with high molding accuracy because the thickness of the region removed by exposure and development of the negative photosensitive molding target film is uniform.

（１０）上記目的を達成するための微細転写成形方法は、凸部を有する成形面と、前記成形面の裏面から前記成形面に至る透光部と、前記凸部の先端を内包し前記凸部の先端からはみ出す投影領域を形成する遮光部と、を備える微細成形モールドを、ネガ型感光性成形対象膜に圧着し、前記微細成形モールドの前記成形面の裏側から前記ネガ型感光性成形対象膜を露光し、前記ネガ型感光性成形対象膜から前記微細成形モールドを引き離し、前記ネガ型感光性成形対象膜の前記遮光部の投影領域を現像により除去する、ことを含む。   (10) A fine transfer molding method for achieving the above object includes a molding surface having a convex portion, a translucent portion extending from the back surface of the molding surface to the molding surface, and a tip of the convex portion. A fine molding mold comprising a light-shielding portion that forms a projection region that protrudes from the tip of the part, and is pressure-bonded to a negative photosensitive molding target film, and the negative photosensitive molding target from the back side of the molding surface of the fine molding mold Exposing the film, pulling the fine mold away from the negative photosensitive molding target film, and removing the projection area of the light-shielding portion of the negative photosensitive molding target film by development.

この方法によると、成形面の凸部を内包する投影領域が遮光部によって形成される。遮光部によって形成される投影領域においては感光性成形対象膜が硬化しないため、成形面の凸部側面と硬化した成形対象膜とが固着することはない。一方、遮光部の投影領域の成形面の凸部からはみ出している領域では感光成形対象膜が硬化しないために微細成形モールドの成形面の形状がそのまま転写されることはない。しかし、成形面の凸部から遮光部の投影領域がはみ出す領域の幅を適度に小さく設定することにより、成形面の形状をほぼ感光性成形対象膜に転写しつつ、離型性を高めることができる。尚、成形面の凸部から遮光部の投影領域がはみ出す領域の幅は、露光波長が最小値の目安となる。   According to this method, the projection region including the convex portion of the molding surface is formed by the light shielding portion. In the projection region formed by the light shielding portion, the photosensitive molding target film is not cured, and thus the convex side surface of the molding surface and the cured molding target film are not fixed. On the other hand, the shape of the molding surface of the fine molding mold is not transferred as it is because the photosensitive molding target film is not cured in the region protruding from the convex portion of the molding surface of the projection area of the light shielding portion. However, by setting the width of the area where the projection area of the light-shielding part protrudes from the convex part of the molding surface to a moderately small size, it is possible to improve the mold release property while transferring the shape of the molding surface to the photosensitive molding target film. it can. Note that the width of the region where the projection region of the light shielding portion protrudes from the convex portion of the molding surface is a guideline for the minimum value of the exposure wavelength.

（１１）上記目的を達成するための微細成形モールドは、ポジ型感光性成形対象膜を成形するための微細成形モールドであって、凹部を有する成形面と、前記成形面の裏面から前記成形面に至る透光部と、前記凹部の底に内包される投影領域を前記ポジ型感光性成形対象膜に形成する遮光部と、を備える。   (11) A fine molding mold for achieving the above object is a fine molding mold for molding a positive type photosensitive molding target film, and a molding surface having a recess and the molding surface from the back surface of the molding surface. And a light-shielding part for forming a projection region included in the bottom of the concave part on the positive type photosensitive molding target film.

この微細成形モールドをポジ型感光性成形対象膜に圧着し、成形面の裏側から成形対象膜を露光すると、成形面の凹部の底に内包される投影領域が遮光部によって形成される。遮光部によって形成される投影領域においては感光性成形対象膜が硬化しないため、成形面の凹部側面と硬化した成形対象膜とが固着することはない。一方、成形面の凹部の底の遮光部の投影領域からはみ出している部分に重なる領域では感光成形対象膜が光分解するためにこの微細成形モールドの成形面の形状がそのまま転写されることはない。しかし、成形面の凹部の底の遮光部の投影領域からはみ出す幅を適度に小さく設定することにより、成形面の形状をほぼ感光性成形対象膜に転写しつつ、離型性を高めることができる。尚、成形面の凹部の底の遮光部の投影領域からはみ出す幅は、露光波長が最小値の目安となる。   When this fine molding mold is pressure-bonded to a positive photosensitive molding target film and the molding target film is exposed from the back side of the molding surface, a projection region included in the bottom of the concave portion of the molding surface is formed by the light shielding portion. In the projection area formed by the light-shielding portion, the photosensitive molding target film is not cured, so that the concave side surface of the molding surface and the cured molding target film are not fixed. On the other hand, in the area overlapping the projected area of the light shielding part at the bottom of the concave part of the molding surface, the shape of the molding surface of the fine molding mold is not transferred as it is because the photosensitive molding target film is photodegraded. . However, by setting the width that protrudes from the projection region of the light-shielding portion at the bottom of the concave portion of the molding surface to be moderately small, it is possible to improve the release property while substantially transferring the shape of the molding surface to the photosensitive molding target film. . Note that the width of the projection surface of the light shielding portion at the bottom of the concave portion of the molding surface is a guideline for the minimum value of the exposure wavelength.

（１２）上記目的を達成するための微細成形モールドの製造方法は、上記（１１）に記載の微細成形モールドを製造する方法であって、犠牲基板の表面上に遮光性膜を形成し、前記犠牲基板の裏面上に支持膜を形成し、前記遮光性膜に開口部を形成して前記遮光性膜からなる前記遮光部を形成し、前記遮光性膜の開口部から露出した前記犠牲基板の表面上と前記遮光性膜の表面上とに、前記遮光部の輪郭と前記凹部の底の輪郭との間の幅を規定するための犠牲膜を形成し、前記犠牲膜を異方性エッチングすることにより前記犠牲膜に開口部を形成するとともに前記犠牲膜を前記遮光部の周囲に所定幅だけ残存させ、前記犠牲膜と前記遮光性膜とを保護膜として異方性エッチングすることにより前記犠牲基板に開口部を形成するとともに前記犠牲基板を前記凹部の反転形状に成形し、前記犠牲基板と前記遮光部とを埋め前記透光部となる透光性膜を前記支持膜の表面上に形成し、前記支持膜と前記犠牲基板とを除去する、ことを含む。   (12) A method for producing a fine mold for achieving the above object is a method for producing a fine mold according to (11) above, wherein a light-shielding film is formed on the surface of a sacrificial substrate, A support film is formed on the back surface of the sacrificial substrate, an opening is formed in the light shielding film to form the light shielding portion made of the light shielding film, and the sacrificial substrate exposed from the opening of the light shielding film is formed. A sacrificial film is formed on the surface and the surface of the light-shielding film to define a width between the contour of the light-shielding portion and the contour of the bottom of the recess, and the sacrificial film is anisotropically etched. As a result, an opening is formed in the sacrificial film, the sacrificial film is left around the light shielding portion by a predetermined width, and the sacrificial film and the light shielding film are anisotropically etched using the sacrificial film and the light shielding film as a protective film. Forming an opening in the substrate and A substrate is formed in an inverted shape of the concave portion, a light-transmitting film that fills the sacrificial substrate and the light-shielding portion and serves as the light-transmitting portion is formed on the surface of the support film, and the support film and the sacrificial substrate Removing.

この製造方法によると、支持膜と犠牲基板とを除去すると、犠牲基板が除去されることによって露出した透光部の表面と遮光性膜の表面とからなる成形面の凹部が形成される。このように形成される成形面の凹部の輪郭と遮光部の輪郭との間の幅は、遮光性膜の周囲において異方性エッチングにより成形される犠牲膜によって規定されるため、精度よく均一にすることが出来る。   According to this manufacturing method, when the support film and the sacrificial substrate are removed, a concave portion of the molding surface is formed which includes the surface of the light-transmitting portion and the surface of the light-shielding film exposed by removing the sacrificial substrate. The width between the contour of the concave portion of the molding surface formed in this way and the contour of the light shielding portion is defined by a sacrificial film formed by anisotropic etching around the light shielding film, so that it is uniform with high accuracy. I can do it.

（１３）上記目的を達成するための微細転写成形方法は、凹部を有する成形面と、前記成形面の裏面から前記成形面に至る遮光部と、前記凹部の底に内包される投影領域を形成する遮光部と、を備える微細成形モールドを、ポジ型感光性成形対象膜に圧着し、前記微細成形モールドの前記成形面の裏側から前記ポジ型感光性成形対象膜を露光し、前記ポジ型感光性成形対象膜から前記微細成形モールドを引き離し、前記ポジ型感光性成形対象膜の前記遮光部の投影領域を現像により除去する、ことを含む。   (13) A fine transfer molding method for achieving the above object includes forming a molding surface having a concave portion, a light-shielding portion from the back surface of the molding surface to the molding surface, and a projection region included in the bottom of the concave portion. A fine molding mold including a light-shielding portion to be bonded to a positive photosensitive molding target film, exposing the positive photosensitive molding target film from a back side of the molding surface of the fine molding mold, Separating the fine molding mold from the film to be molded, and removing the projection area of the light-shielding portion of the positive photosensitive molding target film by development.

この方法によると、成形面の凹部の底に内包される投影領域が遮光部によって形成される。遮光部によって形成される投影領域においては感光性成形対象膜が硬化しないため、成形面の凹部側面と硬化した成形対象膜とが固着することはない。一方、成形面の凹部の底の遮光部の投影領域からはみ出している部分に重なる領域では感光成形対象膜が光分解するためにこの微細成形モールドの成形面の形状がそのまま転写されることはない。しかし、成形面の凹部の底の遮光部の投影領域からはみ出す幅を適度に小さく設定することにより、成形面の形状をほぼ感光性成形対象膜に転写しつつ、離型性を高めることができる。尚、成形面の凹部の底の遮光部の投影領域からはみ出す幅は、露光波長が最小値の目安となる。   According to this method, the projection region included in the bottom of the concave portion of the molding surface is formed by the light shielding portion. In the projection area formed by the light-shielding portion, the photosensitive molding target film is not cured, so that the concave side surface of the molding surface and the cured molding target film are not fixed. On the other hand, in the area overlapping the projected area of the light shielding part at the bottom of the concave part of the molding surface, the shape of the molding surface of the fine molding mold is not transferred as it is because the photosensitive molding target film is photodegraded. . However, by setting the width that protrudes from the projection region of the light-shielding portion at the bottom of the concave portion of the molding surface to be moderately small, it is possible to improve the release property while substantially transferring the shape of the molding surface to the photosensitive molding target film. . Note that the width of the projection surface of the light shielding portion at the bottom of the concave portion of the molding surface is a guideline for the minimum value of the exposure wavelength.

以下、本発明の実施の形態を添付図面を参照しながら説明する。尚、各図において対応する構成要素には同一の符号が付され、重複する説明は省略される。
１．第一実施形態
・スタンパの構成
図１は、本発明による微細成形モールド（以下、スタンパという。）の第一実施形態を示す断面図である。スタンパ１は、ネガ型感光性樹脂膜を成形するためのものであり、透光性基板１３と遮光性膜１２と成形面の凸部１６１を構成するための膜１１とで構成されている。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected to the corresponding component in each figure, and the overlapping description is abbreviate | omitted.
1. First Embodiment Configuration of Stamper FIG. 1 is a cross-sectional view showing a first embodiment of a fine mold (hereinafter referred to as a stamper) according to the present invention. The stamper 1 is for molding a negative photosensitive resin film, and is composed of a translucent substrate 13, a light-shielding film 12, and a film 11 for forming a convex portion 161 of the molding surface.

透光性基板１３は、成形対象である光硬化性樹脂の露光波長に対して十分な透光性のある材料である例えば石英、ガラス、樹脂などからなる。
遮光性膜１２は、成形面の凸部１６１の基端部１２２を構成している。遮光性膜１２は、成形対象である光硬化性樹脂の露光波長に対して十分な遮光性のある材料からなり、透光性基板１３の表面に接合されている。 The translucent substrate 13 is made of, for example, quartz, glass, resin, or the like, which is a material having sufficient translucency with respect to the exposure wavelength of the photocurable resin to be molded.
The light-shielding film 12 constitutes the base end portion 122 of the convex portion 161 of the molding surface. The light-shielding film 12 is made of a material having a sufficient light-shielding property with respect to the exposure wavelength of the photocurable resin to be molded, and is bonded to the surface of the light-transmitting substrate 13.

膜１１は、遮光性膜１２の表面に接合され、成形面の凸部１６１の先端部１１２を構成している。膜１１の材料として、遮光性材料、透光性材料のいずれを選択してもよい。
成形面の凸部１６１の先端の輪郭は遮光性膜１２の輪郭に内包されている。具体的には、膜１１によって構成される先端部１１２の側面は遮光性膜１２の輪郭より内側に位置している。 The film 11 is bonded to the surface of the light-shielding film 12 and constitutes the tip 112 of the convex portion 161 of the molding surface. As the material of the film 11, either a light shielding material or a light transmissive material may be selected.
The contour of the tip of the convex portion 161 of the molding surface is included in the contour of the light shielding film 12. Specifically, the side surface of the distal end portion 112 constituted by the film 11 is located inside the contour of the light-shielding film 12.

成形面の凸部１６１を構成する膜１１と遮光性膜１２の材料は、スタンパ１に求められる硬度や靭性といった機械的特性と、製造工程におけるエッチング選択性を考慮して選択される。具体的には例えば膜１１の材料にはＳｉＮ、ＡｌＮ、ＳｉＣ等が選択され、遮光性膜１２の材料にはＷＳｉが選択される。
スタンパ１の成形面の裏側から光を照射すると、遮光性膜１２に重なっていない領域Ｔにおいて光は成形面に到達し、遮光性膜１２は成形面の凸部の先端部１１２を覆う影を形成する。透光性基板１３の遮光性膜１２に重なっていない領域Ｔがスタンパ１の透光部である。 The material of the film 11 and the light-shielding film 12 constituting the convex portion 161 of the molding surface is selected in consideration of mechanical characteristics such as hardness and toughness required for the stamper 1 and etching selectivity in the manufacturing process. Specifically, for example, SiN, AlN, SiC or the like is selected as the material of the film 11, and WSi is selected as the material of the light shielding film 12.
When light is irradiated from the back side of the molding surface of the stamper 1, the light reaches the molding surface in a region T that does not overlap the light shielding film 12, and the light shielding film 12 has a shadow covering the tip 112 of the convex portion of the molding surface. Form. A region T of the light transmissive substrate 13 that does not overlap the light shielding film 12 is a light transmissive portion of the stamper 1.

・スタンパの製造方法
図２から図４はスタンパ１の製造工程を示す断面図である。
はじめに図２に示すように、透光性基板１３の上に遮光性膜１２、膜１１、保護膜としてのフォトレジスト膜１０を形成する。具体的には例えば次の通りである。透光性基板１３の表面上にＷＳｉからなる遮光性膜１２を蒸着、スパッタなどによって形成する。次に遮光性膜１２の表面上にＳｉＮ、ＡｌＮ、ＳｉＣなどからなる凸部を形成するための膜１１をスパッタなどによって形成する。次にポジ型フォトレジストを厚さ５μｍ塗布し、フォトマスクを用いて露光した後に現像して開口部１０１を有するフォトレジスト膜１０を形成する。 Stamper Manufacturing Method FIGS. 2 to 4 are cross-sectional views showing the manufacturing process of the stamper 1.
First, as shown in FIG. 2, a light-shielding film 12, a film 11, and a photoresist film 10 as a protective film are formed on a translucent substrate 13. Specifically, for example, as follows. A light shielding film 12 made of WSi is formed on the surface of the translucent substrate 13 by vapor deposition, sputtering, or the like. Next, a film 11 for forming convex portions made of SiN, AlN, SiC or the like is formed on the surface of the light-shielding film 12 by sputtering or the like. Next, a positive photoresist is applied to a thickness of 5 μm, exposed using a photomask, and then developed to form a photoresist film 10 having an opening 101.

次にフォトレジスト膜１０を保護膜とする異方性エッチングにより、開口部１０１から露出している膜１１に図３に示すように開口部１１１を形成する。具体的には例えばＣＦ４、ＣＨＦ３、ＣＨ２Ｆ２ガスを用いた反応性イオンエッチング（ＲＩＥ）によってＳｉＮからなる膜１１に開口部１１１を形成する。 Next, an opening 111 is formed in the film 11 exposed from the opening 101 by anisotropic etching using the photoresist film 10 as a protective film, as shown in FIG. Specifically, the opening 111 is formed in the film 11 made of SiN by reactive ion etching (RIE) using CF 4 , CHF 3 , and CH 2 F 2 gas, for example.

次にフォトレジスト膜１０を例えばアセトン、ＮＭＰ（エヌ・メチル・ジ・ピロリドン）等の有機溶剤を用いて除去する。Ｏ２プラズマを用いたドライエッチングによりフォトレジスト膜１０を除去してもよい。 Next, the photoresist film 10 is removed using an organic solvent such as acetone or NMP (N-methyl-di-pyrrolidone). The photoresist film 10 may be removed by dry etching using O 2 plasma.

次に膜１１を保護膜とする異方性エッチングにより開口部１１１から露出している遮光性膜１２に図４に示すように開口部１２１を形成し、透光性基板１３を遮光性膜１２の開口部１２１から露出させる。具体的には例えばＣＣｌ４またはＳＦ６のガスを用いたＲＩＥによってＷＳｉからなる遮光性膜１２に開口部１２１を形成する。 Next, as shown in FIG. 4, an opening 121 is formed in the light-shielding film 12 exposed from the opening 111 by anisotropic etching using the film 11 as a protective film, and the light-transmitting substrate 13 is attached to the light-shielding film 12. It exposes from the opening part 121 of this. Specifically, the opening 121 is formed in the light-shielding film 12 made of WSi by RIE using, for example, CCl 4 or SF 6 gas.

最後に膜１１を等方的にエッチングすると図１に示すスタンパ１が完成する。具体的には例えばＳｉＮからなる膜１１をＷＳｉからなる遮光性膜１２に対して選択性の高い熱硝酸（Ｈ３ＰＯ４）を用いて１７０℃の温度条件で等方的にエッチングする。 Finally, when the film 11 is isotropically etched, the stamper 1 shown in FIG. 1 is completed. Specifically, for example, the film 11 made of SiN is etched isotropically at 170 ° C. using hot nitric acid (H 3 PO 4 ) having high selectivity with respect to the light-shielding film 12 made of WSi.

・微細転写成形方法
図５から図９はスタンパ１を用いた微細転写成形方法を示す断面図である。
はじめに図５に示すように支持基板１５の表面上にネガ型感光性成形対象膜１４を形成する。具体的には例えば、ネガ型フォトレジスト、ネガ型感光性ポリイミドなどの光硬化性樹脂を支持基板１５の表面に塗布する。塗膜の厚さはスタンパ１の成形面の凹部の深さによるが、例えば７０μｍとする。 Fine Transfer Molding Method FIGS. 5 to 9 are sectional views showing a fine transfer molding method using the stamper 1.
First, as shown in FIG. 5, a negative photosensitive molding target film 14 is formed on the surface of the support substrate 15. Specifically, for example, a photocurable resin such as a negative photoresist or a negative photosensitive polyimide is applied to the surface of the support substrate 15. The thickness of the coating film depends on the depth of the concave portion of the molding surface of the stamper 1, but is set to 70 μm, for example.

次に図６に示すようネガ型感光性成形対象膜１４にスタンパ１を圧着する。このときスタンパ１を加圧してもスタンパ１の成形面１６が支持基板１５に接することはなく、成形面１６の先端と支持基板１５との間においてもネガ型感光性成形対象膜１４が残る。   Next, as shown in FIG. 6, the stamper 1 is pressure-bonded to the negative photosensitive molding target film 14. At this time, even if the stamper 1 is pressurized, the molding surface 16 of the stamper 1 does not contact the support substrate 15, and the negative photosensitive molding target film 14 remains between the tip of the molding surface 16 and the support substrate 15.

次に図７に示すようにスタンパ１の成形面の裏側から紫外線や可視光線などの光を照射し、スタンパ１を介してネガ型感光性成形対象膜１４を露光する。このとき、遮光性膜１２がネガ型感光性成形対象膜１４に投影領域１４２を形成し、投影領域１４２においてネガ型感光性成形対象膜１４は硬化しない。透光性基板１３を透過し、遮光性膜１２の開口部１２１を通過した光はネガ型感光性成形対象膜１４を硬化させる。成形面の凸部の先端部１１２の側面は遮光性膜１２の輪郭に内包されているため、成形面の凸部の先端部１１２の周囲においてネガ型感光性成形対象膜１４は硬化しない。したがって、成形面の凸部の先端部１１２にネガ型感光性成形対象膜１４の硬化した感光領域１４１が固着することはない。   Next, as shown in FIG. 7, light such as ultraviolet rays or visible light is irradiated from the back side of the molding surface of the stamper 1, and the negative photosensitive molding target film 14 is exposed through the stamper 1. At this time, the light-shielding film 12 forms a projection region 142 on the negative photosensitive molding target film 14, and the negative photosensitive molding target film 14 is not cured in the projection region 142. The light that has passed through the translucent substrate 13 and passed through the opening 121 of the light-shielding film 12 cures the negative photosensitive molding target film 14. Since the side surface of the tip 112 of the convex portion of the molding surface is included in the contour of the light-shielding film 12, the negative photosensitive molding target film 14 is not cured around the tip 112 of the convex portion of the molding surface. Accordingly, the cured photosensitive region 141 of the negative photosensitive molding target film 14 does not adhere to the tip 112 of the convex portion of the molding surface.

次に図８に示すようにスタンパ１をネガ型感光性成形対象膜１４から引き離す。このとき成形面１６の凸部の先端部１１２にネガ型感光性成形対象膜１４の感光領域１４１が固着していないため、硬化した感光領域１４１が変形したり破損しにくい。尚、スタンパ１をネガ型感光性成形対象膜１４に圧着する前に、成形面１６、ネガ型感光性成形対象膜１４の表面のいずれかまたは両方に離型剤を成膜してもよい。この離型剤は成形面１６の凸部の基端部１２２と感光性成形対象膜１４との固着力を低下させ、離型性をさらに向上させる。   Next, as shown in FIG. 8, the stamper 1 is separated from the negative photosensitive molding target film 14. At this time, since the photosensitive region 141 of the negative photosensitive molding target film 14 is not fixed to the tip 112 of the convex portion of the molding surface 16, the cured photosensitive region 141 is not easily deformed or damaged. Before the stamper 1 is pressure-bonded to the negative photosensitive molding target film 14, a release agent may be formed on either or both of the molding surface 16 and the surface of the negative photosensitive molding target film 14. This mold release agent reduces the fixing force between the base end portion 122 of the convex portion of the molding surface 16 and the photosensitive molding target film 14 and further improves the mold release property.

最後に図９に示すようにネガ型感光性成形対象膜１４を現像し未感光領域１４２を除去すると感光領域１４１からなる成形膜が完成する。このような成形膜はエッチングやリフトオフの保護膜として用いることも出来るし、ＭＥＭＳ（Micro Electro Mechanical System）の構造体として用いることも出来る。   Finally, as shown in FIG. 9, when the negative photosensitive molding target film 14 is developed and the unexposed area 142 is removed, a molded film composed of the photosensitive area 141 is completed. Such a molded film can be used as a protective film for etching or lift-off, and can also be used as a structure of MEMS (Micro Electro Mechanical System).

以上説明したように本実施形態によると、遮光性膜１２の輪郭が成形面１６の凸部の先端部側面より外側にあるため、スタンパ１とネガ型感光性成形対象膜１４の離型性が高く、硬化した成形膜が離型によって変形したり損傷しにくい。また成形面１６の凸部を用いずに露光・現像によって成形膜に凹部を形成する場合に比べると、現像によって除去される成形対象膜の体積が小さくなるため、スループットが高くなる。また成形面１６の先端と支持基板１５との間の残膜を異方性エッチングで除去する必要がない。またスタンパ1に付着する成形対象膜は、硬化していない状態であるため、除去することが容易である。また、スタンパ１の凸部が硬化したネガ型感光性成形対象膜１４に固着して破断しにくいため、スタンパ１の耐久寿命が延びる。   As described above, according to the present embodiment, since the contour of the light-shielding film 12 is outside the side surface of the tip of the convex portion of the molding surface 16, the releasability between the stamper 1 and the negative photosensitive molding target film 14 is high. High and hard molded film is not easily deformed or damaged by mold release. Further, as compared with the case where the concave portion is formed in the molded film by exposure / development without using the convex portion of the molding surface 16, the volume of the molding target film to be removed by the development is reduced, and the throughput is increased. Further, it is not necessary to remove the remaining film between the tip of the molding surface 16 and the support substrate 15 by anisotropic etching. Further, since the film to be molded that adheres to the stamper 1 is in an uncured state, it can be easily removed. Moreover, since the convex part of the stamper 1 adheres to the cured negative photosensitive molding target film 14 and is not easily broken, the durability life of the stamper 1 is extended.

２．第二実施形態
図１０は、本発明の第二実施形態によるスタンパ２を示す断面図である。
スタンパ２において、遮光性膜１２の開口部は透光性基板１３の表面に接合されている透光性膜１７で埋められており、太線で示す成形面１６の凹部に遮光性膜１２による段差がなく、成形面１６の凸部全体が膜１１で構成されている形状になっている。スタンパ２の遮光性膜１２に重なっていない部分は、透光性基板１３と透光性膜１７とで構成され、これらが成形面１６の裏面から成形面１６に至る透光部を構成している。 2. Second Embodiment FIG. 10 is a cross-sectional view showing a stamper 2 according to a second embodiment of the present invention.
In the stamper 2, the opening of the light-shielding film 12 is filled with a light-transmitting film 17 bonded to the surface of the light-transmitting substrate 13, and a step due to the light-shielding film 12 is formed in the concave portion of the molding surface 16 indicated by a thick line. In other words, the entire convex portion of the molding surface 16 is formed of the film 11. The portion of the stamper 2 that does not overlap the light-shielding film 12 is composed of a light-transmitting substrate 13 and a light-transmitting film 17, which constitute a light-transmitting portion that extends from the back surface of the molding surface 16 to the molding surface 16. Yes.

スタンパ２では、成形面１６の凸部全体が膜１１で構成され、膜１１からなる凸部の全体が遮光性膜１２の輪郭に内包されているため、成形面の凸部のいずれの部分にも硬化したネガ型感光性成形対象膜が固着することがない。
したがって図１１に示すように、スタンパ２を圧着した状態でネガ型感光性成形対象膜１４を露光した後にネガ型感光性成形対象膜１４からスタンパ２を引き離すとき、離型性がさらに良好になる。 In the stamper 2, the entire convex portion of the molding surface 16 is composed of the film 11, and the entire convex portion made of the film 11 is included in the outline of the light-shielding film 12. Also, the cured negative photosensitive molding target film does not stick.
Therefore, as shown in FIG. 11, when the stamper 2 is pressure-bonded and the negative photosensitive molding target film 14 is exposed and then the stamper 2 is pulled away from the negative photosensitive molding target film 14, the mold release property is further improved. .

図１２、図１３は、スタンパ２の製造方法を示す断面図である。
はじめに中間生成物として第一実施形態のスタンパ１を製造する。 12 and 13 are cross-sectional views showing a method for manufacturing the stamper 2.
First, the stamper 1 of the first embodiment is manufactured as an intermediate product.

次に図１２に示すように透光性膜１７を膜１１が埋没する厚さに形成する。   Next, as shown in FIG. 12, a translucent film 17 is formed to a thickness so that the film 11 is buried.

次に図１３に示すように透光性膜１７の表面を研削および研磨の少なくともいずれか一方によって平坦化する。このとき、成形面の凸部を形成する膜１１に達する手前で研削または研磨を終了してもよいし、膜１１の表層もろとも研削又は研磨してもよい。また、透光性膜１７の表面を研削又は研磨せずに次の工程に進んでもよい。   Next, as shown in FIG. 13, the surface of the translucent film 17 is planarized by at least one of grinding and polishing. At this time, the grinding or polishing may be terminated before reaching the film 11 forming the convex portion of the molding surface, or the surface layer of the film 11 may be ground or polished. Further, the process may proceed to the next step without grinding or polishing the surface of the translucent film 17.

最後に透光性膜１７の表面全体を選択的にエッチングすると図１０に示すスタンパ２が完成する。エッチングの終点は、遮光性膜１２が露出する手前か、遮光性膜１２がちょうど露出する深さに設定し、成形面の凹部に遮光性膜１２による段差が出ないように制御する。   Finally, when the entire surface of the translucent film 17 is selectively etched, the stamper 2 shown in FIG. 10 is completed. The end point of the etching is set to be just before the light-shielding film 12 is exposed or to a depth at which the light-shielding film 12 is just exposed, and is controlled so that a step due to the light-shielding film 12 does not appear in the recess of the molding surface.

３．第三実施形態
図１４は、本発明の第三実施形態によるスタンパ３を示す断面図である。
スタンパ３の成形面には、テーパー形状の凸部１６２が形成されている。凸部１６２の先端部はテーパー形状の開口部１１３を有する膜１１で形成されている。
図１５に示すように、スタンパ３をネガ型感光性成形対象膜１４に圧着した状態でスタンパ３を介してネガ型感光性成形対象膜１４を露光しても、遮光性膜１２の投影領域１４２ではネガ型感光性成形対象膜１４は硬化しない。ネガ型感光性成形対象膜１４の硬化する感光領域１４１のパターンは遮光性膜１２のパターンによって決まる。成形しようとするパターンが同一である場合、膜１１によって構成される成形面の凸部をその基端の輪郭が遮光性膜１２の輪郭に重なるテーパー形状にした方が、成形面の凸部を柱形状にするときに比べて未感光領域１４２の体積が小さくできる。したがって、膜１１によって構成される成形面の凸部がテーパー形状である方が、成形面の凸部が柱形状である場合に比べて、ネガ型感光性成形対象膜１４の未感光領域１４２を現像によって除去する時間を短縮することが出来る。また成形面の凸部がテーパー形状である方が、成形面の凸部が柱形状である場合に比べ、離型性がよくなる。 3. Third Embodiment FIG. 14 is a cross-sectional view showing a stamper 3 according to a third embodiment of the present invention.
A tapered convex portion 162 is formed on the molding surface of the stamper 3. The tip of the convex portion 162 is formed of a film 11 having a tapered opening 113.
As shown in FIG. 15, even if the negative photosensitive molding target film 14 is exposed through the stamper 3 in a state where the stamper 3 is pressed against the negative photosensitive molding target film 14, the projection region 142 of the light shielding film 12 is exposed. Then, the negative photosensitive molding target film 14 is not cured. The pattern of the photosensitive region 141 where the negative photosensitive molding target film 14 is cured is determined by the pattern of the light shielding film 12. When the pattern to be molded is the same, the convex part of the molding surface is formed by forming the convex part of the molding surface constituted by the film 11 into a tapered shape with the outline of the base end overlapping the outline of the light-shielding film 12. The volume of the non-photosensitive area 142 can be reduced as compared with the case of the column shape. Therefore, when the convex part of the molding surface constituted by the film 11 has a tapered shape, the non-photosensitive region 142 of the negative photosensitive molding target film 14 is formed in comparison with the case where the convex part of the molding surface has a columnar shape. The time for removal by development can be shortened. Moreover, the direction where the convex part of the molding surface is a taper shape improves the releasability as compared with the case where the convex part of the molding surface is a column shape.

図１６、図１７はスタンパ３の製造方法を示す断面図である。
はじめに図１６に示すように透光性基板１３の上に遮光性膜１２、膜１１を形成した後に、テーパー形状の開口部１０２を有するフォトレジスト膜１０を形成する。テーパー形状の開口部１０２は、開口部がテーパー形状になるフォトレジスト材料と現像液とを用いることにより形成することが出来る。フォトレジスト膜１０の厚さは例えば３０μｍとする。尚、フォトレジスト膜１０にはテーパー形状の開口部１０２に代えてテーパー形状の凹部を形成してもよい。 16 and 17 are cross-sectional views showing a method for manufacturing the stamper 3.
First, as shown in FIG. 16, after the light-shielding film 12 and the film 11 are formed on the translucent substrate 13, the photoresist film 10 having the tapered opening 102 is formed. The tapered opening 102 can be formed by using a photoresist material and a developer that have a tapered opening. The thickness of the photoresist film 10 is 30 μm, for example. Note that a tapered recess may be formed in the photoresist film 10 instead of the tapered opening 102.

次に図１７に示すようにフォトレジスト膜１０もろともに膜１１を例えばＲＩＥなどで異方性エッチングすることにより膜１１にテーパー形状の開口部１１３を形成する。フォトレジスト膜１０と膜１１との選択比によって開口部１１３の壁面斜度が決定される。   Next, as shown in FIG. 17, both the photoresist film 10 and the film 11 are anisotropically etched by, for example, RIE to form a tapered opening 113 in the film 11. The slope of the wall surface of the opening 113 is determined by the selection ratio between the photoresist film 10 and the film 11.

最後に、残存したフォトレジスト膜１０を除去すると図１４に示すスタンパ３が完成する。   Finally, when the remaining photoresist film 10 is removed, the stamper 3 shown in FIG. 14 is completed.

４．第四実施形態
図１８は、本発明の第四実施形態によるスタンパ４を示す断面図である。
スタンパ４の成形面のテーパー形状の凸部１６２は、柱形状の芯を形成する膜１１とテーパー形状の側壁部１８とで構成される。側壁部１８は、膜１１に接合されており、透光性であっても遮光性であってもよい。成形面の裏面からスタンパ４の透光性基板１３に入射した光は、遮光性膜１２の開口部を埋めている透光性膜１７を透過して成形面に至る。すなわち、スタンパ４の透光部は透光性基板１３と透光性膜１７とによって構成されている。 4). Fourth Embodiment FIG. 18 is a cross-sectional view showing a stamper 4 according to a fourth embodiment of the present invention.
The taper-shaped convex part 162 of the molding surface of the stamper 4 is constituted by a film 11 forming a columnar core and a taper-shaped side wall part 18. The side wall portion 18 is bonded to the film 11 and may be light transmissive or light shielding. The light incident on the translucent substrate 13 of the stamper 4 from the back surface of the molding surface passes through the translucent film 17 filling the opening of the light shielding film 12 and reaches the molding surface. That is, the translucent part of the stamper 4 is constituted by the translucent substrate 13 and the translucent film 17.

図１９は、スタンパ４を用いた微細転写成形方法を示す断面図である。遮光性膜１２の輪郭が膜１１と側壁部１８とで構成される成形面の凸部１６２の先端の輪郭を内包しており、遮光性膜１２の投影領域に凸部１６２の全体が含まれるため、成形面の凸部１６２とネガ型感光性成形対象膜１４の硬化した感光領域１４１とが固着することがない。   FIG. 19 is a cross-sectional view showing a fine transfer molding method using the stamper 4. The contour of the light-shielding film 12 includes the contour of the tip of the convex part 162 of the molding surface constituted by the film 11 and the side wall part 18, and the entire convex part 162 is included in the projection region of the light-shielding film 12. Therefore, the convex part 162 of the molding surface and the cured photosensitive region 141 of the negative photosensitive molding target film 14 are not fixed.

図２０、図２１、図２２は、スタンパ４の製造方法を示す断面図である。
はじめに図２０に示すように、透光性基板１３の表面上に遮光性膜１２を形成し、遮光性膜１２の表面上に開口部１１１を有する膜１１を形成する。 20, 21, and 22 are cross-sectional views illustrating a method for manufacturing the stamper 4.
First, as shown in FIG. 20, the light shielding film 12 is formed on the surface of the light transmitting substrate 13, and the film 11 having the opening 111 is formed on the surface of the light shielding film 12.

次に図２１に示すように、側壁部１８を形成するための膜１８１を膜１１の表面上と開口部１１１から露出している遮光性膜１２の表面上とに形成する。具体的には例えばＣＶＤ、スパッタ、蒸着などによってＳｉＯ２からなる膜１８１を形成する。 Next, as shown in FIG. 21, a film 181 for forming the side wall portion 18 is formed on the surface of the film 11 and the surface of the light shielding film 12 exposed from the opening 111. Specifically, the film 181 made of SiO 2 is formed by, for example, CVD, sputtering, vapor deposition, or the like.

次に図２２に示すように、膜１８１の表面全体を異方性エッチングすることにより、膜１１の側面に接合されたテーパー形状の側壁部１８を成形する。   Next, as shown in FIG. 22, the entire surface of the film 181 is anisotropically etched to form a tapered side wall portion 18 bonded to the side surface of the film 11.

続いて膜１１と膜１８１とからなる成形面の凸部を保護膜として膜１８１の開口部から露出している遮光性膜１２をエッチングすることにより開口部を形成し、遮光性膜１２の開口部を埋める透光性膜１７を形成すると図１８に示すスタンパ４が完成する。   Subsequently, an opening is formed by etching the light-shielding film 12 exposed from the opening of the film 181 with the convex portion of the molding surface formed of the film 11 and the film 181 as a protective film, and the opening of the light-shielding film 12 is formed. When the translucent film 17 filling the portion is formed, the stamper 4 shown in FIG. 18 is completed.

この製造方法によると、膜１１からなる成形面の凸部の芯に対して遮光性膜１２が自己整合的に形成される。具体的には、膜１１からなる成形面の凸部の芯の輪郭と遮光性膜１２の輪郭の間の幅が精度よく均一になる。その理由は、膜１１の側面に接合されている膜１８１が異方性エッチングによってテーパー形状の側壁部１８に成形されるからである。その結果、成形面の凸部の周囲において硬化しない未感光領域１４２（図１９参照）の厚さ（幅）が精度よく均一になる。   According to this manufacturing method, the light-shielding film 12 is formed in a self-aligned manner with respect to the core of the convex portion of the molding surface made of the film 11. Specifically, the width between the contour of the core of the convex portion of the molding surface made of the film 11 and the contour of the light shielding film 12 becomes uniform with high accuracy. This is because the film 181 bonded to the side surface of the film 11 is formed into the tapered side wall portion 18 by anisotropic etching. As a result, the thickness (width) of the unexposed region 142 (see FIG. 19) that is not cured around the convex portion of the molding surface becomes uniform with high accuracy.

５．第五実施形態
図２３は本発明の第五実施形態によるスタンパ５を示す断面図である。
スタンパ５は、ポジ型感光性成形対象膜を成形するためのものであり、透光性基板２０と遮光部としての遮光性膜２１とで構成されている。太線で示す成形面２２の凹部２２１は、透光性基板２０の表面と遮光性膜２１の表面とからなる。
透光性基板２０は、成形対象である光分解性樹脂の露光波長に対して十分な透光性のある材料である例えば樹脂、ＳｉＯ２、低融点ガラスなどからなる。 5. Fifth Embodiment FIG. 23 is a sectional view showing a stamper 5 according to a fifth embodiment of the present invention.
The stamper 5 is for molding a positive type photosensitive molding target film, and is composed of a translucent substrate 20 and a light shielding film 21 as a light shielding part. The concave portion 221 of the molding surface 22 indicated by a thick line is composed of the surface of the translucent substrate 20 and the surface of the light shielding film 21.
The translucent substrate 20 is made of, for example, a resin, SiO 2 , low-melting glass, or the like, which is a material having sufficient translucency with respect to the exposure wavelength of the photodegradable resin to be molded.

遮光性膜２１は、成形対象である光分解性樹脂の露光波長に対して十分な遮光性のある材料である例えばＣｒなどからなる。遮光性膜２１の輪郭は成形面の凹部２２１の底の輪郭に内包されている。換言すると、遮光性膜２１の輪郭は成形面の凸部の輪郭の外側にある。
スタンパ５の成形面２２の裏側から光を照射すると、遮光性膜２１に重なっていない領域Ｔにおいて光は成形面２２に到達し、遮光性膜２１は成形面２２の凹部２２１の内側に影を形成する。透光性基板２０の遮光性膜２１に重なっていない領域Ｔがスタンパ５の透光部である。 The light shielding film 21 is made of, for example, Cr, which is a material having sufficient light shielding properties with respect to the exposure wavelength of the photodegradable resin to be molded. The contour of the light-shielding film 21 is included in the contour of the bottom of the recess 221 on the molding surface. In other words, the contour of the light-shielding film 21 is outside the contour of the convex portion of the molding surface.
When light is irradiated from the back side of the molding surface 22 of the stamper 5, the light reaches the molding surface 22 in the region T not overlapping the light shielding film 21, and the light shielding film 21 shadows the inside of the recess 221 of the molding surface 22. Form. A region T of the light transmissive substrate 20 that does not overlap the light shielding film 21 is a light transmissive portion of the stamper 5.

図２４、図２５、図２６はスタンパ５を用いた微細成形転写方法を示す断面図である。
はじめに図２４に示すように、支持基板１５の表面上にポジ型感光性成形対象膜２３を形成し、スタンパ５をポジ型感光性成形対象膜２３に圧着した状態で、スタンパ５を介してポジ型感光性成形対象膜２３を露光する。具体的には例えばポジ型フォトレジスト、ポジ型感光性ポリイミドなどの光分解性樹脂を支持基板１５の表面に塗布する。次にスタンパ５を加圧してポジ型感光性成形対象膜２３に圧着し、紫外線や可視光線などの光をスタンパ５の成形面の裏側から照射する。このとき、遮光性膜２１がポジ型感光性成形対象膜２３に投影領域２３２を形成し、ポジ型感光性成形対象膜２３は投影領域２３２において分解せず、感光領域２３１において分解する。 24, 25, and 26 are cross-sectional views showing a fine molding transfer method using the stamper 5. FIG.
First, as shown in FIG. 24, a positive photosensitive molding target film 23 is formed on the surface of the support substrate 15, and the stamper 5 is pressed against the positive photosensitive molding target film 23 with the positive electrode interposed therebetween. The mold photosensitive molding target film 23 is exposed. Specifically, for example, a photodegradable resin such as positive photoresist or positive photosensitive polyimide is applied to the surface of the support substrate 15. Next, the stamper 5 is pressurized and pressure-bonded to the positive type photosensitive molding target film 23, and light such as ultraviolet rays and visible light is irradiated from the back side of the molding surface of the stamper 5. At this time, the light-shielding film 21 forms the projection region 232 on the positive photosensitive molding target film 23, and the positive photosensitive molding target film 23 is not decomposed in the projection region 232 but is decomposed in the photosensitive region 231.

次に図２５に示すように、ポジ型感光性成形対象膜２３からスタンパ５を引き離す。このとき、ポジ型感光性成形対象膜２３の硬化している未感光領域２３２とスタンパ５の成形面の凹部２２１の側壁面との間にはポジ型感光性成形対象膜２３の感光して軟化した部分が存在する。このため、スタンパ５の成形面の凹部２２１にはまりこんで硬化した部分がスタンパ５の離型によって変形しにくい。   Next, as shown in FIG. 25, the stamper 5 is pulled away from the positive photosensitive molding target film 23. At this time, the positive photosensitive molding target film 23 is exposed and softened between the unexposed region 232 where the positive photosensitive molding target film 23 is cured and the side wall surface of the concave portion 221 of the molding surface of the stamper 5. There is a part that. For this reason, the hardened part of the molding surface of the stamper 5 that is stuck and hardened is not easily deformed by the release of the stamper 5.

最後に図２６に示すようにポジ型感光性成形対象膜２３を現像し感光領域２３１を除去すると未感光領域２３２からなる成形膜が完成する。このような成形膜はエッチングやリフトオフの保護膜として用いることも出来るし、ＭＥＭＳ（Micro Electro Mechanical System）の構造体として用いることも出来る。   Finally, as shown in FIG. 26, when the positive photosensitive molding target film 23 is developed and the photosensitive area 231 is removed, a molded film composed of the non-photosensitive area 232 is completed. Such a molded film can be used as a protective film for etching or lift-off, and can also be used as a structure of MEMS (Micro Electro Mechanical System).

図２７から図３５はスタンパ５の製造方法を示す断面図である。
はじめに図２７に示すように支持膜としての犠牲膜２６、シード層２５、犠牲基板２４、遮光性膜２１、フォトレジスト膜２８がこの順に積層された積層体を形成する。具体的には例えば、まずＳｉＮ、ＡｌＮ、ＳｉＣなどからなる犠牲基板２４の表面上にＣｕからなる厚さ０．３μｍのシード層２５をスパッタで形成する。犠牲基板２４とシード層２５との間にＣｒ、Ｔｉなどからなる厚さ０．０５μｍ程度の密着層を形成してもよい。次に電解めっきによりＣｕなどからなる厚さ１ｍｍ程度の犠牲膜２６を形成する。次に犠牲基板２４の裏面上にＣｒなどからなる厚さ０．１μｍ程度の遮光性膜２１を蒸着やスパッタなどで形成する。次に遮光性膜２１の表面上にポジ型フォトレジスト材料などを塗布し、露光・現像して厚さ５μｍ程度のフォトレジスト膜２８を形成する。 27 to 35 are cross-sectional views showing a method for manufacturing the stamper 5.
First, as shown in FIG. 27, a sacrificial film 26 as a support film, a seed layer 25, a sacrificial substrate 24, a light-shielding film 21, and a photoresist film 28 are laminated in this order. Specifically, for example, a seed layer 25 made of Cu having a thickness of 0.3 μm is first formed on the surface of the sacrificial substrate 24 made of SiN, AlN, SiC, or the like by sputtering. An adhesion layer made of Cr, Ti or the like and having a thickness of about 0.05 μm may be formed between the sacrificial substrate 24 and the seed layer 25. Next, a sacrificial film 26 made of Cu or the like and having a thickness of about 1 mm is formed by electrolytic plating. Next, a light shielding film 21 made of Cr or the like and having a thickness of about 0.1 μm is formed on the back surface of the sacrificial substrate 24 by vapor deposition or sputtering. Next, a positive photoresist material or the like is applied onto the surface of the light-shielding film 21, exposed and developed to form a photoresist film 28 having a thickness of about 5 μm.

次にフォトレジスト膜２８を保護膜として遮光性膜２１をエッチングすることにより図２８に示すように開口部２１１を形成した後に、フォトレジスト膜２８を除去する。例えばＣｒからなる遮光性膜２１を硝酸第二セリウムアンモニウム溶液に浸して湿式でエッチングしてもよいし、Ｃｌ２ガス又はＣＣｌ４ガスを用いて遮光性膜２１をドライエッチングしてもよい。 Next, the light-shielding film 21 is etched using the photoresist film 28 as a protective film to form an opening 211 as shown in FIG. 28, and then the photoresist film 28 is removed. For example, the light-shielding film 21 made of Cr may be immersed in a ceric ammonium nitrate solution and etched wet, or the light-shielding film 21 may be dry-etched using Cl 2 gas or CCl 4 gas.

次に図２９に示すように第二の犠牲膜２７を遮光性膜２１の表面の上と開口部２１１から露出した犠牲基板２４の表面の上とに形成する。具体的には例えばＳｉＯ２、多結晶Ｓｉなどからなる第二の犠牲膜２７をＣＶＤ、スパッタ、蒸着などによって形成する。 Next, as shown in FIG. 29, the second sacrificial film 27 is formed on the surface of the light shielding film 21 and on the surface of the sacrificial substrate 24 exposed from the opening 211. Specifically, the second sacrificial film 27 made of, for example, SiO 2 or polycrystalline Si is formed by CVD, sputtering, vapor deposition, or the like.

次に図３０に示すように第二の犠牲膜２７を全面的に異方性エッチングすることにより開口部２７１を形成するとともに遮光性膜２１の周囲において犠牲基板２４を一定幅保護するための形状に第二の犠牲膜２７を成形する。具体的には例えばＣＦ４ガスまたはＣＨ２Ｆ２ガスを用いたＲＩＥによって第二の犠牲膜２７を成形する。 Next, as shown in FIG. 30, an opening 271 is formed by anisotropically etching the second sacrificial film 27, and a shape for protecting the sacrificial substrate 24 by a certain width around the light-shielding film 21. Second sacrificial film 27 is formed. Specifically, for example, the second sacrificial film 27 is formed by RIE using CF 4 gas or CH 2 F 2 gas.

次に図３１に示すように遮光性膜２１と第二の犠牲膜２７とを保護膜とする異方性エッチングにより犠牲基板２４に開口部２４１を形成する。具体的には例えばＲＩＥによって開口部２４１を形成する。その結果、犠牲基板２４は成形面の凹部の反転形状に成形される。   Next, as shown in FIG. 31, an opening 241 is formed in the sacrificial substrate 24 by anisotropic etching using the light-shielding film 21 and the second sacrificial film 27 as protective films. Specifically, the opening 241 is formed by RIE, for example. As a result, the sacrificial substrate 24 is formed into a reverse shape of the concave portion of the forming surface.

次に図３２に示すように第二の犠牲膜２７をエッチングにより除去する。   Next, as shown in FIG. 32, the second sacrificial film 27 is removed by etching.

次に図３３に示すように、遮光性膜２１の表面上と、遮光性膜２１の開口部から露出している犠牲基板２４の表面上と、犠牲基板２４の開口部から露出しているシード層２５の表面上とに、犠牲基板２４の開口部を埋める透光性膜２０１を形成し、透光性膜２０１の表面を研削および研磨の少なくとも一方により平坦化することにより透光性基板２０を成形する。透光性基板２０の材料としては例えば樹脂、ＳｉＯ２、低融点ガラスを用いる。ＣＩＭ（Ceramic Injection Molding）によって透光性基板２０を形成してもよい。 Next, as shown in FIG. 33, the seed exposed on the surface of the light-shielding film 21, the surface of the sacrificial substrate 24 exposed from the opening of the light-shielding film 21, and the seed exposed from the opening of the sacrificial substrate 24. A translucent film 201 that fills the opening of the sacrificial substrate 24 is formed on the surface of the layer 25, and the surface of the translucent film 201 is planarized by at least one of grinding and polishing, thereby translucent substrate 20. Is molded. As a material of the translucent substrate 20, for example, resin, SiO 2 or low melting point glass is used. The translucent substrate 20 may be formed by CIM (Ceramic Injection Molding).

次に、犠牲膜２６、シード層２５を図３４、図３５に示すように順次除去する。Ｃｒからなるシード層２５には例えば硝酸第二セリウムアンモニウム液をエッチャントに用いる。Ｃｌ２ガスまたはＣＣｌ４ガスを用いたドライエッチングによってシード層２５を除去してもよい。 Next, the sacrificial film 26 and the seed layer 25 are sequentially removed as shown in FIGS. For the seed layer 25 made of Cr, for example, a ceric ammonium nitrate solution is used as an etchant. The seed layer 25 may be removed by dry etching using Cl 2 gas or CCl 4 gas.

最後に犠牲基板２４をエッチングにより除去すると図２３に示すスタンパ５が完成する。具体的には例えば熱燐酸（Ｈ３ＰＯ４）を用いて１７０℃の温度条件でＳｉＮからなる犠牲基板２４を除去することができる。 Finally, when the sacrificial substrate 24 is removed by etching, the stamper 5 shown in FIG. 23 is completed. Specifically, the sacrificial substrate 24 made of SiN can be removed using, for example, hot phosphoric acid (H 3 PO 4 ) at a temperature of 170 ° C.

以上説明したスタンパ５（図２３参照）の製造方法によると、遮光性膜２１の輪郭に対して成形面２２の凹部２２１を自己整合的に形成することができる。その理由は、凹部２２１の側壁面と遮光性膜２１の輪郭との間の幅は、遮光性膜２１の周囲に成形される第二の犠牲膜２７の形状によって決まり、第二の犠牲膜２７は遮光性膜２１の側面に接合された状態で異方性エッチングによって成形されるからである。   According to the manufacturing method of the stamper 5 (see FIG. 23) described above, the concave portion 221 of the molding surface 22 can be formed in a self-aligned manner with respect to the contour of the light-shielding film 21. The reason is that the width between the side wall surface of the recess 221 and the outline of the light shielding film 21 is determined by the shape of the second sacrificial film 27 formed around the light shielding film 21, and the second sacrificial film 27. This is because it is molded by anisotropic etching while being bonded to the side surface of the light-shielding film 21.

６．第六実施形態
尚、図２９に示した第二の犠牲膜２７が透光性材料からなる場合、図３０に示したように第二の犠牲膜２７を成形し、犠牲基板２４をエッチングした後に、第二の犠牲膜２７を除去することなく、第二の犠牲膜２７を図３６に示すようにスタンパ６の一部として残存させてもよい。 6). Sixth Embodiment When the second sacrificial film 27 shown in FIG. 29 is made of a light-transmitting material, the second sacrificial film 27 is formed as shown in FIG. 30 and the sacrificial substrate 24 is etched. The second sacrificial film 27 may be left as a part of the stamper 6 as shown in FIG. 36 without removing the second sacrificial film 27.

７．他の実施形態
本発明の技術的範囲は、上述した実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々変更を加え得ることは勿論である。例えば、上記実施形態で示した材質や寸法や成膜方法やパターン転写方法はあくまで例示であるし、当業者であれば自明である工程の追加や削除や工程順序の入れ替えについては説明が省略されている。 7). Other Embodiments The technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the materials, dimensions, film forming methods, and pattern transfer methods shown in the above embodiments are merely examples, and descriptions of addition and deletion of processes and replacement of process orders that are obvious to those skilled in the art are omitted. ing.

本発明の第一実施形態にかかる断面図である。It is sectional drawing concerning 1st embodiment of this invention. 本発明の第一実施形態にかかる断面図である。It is sectional drawing concerning 1st embodiment of this invention. 本発明の第一実施形態にかかる断面図である。It is sectional drawing concerning 1st embodiment of this invention. 本発明の第一実施形態にかかる断面図である。It is sectional drawing concerning 1st embodiment of this invention. 本発明の第一実施形態にかかる断面図である。It is sectional drawing concerning 1st embodiment of this invention. 本発明の第一実施形態にかかる断面図である。It is sectional drawing concerning 1st embodiment of this invention. 本発明の第一実施形態にかかる断面図である。It is sectional drawing concerning 1st embodiment of this invention. 本発明の第一実施形態にかかる断面図である。It is sectional drawing concerning 1st embodiment of this invention. 本発明の第一実施形態にかかる断面図である。It is sectional drawing concerning 1st embodiment of this invention. 本発明の第二実施形態にかかる断面図である。It is sectional drawing concerning 2nd embodiment of this invention. 本発明の第二実施形態にかかる断面図である。It is sectional drawing concerning 2nd embodiment of this invention. 本発明の第二実施形態にかかる断面図である。It is sectional drawing concerning 2nd embodiment of this invention. 本発明の第二実施形態にかかる断面図である。It is sectional drawing concerning 2nd embodiment of this invention. 本発明の第三実施形態にかかる断面図である。It is sectional drawing concerning 3rd embodiment of this invention. 本発明の第三実施形態にかかる断面図である。It is sectional drawing concerning 3rd embodiment of this invention. 本発明の第三実施形態にかかる断面図である。It is sectional drawing concerning 3rd embodiment of this invention. 本発明の第三実施形態にかかる断面図である。It is sectional drawing concerning 3rd embodiment of this invention. 本発明の第四実施形態にかかる断面図である。It is sectional drawing concerning 4th embodiment of this invention. 本発明の第四実施形態にかかる断面図である。It is sectional drawing concerning 4th embodiment of this invention. 本発明の第四実施形態にかかる断面図である。It is sectional drawing concerning 4th embodiment of this invention. 本発明の第四実施形態にかかる断面図である。It is sectional drawing concerning 4th embodiment of this invention. 本発明の第四実施形態にかかる断面図である。It is sectional drawing concerning 4th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第五実施形態にかかる断面図である。It is sectional drawing concerning 5th embodiment of this invention. 本発明の第六実施形態にかかる断面図である。It is sectional drawing concerning 6th embodiment of this invention.

符号の説明Explanation of symbols

１：スタンパ、２：スタンパ、３：スタンパ、４：スタンパ、５：スタンパ、６：スタンパ、１０：フォトレジスト膜、１１：成形面の凸部を形成するための膜、１２：遮光性膜、１３：透光性基板、１４：ネガ型感光性成形対象膜、１５：支持基板、１６：成形面、１７：透光性膜、１８：側壁部、２０：透光性基板、２１：遮光性膜、２２：成形面、２３：ポジ型感光性成形対象膜、２４：犠牲基板、２５：シード層、２６：犠牲膜、２７：第二の犠牲膜、２８：フォトレジスト膜、１０１：開口部、１０２：開口部、１１１：開口部、１１２：先端部、１１３：開口部、１２１：開口部、１２２：基端部、１４１：感光領域、１４２：投影領域、１６１：凸部、１６２：凸部、１８１：膜、２０１：透光性膜、２１１：開口部、２２１：凹部、２３１：感光領域、２３２：投影領域、２４１：開口部、２７１：開口部 1: stamper, 2: stamper, 3: stamper, 4: stamper, 5: stamper, 6: stamper, 10: photoresist film, 11: film for forming convex portions of the molding surface, 12: light-shielding film, 13: Translucent substrate, 14: Negative photosensitive molding target film, 15: Support substrate, 16: Molding surface, 17: Translucent film, 18: Side wall, 20: Translucent substrate, 21: Light shielding property Film: 22: molding surface, 23: positive photosensitive molding target film, 24: sacrificial substrate, 25: seed layer, 26: sacrificial film, 27: second sacrificial film, 28: photoresist film, 101: opening , 102: opening, 111: opening, 112: distal end, 113: opening, 121: opening, 122: base end, 141: photosensitive region, 142: projection region, 161: convex portion, 162: convex Part, 181: film, 201: translucent film, 211: opening, 221 Recess 231: photosensitive region, 232: projection area, 241: opening, 271: opening

Claims (13)

ネガ型感光性成形対象膜を成形するための微細成形モールドであって、
凸部を有する成形面と、
前記成形面の裏面から前記成形面に至る透光部と、
前記凸部の先端を内包し前記凸部の先端からはみ出す投影領域を前記ネガ型感光性成形対象膜に形成する遮光部と、
を備える微細成形モールド。 A fine molding mold for molding a negative photosensitive molding target film,
A molding surface having a convex part;
A translucent part extending from the rear surface of the molding surface to the molding surface;
A light-shielding portion that forms a projection region that includes the tip of the convex portion and protrudes from the tip of the convex portion on the negative photosensitive molding target film;
A fine molding mold comprising: 前記凸部はテーパー形状である、
請求項１に記載の微細成形モールド。 The convex portion is tapered.
The fine mold according to claim 1. 前記凸部の基端の輪郭は前記遮光部の輪郭に重なる、
請求項２に記載の微細成形モールド。 The outline of the base end of the convex part overlaps the outline of the light shielding part,
The fine mold according to claim 2. 前記凸部は、
柱状の芯と、
前記芯の外側に接合されているテーパー形状の側壁部と、
を備える請求項３に記載の微細成形モールド。 The convex portion is
Columnar core,
A tapered sidewall joined to the outside of the core;
A fine mold according to claim 3. 前記凸部の基端の輪郭は前記遮光部の輪郭に内包される、
請求項１に記載の微細成形モールド。 The outline of the base end of the convex part is included in the outline of the light shielding part,
The fine mold according to claim 1. 少なくとも一部が前記透光部の一部を構成する透光性基板と、
少なくとも一部が前記透光部の一部を構成し表面が前記成形面の一部を構成し前記透光性基板に接合している透光性膜と、
前記遮光部の少なくとも一部を構成し前記透光性基板に接合している遮光性膜と、
前記凸部の少なくとも一部を構成し前記遮光性膜に接合している膜と、
を備え、
前記遮光性膜の開口部は前記透光性膜で埋められている、
請求項５に記載の微細成形モールド。 A translucent substrate at least part of which constitutes part of the translucent part;
A translucent film in which at least a part constitutes a part of the translucent part and a surface constitutes a part of the molding surface and is bonded to the translucent substrate;
A light-shielding film that constitutes at least a part of the light-shielding part and is bonded to the light-transmitting substrate;
A film constituting at least a part of the convex portion and bonded to the light-shielding film;
With
The opening of the light-shielding film is filled with the light-transmitting film;
The fine mold according to claim 5. 透光性基板の表面上に遮光性膜を形成し、
前記遮光性膜の表面上に成形面の凸部を形成するための膜を形成し、
前記凸部を形成するための膜の表面上に保護膜を形成し、
前記保護膜にテーパー形状の開口部または凹部を形成し、
前記保護膜もろともに異方性エッチングすることにより前記凸部を形成するための膜にテーパー形状の開口部を形成し、
前記凸部を形成するための膜の開口部から露出した前記遮光性膜に異方性エッチングによって開口部を形成する、
ことを含む微細成形モールドの製造方法。 Forming a light-shielding film on the surface of the light-transmitting substrate;
Forming a film for forming convex portions of the molding surface on the surface of the light-shielding film;
Forming a protective film on the surface of the film for forming the convex part,
Forming a tapered opening or recess in the protective film;
A tapered opening is formed in the film for forming the convex portion by anisotropic etching together with the protective film,
Forming an opening by anisotropic etching in the light-shielding film exposed from the opening of the film for forming the convex part,
The manufacturing method of the fine mold which contains this. 透光性基板の表面上に遮光性膜を形成し、
前記遮光性膜の表面上に成形面の凸部を形成するための膜を形成し、
前記凸部を形成するための膜の表面上に保護膜を形成し、
前記保護膜に開口部を形成し、
前記保護膜の開口部から露出した前記凸部を形成するための膜に異方性エッチングにより開口部を形成し、
前記凸部を形成するための膜の開口部から露出した前記遮光性膜に異方性エッチングによって開口部を形成した後に、前記凸部を形成するための膜を等方性エッチングする、
ことを含む微細成形モールドの製造方法。 Forming a light-shielding film on the surface of the light-transmitting substrate;
Forming a film for forming convex portions of the molding surface on the surface of the light-shielding film;
Forming a protective film on the surface of the film for forming the convex part,
Forming an opening in the protective film;
Forming an opening by anisotropic etching in the film for forming the convex portion exposed from the opening of the protective film;
Forming an opening by anisotropic etching in the light-shielding film exposed from the opening of the film for forming the convex, and then isotropically etching the film for forming the convex;
The manufacturing method of the fine mold which contains this. 透光性基板の表面上に遮光性膜を形成し、
前記遮光性膜の表面上に成形面の凸部の芯を形成するための膜を形成し、
前記凸部の芯を形成するための膜の表面上に保護膜を形成し、
前記保護膜に開口部を形成し、
前記保護膜の開口部から露出した前記凸部の芯を形成するための膜に異方性エッチングにより開口部を形成し、
前記凸部の芯を形成するための膜の表面上と前記遮光性膜との表面上とに、前記凸部の側壁部を形成するための膜を形成し、
前記凸部の側壁部を形成するための膜の異方性エッチングにより、前記凸部の側壁部をテーパー形状に成形するとともに前記凸部の側壁部を形成するための膜に開口部を形成し、
前記凸部の側壁部を形成するための膜の開口部から露出した前記遮光性膜に異方性エッチングによって開口部を形成する、
ことを含む微細成形モールドの製造方法。 Forming a light-shielding film on the surface of the light-transmitting substrate;
Forming a film for forming the core of the convex portion of the molding surface on the surface of the light-shielding film;
Forming a protective film on the surface of the film for forming the core of the convex part,
Forming an opening in the protective film;
Forming an opening by anisotropic etching in the film for forming the core of the convex portion exposed from the opening of the protective film;
On the surface of the film for forming the core of the convex part and on the surface of the light-shielding film, a film for forming the side wall part of the convex part is formed,
By anisotropic etching of the film for forming the side wall part of the convex part, the side wall part of the convex part is formed into a tapered shape and an opening is formed in the film for forming the side wall part of the convex part. ,
Forming an opening by anisotropic etching in the light-shielding film exposed from the opening of the film for forming the side wall of the convex part;
The manufacturing method of the fine mold which contains this. 凸部を有する成形面と、
前記成形面の裏面から前記成形面に至る透光部と、
前記凸部の先端を内包し前記凸部の先端からはみ出す投影領域を形成する遮光部と、
を備える微細成形モールドを、ネガ型感光性成形対象膜に圧着し、
前記微細成形モールドの前記成形面の裏側から前記ネガ型感光性成形対象膜を露光し、
前記ネガ型感光性成形対象膜から前記微細成形モールドを引き離し、
前記ネガ型感光性成形対象膜の前記遮光部の投影領域を現像により除去する、
ことを含む微細転写成形方法。 A molding surface having a convex part;
A translucent part extending from the rear surface of the molding surface to the molding surface;
A light-shielding portion that forms a projection region that includes the tip of the convex portion and protrudes from the tip of the convex portion;
A fine molding mold comprising a negative-type photosensitive molding target film,
Exposing the negative photosensitive molding target film from the back side of the molding surface of the fine molding mold,
The fine mold is separated from the negative photosensitive molding target film,
Removing the projection area of the light-shielding portion of the negative photosensitive molding target film by development;
A fine transfer molding method. ポジ型感光性成形対象膜を成形するための微細成形モールドであって、
凹部を有する成形面と、
前記成形面の裏面から前記成形面に至る透光部と、
前記凹部の底に内包される投影領域を前記ポジ型感光性成形対象膜に形成する遮光部と、
を備える微細成形モールド。 A fine molding mold for molding a positive photosensitive molding target film,
A molding surface having a recess;
A translucent part extending from the rear surface of the molding surface to the molding surface;
A light-shielding portion for forming a projection region included in the bottom of the concave portion on the positive photosensitive molding target film;
A fine molding mold comprising: 請求項１１に記載の微細成形モールドを製造する方法であって、
犠牲基板の表面上に遮光性膜を形成し、
前記犠牲基板の裏面上に支持膜を形成し、
前記遮光性膜に開口部を形成して前記遮光性膜からなる前記遮光部を形成し、
前記遮光性膜の開口部から露出した前記犠牲基板の表面上と前記遮光性膜の表面上とに、前記遮光部の輪郭と前記凹部の底の輪郭との間の幅を規定するための犠牲膜を形成し、
前記犠牲膜を異方性エッチングすることにより前記犠牲膜に開口部を形成するとともに前記犠牲膜を前記遮光部の周囲に所定幅だけ残存させ、
前記犠牲膜と前記遮光性膜とを保護膜として異方性エッチングすることにより前記犠牲基板に開口部を形成するとともに前記犠牲基板を前記凹部の反転形状に成形し、
前記犠牲基板と前記遮光部とを埋め前記透光部となる透光性膜を前記支持膜の表面上に形成し、
前記支持膜と前記犠牲基板とを除去する、
ことを含む微細成形モールドの製造方法。 A method for producing the fine mold according to claim 11, comprising:
Form a light-shielding film on the surface of the sacrificial substrate,
Forming a support film on the back surface of the sacrificial substrate;
Forming an opening in the light-shielding film to form the light-shielding part made of the light-shielding film;
A sacrifice for defining a width between the contour of the light shielding portion and the contour of the bottom of the recess on the surface of the sacrificial substrate exposed from the opening of the light shielding film and on the surface of the light shielding film. Forming a film,
The sacrificial film is anisotropically etched to form an opening in the sacrificial film and leave the sacrificial film a predetermined width around the light shielding part,
Forming an opening in the sacrificial substrate by anisotropic etching using the sacrificial film and the light-shielding film as a protective film, and forming the sacrificial substrate into an inverted shape of the recess,
Forming a light-transmitting film that fills the sacrificial substrate and the light-shielding portion and serves as the light-transmitting portion on the surface of the support film;
Removing the support film and the sacrificial substrate;
The manufacturing method of the fine mold which contains this. 凹部を有する成形面と、
前記成形面の裏面から前記成形面に至る遮光部と、
前記凹部の底に内包される投影領域を形成する遮光部と、
を備える微細成形モールドを、ポジ型感光性成形対象膜に圧着し、
前記微細成形モールドの前記成形面の裏側から前記ポジ型感光性成形対象膜を露光し、
前記ポジ型感光性成形対象膜から前記微細成形モールドを引き離し、
前記ポジ型感光性成形対象膜の前記遮光部の投影領域を現像により除去する、
ことを含む微細転写成形方法。 A molding surface having a recess;
A light shielding portion from the back surface of the molding surface to the molding surface;
A light-shielding portion that forms a projection region contained in the bottom of the recess;
A fine molding mold comprising a positive type photosensitive molding target film,
Exposing the positive photosensitive molding target film from the back side of the molding surface of the fine molding mold,
The fine mold is separated from the positive photosensitive molding target film,
Removing the projection area of the light-shielding portion of the positive-type photosensitive molding target film by development;
A fine transfer molding method.
JP2007002127A 2007-01-10 2007-01-10 Minute molding mold Withdrawn JP2008168475A (en)

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Cited By (6)

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JP2008226877A (en) * 2007-03-08 2008-09-25 Seiko Epson Corp Process for fabricating electronic device
JP2011014875A (en) * 2009-06-03 2011-01-20 Canon Inc Method for manufacturing structure
JP2014209509A (en) * 2013-04-16 2014-11-06 大日本印刷株式会社 Method of manufacturing imprint mold
KR20170030319A (en) * 2015-09-09 2017-03-17 주식회사 엘지화학 Method for manufacturing cliche for offset printing and cliche for offset printing
JPWO2017057263A1 (en) * 2015-09-29 2018-07-26 大日本印刷株式会社 WIRING STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, MULTILAYER WIRING STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING BOARD, PATTERN STRUCTURE FORMING METHOD, IMPRINT MOLD AND ITS MANUFACTURING METHOD, IMPRINT MOLD SET, AND MULTILAYER Wiring board manufacturing method
CN114193239A (en) * 2021-12-15 2022-03-18 深圳市南和建毅模具有限公司 Mold core processing technology

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008226877A (en) * 2007-03-08 2008-09-25 Seiko Epson Corp Process for fabricating electronic device
JP2011014875A (en) * 2009-06-03 2011-01-20 Canon Inc Method for manufacturing structure
JP2014209509A (en) * 2013-04-16 2014-11-06 大日本印刷株式会社 Method of manufacturing imprint mold
KR20170030319A (en) * 2015-09-09 2017-03-17 주식회사 엘지화학 Method for manufacturing cliche for offset printing and cliche for offset printing
KR102016616B1 (en) * 2015-09-09 2019-08-30 주식회사 엘지화학 Method for manufacturing cliche for offset printing and cliche for offset printing
JPWO2017057263A1 (en) * 2015-09-29 2018-07-26 大日本印刷株式会社 WIRING STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, MULTILAYER WIRING STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING BOARD, PATTERN STRUCTURE FORMING METHOD, IMPRINT MOLD AND ITS MANUFACTURING METHOD, IMPRINT MOLD SET, AND MULTILAYER Wiring board manufacturing method
CN114193239A (en) * 2021-12-15 2022-03-18 深圳市南和建毅模具有限公司 Mold core processing technology

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