JP2008121097A - Electroplating apparatus, electroplating method and plating jig - Google Patents

Electroplating apparatus, electroplating method and plating jig Download PDF

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JP2008121097A
JP2008121097A JP2006309608A JP2006309608A JP2008121097A JP 2008121097 A JP2008121097 A JP 2008121097A JP 2006309608 A JP2006309608 A JP 2006309608A JP 2006309608 A JP2006309608 A JP 2006309608A JP 2008121097 A JP2008121097 A JP 2008121097A
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anode plate
cathode
anode
electronic component
plating
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JP4820736B2 (en
JP2008121097A5 (en
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Yoko Nakabayashi
陽子 中林
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2006309608A priority Critical patent/JP4820736B2/en
Priority to TW096140697A priority patent/TW200825211A/en
Priority to KR1020070112485A priority patent/KR20080044162A/en
Priority to CN2007101872661A priority patent/CN101240443B/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/22—Apparatus for electrolytic coating of small objects in bulk having open containers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electroplating apparatus in which a coating film having uniform thickness is formed on an electronic component and between the electronic components having a plurality of leads extended from one surface side of a cap part. <P>SOLUTION: The electroplating apparatus is equipped with a first anode plate and a plating jig 10 holding the electronic component to position the electronic component 18 having the leads 18b extended from one surface side of the cap part 18a in a position opposed to the first anode plate. The plating jig is provided with a cathode part 22 in which a permanent magnet 20 is included, a second anode plate 26 formed to be inserted between insulating layers 24a, 24b on a first anode plate side of a cathode part and a recessed part 28 which penetrates through the insulating layers and the second anode plate so that the cathode surface 22a of the cathode part is exposed to the bottom surface and the anode surface 26a of the second anode plate is exposed along the inside wall surface and into which the leads are inserted. The tip of the lead is brought into contact with the cathode surface of the recessed part and the electronic component is attracted by the permanent magnet. Current applied between the first anode plate and the cathode part, and current applied between the second anode plate and the cathode part are separately controlled. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は電解めっき装置及び電解めっき方法並びにめっき治具に関し、更に詳細にはキャップ部の一面側から複数本のリードが延出された電子部品に電解めっきを施す電解めっき装置及び電解めっき方法並びにめっき治具に関する。   The present invention relates to an electroplating apparatus, an electroplating method, and a plating jig, and more specifically, an electroplating apparatus, an electroplating method, and an electroplating method for performing electroplating on an electronic component in which a plurality of leads are extended from one side of a cap portion. The present invention relates to a plating jig.

キャップ部の一面側から複数本のリードが延出された複数個の電子部品（以下、単に電子部品と称することがある）に電解めっきを施す際には、従来、バレルめっき方法が採用されている。かかるバレルめっき方法では、複数個の電子部品が収納された籠状のバレルを、陽極が浸漬された電解めっき液中で回転しつつ、バレル内に設けられた陰極部と陽極との間に電流を印加して、電子部品の各々に電解めっきを施す。
しかし、かかるバレルめっき方法では、電子部品同士の接触による傷やリードの曲り、或いは電子部品同士の絡み合いが発生し易いという問題が存在する。
この様な問題を解決すべく、下記特許文献１には、図４に示す電解めっき装置が提案されている。
図４に示す電解めっき装置では、複数個の電子部品１０２，１０２・・が整列されて保持されためっき治具１００を、めっき槽１０４に貯留された電解めっき液中に浸漬されている陽極板に電子部品１０２，１０２・・が対向するように垂直に浸漬して、上下摺動機構１０６で上下方向に振動させつつ、陽極板とめっき治具１００内に設けられている陰極部との間に電流を印加し、電子部品１０２，１０２・・の各々に電解めっきを施す。
図４に示すめっき治具１００は、図５に示す様に、磁石１１２，１１２・・が所定間隔で内包され、磁石１１２，１１２・・に相当する位置に凹部１１４，１１４・・が形成されている。かかる凹部１１４，１１４・・の各開口部には、隙間１１８を介して陰極板１１６，１１６が設けられている。
この陰極板１１６，１１６上に載置した、電子部品１０２のリード１０２ｂ，１０２ｂ・・の各先端は磁石１１４の磁力によって吸着され、電子部品１０２は陰極板１１６，１１６上に立設された状態で把持される。
かかる電子部品１０２を把持する把持力は、図４に示す様に、めっき治具１００を垂直にしても、電子部品１０２，１０２・・を把持できる。
特開２００６−１９３８０６号公報 When electrolytic plating is applied to a plurality of electronic components (hereinafter simply referred to as electronic components) in which a plurality of leads are extended from one side of the cap portion, a barrel plating method has been conventionally employed. Yes. In such a barrel plating method, a bowl-shaped barrel containing a plurality of electronic components is rotated in an electrolytic plating solution in which the anode is immersed, and a current is passed between the cathode portion and the anode provided in the barrel. To apply electrolytic plating to each of the electronic components.
However, such a barrel plating method has a problem in that scratches due to contact between electronic components, bending of leads, or entanglement between electronic components tend to occur.
In order to solve such problems, the following Patent Document 1 proposes an electrolytic plating apparatus shown in FIG.
In the electrolytic plating apparatus shown in FIG. 4, an anode plate in which a plating jig 100 in which a plurality of electronic components 102, 102... Are aligned and held is immersed in an electrolytic plating solution stored in a plating tank 104. Are vertically immersed so that the electronic components 102, 102... Face each other, and are vibrated in the vertical direction by the vertical sliding mechanism 106, and between the anode plate and the cathode portion provided in the plating jig 100. A current is applied to each of the electronic components 102, 102,.
As shown in FIG. 5, the plating jig 100 shown in FIG. 4 includes magnets 112, 112,... At predetermined intervals, and recesses 114, 114,. ing. A cathode plate 116, 116 is provided at each opening of the recess 114, 114,.
The tips of the leads 102b, 102b,... Of the electronic component 102 placed on the cathode plates 116, 116 are attracted by the magnetic force of the magnet 114, and the electronic component 102 is erected on the cathode plates 116, 116. Is gripped by.
The gripping force for gripping the electronic component 102 can grip the electronic components 102, 102,... Even when the plating jig 100 is vertical as shown in FIG.
JP 2006-193806 A

図４及び図５に示すめっき治具１００を用いた電解めっき装置によれば、電解めっき液中に電子部品１０２，１０２・・を整列した状態を保持して浸漬しつつ、電子部品１０２，１０２・・の各キャップ部１０２ａ及びリード１０２ｂに電解めっきを施すことができる。
従って、図４及び図５に示すめっき治具を用いた電解めっき装置によって、電子部品同士の接触による傷やリードの曲り、或いは電子部品同士の絡み合いの発生を防止できる。
しかしながら、図４及び図５に示すめっき治具を用いた電解めっき装置では、通常、陽極板は、めっき治具１００に整列された電子部品１０２，１０２・・の各キャップ部１０２ａに対向する位置にある。
このため、電解めっきが施された電子部品１０２には、陽極板に近いキャップ部１０２ａには、リード１０２ｂよりも厚いめっき皮膜が形成され易くなり、電子部品内及び電子部品間でのめっき皮膜の厚さバラツキが大きくなり易い。
そこで、本発明は、従来の磁石を内部に具備するめっき治具を用いた、キャップ部の一面側から複数本のリードが延出された電子部品に電解めっきを施したとき、電子部品内及び電子部品間でのめっき皮膜の厚さバラツキが大きくなり易いという課題を解消し、キャップ部の一面側から複数本のリードが延出された電子部品内及び電子部品間において、可及的に均一厚さのめっき皮膜を形成できる電解めっき装置及び電解めっき方法並びにめっき治具を提供することにある。 According to the electroplating apparatus using the plating jig 100 shown in FIGS. 4 and 5, the electronic components 102, 102 are immersed while maintaining the aligned state of the electronic components 102, 102,. The electrolytic plating can be applied to the cap portions 102a and the leads 102b.
Therefore, the electroplating apparatus using the plating jig shown in FIGS. 4 and 5 can prevent the occurrence of scratches, lead bending, or entanglement between electronic components due to contact between electronic components.
However, in the electroplating apparatus using the plating jig shown in FIGS. 4 and 5, the anode plate is usually located at a position facing each cap portion 102 a of the electronic components 102, 102,. It is in.
Therefore, a thicker plating film than the lead 102b is easily formed on the cap part 102a near the anode plate on the electronic component 102 that has been subjected to electrolytic plating. Thickness variation tends to increase.
Therefore, the present invention uses a plating jig having a conventional magnet inside, and when electrolytic plating is applied to an electronic component in which a plurality of leads are extended from one side of the cap portion, Eliminates the problem that plating film thickness variations between electronic parts tend to be large, and as uniform as possible within and between electronic parts where multiple leads are extended from one side of the cap An object of the present invention is to provide an electrolytic plating apparatus, an electrolytic plating method, and a plating jig capable of forming a plating film having a thickness.

本発明者は、前記課題を解決すべく、先ず、図４及び図５に示すめっき治具を用いた電解めっき装置によって電解めっきを施した電子部品１０２に、めっき皮膜の厚さがバラツキ易い原因について検討したところ、電解めっき液中の電流は、極板に対して直角方向に流れ易いため、電子部品１０２に電流が集中し易い箇所と電流が回り込み難い箇所とが存在し易いこと、及び電解めっきを施した電子部品１０２のキャップ部１０２ａのめっき皮膜がリード１０２ｂのめっき皮膜よりも厚く形成され易いことが判明した。
従って、本発明者は、電子部品１０２のキャップ部１０２ａが、リード１０２ｂよりも陽極板に近く、リード１０２ｂよりも電流が集中し易いため、電解めっきを施した電子部品１０２に、めっき皮膜の厚さがバラツキ易いものと考えた。このため、電解めっきを施す際に、電子部品１０２のキャップ部１０２ａの近傍のみならず、リードに近い箇所にも陽極を形成することによって、電子部品１０２のキャップ部１０２ａ及びリード１０２ｂに電流が分散できるものと考え検討した結果、本発明に到達した。 In order to solve the above-mentioned problem, the present inventor first causes the thickness of the plating film to easily vary on the electronic component 102 subjected to electrolytic plating by the electrolytic plating apparatus using the plating jig shown in FIGS. 4 and 5. As a result, the current in the electrolytic plating solution tends to flow in a direction perpendicular to the electrode plate, so that there are places where the current tends to concentrate on the electronic component 102 and places where the current is difficult to circulate, and electrolysis. It has been found that the plating film of the cap portion 102a of the plated electronic component 102 is more easily formed than the plating film of the lead 102b.
Therefore, the present inventor believes that the cap portion 102a of the electronic component 102 is closer to the anode plate than the lead 102b and current is more concentrated than the lead 102b, so that the thickness of the plating film is applied to the electronic component 102 subjected to electrolytic plating. I thought it was easy to vary. For this reason, when electrolytic plating is performed, current is dispersed not only in the vicinity of the cap portion 102a of the electronic component 102 but also in a portion near the lead, so that the current is distributed to the cap portion 102a and the lead 102b of the electronic component 102. As a result of studying it as possible, the present invention has been achieved.

すなわち、本発明は、めっき槽の電解めっき液に浸漬された第１陽極板と、前記電解めっき液中の前記第１陽極板の一面側に対向する位置に、電解めっき対象のキャップ部の一面側から複数本のリードが延出された電子部品が位置するように、前記電子部品が保持されるめっき治具とを具備し、前記めっき治具には、磁石が内包された陰極部と、前記陰極部の第１陽極板側に、絶縁層に挟み込まれて形成された第２陽極板と、前記絶縁層及び第２陽極板を貫通して、前記陰極部の陰極面が底面に露出すると共に、前記第２陽極板の陽極面が内壁面に沿って露出し、前記電子部品のリードが挿入される凹部とが設けられ、前記めっき治具の凹部に挿入されたリードの先端が、前記凹部の底面に露出する陰極面に当接して、前記磁石の磁力によって前記陰極面に吸着され、前記めっき治具に保持されている電子部品のキャップ部とリードとに電解めっきが施されるように、前記第１陽極板及び第２陽極板と陰極部との間に電流を印加する電源が設けられていることを特徴とする電解めっき装置にある。   That is, the present invention provides the first anode plate immersed in the electrolytic plating solution in the plating tank and the one surface of the cap portion to be electroplated at a position facing one surface side of the first anode plate in the electrolytic plating solution. A plating jig for holding the electronic component so that an electronic component in which a plurality of leads are extended from the side is positioned, and the plating jig includes a cathode portion including a magnet; On the first anode plate side of the cathode portion, a second anode plate formed by being sandwiched by an insulating layer, and the cathode surface of the cathode portion is exposed to the bottom surface through the insulating layer and the second anode plate. In addition, the anode surface of the second anode plate is exposed along the inner wall surface, and a recess into which the lead of the electronic component is inserted is provided, and the tip of the lead inserted into the recess of the plating jig is Abutting against the cathode surface exposed at the bottom of the recess, the magnetic force of the magnet Between the first anode plate and the second anode plate and the cathode portion so that the electroplating is applied to the cap portion and the lead of the electronic component that is adsorbed on the cathode surface and held by the plating jig. The electroplating apparatus is characterized in that a power source for applying a current is provided.

また、本発明は、電解めっき対象のキャップ部の一面側から複数本のリードが延出された電子部品を保持するめっき治具として、磁石が内包された陰極部の一面側に、絶縁層に挟み込まれて第２陽極板が形成され、且つ前記第２陽極板及び絶縁層を貫通して、前記陰極部の表面が底面に露出すると共に、前記第２陽極板の陽極面が内壁面に沿って露出している凹部が形成されているめっき治具を用い、前記電子部品のリードを前記めっき治具の凹部内に挿入し、前記凹部の陰極面に当接するリードの先端を、前記磁石の磁力によって前記陰極面に吸着して、前記電子部品をめっき治具に保持した後、前記めっき治具を、第１陽極板が浸漬されているめっき槽の電解めっき液に、前記めっき治具の凹部内に保持されている電子部品のキャップ部が前記第１陽極板の一面側に向くように浸漬し、次いで、電源の陽極と前記第１陽極板及び第２陽極板とを接続すると共に、前記電源の陰極と前記陰極部とを接続し、前記キャップ部及びリードに電解めっきを施すことを特徴とする電解めっき方法でもある。   In addition, the present invention provides an insulating layer on one surface side of a cathode portion including a magnet as a plating jig for holding an electronic component in which a plurality of leads are extended from one surface side of a cap portion to be electroplated. A second anode plate is formed by being sandwiched, penetrates the second anode plate and the insulating layer, the surface of the cathode portion is exposed to the bottom surface, and the anode surface of the second anode plate is along the inner wall surface. The lead of the electronic component is inserted into the recess of the plating jig, and the tip of the lead that contacts the cathode surface of the recess is inserted into the recess of the magnet. After adsorbing to the cathode surface by magnetic force and holding the electronic component on a plating jig, the plating jig is applied to an electrolytic plating solution in a plating tank in which the first anode plate is immersed in the plating jig. Cap part of the electronic component held in the recess Immersion so as to face one side of the first anode plate, then connect the anode of the power source and the first anode plate and the second anode plate, and connect the cathode of the power source and the cathode part, In the electrolytic plating method, the cap portion and the lead may be subjected to electrolytic plating.

更に、本発明は、めっき槽の電解めっき液に浸漬された第１陽極板に対向する位置に、電解めっき対象のキャップ部の一面側から複数本のリードが延出された電子部品が位置するように、前記電子部品が保持されるめっき治具には、磁石が内包された金属部材によって形成され、電解めっき用の電源の陰極と接続される陰極部と、前記陰極部の第１陽極板側に絶縁層に挟み込まれて形成され、前記電源の陽極と接続される第２陽極板と、前記絶縁層及び第２陽極板を貫通して、前記陰極部の陰極面が底面に露出している共に、前記第２陽極板の陽極面が内壁面に沿って露出し、挿入されて前記底面に当接した前記電子部品のリードの先端が前記磁石の磁力によって吸着され、前記電子部品が保持される凹部とを具備することを特徴とするめっき治具でもある。   Further, according to the present invention, an electronic component in which a plurality of leads are extended from one surface side of the cap portion to be electroplated is positioned at a position facing the first anode plate immersed in the electrolytic plating solution of the plating tank. As described above, the plating jig for holding the electronic component is formed of a metal member including a magnet and is connected to a cathode of a power source for electrolytic plating, and the first anode plate of the cathode portion A second anode plate that is sandwiched between insulating layers on the side and connected to the anode of the power source; and the cathode surface of the cathode portion is exposed to the bottom surface through the insulating layer and the second anode plate In addition, the anode surface of the second anode plate is exposed along the inner wall surface, the tip of the lead of the electronic component that is inserted and abutted against the bottom surface is attracted by the magnetic force of the magnet, and the electronic component is held And a recessed portion to be formed. There is also a jig.

かかる本発明において、第２陽極板の陽極面を、電子部品のリードを取り囲むように、めっき治具の凹部の内壁面に沿って露出することによって、電子部品のリードの各々に万遍なく電解めっきを施すことができる。
また、電源の陽極と第２陽極板とを接続する導電線の一部を、陰極部の表面を覆う絶縁層内に配設することによって、めっき治具の取扱いを容易とすることができる。
更に、第１陽極板と陰極部とに電流を印加する第１電源と、第２陽極板と陰極部とに電流を印加する第２電源とを設け、印加する電流値を個々に制御することによって、電解めっきを施した電子部品のキャップ部及びリードに形成されるめっき皮膜を更に一層均一化できる。 In the present invention, the anode surface of the second anode plate is exposed along the inner wall surface of the recess of the plating jig so as to surround the lead of the electronic component. Plating can be applied.
Further, by disposing a part of the conductive wire connecting the anode of the power source and the second anode plate in the insulating layer covering the surface of the cathode part, the handling of the plating jig can be facilitated.
Furthermore, a first power source for applying current to the first anode plate and the cathode portion and a second power source for applying current to the second anode plate and the cathode portion are provided, and the applied current value is individually controlled. Thus, the plating film formed on the cap portion and the lead of the electronic component subjected to electrolytic plating can be made even more uniform.

本発明によれば、めっき治具の凹部に複数本のリードが挿入された電子部品のキャップ部の近傍に第１陽極板を配設すると共に、凹部の底面に露出する陰極面にリードの先端が当接している。
しかも、凹部に挿入されている電子部品のリードは、凹部の内壁面に沿って露出する第２陽極板の露出面と凹部の底面に露出する陰極面との間に位置する。
このため、第１陽極板及び第２陽極板と陰極部との間に電流を印加することによって、第１陽極板と陰極部との間では、主として電子部品のキャップ部に電解めっき皮膜を形成でき、第２陽極板と陰極部との間では、主として電気部品のリードに電解めっき皮膜を形成できる。
その結果、電解めっきを終了した電子部品では、そのキャップ部及び複数本のリードに可及的に均一厚さの電解めっき皮膜が形成でき、且つ電子部品間でも、可及的に均一厚さの電解めっき皮膜を形成できる。 According to the present invention, the first anode plate is disposed in the vicinity of the cap portion of the electronic component in which a plurality of leads are inserted into the concave portion of the plating jig, and the tip of the lead is exposed to the cathode surface exposed at the bottom surface of the concave portion. Are in contact.
Moreover, the lead of the electronic component inserted in the recess is located between the exposed surface of the second anode plate exposed along the inner wall surface of the recess and the cathode surface exposed on the bottom surface of the recess.
Therefore, by applying a current between the first anode plate and the second anode plate and the cathode portion, an electrolytic plating film is mainly formed on the cap portion of the electronic component between the first anode plate and the cathode portion. In addition, an electrolytic plating film can be formed mainly on the lead of the electrical component between the second anode plate and the cathode portion.
As a result, in an electronic component that has been electroplated, an electrolytic plating film having a uniform thickness can be formed on the cap portion and the plurality of leads, and a uniform thickness can be formed between the electronic components. An electrolytic plating film can be formed.

本発明に係る電解めっき装置の一例を図１に示す。図１に示す電解めっき装置では、めっき槽１２の電解めっき液１４中に、矩形状の第１陽極板１６とめっき治具１０とが浸漬されている。この第１陽極板１６の一面側と対向するめっき治具１０の対向面側には、電解めっき対象の複数個の電子部品１８，１８・・が整列された状態で保持されている。かかる電子部品１８は、図２に示す様に、キャップ部１８ａの一面側に複数本のリード１８ｂ，１８ｂ・・が延出されているものである。
めっき治具１０には、図２に示す様に、内部に永久磁石２０が内包された、金属部材から成る陰極部２２が設けられている。この陰極部２２には、図１に示す直流電源３２の陰極に接続される導電線２５が接続されている。
かかる陰極部２２の一面側には、絶縁層２４ａ，２４ｂに挟み込まれて第２陽極板２６が配設されている。この第２陽極板２６は、第１陽極板１６と同一金属によって形成されている。 An example of the electrolytic plating apparatus according to the present invention is shown in FIG. In the electrolytic plating apparatus shown in FIG. 1, a rectangular first anode plate 16 and a plating jig 10 are immersed in an electrolytic plating solution 14 in a plating tank 12. A plurality of electronic components 18, 18... To be electroplated are held in an aligned state on the facing surface side of the plating jig 10 facing the one surface side of the first anode plate 16. As shown in FIG. 2, the electronic component 18 has a plurality of leads 18b, 18b,... Extended on one side of the cap portion 18a.
As shown in FIG. 2, the plating jig 10 is provided with a cathode portion 22 made of a metal member in which a permanent magnet 20 is included. A conductive line 25 connected to the cathode of the DC power source 32 shown in FIG.
A second anode plate 26 is disposed on one surface side of the cathode portion 22 so as to be sandwiched between the insulating layers 24a and 24b. The second anode plate 26 is made of the same metal as the first anode plate 16.

陰極部２２の一面側には、第２陽極板２６及び絶縁層２４ａ，２４ｂを貫通し、陰極部２２の陰極面２２ａが底面に露出する凹部２８，２８・・が形成されている。この凹部２８，２８・・の各内壁面には、内壁面に沿って第２陽極板２６の陽極面２６ａが露出されている。
かかる凹部２８には、図２に示す様に、電子部品１８の複数本のリード１８ｂ、１８ｂ・・が挿入される。このため、凹部２８では、挿入された電子部品１８のリード１８ｂ、１８ｂ・・を取り囲むように、凹部２８の内壁面に沿って第２陽極板２６の陽極面２６ａが露出している。
また、陰極部２２の一面側に形成された絶縁層１４ｂの一部は、陰極部２２の側面側にも延出されている。この陰極部２２の側面側に延出された絶縁層１４ｂ内には、第２陽極板２６と直流電源の陽極とを接続する導電線３０の一部が陰極部２２との間に絶縁層１４ｂの一部を介して配設されている。この様に、導電線３０のめっき治具１０近傍を、絶縁層２４ｂの延出部内に配設することによって、めっき治具１０と導電線３０の一部を一体化でき、めっき治具１０の取扱性を向上できる。 On one surface side of the cathode portion 22, there are formed recesses 28, 28,... That penetrate the second anode plate 26 and the insulating layers 24a and 24b and expose the cathode surface 22a of the cathode portion 22 to the bottom surface. The anode surface 26a of the second anode plate 26 is exposed along the inner wall surface of each inner wall surface of the recesses 28,.
2, a plurality of leads 18b, 18b,... Of the electronic component 18 are inserted into the recess 28. As shown in FIG. Therefore, in the recess 28, the anode surface 26a of the second anode plate 26 is exposed along the inner wall surface of the recess 28 so as to surround the leads 18b, 18b... Of the inserted electronic component 18.
Further, a part of the insulating layer 14 b formed on the one surface side of the cathode portion 22 extends to the side surface side of the cathode portion 22. In the insulating layer 14 b extending to the side surface side of the cathode portion 22, a part of the conductive wire 30 connecting the second anode plate 26 and the anode of the DC power source is between the cathode portion 22 and the insulating layer 14 b. It is arrange | positioned through a part of. In this manner, by arranging the vicinity of the plating jig 10 of the conductive wire 30 in the extending portion of the insulating layer 24b, the plating jig 10 and a part of the conductive wire 30 can be integrated. Handleability can be improved.

図２に示すめっき治具１０の凹部２８，２８・・の各々に、電子部品１８のリード１８ｂ，１８ｂ・・を挿入すると、各リード１８ｂの先端が凹部２８の底面に露出する陰極面２２ａに当接する。凹部２８の陰極面２２ａに先端が当接したリード１８ｂは、陰極部２２内に配設された永久磁石２０の磁力によって、凹部２８の陰極面２２ａに吸着される。このため、電子部品１８は、そのキャップ部１８ａが凹部２８の外方に位置した状態でめっき治具１０の一面側に保持される。
この様に、めっき治具１０の凹部２８，２８・・の各々に、電子部品１８が保持された状態では、水平に載置されためっき治具１０を、図２に示すように垂直にしても、電子部品１８，１８・・の各々はめっき治具１０の所定位置に保持できる。 When the leads 18b, 18b,... Of the electronic component 18 are inserted into the recesses 28, 28,... Of the plating jig 10 shown in FIG. 2, the tips of the leads 18b are exposed to the cathode surface 22a exposed at the bottom surface of the recess 28. Abut. The lead 18 b whose tip is in contact with the cathode surface 22 a of the recess 28 is attracted to the cathode surface 22 a of the recess 28 by the magnetic force of the permanent magnet 20 disposed in the cathode portion 22. For this reason, the electronic component 18 is held on the one surface side of the plating jig 10 in a state where the cap portion 18 a is positioned outside the recess 28.
As described above, when the electronic component 18 is held in each of the recesses 28, 28,... Of the plating jig 10, the horizontally placed plating jig 10 is placed vertically as shown in FIG. However, each of the electronic components 18, 18... Can be held at a predetermined position of the plating jig 10.

次いで、図２に示すめっき治具１０を、図１に示す様に、めっき槽１２の電解めっき液１４中に浸漬する。この際に、めっき治具１０を、保持されている電子部品１８，１８・・が第１陽極板１６に向くように電解めっき液１４に浸漬する。
その後、図１に示す様に、第１陽極板１６及びめっき治具１０の第２陽極板２６と直流電源３２の陽極とを接続すると共に、めっき治具１０の陰極部２２と直流電源３２の陰極とを接続することによって、めっき治具１０に保持されている電子部品１８に電解めっきを施すことができる。
この電解めっきでは、第１陽極板１６と凹部２８，２８・・の各底面に露出する陰極面２２ａとの間で流れる電流によって、主として電子部品１８のキャップ部１８ａに電解めっきが施される。
また、凹部２８の内壁面に露出する第２陽極板２６の陽極面２６ａと、その底面に露出する陰極面２２ａとの間に流れる電流によって、主として電子部品１８のリード１８ｂ，１８ｂ・・に電解めっきが施される。
このため、電子部品１８，１８・・の各々のキャップ部１８ａ及びリード１８ｂ，１８・・の全体に均一な電解めっきを施すことができ、電子部品間においても、可及的に均一な厚さの電解めっき皮膜を形成できる。 Next, the plating jig 10 shown in FIG. 2 is immersed in the electrolytic plating solution 14 of the plating tank 12 as shown in FIG. At this time, the plating jig 10 is immersed in the electrolytic plating solution 14 so that the held electronic components 18, 18... Face the first anode plate 16.
Thereafter, as shown in FIG. 1, the first anode plate 16 and the second anode plate 26 of the plating jig 10 are connected to the anode of the DC power supply 32, and the cathode portion 22 of the plating jig 10 and the DC power supply 32 are connected. By connecting the cathode, the electroplating can be applied to the electronic component 18 held by the plating jig 10.
In this electrolytic plating, the electrolytic plating is mainly performed on the cap portion 18a of the electronic component 18 by the current flowing between the first anode plate 16 and the cathode surface 22a exposed at the bottom surfaces of the recesses 28,.
In addition, the leads 18b, 18b,... Of the electronic component 18 are mainly electrolyzed by the current flowing between the anode surface 26a of the second anode plate 26 exposed on the inner wall surface of the recess 28 and the cathode surface 22a exposed on the bottom surface. Plating is applied.
Therefore, uniform electrolytic plating can be applied to the entire cap portion 18a and leads 18b, 18... Of the electronic components 18, 18,..., And the thickness as uniform as possible between the electronic components. The electrolytic plating film can be formed.

ここで、図１に示す電解めっき装置の第１陽極板１６と第２陽極板２６として、ニッケルから成る第１陽極板１６と第２陽極板２６とを用いて、めっき治具１０に保持されている電子部品１８，１８・・に電解ニッケルめっきを施した。この際に、電解めっき液１４としては市販のニッケル電解めっき液を用い、第1陽極板１６及び第２陽極板２６と陰極部２２との間に、凹部２８，２８・・の底面に露出する陰極面２２ａに対して電流密度が５Ａ／ｃｍ２となるように直流電流を印加した。
電解ニッケルめっきを施した電子部品１８のキャップ部１８ａとリード１８ｂとに形成されたニッケルめっき皮膜の厚さのバラツキは４．６μｍであり、電子部品１８，１８・・間のニッケルめっき皮膜の厚さのバラツキは４．３μｍであった。
一方、図１に示す電解めっき装置において、第２陽極板２６と陰極部２２との間に直流電流を印加しなかった他は、上記と同様に、めっき治具１０に保持されている電子部品１８，１８・・に電解ニッケルめっきを施した。電解ニッケルめっきを施した電子部品１８のキャップ部１８ａとリード１８ｂとに形成されたニッケルめっき皮膜の厚さのバラツキは９．４μｍであり、電子部品１８，１８・・間のニッケルめっき皮膜の厚さのバラツキは５．３μｍであった。これらのニッケルめっき皮膜のバラツキは、第２陽極板２６と陰極部２２との間に直流電流を印加した上記場合に比較して大きくなっている。 Here, the first anode plate 16 and the second anode plate 26 made of nickel are used as the first anode plate 16 and the second anode plate 26 of the electrolytic plating apparatus shown in FIG. Electron nickel plating was applied to the electronic parts 18, 18. At this time, a commercially available nickel electrolytic plating solution is used as the electrolytic plating solution 14, and is exposed on the bottom surfaces of the recesses 28, 28... Between the first anode plate 16 and the second anode plate 26 and the cathode portion 22. A direct current was applied to the cathode surface 22a so that the current density was 5 A / cm 2 .
The variation in the thickness of the nickel plating film formed on the cap portion 18a and the lead 18b of the electronic component 18 subjected to electrolytic nickel plating is 4.6 μm, and the thickness of the nickel plating film between the electronic components 18, 18,. The variation was 4.3 μm.
On the other hand, in the electrolytic plating apparatus shown in FIG. 1, the electronic component held by the plating jig 10 is the same as described above except that no direct current is applied between the second anode plate 26 and the cathode portion 22. 18, 18... Were subjected to electrolytic nickel plating. The variation in the thickness of the nickel plating film formed on the cap portion 18a and the lead 18b of the electronic component 18 subjected to electrolytic nickel plating is 9.4 μm, and the thickness of the nickel plating film between the electronic components 18, 18,. The variation in thickness was 5.3 μm. The variation of these nickel plating films is larger than that in the above case where a direct current is applied between the second anode plate 26 and the cathode portion 22.

図１に示す電解めっき装置では、第１陽極板１６と凹部２８，２８・・の各底面に露出する陰極面２２ａとの間に印加する直流電流値と、凹部２８の内壁面に露出する第２陽極板２６の陽極面２６ａと、その底面に露出する陰極面２２ａとの間に印加する直流電流値とを独立して制御できない。このため、電子部品内及び電子部品間での電解めっき皮膜の厚さの均一化には限界が存在する場合がある。
この場合には、図３に示す様に、第１陽極板１６と陰極部２２とに直流電流を印加する第１電源３２ａと、第２陽極板２６と陰極部２２とに直流電流を印加する第２電源３２ｂとを設けることが好ましい。
図３に示す電解めっき装置では、第１陽極板１４と凹部２８，２８・・の各底面に露出する陰極面２２ａとの間に印加する直流電流値と、凹部２８の内壁面に露出する第２陽極板２６の陽極面２６ａと、その底面に露出する陰極面２２ａとの間に印加する直流電流値とを独立して制御できる。このため、電解めっきを施した電子部品１８について、電子部品内及び電子部品間において、電解めっき皮膜の厚さにバラツキが存在している場合には、電解めっき皮膜の厚さを可及的に均一化すべく、第１電源３２ａ又は第２電源３２ｂからの直流電流値を独立して変更できる。 In the electrolytic plating apparatus shown in FIG. 1, the direct current value applied between the first anode plate 16 and the cathode surface 22a exposed on the bottom surfaces of the recesses 28, 28,. The direct current value applied between the anode surface 26a of the two anode plates 26 and the cathode surface 22a exposed on the bottom surface thereof cannot be controlled independently. For this reason, there may be a limit in making the thickness of the electrolytic plating film uniform within and between electronic components.
In this case, as shown in FIG. 3, a direct current is applied to the first power source 32 a that applies a direct current to the first anode plate 16 and the cathode portion 22, and a second anode plate 26 and the cathode portion 22. A second power source 32b is preferably provided.
In the electroplating apparatus shown in FIG. 3, the direct current value applied between the first anode plate 14 and the cathode surface 22a exposed on the bottom surfaces of the recesses 28, 28,. The direct current value applied between the anode surface 26a of the two anode plates 26 and the cathode surface 22a exposed on the bottom surface thereof can be controlled independently. For this reason, when there is a variation in the thickness of the electrolytic plating film in the electronic component and between the electronic components, the thickness of the electrolytic plating film is made as much as possible. The DC current value from the first power supply 32a or the second power supply 32b can be changed independently in order to make it uniform.

ここで、図３に示す電解めっき装置を用い、第１陽極板１６と凹部２８，２８・・の各底面に露出する陰極部２２の表面との間に第１電源３２ａから印加する直流電流値を、凹部２８，２８・・の底面に露出する陰極面２２ａに対して電流密度が２．５Ａ／ｃｍ２となるように調整した。また、凹部２８の内壁面に露出する第２陽極板２６の露出面２６ａと凹部２８，２８・・の各底面に露出する陰極面２２ａとの間に第２電源３２ｂから印加する直流電流値を、凹部２８，２８・・の底面に対して電流密度が２．５Ａ／ｃｍ２となるように調整した。この他は、図１に示す電解めっき装置を用いた電解ニッケルめっきと同様にして、めっき治具１０に保持されている電子部品１８，１８・・に電解ニッケルめっきを施した。
電解ニッケルめっきを施した電子部品１８のキャップ部１８ａとリード１８ｂとに形成されたニッケルめっき皮膜の厚さのバラツキは３．７μｍであり、電子部品１８，１８・・間のニッケルめっき皮膜の厚さのバラツキは４．１μｍであった。
これらのニッケルめっき皮膜のバラツキは、図１に示す電解めっき装置を用いた場合に比較して小さくなっている。
以上、説明してきた図２に示すめっき治具１０では、凹部２８，２８・・の底面全体に亘って一枚の永久磁石２０が設けられているが、凹部２８，２８・・の各底面ごとに、対応する永久磁石が設けられていてもよい。
また、永久磁石２０に代えて、電磁石を用いてもよい。 Here, using the electrolytic plating apparatus shown in FIG. 3, the direct current value applied from the first power source 32a between the first anode plate 16 and the surface of the cathode portion 22 exposed at the bottom surfaces of the recesses 28, 28,. Were adjusted so that the current density was 2.5 A / cm 2 with respect to the cathode surface 22 a exposed at the bottom surfaces of the recesses 28, 28. Further, a direct current value applied from the second power source 32b between the exposed surface 26a of the second anode plate 26 exposed on the inner wall surface of the recess 28 and the cathode surface 22a exposed on the bottom surfaces of the recesses 28, 28,. The current density was adjusted to 2.5 A / cm 2 with respect to the bottom surfaces of the recesses 28, 28. Other than this, in the same manner as the electrolytic nickel plating using the electrolytic plating apparatus shown in FIG. 1, electrolytic nickel plating was applied to the electronic components 18, 18.
The variation in the thickness of the nickel plating film formed on the cap portion 18a and the lead 18b of the electronic component 18 subjected to electrolytic nickel plating is 3.7 μm, and the thickness of the nickel plating film between the electronic components 18, 18,. The variation in thickness was 4.1 μm.
The variation of these nickel plating films is smaller than when the electrolytic plating apparatus shown in FIG. 1 is used.
As described above, in the plating jig 10 shown in FIG. 2, the single permanent magnet 20 is provided over the entire bottom surface of the recesses 28, 28,. A corresponding permanent magnet may be provided.
Further, instead of the permanent magnet 20, an electromagnet may be used.

本発明に係る電解めっき装置の一例を説明するための概略図である。It is the schematic for demonstrating an example of the electroplating apparatus which concerns on this invention. 図１に示す電解めっき装置で用いためっき治具を説明するための断面図である。It is sectional drawing for demonstrating the plating jig | tool used with the electrolytic plating apparatus shown in FIG. 本発明に係る電解めっき装置の他の例を説明するための概略図である。It is the schematic for demonstrating the other example of the electroplating apparatus which concerns on this invention. 従来の電解めっき装置を説明するための概略図である。It is the schematic for demonstrating the conventional electrolytic plating apparatus. 図４に示す電解めっき装置に用いられているめっき治具を説明するための断面図である。It is sectional drawing for demonstrating the plating jig used for the electroplating apparatus shown in FIG.

符号の説明Explanation of symbols

１０ めっき治具
１２ めっき槽
１４ 電解めっき液
１６ 第１陽極板
１８ 電子部品
１８ａ キャップ部
１８ｂ リード
２０ 永久磁石
２２ 陰極部
２２ａ 陰極面
２４ａ，２４ｂ 絶縁層
２５，３０ 導電線
２６ 陽極板
２６ａ 陽極面
２８ 凹部
３２ 電源
３２ａ 第１電源
３２ｂ 第２電源 DESCRIPTION OF SYMBOLS 10 Plating jig 12 Plating tank 14 Electrolytic plating solution 16 1st anode plate 18 Electronic component 18a Cap part 18b Lead 20 Permanent magnet 22 Cathode part 22a Cathode surface 24a, 24b Insulating layer 25, 30 Conductive wire 26 Anode plate 26a Anode surface 28 Recess 32 Power source 32a First power source 32b Second power source

Claims (11)

めっき槽の電解めっき液に浸漬された第１陽極板と、前記電解めっき液中の前記第１陽極板の一面側に対向する位置に、電解めっき対象のキャップ部の一面側から複数本のリードが延出された電子部品が位置するように、前記電子部品が保持されるめっき治具とを具備し、
前記めっき治具には、磁石が内包された陰極部と、前記陰極部の第１陽極板側に、絶縁層に挟み込まれて形成された第２陽極板と、前記絶縁層及び第２陽極板を貫通して、前記陰極部の陰極面が底面に露出すると共に、前記第２陽極板の陽極面が内壁面に沿って露出し、前記電子部品のリードが挿入される凹部とが設けられ、
前記めっき治具の凹部に挿入されたリードの先端が、前記凹部の底面に露出する陰極面に当接して、前記磁石の磁力によって前記陰極面に吸着され、前記めっき治具に保持されている電子部品のキャップ部とリードとに電解めっきが施されるように、前記第１陽極板及び第２陽極板と陰極部との間に電流を印加する電源が設けられていることを特徴とする電解めっき装置。 A plurality of leads from the one surface side of the cap portion to be electroplated at a position facing the one surface side of the first anode plate in the electrolytic plating solution and the first anode plate immersed in the electrolytic plating solution of the plating tank And a plating jig for holding the electronic component so that the extended electronic component is located,
The plating jig includes a cathode portion including a magnet, a second anode plate formed by being sandwiched by an insulating layer on the first anode plate side of the cathode portion, and the insulating layer and the second anode plate. The cathode surface of the cathode portion is exposed on the bottom surface, the anode surface of the second anode plate is exposed along the inner wall surface, and a recess into which the lead of the electronic component is inserted is provided.
The tip of the lead inserted into the recess of the plating jig contacts the cathode surface exposed on the bottom surface of the recess, is attracted to the cathode surface by the magnetic force of the magnet, and is held by the plating jig A power supply for applying a current is provided between the first anode plate and the second anode plate and the cathode portion so that the electroplating is performed on the cap portion and the lead of the electronic component. Electroplating equipment. 第２陽極板の陽極面が、電子部品のリードを取り囲むように、めっき治具の凹部の内壁面に沿って露出している請求項１記載の電解めっき装置。   The electrolytic plating apparatus according to claim 1, wherein the anode surface of the second anode plate is exposed along the inner wall surface of the concave portion of the plating jig so as to surround the lead of the electronic component. 電源の陽極と第２陽極板とを接続する導電線は、その一部が陰極部の表面を覆う絶縁層内に配設されている請求項１又は請求項２記載の電解めっき装置。   The electroplating apparatus according to claim 1 or 2, wherein a part of the conductive wire connecting the anode of the power source and the second anode plate is disposed in an insulating layer covering the surface of the cathode part. 第１陽極板と陰極部とに電流を印加する第１電源と、第２陽極板と陰極部とに電流を印加する第２電源とが設けられている請求項１〜３のいずれか一項記載の電解めっき装置。   The 1st power supply which applies an electric current to a 1st anode plate and a cathode part and the 2nd power supply which applies an electric current to a 2nd anode plate and a cathode part are provided. The electroplating apparatus of description. 電解めっき対象のキャップ部の一面側から複数本のリードが延出された電子部品を保持するめっき治具として、磁石が内包された陰極部の一面側に、絶縁層に挟み込まれて第２陽極板が形成され、且つ前記第２陽極板及び絶縁層を貫通して、前記陰極部の表面が底面に露出すると共に、前記第２陽極板の陽極面が内壁面に沿って露出している凹部が形成されているめっき治具を用い、
前記電子部品のリードを前記めっき治具の凹部内に挿入し、前記凹部の陰極面に当接するリードの先端を、前記磁石の磁力によって前記陰極面に吸着して、前記電子部品をめっき治具に保持した後、
前記めっき治具を、第１陽極板が浸漬されているめっき槽の電解めっき液に、前記めっき治具の凹部内に保持されている電子部品のキャップ部が前記第１陽極板の一面側に向くように浸漬し、
次いで、電源の陽極と前記第１陽極板及び第２陽極板とを接続すると共に、前記電源の陰極と前記陰極部とを接続し、前記キャップ部及びリードに電解めっきを施すことを特徴とする電解めっき方法。 As a plating jig for holding an electronic component in which a plurality of leads are extended from one surface side of a cap portion to be electroplated, a second anode is sandwiched between insulating layers on one surface side of a cathode portion including a magnet. A concave portion formed with a plate and penetrating through the second anode plate and the insulating layer so that the surface of the cathode portion is exposed on the bottom surface and the anode surface of the second anode plate is exposed along the inner wall surface Using a plating jig on which is formed,
The lead of the electronic component is inserted into the recess of the plating jig, and the tip of the lead contacting the cathode surface of the recess is attracted to the cathode surface by the magnetic force of the magnet, so that the electronic component is attached to the plating jig. After holding on
The plating jig is placed in the electrolytic plating solution of the plating tank in which the first anode plate is immersed, and the cap part of the electronic component held in the recess of the plating jig is on the one surface side of the first anode plate. Soak so that it faces
Next, the anode of the power source is connected to the first anode plate and the second anode plate, the cathode of the power source is connected to the cathode portion, and the cap portion and the lead are subjected to electrolytic plating. Electroplating method. 第２陽極板の露出面を、電子部品の複数本のリードを取り囲むように、めっき治具の凹部の内壁面に沿って露出する請求項５記載の電解めっき方法。   The electrolytic plating method according to claim 5, wherein the exposed surface of the second anode plate is exposed along the inner wall surface of the concave portion of the plating jig so as to surround a plurality of leads of the electronic component. 電源の陽極と第２陽極板とを接続する導電線の一部を、陰極部の表面を覆う絶縁層内に配設する請求項５又は請求項６記載の電解めっき方法。   The electrolytic plating method according to claim 5 or 6, wherein a part of the conductive wire connecting the anode of the power source and the second anode plate is disposed in an insulating layer covering the surface of the cathode portion. 第１陽極板と陰極部とに電流を印加する第１電源と、第２陽極板と陰極部とに電流を印加する第２電源とを設け、印加する電流値を個々に制御する請求項５〜６のいずれか一項記載の電解めっき方法。   6. A first power source for applying a current to the first anode plate and the cathode portion and a second power source for applying a current to the second anode plate and the cathode portion are provided, and the applied current value is individually controlled. The electrolytic plating method as described in any one of -6. めっき槽の電解めっき液に浸漬された第１陽極板に対向する位置に、電解めっき対象のキャップ部の一面側から複数本のリードが延出された電子部品が位置するように、前記電子部品が保持されるめっき治具には、
磁石が内包された金属部材によって形成され、電解めっき用の電源の陰極と接続される陰極部と、
前記陰極部の第１陽極板側に絶縁層に挟み込まれて形成され、前記電源の陽極と接続される第２陽極板と、
前記絶縁層及び第２陽極板を貫通して、前記陰極部の陰極面が底面に露出している共に、前記第２陽極板の陽極面が内壁面に沿って露出し、挿入されて前記底面に当接した前記電子部品のリードの先端が前記磁石の磁力によって吸着され、前記電子部品が保持される凹部とを具備することを特徴とするめっき治具。 The electronic component such that an electronic component having a plurality of leads extending from one surface side of the cap portion to be electroplated is positioned at a position facing the first anode plate immersed in the electrolytic plating solution of the plating tank. In the plating jig that holds
A cathode part formed by a metal member including a magnet and connected to a cathode of a power source for electrolytic plating;
A second anode plate formed by being sandwiched between insulating layers on the first anode plate side of the cathode portion and connected to the anode of the power source;
The cathode surface of the cathode portion is exposed on the bottom surface through the insulating layer and the second anode plate, and the anode surface of the second anode plate is exposed along the inner wall surface and inserted into the bottom surface. A plating jig, comprising: a tip of the lead of the electronic component that is in contact with the magnet; and a recess in which the electronic component is held by being attracted by the magnetic force of the magnet. 第２陽極板の陽極面が、電子部品のリードを取り囲むように、めっき治具の凹部の内壁面に沿って露出している請求項９記載のめっき治具。   The plating jig according to claim 9, wherein the anode surface of the second anode plate is exposed along the inner wall surface of the concave portion of the plating jig so as to surround the lead of the electronic component. 電源の陽極と第２陽極板とを接続する導電線の一部が、陰極部の表面を覆う絶縁層内に配設されている請求項９又は請求項１０記載のめっき治具。   The plating jig according to claim 9 or 10, wherein a part of the conductive wire connecting the anode of the power source and the second anode plate is disposed in an insulating layer covering the surface of the cathode portion.
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