JP2007334786A - 情報処理装置 - Google Patents
情報処理装置 Download PDFInfo
- Publication number
- JP2007334786A JP2007334786A JP2006168418A JP2006168418A JP2007334786A JP 2007334786 A JP2007334786 A JP 2007334786A JP 2006168418 A JP2006168418 A JP 2006168418A JP 2006168418 A JP2006168418 A JP 2006168418A JP 2007334786 A JP2007334786 A JP 2007334786A
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- space
- information processing
- processing apparatus
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- housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】上部カバー11、下部カバー12、前面パネル14、及び分割部材15の後壁部15dにより、情報処理装置100に用いられる電気部品等を収容する内部空間を形成する。そして、内部空間を分割部材15の隔壁部15aにより、第1空間10A及び10Bに分割し、第1空間10A内には、消費電力が高い高発熱部品等を収容し、第2空間10B内には、耐熱性が低い電気部品を収容する。これにより、第1空間での発熱は隔壁部15aをヒートシンクとして外部空間へ放熱され、第2空間へ与える熱的影響を軽減することが可能となる。
【選択図】図4
Description
Claims (8)
- 中央処理装置を備える情報処理装置であって、
前記中央処理装置が実装された基板と;
前記基板を収容する空間が形成された筐体と;
前記空間を、前記基板を収容する第1空間と、該第1空間以外の第2空間に分ける分割部材と;を備える情報処理装置。 - 前記中央処理装置以外の高発熱部品を含む複数の電気部品を更に備え、前記高発熱部品を、前記第1空間に収容したことを特徴とする請求項1に記載の情報処理装置。
- 前記高発熱部品は、チップセットを含むことを特徴とする請求項2に記載の情報処理装置。
- 前記複数の電気部品のうちの交換が必要な電気部品を、前記第2空間に収容したことを特徴とする請求項2又は3に記載の情報処理装置。
- 前記交換が必要な電気部品は、ハードディスク及びPCIカードのうちの少なくとも一方を含むことを特徴とする請求項4に記載の情報処理装置。
- 前記分割部材は、前記中央処理装置及び前記高発熱部品のうちの少なくとも一方からの発熱を、前記筐体に伝達する放熱板であることを特徴とする請求項2〜5のいずれか一項に記載の情報処理装置。
- 前記中央処理装置及び前記高発熱部品のうちの少なくとも一方からの発熱を、前記筐体に伝達する放熱部材を更に備える請求項2〜6のいずれか一項に記載の情報処理装置。
- 前記筐体は複数の面を有し、前記放熱部材は、前記中央処理装置からの発熱と、前記高発熱部品からの発熱とを、前記筐体のそれぞれ異なる面に伝達することを特徴とする請求項7に記載の情報処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006168418A JP5159052B2 (ja) | 2006-06-19 | 2006-06-19 | 情報処理装置 |
US11/808,370 US7561428B2 (en) | 2006-06-19 | 2007-06-08 | Information processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006168418A JP5159052B2 (ja) | 2006-06-19 | 2006-06-19 | 情報処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007334786A true JP2007334786A (ja) | 2007-12-27 |
JP5159052B2 JP5159052B2 (ja) | 2013-03-06 |
Family
ID=38861317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006168418A Expired - Fee Related JP5159052B2 (ja) | 2006-06-19 | 2006-06-19 | 情報処理装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7561428B2 (ja) |
JP (1) | JP5159052B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018116531A (ja) * | 2017-01-19 | 2018-07-26 | 株式会社ザクティ | ドライブレコーダ装置 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4824624B2 (ja) * | 2007-05-15 | 2011-11-30 | 株式会社リコー | 熱移動部材、熱移動機構及び情報処理装置 |
JP5009679B2 (ja) * | 2007-05-15 | 2012-08-22 | 株式会社リコー | 情報処理装置 |
CN101377705B (zh) * | 2007-08-30 | 2012-08-29 | 鸿富锦精密工业(深圳)有限公司 | 电脑 |
JP5086047B2 (ja) * | 2007-12-07 | 2012-11-28 | 株式会社日立製作所 | 受信装置 |
US8289714B2 (en) * | 2008-01-04 | 2012-10-16 | APlus Mobile Inc. | Ruggedized computer and aspects thereof |
JP5402200B2 (ja) * | 2009-04-20 | 2014-01-29 | 株式会社リコー | 熱移動機構及び情報機器 |
TW201201000A (en) * | 2010-06-30 | 2012-01-01 | Hon Hai Prec Ind Co Ltd | Heat dissipation apparatus |
US8619427B2 (en) | 2011-03-21 | 2013-12-31 | Eldon Technology Limited | Media content device chassis with internal extension members |
CN103517611A (zh) * | 2012-06-19 | 2014-01-15 | 鸿富锦精密工业(深圳)有限公司 | 电子设备及其散热装置 |
KR102148201B1 (ko) * | 2013-05-06 | 2020-08-26 | 삼성전자주식회사 | 제어장치 |
US9877413B2 (en) * | 2013-11-12 | 2018-01-23 | Molex, Llc | Thermally configured connector system |
TWM521853U (zh) * | 2016-01-28 | 2016-05-11 | Trans Electric Co Ltd | 影音無線傳輸裝置的散熱架構 |
US10314203B1 (en) * | 2018-05-10 | 2019-06-04 | Juniper Networks, Inc | Apparatuses, systems, and methods for cooling electronic components |
CN108572707A (zh) * | 2018-05-31 | 2018-09-25 | 合肥利元杰信息科技有限公司 | 一种计算机机箱用清灰装置 |
JP7349837B2 (ja) * | 2019-07-16 | 2023-09-25 | 株式会社デンソーテン | 発熱部品の放熱構造 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1115566A (ja) * | 1997-06-24 | 1999-01-22 | Hitachi Ltd | 電子装置 |
JPH11110084A (ja) * | 1997-10-06 | 1999-04-23 | Matsushita Electric Ind Co Ltd | 情報処理装置 |
JP2003108269A (ja) * | 2001-09-28 | 2003-04-11 | Nec Gumma Ltd | 電子部品の冷却構造及び冷却方法 |
JP2006119234A (ja) * | 2004-10-20 | 2006-05-11 | Ricoh Co Ltd | 電装装置及び画像形成装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4557225A (en) * | 1984-01-18 | 1985-12-10 | Mikuni Kogyo Kabushiki Kaisha | Combined housing and heat sink for electronic engine control system components |
US5430617A (en) * | 1991-09-30 | 1995-07-04 | Hsu; Winston | Modular electronic packaging for internal I/O modules |
US5426564A (en) * | 1991-09-30 | 1995-06-20 | Hsu; Winston | Modular electronic packaging |
EP0648404B1 (en) * | 1992-06-29 | 1998-11-25 | Elonex Technologies, Inc. | Modular notebook computer |
US5463742A (en) * | 1993-03-05 | 1995-10-31 | Hitachi Computer Products (America), Inc. | Personal processor module and docking station for use therewith |
US5552967A (en) * | 1993-04-30 | 1996-09-03 | Kabushiki Kaisha Toshiba | Portable electronic apparatus having a housing for containing circuits board and functional components |
US5537343A (en) * | 1993-09-02 | 1996-07-16 | Elonex Technologies, Inc. | Digital assistant system having a host computer with a docking bay and a moveable heat sink for cooling a docked module |
US5786984A (en) * | 1994-08-23 | 1998-07-28 | Packard Bell Nec | Modular portable personal computer |
US6108199A (en) * | 1994-08-23 | 2000-08-22 | Nec Corporation | Modular portable personal computer having bays to receive interchangeable modules |
US5550710A (en) * | 1994-09-09 | 1996-08-27 | Hitachi Computer Products (America), Inc. | Packaging and cooling structure for the personal processor module |
US5694294A (en) * | 1995-01-27 | 1997-12-02 | Hitachi, Ltd. | Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a second space created between the first circuit board and a second circuit board |
US5813243A (en) * | 1997-04-04 | 1998-09-29 | Micron Electronics, Inc. | Chambered forced cooling system |
US6297955B1 (en) * | 1999-03-31 | 2001-10-02 | Western Digital Ventures, Inc. | Host assembly for an integrated computer module |
US6411522B1 (en) * | 1999-04-01 | 2002-06-25 | Western Digital Ventures, Inc. | Integrated computer module with EMI shielding plate |
US6359779B1 (en) * | 1999-04-05 | 2002-03-19 | Western Digital Ventures, Inc. | Integrated computer module with airflow accelerator |
US6389499B1 (en) * | 1999-06-09 | 2002-05-14 | Western Digital Ventures, Inc. | Integrated computer module |
US6525932B1 (en) * | 1999-08-18 | 2003-02-25 | Fujitsu Limited | Expansion unit and electronic apparatus |
US6597569B1 (en) * | 2000-06-29 | 2003-07-22 | Intel Corporation | Partitioned computer platform |
EP1333359B1 (en) * | 2002-02-04 | 2013-09-18 | Kontron AG | Housing for a passively cooled computer |
TWM244718U (en) * | 2003-08-22 | 2004-09-21 | Hon Hai Prec Ind Co Ltd | Heat dissipating device employing air duct |
JP4069877B2 (ja) * | 2004-02-03 | 2008-04-02 | ソニー株式会社 | 電子機器およびハードディスク・ドライブ収納装置 |
US7937012B2 (en) | 2005-03-17 | 2011-05-03 | Ricoh Company, Ltd. | Angle adjusting device and image forming apparatus |
JP4520354B2 (ja) | 2005-04-18 | 2010-08-04 | 株式会社リコー | 情報処理装置 |
-
2006
- 2006-06-19 JP JP2006168418A patent/JP5159052B2/ja not_active Expired - Fee Related
-
2007
- 2007-06-08 US US11/808,370 patent/US7561428B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1115566A (ja) * | 1997-06-24 | 1999-01-22 | Hitachi Ltd | 電子装置 |
JPH11110084A (ja) * | 1997-10-06 | 1999-04-23 | Matsushita Electric Ind Co Ltd | 情報処理装置 |
JP2003108269A (ja) * | 2001-09-28 | 2003-04-11 | Nec Gumma Ltd | 電子部品の冷却構造及び冷却方法 |
JP2006119234A (ja) * | 2004-10-20 | 2006-05-11 | Ricoh Co Ltd | 電装装置及び画像形成装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018116531A (ja) * | 2017-01-19 | 2018-07-26 | 株式会社ザクティ | ドライブレコーダ装置 |
Also Published As
Publication number | Publication date |
---|---|
US7561428B2 (en) | 2009-07-14 |
US20070291450A1 (en) | 2007-12-20 |
JP5159052B2 (ja) | 2013-03-06 |
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