JP2007089316A - Microminiature power conversion device and manufacturing method therefor - Google Patents

Microminiature power conversion device and manufacturing method therefor Download PDF

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JP2007089316A
JP2007089316A JP2005275429A JP2005275429A JP2007089316A JP 2007089316 A JP2007089316 A JP 2007089316A JP 2005275429 A JP2005275429 A JP 2005275429A JP 2005275429 A JP2005275429 A JP 2005275429A JP 2007089316 A JP2007089316 A JP 2007089316A
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hoop
coil
coil conductor
semiconductor chip
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JP4661489B2 (en
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Yoshitomo Hayashi
善智 林
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Fuji Electric Co Ltd
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Fuji Electric Device Technology Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a microminiature power conversion device and a manufacturing method therefor wherein a thin-film magnetic induction element that makes it possible to further enhance magnetic induction element characteristics is provided and a cost can be reduced. <P>SOLUTION: The microminiature power conversion device is constructed of second terminal electrodes 7 formed on a second principal surface of a hoop-shaped substrate 1 that is a flexible substrate wound in a roll like a hoop material, first terminal electrodes 6 formed on a first principal surface of the hoop-shaped substrate 1, a semiconductor chip 10 connected with the first terminal electrodes 6 through bumps 11, the thin-film magnetic induction element 100 bonded to the rear face (back face) of the semiconductor chip 10 through adhesive 14; by bending the hoop-shaped substrate 1, first and second windings 4, 5 connecting the first terminal electrodes 6 with first and second coil conductors 2, 3; and the like. The magnetic induction element characteristics can be enhanced by forming an internal magnetic core 13 in the center of the vortical coil conductors 2, 3 of the thin-film magnetic induction element 100. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、ＤＣ−ＤＣコンバ−タなどの超小型電力変換装置およびその製造方法に関する。   The present invention relates to a micro power converter such as a DC-DC converter and a method for manufacturing the same.

ＤＣ−ＤＣコンバータなどの電力変換装置は、スイッチング素子、整流素子、コンデンサ、制御用ＩＣおよび磁気誘導素子であるコイル、トランスなどの個別部品をセラミックやプラスチックなどのプリント基板上にハイブリッドで搭載したハイブリッド型の電源モジュールが報告されている（例えば、特許文献１）。
このハイブリッド型の電源モジュールの小型化は、ＭＣＭ（マルチチップモジュール）などの技術により進歩してきている。しかしながら、コイルやトランスなどの磁気誘導素子の小型化は困難であり、その占める体積が大きいため、この電源モジュールの小型化にとって制約条件となっている。
近年、この磁気誘導素子の製作に半導体技術を適用し、半導体基板上に薄型の超小型磁気誘導素子（コイル、トランス）を形成した例が報告されている（例えば、特許文献２や特許文献３）。 A power conversion device such as a DC-DC converter is a hybrid in which individual components such as a switching element, a rectifying element, a capacitor, a control IC, and a coil and a transformer, which are magnetic induction elements, are mounted in a hybrid on a printed circuit board such as ceramic or plastic. A type power supply module has been reported (for example, Patent Document 1).
Miniaturization of this hybrid power supply module has been advanced by technologies such as MCM (multi-chip module). However, it is difficult to reduce the size of magnetic induction elements such as coils and transformers, and the volume occupied by the induction device is large, which is a limiting condition for reducing the size of the power supply module.
In recent years, there have been reported examples in which a semiconductor technology is applied to manufacture the magnetic induction element, and a thin ultra-small magnetic induction element (coil, transformer) is formed on a semiconductor substrate (for example, Patent Document 2 and Patent Document 3). ).

さらに、複数の半導体チップをフレキシブル基板に固着し、このフレキシブル基板を折り曲げて半導体チップを重ね合わせて、低コストで占有面積を縮小化した半導体装置が報告されている（例えば、特許文献４）。
また、フレキシブル基板に渦巻き状の平面コイルおよび端子電極を形成し、この端子電極に半導体チップの表面側をバンプを介して固着し、フレキシブル基板を折り曲げてコイル部分を半導体チップの裏面側（背面）に重ねることで、超小型電力変換装置を製作することが行われている。
特開２００１−３３２６８１号公報 特開平９−３３０８１７号公報 特開２００１−１９６５４２号公報 特開２００３−８６７６０号公報 Furthermore, a semiconductor device has been reported in which a plurality of semiconductor chips are fixed to a flexible substrate, the flexible substrate is bent and the semiconductor chips are overlapped to reduce the occupied area at a low cost (for example, Patent Document 4).
Further, a spiral planar coil and a terminal electrode are formed on the flexible substrate, and the front surface side of the semiconductor chip is fixed to the terminal electrode via a bump, and the flexible substrate is bent to place the coil portion on the back surface side (rear surface) of the semiconductor chip. The super small power conversion device is manufactured by superimposing on.
JP 2001-326881 A JP-A-9-330817 JP 2001-196542 A JP 2003-86760 A

しかし、磁気誘導素子の製作に半導体技術を適用し、半導体基板上に薄型の超小型磁気誘導素子を形成する方法では、製造工程が複雑で、製造時間が長くなり、製造コストが増大する。
また、前記のフレキシブル基板を用いて製作した超小型電力変換装置の薄膜磁気誘導素子では、フレキシブル基板に形成した渦巻き状のコイルは、渦巻きの中心部が磁性材で貫通されていないので、磁気誘導素子特性（インダクタンスや飽和電流など）の一層の向上を図ることは困難である。
この発明の目的は、前記の課題を解決して、磁気誘導素子特性の一層の向上を図ることができる薄膜磁気誘導素子を有し、低コスト化できる超小型電力変換装置およびその製造方法を提供することにある。 However, in the method of applying a semiconductor technology to manufacture a magnetic induction element and forming a thin microminiature magnetic induction element on a semiconductor substrate, the manufacturing process is complicated, the manufacturing time is increased, and the manufacturing cost is increased.
In addition, in the thin film magnetic induction element of the micro power converter manufactured using the flexible substrate, the spiral coil formed on the flexible substrate is not penetrated by a magnetic material at the center of the spiral. It is difficult to further improve the element characteristics (inductance, saturation current, etc.).
An object of the present invention is to provide an ultra-compact power conversion device that has a thin-film magnetic induction element that can further improve the characteristics of the magnetic induction element and that can reduce the cost, and a method for manufacturing the same. There is to do.

前記の目的を達成するために、第１主面に渦巻き状の第１コイル導体と複数の第１端子電極および第２主面に前記第１コイル導体と接続する渦巻き状の第２コイル導体と複数の第２端子電極が形成され、前記第１端子電極と前記第１コイル導体とを接続する第１配線と別の前記第１端子電極と前記第２コイル導体を接続する第２配線が第１主面に形成された絶縁性もしくは半絶縁性のフープ状基板と、前記渦巻きの中心部のフープ状基板を開口し該開口部を埋めるとともに、前記第１、第２コイル導体上を被覆する磁性材と、前記第１端子電極とバンプを介して表面側が接続し、裏面側が前記磁性材と固着する半導体チップとを有する超小型電力変換装置であって、前記半導体チップの裏面側に前記第１、第２配線が形成された箇所の前記フープ状基板を折り曲げて前記磁性材を固着する構成とする。   To achieve the above object, a spiral first coil conductor and a plurality of first terminal electrodes on a first main surface and a spiral second coil conductor connected to the first coil conductor on a second main surface; A plurality of second terminal electrodes are formed, and a first wiring that connects the first terminal electrode and the first coil conductor and a second wiring that connects the other first terminal electrode and the second coil conductor are first An insulating or semi-insulating hoop-like substrate formed on one main surface and a hoop-like substrate at the center of the spiral are opened to fill the opening and cover the first and second coil conductors. An ultra-compact power converter having a magnetic material, a semiconductor chip having a front surface connected to the first terminal electrode and a bump, and a back surface fixed to the magnetic material, wherein the first power is connected to the back surface of the semiconductor chip. 1. The above-mentioned flange at the place where the second wiring is formed. By bending the looped substrate and configured to fix the magnetic material.

また、前記磁性材が磁性体粒子分散樹脂もしくは低温成形フェライト粉を圧縮成形および焼結したフェライトコアであるとよい。
また、前記第１コイル導体と前記第２コイル導体を挟み込む前記磁性材が、中心部が凸状となっている第１フェライト基板と、平坦な第２フェライト基板で構成されるとよい。 また、第１主面に磁性材に巻かれたソレノイド状コイルを構成するコイル導体と複数の第１端子電極および第２主面に複数の第２端子電極とが形成され、コイル導体の両端が別々の第１端子電極と接続する配線が前記第１主面に形成された絶縁性もしくは半絶縁性のフープ状基板と、該フープ状基板の前記第１端子電極とバンプを介して表面側が接続する半導体チップとを有する超小型電力変換装置であって、前記半導体チップの裏面側に前記ソレノイド状コイルを前記フープ状基板を折り曲げることで固着する構成とする。 The magnetic material may be a ferrite core obtained by compression-molding and sintering a magnetic particle-dispersed resin or low-temperature shaped ferrite powder.
The magnetic material sandwiching the first coil conductor and the second coil conductor may be composed of a first ferrite substrate having a convex center portion and a flat second ferrite substrate. Further, a coil conductor constituting a solenoid coil wound around a magnetic material on the first main surface, a plurality of first terminal electrodes, and a plurality of second terminal electrodes on the second main surface are formed, and both ends of the coil conductor are An insulating or semi-insulating hoop-like substrate in which wirings to be connected to different first terminal electrodes are formed on the first main surface, and the surface side of the hoop-like substrate are connected to the first terminal electrodes via bumps An ultra-compact power conversion device having a semiconductor chip to be fixed to the back surface side of the semiconductor chip by bending the solenoid-like coil by bending the hoop-like substrate.

また、前記磁性材がＩ字型フェライトコアであるとよい。
また、前記Ｉ字型フェライトコアの上下にフェライト基板を配置するとよい。
また、前記フープ状基板が、ロール状に巻かれたテープ状の導電パターンが形成されたフレキシブル基板をカットしたものであるとよい。
また、第１主面に渦巻き状の第１コイル導体と複数の第１端子電極および第２主面に前記第１コイル導体と接続する渦巻き状の第２コイル導体と複数の第２端子電極が形成され、前記第１端子電極と前記第１コイル導体とを接続する第１配線と別の前記第１端子電極と前記第２コイル導体を接続する第２配線が第１主面に形成された絶縁性もしくは半絶縁性のフープ状基板の前記渦巻きの中心部と前記第１、第２コイル導体が形成された箇所の第１外周部の前記フープ状基板を開口する工程と、前記中心部と第１外周部に形成された前記開口部を磁性材で埋めるとともに、前記第１、第２コイル導体上を該磁性材で被覆する工程と、前記第１端子電極と半導体チップの表面側とをバンプを介して接続する工程と、前記第１、第２コイル導体、前記第１、第２配線が形成された箇所および前記半導体チップが固着した箇所を残して他の箇所の前記フープ状基板を除去する工程と、前記半導体チップの裏面側に前記フープ状基板を折り曲げて前記磁性材を固着する工程とを含む製造方法とする。 The magnetic material may be an I-shaped ferrite core.
Further, a ferrite substrate may be disposed above and below the I-shaped ferrite core.
Moreover, the said hoop-shaped board | substrate is good in what cut the flexible substrate in which the tape-shaped electroconductive pattern wound by roll shape was formed.
Further, a spiral first coil conductor and a plurality of first terminal electrodes on the first main surface, and a spiral second coil conductor and a plurality of second terminal electrodes connected to the first coil conductor on the second main surface. A first wiring that is formed and connects the first terminal electrode and the first coil conductor and a second wiring that connects the other first terminal electrode and the second coil conductor are formed on the first main surface. Opening the hoop-like substrate in the central portion of the spiral of the insulative or semi-insulating hoop-like substrate and the first outer peripheral portion of the portion where the first and second coil conductors are formed; The step of filling the opening formed in the first outer peripheral portion with a magnetic material, and covering the first and second coil conductors with the magnetic material, and the first terminal electrode and the surface side of the semiconductor chip Connecting via bumps, the first and second coil conductors, The step of removing the hoop-like substrate in other places leaving the place where the first and second wirings are formed and the place where the semiconductor chip is fixed, and folding the hoop-like substrate on the back side of the semiconductor chip And a step of fixing the magnetic material.

また、第１主面に併設される複数のコイル導体と複数の第１端子電極および第２主面に複数の第２端子電極とが形成され、前記複数のコイル導体の最外部に配置されたコイル導体と第１、第２端子電極と接続する第１、第２配線とが形成された絶縁性もしくは半絶縁性のフープ状基板の前記の全コイル導体を横切るように磁性材を配置する工程と、前記フープ状基板の第１端子電極にバンプを介して半導体チップの表面側を固着する工程と、前記磁性材の外周を包むように前記フープ状基板を折り曲げ、各コイル導体の端部を互い違いに接続してソレノイド状のコイルを形成する工程と、前記半導体チップの裏面側に前記第１、第２配線が形成された箇所の前記フープ状基板を折り曲げて前記ソレノイド状のコイルを前記フープ状基板を介して固着する工程とを含む製造方法とする。
また、前記の各工程を自動化ラインで行うとよい。 Also, a plurality of coil conductors and a plurality of first terminal electrodes provided on the first main surface, and a plurality of second terminal electrodes on the second main surface are formed, and arranged at the outermost portion of the plurality of coil conductors. Arranging a magnetic material so as to cross all the coil conductors of the insulating or semi-insulating hoop-like substrate in which the coil conductor and the first and second wirings connected to the first and second terminal electrodes are formed. A step of fixing the surface side of the semiconductor chip to the first terminal electrode of the hoop-like substrate via a bump, and the hoop-like substrate is bent so as to wrap the outer periphery of the magnetic material, and the ends of the coil conductors are staggered. Forming a solenoid-like coil by connecting to the semiconductor chip, and bending the hoop-like substrate where the first and second wirings are formed on the back surface side of the semiconductor chip to form the solenoid-like coil in the hoop-like shape. Through the board A manufacturing method comprising a step of fixing.
Moreover, it is good to perform each said process by an automated line.

この発明によれば、フレキシブル基板としてロール状のフープ状基板を用いることにより、一連の製造工程を連続的に自動化ラインで処理できるため、製造コストの大幅な低減を図ることができる。
また、渦巻き状のコイルの中心部で磁性材を貫通させることができるために、磁気誘導素子特性を一層向上させることができる。 According to the present invention, by using a roll-shaped hoop-shaped substrate as the flexible substrate, a series of manufacturing processes can be continuously processed by an automated line, so that the manufacturing cost can be greatly reduced.
Further, since the magnetic material can be penetrated at the center of the spiral coil, the magnetic induction element characteristics can be further improved.

実施の形態を以下の実施例にて説明する。   Embodiments will be described in the following examples.

図１は、この発明の第１実施例の超小型電力変換装置の構成図であり、同図（ａ）は要部平面図、同図（ｂ）は同図（ａ）のＸ−Ｘ線で切断した要部断面図である。同図（ｂ）は、半導体チップ１０の裏面側に薄膜磁気誘導素子１００を固着した断面図である。
この超小型電力変換装置の薄膜化される主要部は、絶縁性もしくは半絶縁性のフレキシブル基板であるフープ状基板１と、フープ状基板１の第２主面に形成された第２端子電極７と、フープ状基板１の第１主面に形成される第１端子電極６と、この第１端子電極６とバンプ１１で接続する半導体チップ１０と、半導体チップ９の裏面側（背面）にフープ状基板１を折り曲げて接着剤１４で固着される薄膜磁気誘導素子１００と、第１端子電極６と第１、第２コイル導体２、３を接続する第１、第２配線４、５（第２コイル導体３と第２配線５との接続部はｂである）などで構成される。前記の第２端子電極７ははんだ１６を介して図示しないプリント基板などに表面実装されるときに用いられる。また、図示しないコンデンサや抵抗などを接続して超小型電力変換装置が完成する。尚、半絶縁性のフープ状基板は絶縁性の基板に導電性物質を混在させて形成する。 FIG. 1 is a configuration diagram of a micro power converter according to a first embodiment of the present invention, where FIG. 1 (a) is a plan view of a main part, and FIG. 1 (b) is an XX line of FIG. 1 (a). It is principal part sectional drawing cut | disconnected by. FIG. 2B is a cross-sectional view in which the thin film magnetic induction element 100 is fixed to the back side of the semiconductor chip 10.
The main parts of the ultra-compact power conversion device that are made thin are a hoop-like substrate 1 that is an insulating or semi-insulating flexible substrate, and a second terminal electrode 7 formed on the second main surface of the hoop-like substrate 1. A first terminal electrode 6 formed on the first main surface of the hoop-like substrate 1, a semiconductor chip 10 connected to the first terminal electrode 6 by a bump 11, and a hoop on the back surface side (back surface) of the semiconductor chip 9. First and second wirings 4, 5 (first) connecting the first terminal electrode 6 and the first and second coil conductors 2, 3 to the thin film magnetic induction element 100 which is bent and fixed with the adhesive 14 by bending the substrate 1 The connection portion between the two-coil conductor 3 and the second wiring 5 is b). The second terminal electrode 7 is used when it is surface-mounted on a printed circuit board (not shown) via a solder 16. In addition, an ultra-compact power converter is completed by connecting a capacitor, a resistor, etc. (not shown). Note that the semi-insulating hoop-like substrate is formed by mixing a conductive substance with an insulating substrate.

薄膜磁気誘導素子１００は、フープ状基板１の第１主面に形成した渦巻き状の第１コイル導体２と、第１コイル導体２の一端と接続し第２主面に形成される渦巻き状の第２コイル導体３（両コイル導体の接続部がａである）と、第１、第２コイル導体２、３を被覆し、渦巻きの中心部に位置するフープ状基板１の開口部８を充填する磁性体粒子分散樹脂またはフェライトコアなどの磁性材１２とで構成される。第１コイル導体２と第２コイル導体３で形成される渦巻き状のコイルの中心部が磁性体粒子分散樹脂またはフェライトコアなどの磁性材１２で埋められているため、埋められていない従来の渦巻き状のコイルと比べて、薄膜磁気誘導素子１００の磁気誘導素子特性（インダクタンス、飽和電流などの特性）を向上させることができる。
前記の中心部を貫通する磁性材１２は内部磁心１３となり、第１、第２コイル導体２、３を被覆する磁性材１２は外部磁心となる。従来の渦巻き状コイルにはこの内部磁心１３がない。 The thin film magnetic induction element 100 includes a spiral first coil conductor 2 formed on the first main surface of the hoop-like substrate 1 and a spiral shape formed on the second main surface connected to one end of the first coil conductor 2. Covers the second coil conductor 3 (the connecting portion of both coil conductors is a), the first and second coil conductors 2 and 3, and fills the opening 8 of the hoop-like substrate 1 located at the center of the spiral. Magnetic material dispersed resin or magnetic material 12 such as ferrite core. Since the central part of the spiral coil formed by the first coil conductor 2 and the second coil conductor 3 is filled with a magnetic material 12 such as a magnetic particle-dispersed resin or a ferrite core, a conventional spiral that is not filled is used. Compared with a coil-like coil, the magnetic induction element characteristics (characteristics such as inductance and saturation current) of the thin film magnetic induction element 100 can be improved.
The magnetic material 12 penetrating through the central portion is an internal magnetic core 13, and the magnetic material 12 covering the first and second coil conductors 2 and 3 is an external magnetic core. A conventional spiral coil does not have this internal magnetic core 13.

図２〜図６は、図１の超小型電力変換装置の製造方法を工程順に示した要部製造工程図である。図２、図３、図４、図５（ａ）は要部平面図、図５（ｂ）は斜視図、図６は要部断面図である。
まず、フレキシブル基板として、フープ材のようにロール状に巻かれたテープ状の基板（ここでは、フープ状基板１と称す）を用意する。このフープ状基板１は、導電パターンが予め形成された絶縁基板（ポリイミドなどの樹脂基材シート）であり、フープ状基板１の第１主面の導電パターンは実線で示した半導体チップ接続用の第１端子電極６と渦巻き状の第１コイル導体２であり、第２主面の導電パターンは点線で示した表面実装用の第２端子電極７と渦巻き状の第２コイル導体３である。第１、第２コイル導体２、３は接続部ａで接続し、第２コイル導体３と第２配線５は接続部ｂで接続する。接続部ａ、ｂはフープ状基板１に貫通孔を開けてこの貫通孔を導体で充填して形成される。第１コイル導体２と第１配線４はフープ状基板１の同じ第１主面に形成されるので、直接接続する。第１、第２コイル導体２、３の厚さは５０μｍ程度である（図２）。 2 to 6 are main part manufacturing process diagrams illustrating the manufacturing method of the microminiature power converter of FIG. 1 in the order of processes. 2, 3, 4, and 5 (a) are main part plan views, FIG. 5 (b) is a perspective view, and FIG. 6 is a main part cross-sectional view.
First, as a flexible substrate, a tape-shaped substrate (herein referred to as a hoop-shaped substrate 1) wound in a roll shape like a hoop material is prepared. The hoop-shaped substrate 1 is an insulating substrate (resin base material sheet such as polyimide) on which a conductive pattern is formed in advance. The conductive pattern on the first main surface of the hoop-shaped substrate 1 is for connecting a semiconductor chip indicated by a solid line. The first terminal electrode 6 and the spiral first coil conductor 2, and the conductive pattern of the second main surface are the surface-mounted second terminal electrode 7 and the spiral second coil conductor 3 indicated by dotted lines. The first and second coil conductors 2 and 3 are connected by a connection part a, and the second coil conductor 3 and the second wiring 5 are connected by a connection part b. The connecting portions a and b are formed by opening a through hole in the hoop-like substrate 1 and filling the through hole with a conductor. Since the first coil conductor 2 and the first wiring 4 are formed on the same first main surface of the hoop-like substrate 1, they are directly connected. The thickness of the first and second coil conductors 2 and 3 is about 50 μm (FIG. 2).

つぎに、この第１主面に形成された第１端子電極６の表面をプラズマクリーニングで清浄にした後（プラズマクリーニングをしない場合もある）、半導体チップ１０に形成されたバンプ１１を超音波フリップチップボンディングにより第１端子電極６に固着する。バンプ１１はＡｕワイヤを用いたスタッドバンプやＡｕメッキバンプなどＡｕバンプとすると密着性がよい。半導体チップ１０とフープ状基板１の第１主面の間の隙間にアンダーフィル１５を充填するのが好ましい。また、第２端子電極７と図示しないプリント基板に形成した導電パターンとの固着には、Ａｕ膜の熱圧着及び、高温はんだ接合を用いるとよい。これらの工程後に、フープ状基板１の中心部と第１、第２コイル導体２、３の外周部に型抜きにより開口部８、９を形成する（図３）。
つぎに、第１、第２コイル導体２、３の表面を覆うように磁性体粒子分散樹脂をモールドし熱硬化させて磁性材１２にするか、または低温成形フェライト粉を型により圧縮成形および焼結によりフェライトコア（外部磁心）を形成して磁性材１２にする。このとき磁性材１２の外周部は開口部９、磁性材１２の中心部は開口部８を貫通して形成される。また、開口部８を貫通した磁性材１２は内部磁心１３となる。尚、図３の工程と磁性材１２の形成する工程の順序を入れ換えてもよい。この場合、まず磁性材１２を形成してから、プラズマクリーニングおよびチップの固着を行うことになる（図４）。 Next, after the surface of the first terminal electrode 6 formed on the first main surface is cleaned by plasma cleaning (plasma cleaning may not be performed), the bumps 11 formed on the semiconductor chip 10 are ultrasonically flipped. It adheres to the 1st terminal electrode 6 by chip bonding. If the bump 11 is an Au bump such as a stud bump or an Au plated bump using an Au wire, the adhesiveness is good. The underfill 15 is preferably filled in the gap between the semiconductor chip 10 and the first main surface of the hoop-like substrate 1. In addition, for bonding between the second terminal electrode 7 and a conductive pattern formed on a printed circuit board (not shown), it is preferable to use thermocompression bonding of an Au film and high-temperature solder bonding. After these steps, openings 8 and 9 are formed by die cutting at the center of the hoop-like substrate 1 and the outer peripheral portions of the first and second coil conductors 2 and 3 (FIG. 3).
Next, the magnetic particle-dispersed resin is molded so as to cover the surfaces of the first and second coil conductors 2 and 3 and thermally cured to form the magnetic material 12, or low-temperature formed ferrite powder is compression-molded and sintered by a mold. A ferrite core (external magnetic core) is formed by bonding to form a magnetic material 12. At this time, the outer periphery of the magnetic material 12 is formed through the opening 9, and the central portion of the magnetic material 12 is formed through the opening 8. Further, the magnetic material 12 penetrating through the opening 8 becomes an internal magnetic core 13. Note that the order of the process of FIG. 3 and the process of forming the magnetic material 12 may be interchanged. In this case, the magnetic material 12 is first formed, and then plasma cleaning and chip fixation are performed (FIG. 4).

つぎに、半導体チップ１０が固着した箇所と第１、第２配線４、５が形成された箇所と磁性材１２が固着した箇所のフープ状基板１を周囲の不要なフープ状基板１から切り離すために型抜きをする。図の右側が薄膜磁気誘導素子１００である（図５）。
つぎに、１５０℃〜２００℃に加熱しながら切り離されたフープ状基板１を折り曲げ、半導体チップ１０の裏面側（背面）に薄膜磁気誘導素子１００を重ねて貼り合わせる。この貼り合わせには接着剤１４もしくは図示しないモールド封止を用いるとよい。最後にフープ状基板１の第２主面に形成された第２端子電極７にＢＧＡ（ボールグリッドアレイ）用のはんだボールなどのはんだ１６を固着させる。はんだボールを付けずにＬＧＡ（ランドグリッドアレイ）として平面実装に用いる場合も可能である（図６）。
図７は、図１の超小型電力変換装置の製造工程の全体の流れを示す概略図である。図７に示すように、フープ状基板１を用いることで、半導体チップ１０の固着工程と、型抜きによる開口部８、９の形成工程と、磁性材１２の形成工程と、フープ状基板１の切断工程と、折り曲げ・接着工程などの一連の製造工程を自動化ラインで行うことができるようになり、大幅なコスト低減を図ることができる。尚、上述のように、プラズマクリーニングおよびチップ固着を磁性材形成と切断の間においてもよい。 Next, in order to separate the hoop-like substrate 1 where the semiconductor chip 10 is fixed, where the first and second wirings 4 and 5 are formed, and where the magnetic material 12 is fixed, from the surrounding unnecessary hoop-like substrate 1. Die-cut. The right side of the figure is the thin film magnetic induction element 100 (FIG. 5).
Next, the hoop-like substrate 1 cut off while being heated to 150 ° C. to 200 ° C. is bent, and the thin film magnetic induction element 100 is laminated and bonded to the back side (back side) of the semiconductor chip 10. For this bonding, an adhesive 14 or a mold seal (not shown) may be used. Finally, a solder 16 such as a BGA (ball grid array) solder ball is fixed to the second terminal electrode 7 formed on the second main surface of the hoop-like substrate 1. It is also possible to use it for planar mounting as an LGA (land grid array) without attaching solder balls (FIG. 6).
FIG. 7 is a schematic diagram showing the overall flow of the manufacturing process of the micro power converter of FIG. As shown in FIG. 7, by using the hoop-shaped substrate 1, the fixing process of the semiconductor chip 10, the forming process of the openings 8 and 9 by die cutting, the forming process of the magnetic material 12, A series of manufacturing processes, such as a cutting process and a bending / bonding process, can be performed by an automated line, and a significant cost reduction can be achieved. As described above, plasma cleaning and chip fixation may be performed between the formation of the magnetic material and the cutting.

また、フープ状基板１を用いると、ロールが回転しフープ状基板１が一方向（進行方向）に伸びて行き、所定のピッチで移動させることで、半導体チップ１０や、渦巻きの中心部と外周部に形成される開口部８、９の位置合わせ方向がフープ状基板１の進行方向に対して直角方向のみでよくなり、素早く精度よい位置合わせが容易にできる。また、半導体チップ固着装置、開口部形成装置、フープ状基板の不要箇所の切断除去装置、フープ状基板の折り曲げおよび固着装置などの各製造装置をフープ状基板１の進行方向に一直線に並べて配置することで、一連の製造工程を自動化ラインで行うことができる。   Further, when the hoop-like substrate 1 is used, the roll rotates and the hoop-like substrate 1 extends in one direction (traveling direction) and moves at a predetermined pitch. The alignment direction of the openings 8 and 9 formed in the portion is only required in the direction perpendicular to the traveling direction of the hoop-like substrate 1, and quick and accurate alignment can be easily performed. Also, each manufacturing apparatus such as a semiconductor chip fixing device, an opening forming device, a cutting / removing device for unnecessary portions of the hoop-like substrate, and a hoop-like substrate bending and fixing device are arranged in a straight line in the advancing direction of the hoop-like substrate 1. Thus, a series of manufacturing processes can be performed on an automated line.

図８は、この発明の第２実施例の超小型電力変換装置の要部断面図である。この図は、半導体チップ１０の裏面側に薄膜磁気誘導素子１００を固着した断面図である。
図１と異なるのは、コア付きフェライト板２１（中心部が凸状となっているフェライト板）と平坦なフェライト板２２で、コア部を渦巻きの中心に位置合わせして、渦巻き状のコイル導体２、３を表裏両面から挟み込むように包囲した点である。コア部は内部磁心１３でありフェライト板２２とフェライト板２１の下板部は外部磁心である。この場合も第１実施例と同様の効果が得られる。
図９〜図１１は、図８の超小型電力変換装置の製造方法であり、工程順に示した要部製造工程図である。尚、図９、図１０（ａ）は要部平面図、図１０（ｂ）は要部斜視図、図１１は要部断面図である。 FIG. 8 is a cross-sectional view of an essential part of a micro power converter according to a second embodiment of the present invention. This figure is a cross-sectional view in which the thin film magnetic induction element 100 is fixed to the back side of the semiconductor chip 10.
What is different from FIG. 1 is a ferrite plate 21 with a core (ferrite plate having a convex center portion) and a flat ferrite plate 22, and the core portion is aligned with the center of the spiral to form a spiral coil conductor. 2 and 3 are surrounded by both sides of the front and back. The core part is an internal magnetic core 13, and the lower plate part of the ferrite plate 22 and the ferrite plate 21 is an external magnetic core. In this case, the same effect as that of the first embodiment can be obtained.
FIGS. 9-11 is a manufacturing method of the micro power converter device of FIG. 8, and is a main part manufacturing process diagram shown in the order of processes. 9 and 10 (a) are plan views of the main part, FIG. 10 (b) is a perspective view of the main part, and FIG. 11 is a cross-sectional view of the main part.

前記と同様に、まず、フープ状基板１を用意し、フープ状基板１の第１主面に形成された第１端子電極６をプラズマクリーニングにより清浄化した後、半導体チップ１０に形成されたバンプ１１を超音波フリップチップボンディングにより第１端子電極６に固着する。このときバンプ１１はＡｕワイヤを用いたスタッドバンプやメッキバンプなどのＡｕバンプとするとよい。半導体チップ１０とフープ状基板１の第１主面の間にアンダーフィル１５を充填するのが好ましい。また、第２端子電極７と図示しないプリント基板との接合には、Ａｕの熱圧着及び、高温はんだ接合を用いるとよい。続いて、第１、第２コイル導体２、３を形成した箇所のフープ状基板１を型抜きして開口部８、９を形成し、コア付きフェライト板２１（中心部が凸状となっているフェライト板）の凸部を開口部８、９に嵌め込む（図９）。   In the same manner as described above, first, a hoop-like substrate 1 is prepared, and after the first terminal electrode 6 formed on the first main surface of the hoop-like substrate 1 is cleaned by plasma cleaning, bumps formed on the semiconductor chip 10 are formed. 11 is fixed to the first terminal electrode 6 by ultrasonic flip chip bonding. At this time, the bump 11 is preferably an Au bump such as a stud bump or a plated bump using an Au wire. It is preferable to fill the underfill 15 between the semiconductor chip 10 and the first main surface of the hoop-shaped substrate 1. Further, for bonding the second terminal electrode 7 and a printed board (not shown), it is preferable to use Au thermocompression bonding and high-temperature solder bonding. Subsequently, the hoop-like substrate 1 where the first and second coil conductors 2 and 3 are formed is punched to form the openings 8 and 9, and the cored ferrite plate 21 (the central portion is convex). The convex portion of the ferrite plate) is fitted into the openings 8 and 9 (FIG. 9).

つぎに、コア付きフェライト板２１（中心部が凸状となっているフェライト板）に平坦なフェライト板２２を被せて、渦巻き状の第１、第２コイル導体２、３を挟み込み、フェライト板２１、２２を接着剤２３で固着し、半導体チップ１０が固着した箇所と第１、第２配線４、５が形成された箇所とフェライト板２１が固着した箇所のフープ状基板１を周囲の不要なフープ状基板１から型抜きにより切離す（図１０）。
つぎに、１５０℃〜２００℃に加熱しながら切り離されたフープ状基板１を折り曲げ、半導体チップ１０の裏面側（背面）に薄膜磁気誘導素子１００を重ねて貼り合わせる。この貼り合わせには接着剤１４もしくは図示しないモールド封止を用いるとよい。最後にフープ状基板１の第２主面に形成された第２端子電極７にＢＧＡ（ボールグリッドアレイ）用のはんだボールなどのはんだ１６を固着させる。はんだボールを付けずにＬＧＡ（ランドグリッドアレイ）として平面実装に用いる場合も可能である（図１１）。 Next, a ferrite plate 21 with a core (ferrite plate having a convex center portion) is covered with a flat ferrite plate 22, and the spiral first and second coil conductors 2 and 3 are sandwiched between the ferrite plates 21. , 22 are fixed with an adhesive 23, and the hoop-like substrate 1 at the position where the semiconductor chip 10 is fixed, the position where the first and second wirings 4 and 5 are formed, and the position where the ferrite plate 21 is fixed is unnecessary in the surrounding area. The hoop-like substrate 1 is separated by die cutting (FIG. 10).
Next, the hoop-like substrate 1 cut off while being heated to 150 ° C. to 200 ° C. is bent, and the thin film magnetic induction element 100 is laminated and bonded to the back side (back side) of the semiconductor chip 10. For this bonding, an adhesive 14 or a mold seal (not shown) may be used. Finally, a solder 16 such as a BGA (ball grid array) solder ball is fixed to the second terminal electrode 7 formed on the second main surface of the hoop-like substrate 1. It is also possible to use it for planar mounting as an LGA (land grid array) without attaching solder balls (FIG. 11).

前記のように、フープ状基板１を用いることで、半導体チップ１０の固着工程と、コイル基板型抜きによる開口部８、９の形成工程と、フェライト板２１、２２の取り付け形成工程と、図示しないプラズマクリーニング工程と、フープ状基板１の切断工程と、折り曲げ・接着工程などの一連の製造工程を自動化ラインで行うことができるようになり、大幅なコスト低減を図ることができる。   As described above, by using the hoop-shaped substrate 1, the fixing process of the semiconductor chip 10, the forming process of the openings 8 and 9 by the coil substrate die cutting, and the attaching and forming process of the ferrite plates 21 and 22 are not shown. A series of manufacturing processes such as a plasma cleaning process, a cutting process of the hoop-like substrate 1 and a bending / bonding process can be performed on an automated line, so that a significant cost reduction can be achieved.

図１２は、この発明の第３実施例の超小型電力変換装置の要部断面図である。この図は、半導体チップ１０の裏面側に薄膜磁気誘導素子２００を固着した断面図である。
図１および図８と異なるのは、渦巻き状のコイル（第１、第２コイル導体２、３で形成されるコイル）ではなくソレノイド状のコイルとし、コイル内に内部磁心としてＩ字型フェライトコア２５を配置した点である。
この超小型電力変換装置の薄膜化される主要部は、一部がフェライトコア２５に巻かれて薄膜磁気誘導素子２００を構成するフレキシブル基板であるフープ状基板１の第２主面に形成された第２端子電極７と、フープ状基板１の第１主面に形成された第１端子電極６およびコイル導体２４と、この第１端子電極６とバンプ１１で接続する半導体チップ１０と、半導体チップ９の裏面側（背面）にフープ状基板１を折り曲げて接着剤１４で固着される薄膜磁気誘導素子２００と、第１端子電極６と最外部のコイル導体２４と接続する第１、第２配線４、５などで構成される。前記の第２端子電極７ははんだ１６を介して図示しないプリント基板などに表面実装されるときに用いられる。また、図示しないコンデンサや抵抗などを接続して超小型電力変換装置が完成する。 FIG. 12 is a cross-sectional view of an essential part of a micro power converter according to a third embodiment of the present invention. This figure is a sectional view in which a thin film magnetic induction element 200 is fixed to the back side of the semiconductor chip 10.
1 and 8 is not a spiral coil (coil formed by the first and second coil conductors 2 and 3) but a solenoid coil, and an I-shaped ferrite core as an internal magnetic core in the coil. 25.
The main part of the ultra-compact power conversion device that is thinned is formed on the second main surface of the hoop-like substrate 1 that is a flexible substrate that is partially wound around the ferrite core 25 and constitutes the thin-film magnetic induction element 200. The second terminal electrode 7, the first terminal electrode 6 and the coil conductor 24 formed on the first main surface of the hoop-like substrate 1, the semiconductor chip 10 connected to the first terminal electrode 6 by the bump 11, and the semiconductor chip 9 is connected to the thin-film magnetic induction element 200, which is bent by the hoop-like substrate 1 and fixed by the adhesive 14, and the first terminal electrode 6 and the outermost coil conductor 24. 4, 5, etc. The second terminal electrode 7 is used when it is surface-mounted on a printed circuit board (not shown) via a solder 16. In addition, an ultra-compact power converter is completed by connecting a capacitor, a resistor, etc. (not shown).

薄膜磁気誘導素子２００は、フープ状基板１の第１主面に形成したストレート（直線状）の複数のコイル導体２４をＩ字型フェライトコア２５に巻き付け、ソレノイド状のコイルとする。ソレノイド状のコイルの中心部にＩ字型フェライトコア２５があるため、薄膜磁気誘導素子２００の磁気誘導素子特性（インダクタンス、飽和電流などの特性）を向上させることができる。
図１３〜図１５は、図１２の超小型電力変換装置の製造方法であり、工程順に示した要部製造工程図である。図１３、図１４は要部斜視図であり、図１５は要部断面図である。 前記と同様に、まず、フープ状基板１を用意し、フープ状基板１の第１主面に形成された第１端子電極６（図１２参照）をプラズマクリーニングにより清浄化した後、バンプ１１（図１２参照）を形成した半導体チップ１０を超音波フリップチップボンディングにより接続する。半導体チップ１０とフープ状基板１の第１主面の間の隙間にアンダーフィル１５を充填するのが好ましい（図１３）。 In the thin film magnetic induction element 200, a plurality of straight (linear) coil conductors 24 formed on the first main surface of the hoop-shaped substrate 1 are wound around an I-shaped ferrite core 25 to form a solenoid coil. Since the I-shaped ferrite core 25 is provided at the center of the solenoid coil, the magnetic induction element characteristics (characteristics such as inductance and saturation current) of the thin film magnetic induction element 200 can be improved.
FIGS. 13-15 is a manufacturing method of the microminiature power converter of FIG. 12, and is the principal part manufacturing process drawing shown to process order. 13 and 14 are perspective views of relevant parts, and FIG. 15 is a sectional view of the relevant parts. Similarly to the above, first, a hoop-like substrate 1 is prepared, and after the first terminal electrode 6 (see FIG. 12) formed on the first main surface of the hoop-like substrate 1 is cleaned by plasma cleaning, the bump 11 ( The semiconductor chip 10 having the structure shown in FIG. 12 is connected by ultrasonic flip chip bonding. It is preferable to fill the gap between the semiconductor chip 10 and the first main surface of the hoop-like substrate 1 with the underfill 15 (FIG. 13).

つぎに、コイル導体２４上にＩ字型フェライトコア２５を設置する（図１４）。
つぎに、フープ状基板１を切断し、１５０℃〜２００℃に加熱しながらフープ状基板１を曲げて、Ｉ字型フェライトコア２５にコイル導体２４を被せ、第２配線５の一端ｄ１とコイル導体２４の一端ｄ２を接続し、コイル導体２４の他端ｄ３と隣のコイル導体２４の一端ｄ４を接続し、これを順次繰り返して接続してソレノイド状のコイルを形成し、薄膜磁気誘導素子２００を形成する。この薄膜磁気誘導素子２００を半導体チップ２００の裏面側に接着剤１４で固着する。最後にフープ状基板１の第２主面に形成された第２端子電極７にＢＧＡ（ボールグリッドアレイ）用のはんだボールなどのはんだ１６を固着させる。はんだボールを付けずにＬＧＡ（ランドグリッドアレイ）として平面実装に用いる場合も可能である（図１５）。 Next, an I-shaped ferrite core 25 is installed on the coil conductor 24 (FIG. 14).
Next, the hoop-like substrate 1 is cut, the hoop-like substrate 1 is bent while being heated to 150 ° C. to 200 ° C., the coil conductor 24 is covered with the I-shaped ferrite core 25, the one end d 1 of the second wiring 5 and the coil One end d2 of the conductor 24 is connected, the other end d3 of the coil conductor 24 and one end d4 of the adjacent coil conductor 24 are connected, and this is sequentially repeated to form a solenoid-like coil. Form. The thin film magnetic induction element 200 is fixed to the back side of the semiconductor chip 200 with an adhesive 14. Finally, a solder 16 such as a BGA (ball grid array) solder ball is fixed to the second terminal electrode 7 formed on the second main surface of the hoop-like substrate 1. It is also possible to use it for planar mounting as an LGA (land grid array) without attaching solder balls (FIG. 15).

さらに薄膜磁気誘導素子２００の形成を詳しく説明すると、フ─プ状基板１の第１主面に予めソレノイド巻き線の１ターンずつのパターンをターン数（ここでは、８ターン）分並べて形成したフレキシブル配線基板（コイル導体２４が形成されたフープ状基板１のこと）で高透磁率材料で形成したＩ字型フェライトコア２５を一周巻いて、隣接したコイルパターンの端部同士を接続することにより、一本のソレノイド巻き線構造のインダクタを形成する。接続部の接合には、Ａｕの熱圧着若しくは、超音波接合を用いるとよい。続いて、さらに、フ─プ状基板１を曲げて半導体チップ１０の裏面側にＩ字型フェライトコア２５を位置させて固着する。
前記のように、フープ状基板１を用いることで、前記した一連の製造工程を自動化ラインで行うことができるようになり、大幅なコスト低減を図ることができる。 Further, the formation of the thin-film magnetic induction element 200 will be described in detail. A flexible structure in which a pattern of one turn of the solenoid winding is previously arranged on the first main surface of the loop-shaped substrate 1 by the number of turns (here, 8 turns). By winding the I-shaped ferrite core 25 formed of a high magnetic permeability material around the wiring substrate (the hoop-shaped substrate 1 on which the coil conductor 24 is formed) and connecting the ends of adjacent coil patterns, An inductor having a single solenoid winding structure is formed. For joining the connecting portions, it is preferable to use Au thermocompression bonding or ultrasonic bonding. Subsequently, the loop-shaped substrate 1 is further bent, and the I-shaped ferrite core 25 is positioned and fixed to the back surface side of the semiconductor chip 10.
As described above, by using the hoop-shaped substrate 1, the series of manufacturing steps described above can be performed with an automated line, and a significant cost reduction can be achieved.

また、図１６、図１７は、図１３〜図１５とは異なる図１２の超小型電力変換装置の製造方法であり、工程順に示した要部製造工程図である。図１６、図１７は要部斜視図である。
図１３〜図１５の場合は比較的半導体チップ１０が大きい場合で、フープ状基板１の進行方向に向かって半導体チップ１０と薄膜磁気誘導素子２００が一列に配置される場合である。一方、図１６、図１７は半導体チップ１０が比較的小さい場合であり、フープ状基板１の進行方向に向かって直角方向に半導体チップ１０と薄膜磁気誘導素子２００が一列に配置される場合である。
図１３〜図１５との違いは、図１６、図１７に示すようにフープ状基板１に開口部２６を形成し、この開口部にＩ字型フェライトコア２５の端部が位置するように配置し、Ｉ字型フェライトコア２５をコイル導体２４が形成された箇所のフープ状基板１を折り曲げてＩ字型フェライトコア２５を覆い隣接したコイル導体２４の端部同士を接続した点である。その後の工程は図１５の工程の説明と同じである。 FIGS. 16 and 17 are manufacturing methods of the micro power conversion device of FIG. 12 different from FIGS. 13 to 15 and are main part manufacturing process diagrams shown in the order of processes. 16 and 17 are perspective views of main parts.
13 to 15 show a case where the semiconductor chip 10 is relatively large, and the semiconductor chip 10 and the thin film magnetic induction element 200 are arranged in a line in the direction of travel of the hoop-like substrate 1. On the other hand, FIGS. 16 and 17 show the case where the semiconductor chip 10 is relatively small, and the case where the semiconductor chip 10 and the thin film magnetic induction element 200 are arranged in a row in a direction perpendicular to the traveling direction of the hoop-like substrate 1. .
The difference from FIGS. 13 to 15 is that an opening 26 is formed in the hoop-shaped substrate 1 as shown in FIGS. 16 and 17, and the end of the I-shaped ferrite core 25 is positioned in this opening. In addition, the I-shaped ferrite core 25 is bent at the location where the coil conductor 24 is formed and the hoop-like substrate 1 is bent to cover the I-shaped ferrite core 25 and the ends of the adjacent coil conductors 24 are connected to each other. Subsequent processes are the same as those described in FIG.

尚、図示しないが、フープ状基板１を折り曲げる方法としては幅がＩ字型フェライトコア２５の幅およびフープ状基板１とコイル導体２４二つ分の厚さを合わせた寸法より多少大き目で、Ｉ字型フェライトコア２５の厚さとフープ状基板１とコイル導体２４のあつさ合わせた寸法より多少大き目の深さの凹型治具を製作し、この凹型治具の凹部にＩ字型フェライトコア２５が載っているフープ状基板１を載せ、上からＩ字型フェライトコア２５を加圧して凹部に嵌め込み、半導体チップ１０が固着している左側のフープ状基板１およびコイル導体が形成されている右側のフープ状基板を凹型治具の底面に垂直な面の表面に沿うように直角に曲げ、コイル導体２４が形成された垂直に立っている右側のフープ状基板１をＩ字型フェライトコア２５を覆うように曲げ、コイル導体２４の端部同士を接続することで薄膜磁気誘導素子２００を形成することができる。   Although not shown, the method of bending the hoop-shaped substrate 1 is slightly larger than the combined width of the I-shaped ferrite core 25 and the thickness of the hoop-shaped substrate 1 and two coil conductors. A concave jig having a depth slightly larger than the thickness of the letter-shaped ferrite core 25 and the combined dimensions of the hoop-shaped substrate 1 and the coil conductor 24 is manufactured, and the I-shaped ferrite core 25 is formed in the concave part of the concave jig. The hoop-like substrate 1 that is placed is placed, the I-shaped ferrite core 25 is pressed from above and is fitted into the recess, and the left-side hoop-like substrate 1 to which the semiconductor chip 10 is fixed and the right-hand side on which the coil conductor is formed. The hoop-like substrate 1 is bent at right angles along the surface of the surface perpendicular to the bottom surface of the concave jig, and the right-side hoop-like substrate 1 on which the coil conductor 24 is formed is turned into the I-shaped ferrite core 2. Bending so as to cover, it is possible to form a thin film magnetic induction element 200 by connecting the ends of the coil conductor 24.

この場合もフープ状基板１を用いることで、前記した一連の製造工程を自動化ラインで行うことができるようになり、大幅なコスト低減を図ることができる。   Also in this case, by using the hoop-shaped substrate 1, the series of manufacturing steps described above can be performed with an automated line, and a significant cost reduction can be achieved.

図１８は、この発明の第４実施例の超小型電力変換装置の要部断面図である。この図は、半導体チップ１０の裏面側に薄膜磁気誘導素子３００を固着した断面図である。
図１２と異なるのは、Ｉ字型フェライトコア２５（内部磁心）の上下にフェライト板２７、２８（外部磁心）を配置した点である。この場合は第３実施例より磁気誘導素子特性を向上させることができる。尚、製造方法については、図１５の工程で、Ｉ字型フェライトコア２５の上下にフェライト板２７、２８を接着剤２９で固着する。または、図１４もしくは図１７の工程で、上下のフェライト板２７、２８をフープ状基板１に固着してもよい。 FIG. 18 is a cross-sectional view of an essential part of a micro power converter according to a fourth embodiment of the present invention. This figure is a cross-sectional view in which a thin film magnetic induction element 300 is fixed to the back side of the semiconductor chip 10.
The difference from FIG. 12 is that ferrite plates 27 and 28 (external magnetic cores) are arranged above and below the I-shaped ferrite core 25 (internal magnetic core). In this case, the magnetic induction element characteristics can be improved as compared with the third embodiment. As for the manufacturing method, ferrite plates 27 and 28 are fixed to the top and bottom of the I-shaped ferrite core 25 with an adhesive 29 in the step of FIG. Alternatively, the upper and lower ferrite plates 27 and 28 may be fixed to the hoop-like substrate 1 in the step of FIG.

この発明の第１実施例の超小型電力変換装置の構成図であり、（ａ）は要部平面図、（ｂ）は（ａ）のＸ−Ｘ線で切断した要部断面図BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram of the micro power converter of 1st Example of this invention, (a) is a principal part top view, (b) is principal part sectional drawing cut | disconnected by the XX line of (a). 図１の超小型電力変換装置の要部製造工程図Manufacturing process diagram of the main part of the micro power converter of FIG. 図２に続く、図１の超小型電力変換装置の要部製造工程図2 is a manufacturing process diagram of the main part of the ultra-small power converter of FIG. 図３に続く、図１の超小型電力変換装置の要部製造工程図3 is a manufacturing process diagram of the main part of the micro power converter of FIG. 1 following FIG. 図４に続く、図１の超小型電力変換装置の要部製造工程図4 is a manufacturing process diagram of the main part of the micro power converter of FIG. 1 following FIG. 図５に続く、図１の超小型電力変換装置の要部製造工程図FIG. 5 is a manufacturing process diagram of a main part of the ultra-small power converter of FIG. 図７は、図１の超小型電力変換装置の製造工程の全体の流れを示す図FIG. 7 is a diagram showing an overall flow of a manufacturing process of the micro power converter of FIG. この発明の第２実施例の超小型電力変換装置の要部断面図Sectional drawing of the principal part of the micro power converter of 2nd Example of this invention 図８の超小型電力変換装置の要部製造工程図Manufacturing process diagram of the main part of the micro power converter of FIG. 図９に続く、図８の超小型電力変換装置の要部製造工程図FIG. 9 is a manufacturing process diagram of a main part of the micro power converter of FIG. 図１０に続く、図８の超小型電力変換装置の要部製造工程図FIG. 10 is a manufacturing process diagram of the main part of the ultra-small power converter of FIG. この発明の第３実施例の超小型電力変換装置の要部断面図Sectional drawing of the principal part of the micro power converter of 3rd Example of this invention 図１２の超小型電力変換装置の要部製造工程図Manufacturing process diagram of the main part of the micro power converter of FIG. 図１３に続く、図１２の超小型電力変換装置の要部製造工程図FIG. 13 is a manufacturing process diagram of a main part of the micro power converter of FIG. 図１４に続く、図１２の超小型電力変換装置の要部製造工程図Continuing to FIG. 14, a manufacturing process diagram of a main part of the micro power converter of FIG. 12. 図１２の超小型電力変換装置の別の要部製造工程図Another main part manufacturing process diagram of the micro power converter of FIG. 図１６に続く、図１２の超小型電力変換装置の別の要部製造工程図FIG. 16 is another principal manufacturing process diagram of the micro power converter of FIG. この発明の第４実施例の超小型電力変換装置の要部断面図Sectional drawing of the principal part of the micro power converter of 4th Example of this invention

符号の説明Explanation of symbols

１ フープ状基板
２ 第１コイル導体
３ 第２コイル導体
４ 第１配線
５ 第２配線
６ 第１端子電極
７ 第２端子電極
８、９、２６ 開口部
１０ 半導体チップ
１１ バンプ
１２ 磁性材
１３ 内部磁心
１４、２３ 接着剤
１５ アンダーフィル
１６ はんだ
２１、２２ フェライト板
２４ コイル導体
２５ Ｉ字型フェライトコア
１００、２００、３００ 薄膜磁気誘導素子 DESCRIPTION OF SYMBOLS 1 Hoop-like board | substrate 2 1st coil conductor 3 2nd coil conductor 4 1st wiring 5 2nd wiring 6 1st terminal electrode 7 2nd terminal electrode 8, 9, 26 Opening 10 Semiconductor chip 11 Bump 12 Magnetic material 13 Internal magnetic core 14, 23 Adhesive 15 Underfill 16 Solder 21, 22 Ferrite plate 24 Coil conductor 25 I-shaped ferrite core 100, 200, 300 Thin film magnetic induction element

Claims (10)

第１主面に渦巻き状の第１コイル導体と複数の第１端子電極および第２主面に前記第１コイル導体と接続する渦巻き状の第２コイル導体と複数の第２端子電極が形成され、前記第１端子電極と前記第１コイル導体とを接続する第１配線と別の前記第１端子電極と前記第２コイル導体を接続する第２配線が第１主面に形成された絶縁性もしくは半絶縁性のフープ状基板と、前記渦巻きの中心部のフープ状基板を開口し該開口部を埋めるとともに、前記第１、第２コイル導体上を被覆する磁性材と、前記第１端子電極とバンプを介して表面側が接続し、裏面側が前記磁性材と固着する半導体チップとを有する超小型電力変換装置であって、
前記半導体チップの裏面側に前記第１、第２配線が形成された箇所の前記フープ状基板を折り曲げて前記磁性材を固着することを特徴とする超小型電力変換装置。 A spiral first coil conductor and a plurality of first terminal electrodes are formed on the first main surface, and a spiral second coil conductor and a plurality of second terminal electrodes connected to the first coil conductor are formed on the second main surface. Insulation in which a first wiring for connecting the first terminal electrode and the first coil conductor and a second wiring for connecting the first terminal electrode and the second coil conductor are formed on the first main surface. Alternatively, a semi-insulating hoop-like substrate, a magnetic material covering the first and second coil conductors while opening the hoop-like substrate at the center of the spiral and filling the opening, and the first terminal electrode And a semiconductor chip having a front surface side connected via a bump and a back surface side fixed to the magnetic material,
An ultra-small power converter characterized in that the magnetic material is fixed by bending the hoop-like substrate where the first and second wirings are formed on the back side of the semiconductor chip. 前記磁性材が磁性体粒子分散樹脂もしくは低温成形フェライト粉を圧縮成形および焼結したフェライトコアであることを特徴とする請求項１に記載の超小型電力変換装置。 The ultra-small power converter according to claim 1, wherein the magnetic material is a ferrite core obtained by compression-molding and sintering a magnetic particle-dispersed resin or low-temperature shaped ferrite powder. 前記第１コイル導体と前記第２コイル導体を挟み込む前記磁性材が、中心部が凸状となっている第１フェライト基板と、平坦な第２フェライト基板で構成されることを特徴とする請求項１に記載の超小型電力変換装置。 The magnetic material sandwiching the first coil conductor and the second coil conductor is composed of a first ferrite substrate having a convex center portion and a flat second ferrite substrate. The ultra-compact power conversion device according to 1. 第１主面に磁性材に巻かれてソレノイド状コイルを構成するコイル導体と複数の第１端子電極および第２主面に複数の第２端子電極とが形成され、コイル導体の両端が別々の第１端子電極と接続する配線が前記第１主面に形成された絶縁性もしくは半絶縁性のフープ状基板と、該フープ状基板の前記第１端子電極とバンプを介して表面側が接続する半導体チップとを有する超小型電力変換装置であって、前記半導体チップの裏面側に前記ソレノイド状コイルをフープ状基板を折り曲げることで固着することを特徴とする超小型電力変換装置。 A coil conductor that is wound around a magnetic material on the first main surface and forms a solenoid coil, a plurality of first terminal electrodes, and a plurality of second terminal electrodes on the second main surface are formed. An insulating or semi-insulating hoop-like substrate in which wiring to be connected to the first terminal electrode is formed on the first main surface, and a semiconductor whose surface side is connected to the first terminal electrode of the hoop-like substrate via bumps A microminiature power converter having a chip, wherein the solenoid coil is fixed to the back side of the semiconductor chip by folding a hoop-shaped substrate. 前記磁性材がＩ字型フェライトコアであることを特徴とする請求項４に記載の超小型電力変換装置。 The micro power converter according to claim 4, wherein the magnetic material is an I-shaped ferrite core. 前記Ｉ字型フェライトコアの上下にフェライト基板を配置することを特徴とする請求項５に記載の超小型電力変換装置。 6. The micro power converter according to claim 5, wherein ferrite substrates are disposed above and below the I-shaped ferrite core. 前記フープ状基板が、ロール状に巻かれたテープ状の導電パターンが形成された絶縁性もしくは半絶縁性のフレキシブル基板をカットしたものであることを特徴とする請求項１〜６のいずれか一項に記載の超小型電力変換装置。 The said hoop-shaped board | substrate is what cut | disconnected the insulating or semi-insulating flexible board | substrate in which the tape-like conductive pattern wound by roll shape was formed, The any one of Claims 1-6 characterized by the above-mentioned. The ultra-compact power converter described in the item. 第１主面に渦巻き状の第１コイル導体と複数の第１端子電極および第２主面に前記第１コイル導体と接続する渦巻き状の第２コイル導体と複数の第２端子電極が形成され、前記第１端子電極と前記第１コイル導体とを接続する第１配線と別の前記第１端子電極と前記第２コイル導体を接続する第２配線が第１主面に形成された絶縁性もしくは半絶縁性のフープ状基板の前記渦巻きの中心部と前記第１、第２コイル導体が形成された箇所の第１外周部の前記フープ状基板を開口する工程と、前記中心部と第１外周部に形成された前記開口部を磁性材で埋めるとともに、前記第１、第２コイル導体上を該磁性材で被覆する工程と、前記第１端子電極と半導体チップの表面側とをバンプを介して接続する工程と、前記第１、第２コイル導体、前記第１、第２配線が形成された箇所および前記半導体チップが固着した箇所を残して他の箇所の前記フープ状基板を除去する工程と、前記半導体チップの裏面側に前記フープ状基板を折り曲げて前記磁性材を固着する工程とを含むことを特徴とする超小型電力変換装置の製造方法。 A spiral first coil conductor and a plurality of first terminal electrodes are formed on the first main surface, and a spiral second coil conductor and a plurality of second terminal electrodes connected to the first coil conductor are formed on the second main surface. Insulation in which a first wiring for connecting the first terminal electrode and the first coil conductor and a second wiring for connecting the first terminal electrode and the second coil conductor are formed on the first main surface. Alternatively, the step of opening the hoop-like substrate in the central portion of the spiral of the semi-insulating hoop-like substrate and the first outer peripheral portion of the portion where the first and second coil conductors are formed, and the central portion and the first A step of filling the opening formed in the outer peripheral portion with a magnetic material, covering the first and second coil conductors with the magnetic material, and bumping the first terminal electrode and the surface side of the semiconductor chip Connecting via the first and second coil conductors, the first A step of removing the hoop-like substrate in other places while leaving a place where the second wiring is formed and a place where the semiconductor chip is fixed; and bending the hoop-like substrate to the back side of the semiconductor chip to And a step of fixing the material. A method for manufacturing a micro power converter. 第１主面に併設される複数のコイル導体と複数の第１端子電極および第２主面に複数の第２端子電極とが形成され、前記複数のコイル導体の最外部に配置されたコイル導体と第１、第２端子電極と接続する第１、第２配線とが形成された絶縁性もしくは半絶縁性のフープ状基板の前記の全コイル導体を横切るように磁性材を配置する工程と、前記フープ状基板の第１端子電極にバンプを介して半導体チップの表面側を固着する工程と、前記磁性材の外周を包むように前記フープ状基板を折り曲げ、各コイル導体の端部を互い違いに接続してソレノイド状のコイルを形成する工程と、前記半導体チップの裏面側に前記第１、第２配線が形成された箇所の前記フープ状基板を折り曲げて前記ソレノイド状のコイルを前記フープ状基板を介して固着する工程とを含むことを特徴とする超小型電力変換装置の製造方法。 A coil conductor in which a plurality of coil conductors provided on the first main surface, a plurality of first terminal electrodes, and a plurality of second terminal electrodes are formed on the second main surface, are arranged at the outermost part of the plurality of coil conductors. And disposing a magnetic material so as to cross all the coil conductors of the insulating or semi-insulating hoop-like substrate in which the first and second wirings connected to the first and second terminal electrodes are formed; The process of fixing the surface side of the semiconductor chip to the first terminal electrode of the hoop-shaped substrate via bumps, the hoop-shaped substrate is bent so as to wrap the outer periphery of the magnetic material, and the ends of the coil conductors are alternately connected. Forming a solenoidal coil, and bending the hoop-like substrate where the first and second wirings are formed on the back side of the semiconductor chip so that the solenoid-like coil becomes the hoop-like substrate. Sticking through Method of manufacturing a micro power converter which comprises a that step. 前記の各工程を自動化ラインで行うことを特徴とする請求項８または９に記載の超小型電力変換装置の製造方法。 10. The method for manufacturing a micro power converter according to claim 8, wherein each of the steps is performed by an automated line.
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JP2009142018A (en) * 2007-12-05 2009-06-25 Fuji Electric Device Technology Co Ltd Micro-power conversion device
KR101958648B1 (en) * 2018-03-15 2019-07-02 주식회사 에이텀 Manufactruing method of plate secondary coil assembly for transformer
WO2019177305A1 (en) * 2018-03-15 2019-09-19 주식회사 에이텀 Secondary coil element for transformer and method for manufacturing same
KR102024849B1 (en) * 2018-11-16 2019-09-24 주식회사 에이텀 Planary secondary coil assembly for transformer
KR102024844B1 (en) * 2018-08-22 2019-09-24 주식회사 에이텀 Secondary coil assembly for transformer
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KR102024849B1 (en) * 2018-11-16 2019-09-24 주식회사 에이텀 Planary secondary coil assembly for transformer

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