JP2007093468A - 電子部品 - Google Patents
電子部品 Download PDFInfo
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- JP2007093468A JP2007093468A JP2005285001A JP2005285001A JP2007093468A JP 2007093468 A JP2007093468 A JP 2007093468A JP 2005285001 A JP2005285001 A JP 2005285001A JP 2005285001 A JP2005285001 A JP 2005285001A JP 2007093468 A JP2007093468 A JP 2007093468A
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- elements
- hall sensor
- electronic component
- sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Magnetic Variables (AREA)
- Wire Bonding (AREA)
Abstract
【解決手段】基板上に成膜された半導体薄膜の結晶が異方性の場合、もしくは、入力抵抗と出力抵抗が異なる場合など、ホールセンサの一方の端子対方向と他方の端子対方向の特性が異なる場合は、第1のホールセンサ57と第2のホールセンサ58を時計回りに45度回転しリードフレームのダイパッド52に搭載し、ワイヤーボンディングを行う。
【選択図】図4
Description
例えば、デジタルカメラの手ブレ補正機構では、瞬時に高精度な位置検出を行う必要があり、それと同時に機器全体の小型化の要求が強いので、センサ自体の小型化が要求されている。さらには、長寿命化、埃や油(グリース)などの影響を受けにくいなど様々な要求がある。
図3に示すように、規定の間隔を隔てて配置された2個のホールセンサ11、12に対向して配置された永久磁石23の側方移動による磁束密度の変化に応じて、2個のホールセンサ11、12のホール出力電圧がそれぞれ変化する。そのホール出力電圧の差を、図2で示すように差動信号処理回路21により処理することで、永久磁石23の位置検出を行うことができる。
第1のホールセンサ11の正極出力端子11bと負極出力端子11dは、差動信号処理回路21の第1の差動増幅器21aに接続され、第2のホールセンサ12の正極出力端子12bと負極出力端子12dは、差動信号処理回路21の第2の差動増幅器21bに接続される。第1の差動増幅器21aと第2の差動増幅器21bの出力信号は、第3の差動増幅器21cに接続される。
12 第2のホールセンサ
11a、12a 正極入力端子
11b、12b 正極出力端子
11c、12c 負極入力端子
11d、12d 負極出力端子
21 差動信号処理回路
21a,21b,21c 差動増幅器
23 永久磁石
31 基板
32、33、34 ホールセンサ
35 ホールセンサの一方の端子対方向を示す矢印
36 ホールセンサの他方の端子対方向を示す矢印
51 正極入力電極
52 負極入力電極
53 第1のホールセンサの正極出力電極
54 第1のホールセンサの負極出力電極
55 第2のホールセンサの正極出力電極
56 第2のホールセンサの負極出力電極
57 第1のホールセンサ
58 第2のホールセンサ
59 パッケージ外形
61 複数の端子を備えた素子
62 正極入力端子
63 負極入力端子
71 正極入力電極
72 負極入力電極
73 第1の複数の端子を備えた素子
74 第2の複数の端子を備えた素子
75 電子部品のパッケージ外形
Claims (6)
- 1つのパッケージ内に複数個の素子と、複数の電極を有するリードフレームとを内包した電子部品において、素子の厚さ方向以外の各辺がパッケージの厚さ方向以外の各辺それぞれに対して、平行もしくは垂直以外の角度となるように、前記複数個の素子を前記リードフレーム上にマウントし、前記複数個の素子の同機能を有する少なくとも各端子の1つを前記電極の1つに共通に接続したことを特徴とする電子部品。
- 前記複数個の素子のうち隣接する素子の同機能を有する少なくとも1対の端子同士が対向するように、前記複数個の素子を前記リードフレーム上にマウントし、前記隣接する素子の同機能を有する少なくとも1対の端子を1つの前記電極に共通に接続したことを特徴とする請求項1に記載の電子部品。
- 前記複数個の素子がセンサであることを特徴とする請求項1または2に記載の電子部品。
- 前記センサがホールセンサであることを特徴とする請求項3に記載の電子部品。
- 前記複数個の素子が2個のホールセンサであることを特徴とする請求項3または4に記載の電子部品。
- 前記複数個の素子を基板上に多数形成された素子の中で隣り合った位置、もしくは近隣の位置にあるものから選択したことを特徴とする請求項1乃至5のいずれかに記載の電子部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005285001A JP4786986B2 (ja) | 2005-09-29 | 2005-09-29 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005285001A JP4786986B2 (ja) | 2005-09-29 | 2005-09-29 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007093468A true JP2007093468A (ja) | 2007-04-12 |
JP4786986B2 JP4786986B2 (ja) | 2011-10-05 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005285001A Active JP4786986B2 (ja) | 2005-09-29 | 2005-09-29 | 電子部品 |
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JP (1) | JP4786986B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101868760B1 (ko) * | 2014-10-03 | 2018-06-18 | 아사히 가세이 일렉트로닉스 가부시끼가이샤 | 홀 센서의 제조 방법 및 홀 센서와 렌즈 모듈 |
JP2019070563A (ja) * | 2017-10-06 | 2019-05-09 | 株式会社デンソー | 電流センサ |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5795685A (en) * | 1980-12-05 | 1982-06-14 | Toshiba Corp | Resin sealed type semiconductor magnetic sensitive device |
JPS58171683A (ja) * | 1981-12-08 | 1983-10-08 | Denki Onkyo Co Ltd | 磁気センサ装置 |
JPS62208683A (ja) * | 1986-03-07 | 1987-09-12 | Seiko Instr & Electronics Ltd | 磁気センサ |
JPH0382358A (ja) * | 1990-03-13 | 1991-04-08 | Murata Mfg Co Ltd | 磁電変換装置 |
JPH05218528A (ja) * | 1992-02-06 | 1993-08-27 | Asahi Chem Ind Co Ltd | 磁電変換素子 |
JPH11237395A (ja) * | 1998-02-23 | 1999-08-31 | Honda Motor Co Ltd | 回転センサ及び回転センサ用磁気検出ic |
JP2000252547A (ja) * | 1999-02-26 | 2000-09-14 | Victor Co Of Japan Ltd | ホール素子 |
JP2003065796A (ja) * | 2001-08-27 | 2003-03-05 | Asahi Kasei Electronics Co Ltd | 磁電変換素子及びこれを用いた変位検出装置 |
JP2004069695A (ja) * | 2002-07-25 | 2004-03-04 | Asahi Kasei Electronics Co Ltd | ポインティングデバイス用磁気センサ |
-
2005
- 2005-09-29 JP JP2005285001A patent/JP4786986B2/ja active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5795685A (en) * | 1980-12-05 | 1982-06-14 | Toshiba Corp | Resin sealed type semiconductor magnetic sensitive device |
JPS58171683A (ja) * | 1981-12-08 | 1983-10-08 | Denki Onkyo Co Ltd | 磁気センサ装置 |
JPS62208683A (ja) * | 1986-03-07 | 1987-09-12 | Seiko Instr & Electronics Ltd | 磁気センサ |
JPH0382358A (ja) * | 1990-03-13 | 1991-04-08 | Murata Mfg Co Ltd | 磁電変換装置 |
JPH05218528A (ja) * | 1992-02-06 | 1993-08-27 | Asahi Chem Ind Co Ltd | 磁電変換素子 |
JPH11237395A (ja) * | 1998-02-23 | 1999-08-31 | Honda Motor Co Ltd | 回転センサ及び回転センサ用磁気検出ic |
JP2000252547A (ja) * | 1999-02-26 | 2000-09-14 | Victor Co Of Japan Ltd | ホール素子 |
JP2003065796A (ja) * | 2001-08-27 | 2003-03-05 | Asahi Kasei Electronics Co Ltd | 磁電変換素子及びこれを用いた変位検出装置 |
JP2004069695A (ja) * | 2002-07-25 | 2004-03-04 | Asahi Kasei Electronics Co Ltd | ポインティングデバイス用磁気センサ |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101868760B1 (ko) * | 2014-10-03 | 2018-06-18 | 아사히 가세이 일렉트로닉스 가부시끼가이샤 | 홀 센서의 제조 방법 및 홀 센서와 렌즈 모듈 |
JP2019070563A (ja) * | 2017-10-06 | 2019-05-09 | 株式会社デンソー | 電流センサ |
US11199563B2 (en) | 2017-10-06 | 2021-12-14 | Denso Corporation | Electric current sensor |
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Publication number | Publication date |
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JP4786986B2 (ja) | 2011-10-05 |
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