JP2007073918A - Method of filling piercing hole or non-piercing hole formed in multilayer circuit board or wafer with filler - Google Patents

Method of filling piercing hole or non-piercing hole formed in multilayer circuit board or wafer with filler Download PDF

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JP2007073918A
JP2007073918A JP2005291647A JP2005291647A JP2007073918A JP 2007073918 A JP2007073918 A JP 2007073918A JP 2005291647 A JP2005291647 A JP 2005291647A JP 2005291647 A JP2005291647 A JP 2005291647A JP 2007073918 A JP2007073918 A JP 2007073918A
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filling
circuit board
wafer
multilayer circuit
filler
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JP4936352B2 (en
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Shigenobu Sekine
重信 関根
Takanori Nagumo
隆徳 南雲
Yurina Sekine
由莉奈 関根
Keiji Okada
圭二 岡田
Ryuji Kimura
竜司 木村
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Napra Co Ltd
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Napra Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of perfectly filling fine holes in a multilayer circuit board or a wafer with a liquid viscous material or the melt of a low-melting-point alloy, wherein each of the holes even has a hole diameter of 25 micrometers or smaller and an aspect ratio of 5 or higher. <P>SOLUTION: The method of filling piercing holes or non-piercing holes formed in a multilayer circuit board or a wafer with a filler is constituted such that the filler is mimeographically printed on the multilayer circuit board or a wafer under vacuum atmosphere, and thereafter the atmosphere is changed to have the atmospheric pressure or a pressure that exceeds the atmospheric pressure, and the holes are filled with the filler utilizing the differential pressure, while an ultrasonic vibration is applied to the multilayer circuit board or to the wafer throughout the mimeogaphic printing process and the differential pressure filling process. The candidates for the filler include a liquid viscous material, a low-melting-point alloy powder, and a low-melting-point alloy melt. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、多層回路基板又はウエハーに設けられた貫通孔又は非貫通孔に充填材を充填する方法に関するものである。充填材としては、液状粘性材料、低融点合金粉末又は低融点合金溶融物などが挙げられる。  The present invention relates to a method for filling a through hole or a non-through hole provided in a multilayer circuit board or wafer with a filler. Examples of the filler include a liquid viscous material, a low melting point alloy powder, or a low melting point alloy melt.

多層回路基板又はウエハーに設けられた貫通孔又は非貫通孔に導電性ペーストや絶縁性樹脂ペースト等の液状粘性材料を充填させることは公知である。例えば特開平１１−２９８１３８号公報には 多層回路基板の貫通孔又は非貫通孔に液状粘性材料を充填せしめる方法において、前記液状粘性材料を真空雰囲気下で前記回路基板上に孔版印刷した後、前記真空雰囲気の真空度を低下せしめるか若しくは前記真空雰囲気を通常の大気圧雰囲気にせしめて差圧充填を行うことを特徴とする液状粘性材料の充填方法（請求項１）が開示されている。
特許第３１９８２７３号公報 It is known to fill a through-hole or a non-through-hole provided in a multilayer circuit board or wafer with a liquid viscous material such as a conductive paste or an insulating resin paste. For example, in JP-A-11-298138, in a method of filling a liquid viscous material into through holes or non-through holes of a multilayer circuit board, the liquid viscous material is stencil printed on the circuit board in a vacuum atmosphere, There is disclosed a liquid viscous material filling method (Claim 1) characterized by lowering the degree of vacuum of a vacuum atmosphere or filling the vacuum atmosphere with a normal atmospheric pressure atmosphere to perform differential pressure filling.
Japanese Patent No. 3198273

孔径が小さくアスペクト比が大きい貫通孔又は非貫通孔の底部まで液状粘性材料又は低融点合金の溶融物が充填された多層回路基板又はウエハーが得られる。  A multilayer circuit board or wafer in which a liquid viscous material or a melt of a low melting point alloy is filled to the bottom of a through hole or a non-through hole having a small hole diameter and a large aspect ratio is obtained.

特開平１１−２９８１３８号公報記載の発明が行われた時点（１９９８年）においては、多層回路基板の貫通孔又は非貫通孔の孔径は５０μｍ程度、孔の深さ／孔の直径比（Ｌ／Ｄ比：アスペクト比）は２〜３程度であった。しかし最近では孔径２５ミクロン以下、アスペクト比５以上を要求されるようになり、公知の方法では未充填部分、特に非貫通孔の底部での未充填部分が残り易く問題になっている。本発明はかかる問題を解決することを目的とする。  At the time when the invention described in Japanese Patent Laid-Open No. 11-298138 was made (1998), the through hole or non-through hole of the multilayer circuit board had a hole diameter of about 50 μm, and the hole depth / hole diameter ratio (L / D ratio: aspect ratio) was about 2-3. However, recently, a pore diameter of 25 microns or less and an aspect ratio of 5 or more have been required, and in the known method, an unfilled portion, particularly an unfilled portion at the bottom of a non-through hole tends to remain. The present invention aims to solve this problem.

本発明は、多層回路基板又はウエハーに設けられた貫通孔又は非貫通孔に充填材を充填する方法であって、前記充填材を真空雰囲気下で前記多層回路基板又はウエハー上に孔版印刷した後、雰囲気を大気圧又は大気圧を超える圧力にして差圧充填すると共に、孔版印刷過程及び差圧充填過程を通じて前記多層回路基板又はウエハーに超音波振動を与えることを特徴とする。  The present invention is a method of filling a through hole or a non-through hole provided in a multilayer circuit board or wafer with a filler, and stencil-prints the filler on the multilayer circuit board or wafer in a vacuum atmosphere. The atmospheric pressure or the pressure exceeding atmospheric pressure is filled with a differential pressure, and ultrasonic vibration is applied to the multilayer circuit board or wafer through a stencil printing process and a differential pressure filling process.

充填材としては、液状粘性材料、低融点合金粉末、又は低融点合金溶融物などが挙げられる。  Examples of the filler include a liquid viscous material, a low melting point alloy powder, or a low melting point alloy melt.

真空雰囲気の圧力は１０パスカル（Ｐａ）以下、なるべくは１パスカルであることが望ましい。また多層回路基板又はウエハーに設けられた貫通孔又は非貫通孔に充填材を孔版印刷する厚さは前記貫通孔又は非貫通孔の深さに相当する厚さであることが望ましい。孔径が非常に小さい場合、或いはアスペクト比が非常に大きい場合など、１回の操作で孔が液状粘性材料又は低融点合金の溶融物で完全に満たされない場合は、多層回路基板又はウエハーに超音波振動を与えつつ、真空雰囲気下での孔版印刷と大気圧又は大気圧を超える圧力下での差圧充填を繰り返しても良い。  The pressure in the vacuum atmosphere is preferably 10 Pascals (Pa) or less, preferably 1 Pascal. The thickness of the stencil printing of the filler in the through holes or non-through holes provided in the multilayer circuit board or wafer is preferably a thickness corresponding to the depth of the through holes or non-through holes. If the hole is not completely filled with a liquid viscous material or a melt of a low melting point alloy in a single operation, such as when the hole diameter is very small or the aspect ratio is very large, ultrasonic waves are applied to the multilayer circuit board or wafer. While applying vibration, stencil printing in a vacuum atmosphere and differential pressure filling under atmospheric pressure or pressure exceeding atmospheric pressure may be repeated.

孔径約２３μｍ、孔の深さ約１６７μｍ、アスペクト比約７の非貫通孔を設けた基板に超音波振動（５５〜６６ＫＨｚ）を与えつつ０．２Ｐａの真空雰囲気下で導電性ペーストを孔版印刷した。次いでこれを大気圧の雰囲気下に置き、引き続き５分間超音波振動（５５〜６６ＫＨｚ）を与えて導電性ペーストを差圧充填し、最終的に加熱して導電性ペーストを固定した（実施例１）。切断面の顕微鏡写真を図１に示す。非貫通孔の底部まで完全に充填されている。実施例１と同じ操作を基板に超音波振動を与えずに行った結果（比較例１）の切断面の顕微鏡写真を図２に示す。非貫通孔の底部まで完全に充填されず、約１７μｍの空隙（全深さ１６７μｍの約９分の１）が残った。なお添付図面の右下に記載されたスケールは５０ミクロンである。  A conductive paste was stencil printed in a 0.2 Pa vacuum atmosphere while applying ultrasonic vibration (55 to 66 KHz) to a substrate provided with a non-through hole having a hole diameter of about 23 μm, a hole depth of about 167 μm, and an aspect ratio of about 7. . Next, this was placed in an atmosphere of atmospheric pressure, and subsequently subjected to ultrasonic vibration (55 to 66 KHz) for 5 minutes to fill the conductive paste with a differential pressure, and finally heated to fix the conductive paste (Example 1). ). A photomicrograph of the cut surface is shown in FIG. The bottom of the non-through hole is completely filled. FIG. 2 shows a micrograph of the cut surface of the result (Comparative Example 1) obtained by performing the same operation as in Example 1 without applying ultrasonic vibration to the substrate. The bottom of the non-through hole was not completely filled, and a gap of about 17 μm (about 1/9 of the total depth of 167 μm) remained. In addition, the scale described in the lower right of the attached drawings is 50 microns.

実施例１に記載した基板に超音波振動を与えながら真空雰囲気下での孔版印刷と大気圧雰囲気下での差圧充填と言う操作を２回繰り返してから、基板を加熱して導電性ペーストを固定した（実施例２）。切断面の拡大写真を図３に示す。非貫通孔の底部まで完全に充填されている。実施例２と同じ操作を基板に超音波振動を与えずに行った結果（比較例２）の切断面の拡大写真を図４に示す。非貫通孔の底部まで完全に充填されず、約５μｍの空隙（全深さ約１６７μｍの約３３分の１）が残った。  The operation of stencil printing in a vacuum atmosphere and differential pressure filling in an atmospheric pressure atmosphere was repeated twice while applying ultrasonic vibration to the substrate described in Example 1, and then the conductive paste was heated by heating the substrate. Fixed (Example 2). An enlarged photograph of the cut surface is shown in FIG. The bottom of the non-through hole is completely filled. FIG. 4 shows an enlarged photograph of the cut surface as a result of performing the same operation as Example 2 without applying ultrasonic vibration to the substrate (Comparative Example 2). The bottom of the non-through hole was not completely filled, and a gap of about 5 μm (about 1/33 of the total depth of about 167 μm) remained.

錫金属主体の低融点ハンダ合金粉末（融点２３０℃、平均粒径５μｍ）を充填材として用いた以外は実施例１と同様な方法で基板の非貫通孔に粉末を充填し、充填後２５０℃に加熱してハンダ合金を溶融し最後に冷却して固定した。切断面を顕微鏡観察したところ非貫通孔の底部まで完全に充填されていた。実施例２と同じ操作を基板に超音波振動を与えずに行った場合は非貫通孔の底部まで完全に充填されてはいなかった。  The non-through holes of the substrate were filled with powder in the same manner as in Example 1 except that low melting point solder alloy powder mainly composed of tin metal (melting point: 230 ° C., average particle size: 5 μm) was used as the filler. And the solder alloy was melted and finally cooled and fixed. When the cut surface was observed with a microscope, the bottom of the non-through hole was completely filled. When the same operation as in Example 2 was performed without applying ultrasonic vibration to the substrate, the bottom of the non-through hole was not completely filled.

本発明の実施例１により得られた充填物の断面の顕微鏡写真  Micrograph of the cross section of the packing obtained in Example 1 of the present invention 本発明の比較例１により得られた充填物の断面の顕微鏡写真  Micrograph of the cross-section of the packing obtained in Comparative Example 1 of the present invention 本発明の実施例１により得られた充填物の断面の顕微鏡写真  Micrograph of the cross section of the packing obtained in Example 1 of the present invention 本発明の比較例２により得られた充填物の断面の顕微鏡写真  Micrograph of the cross-section of the packing obtained in Comparative Example 2 of the present invention

Claims (6)

多層回路基板又はウエハーに設けられた貫通孔又は非貫通孔に充填材を充填する方法であって、前記充填材を真空雰囲気下で前記多層回路基板又はウエハー上に孔版印刷した後、雰囲気を大気圧又は大気圧を超える圧力にして差圧充填すると共に、孔版印刷過程及び差圧充填過程を通じて前記多層回路基板又はウエハーに超音波振動を与えることを特徴とする充填材の充填方法。  A method of filling a through-hole or non-through-hole provided in a multilayer circuit board or wafer with a filler, stencil-printing the filler on the multilayer circuit board or wafer in a vacuum atmosphere, and then increasing the atmosphere. A filling material filling method, wherein filling is performed at a pressure exceeding atmospheric pressure or atmospheric pressure, and ultrasonic vibration is applied to the multilayer circuit board or wafer through a stencil printing process and a differential pressure filling process. 充填材が、液状粘性材料、低融点合金粉末及び低融点合金溶融物の中から選ばれたものである請求項１に記載の充填方法。  The filling method according to claim 1, wherein the filler is selected from a liquid viscous material, a low melting point alloy powder, and a low melting point alloy melt. 真空雰囲気の圧力が１０パスカル（Ｐａ）以下である請求項１に記載の充填方法。  The filling method according to claim 1, wherein the pressure of the vacuum atmosphere is 10 Pascals (Pa) or less. 多層回路基板又はウエハーに設けられた貫通孔又は非貫通孔に液状粘性材料又は低融点合金の溶融物を孔版印刷する厚さが前記貫通孔又は非貫通孔の深さに相当する厚さである請求項１に記載の充填方法。  The thickness of stencil printing of a liquid viscous material or a low melting point alloy melt in a through hole or a non-through hole provided in a multilayer circuit board or wafer is a thickness corresponding to the depth of the through hole or the non-through hole. The filling method according to claim 1. 真空雰囲気下での孔版印刷と大気圧又は大気圧を超える圧力下での差圧充填及び超音波振動付与を繰り返すことよりなる請求項１に記載の充填方法。  The filling method according to claim 1, comprising stencil printing under a vacuum atmosphere, differential pressure filling under atmospheric pressure or a pressure exceeding atmospheric pressure, and applying ultrasonic vibration. 液状粘性材料がが導電性ペーストである請求項２に記載の充填方法。  The filling method according to claim 2, wherein the liquid viscous material is a conductive paste.
JP2005291647A 2005-09-02 2005-09-02 Method for filling a through hole or a non-through hole provided in a multilayer circuit board or wafer with a filler Expired - Fee Related JP4936352B2 (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032991A (en) * 2007-07-27 2009-02-12 Kuroda Techno Co Ltd Liquid viscous material filling method
JP2009044065A (en) * 2007-08-10 2009-02-26 Napura:Kk Conductive composition for board wiring, circuit board, and electronic device
EP2082825A1 (en) * 2008-01-18 2009-07-29 Napra co.,Ltd Wiring board having a hole with a metal wiring formed therein, and method for producing the same
JP2009290098A (en) * 2008-05-30 2009-12-10 Fujitsu Ltd Semiconductor device and method of manufacturing the same
JP2010147308A (en) * 2008-12-19 2010-07-01 Canon Inc Method of manufacturing wiring board, and method of manufacturing board for ink-jet recording head
US7910837B2 (en) 2007-08-10 2011-03-22 Napra Co., Ltd. Circuit board, electronic device and method for manufacturing the same
JP2012009640A (en) * 2010-06-25 2012-01-12 Napura:Kk Method for filling insulator into fine space
JP2012044092A (en) * 2010-08-23 2012-03-01 Napura:Kk Semiconductor device
JP5450780B1 (en) * 2012-12-21 2014-03-26 有限会社 ナプラ Method for forming a conductor in a minute space
CN112331613A (en) * 2020-11-25 2021-02-05 哈尔滨工业大学 Method for rapidly filling liquid metal to TSV (through silicon Via) based on ultrasonic-pressure composite process

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JP2005116863A (en) * 2003-10-09 2005-04-28 Sumitomo Heavy Ind Ltd Metal filling device and metal filling method

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JPH02277284A (en) * 1989-02-03 1990-11-13 Amdahl Corp Method and apparatus for filling high density via holes
JPH09283910A (en) * 1996-04-10 1997-10-31 Hitachi Ltd Solder paste hole-filling printer and printing method
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032991A (en) * 2007-07-27 2009-02-12 Kuroda Techno Co Ltd Liquid viscous material filling method
JP2009044065A (en) * 2007-08-10 2009-02-26 Napura:Kk Conductive composition for board wiring, circuit board, and electronic device
US7910837B2 (en) 2007-08-10 2011-03-22 Napra Co., Ltd. Circuit board, electronic device and method for manufacturing the same
US8217280B2 (en) 2007-08-10 2012-07-10 Napra Co., Ltd. Circuit board, electronic device and method for manufacturing the same
US8609999B2 (en) 2007-08-10 2013-12-17 Napra Co., Ltd. Circuit board, electronic device and method for manufacturing the same
EP2082825A1 (en) * 2008-01-18 2009-07-29 Napra co.,Ltd Wiring board having a hole with a metal wiring formed therein, and method for producing the same
JP2009290098A (en) * 2008-05-30 2009-12-10 Fujitsu Ltd Semiconductor device and method of manufacturing the same
JP2010147308A (en) * 2008-12-19 2010-07-01 Canon Inc Method of manufacturing wiring board, and method of manufacturing board for ink-jet recording head
JP2012009640A (en) * 2010-06-25 2012-01-12 Napura:Kk Method for filling insulator into fine space
JP2012044092A (en) * 2010-08-23 2012-03-01 Napura:Kk Semiconductor device
JP5450780B1 (en) * 2012-12-21 2014-03-26 有限会社 ナプラ Method for forming a conductor in a minute space
CN112331613A (en) * 2020-11-25 2021-02-05 哈尔滨工业大学 Method for rapidly filling liquid metal to TSV (through silicon Via) based on ultrasonic-pressure composite process

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