JP2008135734A - 回路接続構造体 - Google Patents
回路接続構造体 Download PDFInfo
- Publication number
- JP2008135734A JP2008135734A JP2007280782A JP2007280782A JP2008135734A JP 2008135734 A JP2008135734 A JP 2008135734A JP 2007280782 A JP2007280782 A JP 2007280782A JP 2007280782 A JP2007280782 A JP 2007280782A JP 2008135734 A JP2008135734 A JP 2008135734A
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- JP
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- Prior art keywords
- circuit
- connection
- conductive particles
- circuit connection
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Abstract
【解決手段】第1の回路基板31の主面31a上に第1の回路電極32が形成された第1の回路部材30と、第1の回路部材30に対向して配置され、第2の回路基板41の主面41a上に第2の回路電極42が形成された第2の回路部材40と、第1の回路部材30の主面と第2の回路部材40の主面との間に設けられ、第1及び第2の回路電極32,42を電気的に接続する回路接続部材10とを備える回路接続構造体において、第1及び第2の回路電極32,42の厚みが50nm以上で、回路接続部材10が、接着剤組成物と表面側に複数の突起部14を備えた導電粒子12とを含有する回路接続材料を硬化処理することにより得られるものであり、導電粒子12の最外層が、ニッケル又はニッケル合金である回路接続構造体1。
【選択図】 図1
Description
[回路接続構造体]
接着剤組成物は、絶縁性及び接着性を有する。接着剤組成物としては、(1)エポキシ樹脂と、エポキシ樹脂の潜在性硬化剤とを含有する組成物、(2)ラジカル重合性物質と、加熱により遊離ラジカルを発生する硬化剤とを含有する組成物、又は(1)と(2)との混合組成物が好ましい。
上記エポキシ樹脂としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、ビスフェノールFノボラック型エポキシ樹脂、脂環式エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ヒダントイン型エポキシ樹脂、イソシアヌレート型エポキシ樹脂、脂肪族鎖状エポキシ樹脂等が挙げられる。これらのエポキシ樹脂は、ハロゲン化されていてもよく、水素添加されていてもよい。これらのエポキシ樹脂は、2種以上を併用してもよい。
次に、上述した回路接続構造体1の製造方法について説明する。
((処理後抵抗値−初期抵抗値)/初期抵抗値)×100
で算出した。接続信頼性の改善効果の判断として、抵抗増加率10%未満を改善効果有り、10%以上15%未満を従来品レベル、15%以上を改善効果無し(NG)とした。
Claims (5)
- 第1の回路基板の主面上に第1の回路電極が形成された第1の回路部材と、
前記第1の回路部材に対向して配置され、第2の回路基板の主面上に第2の回路電極が形成された第2の回路部材と、
前記第1の回路部材の主面と前記第2の回路部材の主面との間に設けられ、前記第1及び第2の回路電極を電気的に接続する回路接続部材と、
を備える回路接続構造体において、
前記第1及び第2の回路電極の厚みが50nm以上であり、前記回路接続部材が、接着剤組成物と表面側に複数の突起部を備えた導電粒子とを含有する回路接続材料を硬化処理して得られるものであり、前記導電粒子の最外層が、ニッケル又はニッケル合金であることを特徴とする回路接続構造体。 - 前記第1又は第2の回路電極のいずれかの少なくとも最外層が、インジウム−錫酸化物を含むことを特徴とする請求項1記載の回路接続構造体。
- 前記第1又は第2の回路電極のいずれかの少なくとも最外層が、インジウム−亜鉛酸化物を含むことを特徴とする請求項1記載の回路接続構造体。
- 前記導電粒子の前記突起部の高さが50〜500nmであり、隣接する前記突起部間の距離が1000nm以下であることを特徴とする請求項1〜3のいずれか一項に記載の回路接続構造体。
- 対向する回路電極同士を電気的に接続するための回路接続材料であって、接着剤組成物と表面側に複数の突起部を備えた導電粒子とを含有し、前記導電粒子の最外層が、ニッケル又はニッケル合金であることを特徴とする、回路接続材料。
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JP2007280782A JP4737177B2 (ja) | 2006-10-31 | 2007-10-29 | 回路接続構造体 |
KR1020097011150A KR20090075749A (ko) | 2006-10-31 | 2007-10-30 | 회로 접속 구조체 |
KR1020117008997A KR20110057253A (ko) | 2006-10-31 | 2007-10-30 | 회로 접속 구조체 |
CN2010105791595A CN102063949A (zh) | 2006-10-31 | 2007-10-30 | 电路连接材料的使用方法 |
PCT/JP2007/071090 WO2008053873A1 (en) | 2006-10-31 | 2007-10-30 | Circuit connection structure |
US12/447,543 US20100025097A1 (en) | 2006-10-31 | 2007-10-30 | Circuit connection structure |
CN2013100705169A CN103198878A (zh) | 2006-10-31 | 2007-10-30 | 电路连接结构体 |
EP07830824A EP2081222A4 (en) | 2006-10-31 | 2007-10-30 | CIRCUIT CONNECTION STRUCTURE |
TW096141010A TW200843577A (en) | 2006-10-31 | 2007-10-31 | Circuit connection structure |
TW100133431A TW201218883A (en) | 2006-10-31 | 2007-10-31 | Circuit connection structure |
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EP2081222A1 (en) | 2009-07-22 |
TWI373993B (ja) | 2012-10-01 |
WO2008053873A1 (en) | 2008-05-08 |
TW201218883A (en) | 2012-05-01 |
EP2081222A4 (en) | 2011-11-30 |
TW200843577A (en) | 2008-11-01 |
JP4737177B2 (ja) | 2011-07-27 |
KR20090075749A (ko) | 2009-07-08 |
US20100025097A1 (en) | 2010-02-04 |
CN103198878A (zh) | 2013-07-10 |
CN102063949A (zh) | 2011-05-18 |
KR20110057253A (ko) | 2011-05-31 |
TWI360377B (ja) | 2012-03-11 |
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