JP2009032991A - Liquid viscous material filling method - Google Patents

Liquid viscous material filling method Download PDF

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JP2009032991A
JP2009032991A JP2007196739A JP2007196739A JP2009032991A JP 2009032991 A JP2009032991 A JP 2009032991A JP 2007196739 A JP2007196739 A JP 2007196739A JP 2007196739 A JP2007196739 A JP 2007196739A JP 2009032991 A JP2009032991 A JP 2009032991A
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viscous material
liquid viscous
hole
circuit board
multilayer circuit
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JP4981572B2 (en
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Makoto Gonda
誠 権田
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Kuroda Techno Co Ltd
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Kuroda Techno Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid viscous material filling method that enables efficient execution of filling of a liquid viscous material into through-holes drilled in a multilayered circuit board, while simplifyication of the working process. <P>SOLUTION: In the liquid viscous material filling method, configured to fill a liquid viscous material 4 into each through-hole 3 of a multilayered circuit board 2, drilled with each through-hole 3 penetrating between the surface and the rear face, by utilizing ultrasonic oscillation, an opening part 3a of each through-hole 3 is immersed in the liquid viscous material 4; and ultrasonic oscillations are given in an axial-center direction of each through-hole 3 so as to supply the liquid viscous material 4 toward the other opening part 3b of each through-hole 3. Consequently, the liquid viscous material is filled in the through-holes. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

この発明は、多層回路基板に用いられる液状粘性材料の充填方法に関する。   The present invention relates to a method for filling a liquid viscous material used for a multilayer circuit board.

近年、処理する情報量の増大にともない、集積化された回路をよりコンパクトに形成できる多層回路基板に関する技術が注目を集めている。   In recent years, with the increase in the amount of information to be processed, a technique related to a multilayer circuit board capable of forming an integrated circuit more compactly has attracted attention.

一例としては、各層間を導体であるワイヤー５１で接続した図４（Ａ）に示す多層回路基板が公知となっている。ただし、この多層回路基板は、ワイヤー５１によって接続されるスペース５２を各層に確保するために積重ねる回路基板５３の大きさを順次小さくせざるを得ないため、多数の回路基板５３を積重ねることができない。   As an example, a multilayer circuit board shown in FIG. 4A in which each layer is connected by a wire 51 as a conductor is known. However, in this multilayer circuit board, the size of the circuit boards 53 to be stacked must be successively reduced in order to secure the spaces 52 connected by the wires 51 in each layer, so that a large number of circuit boards 53 are stacked. I can't.

これに対し、多層回路基板の表裏面間を貫通する貫通孔５４に導電性の液状粘性材料５６を充填して各層間を導通させる図４（Ｂ）に示す技術が公知となっている。この技術によれば、多くの回路基板５７を積重ねることが可能になる一方で、上記貫通孔５４が非常に小さいな孔であるため、このような孔に液状粘性材料５６をどのようにして充填させるかが問題となる。   On the other hand, a technique shown in FIG. 4B is known in which a through-hole 54 penetrating between the front and back surfaces of a multilayer circuit board is filled with a conductive liquid viscous material 56 to conduct each layer. According to this technique, a large number of circuit boards 57 can be stacked. On the other hand, since the through hole 54 is a very small hole, how can the liquid viscous material 56 be placed in such a hole? The problem is whether to fill.

上記問題を解決する手段として、表裏面間に貫通する貫通孔を穿設した多層回路基板の上記貫通孔に超音波振動を利用して液状粘性材料を充填する特許文献１に示す液状粘性材料の充填方法が公知となっている。
特開２００７−７３９１８号公報 As a means for solving the above problem, the liquid viscous material shown in Patent Document 1 is filled with liquid viscous material using ultrasonic vibration in the through hole of the multilayer circuit board having a through hole penetrating between the front and back surfaces. Filling methods are known.
JP 2007-73918 A

しかし、上記文献の液状粘性材料の充填方法は、昇圧処理して差圧充填する際に超音波振動を付加するもので、充填作業工程が複雑になるという課題がある他、多層回路基板に穿設された貫通孔への充填に適用すると、各層間に形成される微小な隙間によって昇圧処理する際に貫通孔内の圧力も上がってしまい、貫通孔内への差圧充填を効率良く行うことができないことがあるという課題もある。
本発明は、上記課題を解決し、作業工程が簡略化されるとともに、多層回路基板に穿設された貫通孔への充填を効率良く行うことができる液状粘性材料の充填方法を提供することを目的とする。 However, the liquid viscous material filling method of the above-mentioned document adds ultrasonic vibration when the pressure is increased and the differential pressure is filled, and there is a problem that the filling work process is complicated, and the multilayer circuit board is perforated. When applied to filling the through-holes provided, the pressure in the through-holes increases when the pressure is increased due to the minute gaps formed between the layers, and the differential pressure filling into the through-holes is efficiently performed. There is also a problem that sometimes cannot be done.
The present invention provides a method for filling a liquid viscous material that solves the above problems, simplifies the work process, and can efficiently fill the through holes formed in the multilayer circuit board. Objective.

上記課題を解決するため本発明の液状粘性材料の充填方法は、第１に表裏面間に貫通する貫通孔３を穿設した多層回路基板２の上記貫通孔３に超音波振動を利用して液状粘性材料４を充填する液状粘性材料の充填方法において、上記貫通孔３の一方の開口部３ａを液状粘性材料４に浸漬し該貫通孔３の軸心方向に超音波振動を与えることにより貫通孔３の他方の開口部３ｂに向かって液状粘性材料４を供給して充填することを特徴としている。   In order to solve the above problems, the liquid viscous material filling method of the present invention firstly utilizes ultrasonic vibration in the through hole 3 of the multilayer circuit board 2 having the through hole 3 penetrating between the front and back surfaces. In the liquid viscous material filling method for filling the liquid viscous material 4, the through-hole 3 is penetrated by immersing one opening 3 a of the through-hole 3 in the liquid viscous material 4 and applying ultrasonic vibration in the axial direction of the through-hole 3. The liquid viscous material 4 is supplied and filled toward the other opening 3b of the hole 3.

第２に、超音波振動する振動体７の振動面７ａに多層回路基板２の開口部３ａを対向させ、前記多層回路基板２を前記振動面７ａ側に押接するとともに、該開口部３ａと前記振動面７ａとの間に液状粘性材料４を介在させたことを特徴としている。   Second, the opening 3a of the multilayer circuit board 2 is opposed to the vibration surface 7a of the vibrating body 7 that vibrates ultrasonically, the multilayer circuit board 2 is pressed against the vibration surface 7a, and the opening 3a and the The liquid viscous material 4 is interposed between the vibrating surface 7a.

第３に、液状粘性材料４の液面より上下方向のホーン７の上端部を突出させて上記ホーン７に超音波振動を与え、ホーン７の上端部外周面に沿って液状粘性材料４を上昇移動させることにより、ホーン７上端面の振動面７ａを液状粘性材料４で覆うことを特徴としている。   Third, the upper end portion of the horn 7 in the vertical direction is projected from the liquid surface of the liquid viscous material 4 to apply ultrasonic vibration to the horn 7, and the liquid viscous material 4 is raised along the outer peripheral surface of the upper end portion of the horn 7. By moving, the vibration surface 7a at the upper end surface of the horn 7 is covered with the liquid viscous material 4.

第４に、貫通孔３が多層回路基板２の各層導通用の孔であり、液状粘性材料４が導電性の材料であることを特徴としている。   Fourth, the through hole 3 is a hole for conducting each layer of the multilayer circuit board 2 and the liquid viscous material 4 is a conductive material.

第５に、液状粘性材料４が溶融金属であることを特徴としている。   Fifth, the liquid viscous material 4 is a molten metal.

第６に、非酸化雰囲気下で行われることを特徴としている。   Sixth, the process is performed in a non-oxidizing atmosphere.

以上のように構成される液状粘性材料の充填方法によれば、貫通孔の一方の開口部を液状粘性材料に浸漬し該貫通孔の軸心方向に超音波振動を与えることにより貫通孔の他方の開口部に向かって液状粘性材料を供給して充填するため、昇圧処理を行う必要がなくなるので、作業工程が簡略化されるとともに多層回路基板の貫通孔への充填を効率良く行うことができるという効果がある。   According to the filling method of the liquid viscous material configured as described above, the other of the through holes is obtained by immersing one opening of the through hole in the liquid viscous material and applying ultrasonic vibration in the axial direction of the through hole. Since the liquid viscous material is supplied and filled toward the opening, there is no need to perform the pressure increasing process, so that the work process is simplified and the through hole of the multilayer circuit board can be efficiently filled. There is an effect.

また、液状粘性材料の液面より上下方向のホーンの上端部を突出させて上記ホーンに超音波振動を与え、ホーンの上端部外周面に沿って液状粘性材料を上昇移動させ、ホーン上端面の振動面を液状粘性材料で覆う方法を用いることにより、多層回路基板が必要以上に液状粘性材料に浸漬されないため、各層間に形成される隙間から多層回路基板の充填対象部分以外の部分に液状粘性材料が入り込んでしまう事態が防止できる。   Further, the upper end of the horn in the vertical direction is projected from the liquid surface of the liquid viscous material to give ultrasonic vibration to the horn, and the liquid viscous material is moved up and moved along the outer peripheral surface of the upper end of the horn. By using the method of covering the vibrating surface with the liquid viscous material, the multilayer circuit board is not immersed in the liquid viscous material more than necessary, so the liquid viscosity is applied from the gap formed between each layer to the part other than the filling target part of the multilayer circuit board. The situation where the material enters can be prevented.

以下図示する実施形態について説明する。
図１は本発明の方法に用いられる充填装置の要部正断面図である。充填装置１は、多層回路基板２の後述する貫通孔３（図２参照）に液状粘性材料である溶融半田４（溶融金属）を充填するものであり、超音波振動を発生させる振動子６と、振動子６の振動が伝搬されるホーン７（振動体）と、フレーム８と、上記溶融半田４及び多層回路基板２を収容する上方が開放されたケース９と、ヒータ１１と、キャップ１２とを備えている。 Hereinafter, illustrated embodiments will be described.
FIG. 1 is a front sectional view of an essential part of a filling apparatus used in the method of the present invention. The filling device 1 is for filling molten solder 4 (molten metal), which is a liquid viscous material, into a later-described through hole 3 (see FIG. 2) of the multilayer circuit board 2, and a vibrator 6 that generates ultrasonic vibrations. A horn 7 (vibrating body) through which the vibration of the vibrator 6 is propagated, a frame 8, a case 9 in which the upper side accommodating the molten solder 4 and the multilayer circuit board 2 is opened, a heater 11, a cap 12, It has.

上記フレーム８の上部には上方が開放された上下方向の筒状部８ａが設置されている。この筒状部８ａ内には上記ホーン７が上向きに収容されている。ホーン７は上下方向に延びる略円柱状に成形され、振動子６の振動が伝えられて上下方向中心が節、上下の端部が腹となる軸方向の超音波振動を発生させるものであり、上記筒状部８ａの同心軸上に配置されている。そして、ホーン７の上端には略水平な振動面７ａが形成されており、この振動面７ａに多層回路基板２を載置する。   On the upper part of the frame 8, a vertical cylindrical part 8 a having an open top is installed. The horn 7 is accommodated upward in the cylindrical portion 8a. The horn 7 is formed in a substantially cylindrical shape extending in the vertical direction, and the vibration of the vibrator 6 is transmitted to generate ultrasonic vibration in the axial direction in which the vertical center is a node and the upper and lower ends are antinodes. It arrange | positions on the concentric axis | shaft of the said cylindrical part 8a. A substantially horizontal vibration surface 7a is formed at the upper end of the horn 7, and the multilayer circuit board 2 is placed on the vibration surface 7a.

上記ホーン７の上部には上記ケース９が固定的に外装されている。ケース９は、ホーン７の上部外周面を囲繞する円筒状に形成されており、上端が開口し、下端内周面でホーン７の外周に嵌合して取り付けられている。上記ケース９へのホーン７の固定は、ホーン７の中途部外周面に突設されたフランジ部１３にケース９の下端面をボルト固定することにより行う。   The case 9 is externally fixed on the horn 7. The case 9 is formed in a cylindrical shape surrounding the upper outer peripheral surface of the horn 7, has an upper end opened, and is fitted and attached to the outer periphery of the horn 7 on the lower end inner peripheral surface. The horn 7 is fixed to the case 9 by bolting the lower end surface of the case 9 to a flange portion 13 projecting from the outer peripheral surface of the middle portion of the horn 7.

ちなみに、上記フランジ部１３はホーン７の上下方向中心に形成され、ホーン７が超音波振動している際にも殆ど振動しないため、上記ケース９も殆ど振動はしない。くわえて、上記ケース９の上端部外周面全体が上記筒状部８ａの上端部内周面全体に当接しており、ケース９によって筒状部８ａの上端開放側が塞がれている。そして、上記ケース９内を溶融半田４で満たして、溶融半田４の液面下に上記振動面７ａを位置させる。なお、ケース９内の溶融半田４の液面を下降させ、該液面からホーン７の上端部を突出させてもよい（図１の状態）。   Incidentally, the flange portion 13 is formed at the center in the vertical direction of the horn 7 and hardly vibrates even when the horn 7 is ultrasonically vibrated, so the case 9 hardly vibrates. In addition, the entire outer peripheral surface of the upper end portion of the case 9 is in contact with the entire inner peripheral surface of the upper end portion of the cylindrical portion 8a, and the upper end open side of the cylindrical portion 8a is blocked by the case 9. Then, the inside of the case 9 is filled with the molten solder 4, and the vibrating surface 7 a is positioned below the liquid surface of the molten solder 4. The liquid level of the molten solder 4 in the case 9 may be lowered and the upper end of the horn 7 may be protruded from the liquid level (state shown in FIG. 1).

上記ヒータ１１は、上記ケース９の外周面に設けられており、ケース９を加熱してケース９内の半田が溶融半田４である状態を維持させる。   The heater 11 is provided on the outer peripheral surface of the case 9 and heats the case 9 to maintain a state where the solder in the case 9 is the molten solder 4.

上記キャップ１２はその基端部が上記筒状部８ａに挿脱可能に嵌合され、振動面７ａに載置された多層回路基板２の周辺及び上方を覆う作業空間Ｓを形成する。また、キャップ１２の天井部分にはキャップ孔１２ａが穿設され、上記作業空間Ｓの外側から多層回路基板２にアクセスできるように構成されている。   The cap 12 has a base end portion that is removably fitted into the cylindrical portion 8a, and forms a work space S that covers the periphery and the top of the multilayer circuit board 2 placed on the vibration surface 7a. A cap hole 12a is formed in the ceiling portion of the cap 12 so that the multilayer circuit board 2 can be accessed from the outside of the work space S.

充填装置１による充填作業中は、上記空間Ｓに窒素ガス、アルゴンガス等の不活性ガス等が常時供給され、作業空間Ｓに非酸化雰囲気（不活性雰囲気、還元雰囲気）が形成される。そして、作業空間Ｓに供給された不活性ガスは、上記キャップ孔１２ａから排出され、作業空間Ｓの圧力が所定以上に上昇しないようになっている。なお、上記キャップ孔１２ａを塞いで作業空間Ｓを真空雰囲気にすることにより非酸化雰囲気を形成することもできる。   During the filling operation by the filling apparatus 1, an inert gas such as nitrogen gas or argon gas is constantly supplied to the space S, and a non-oxidizing atmosphere (inert atmosphere, reducing atmosphere) is formed in the working space S. The inert gas supplied to the work space S is discharged from the cap hole 12a so that the pressure in the work space S does not rise above a predetermined level. A non-oxidizing atmosphere can also be formed by closing the cap hole 12a and making the working space S a vacuum atmosphere.

図２は多層回路基板の要部正断面図である。多層回路基板２は複数の回路基板１４によって構成される。回路基板１４はウエハー１６と、ウエハー１６の片面に形成された電気回路である集積回路１７と、集積回路１７を覆って保護する絶縁層１８とを備える。さらに回路基板１４には表裏を貫く積層方向の導通孔１９が穿設されている。そして、各回路基板１４の集積回路形成側（表面側）を積層方向に向けた状態で、回路基板１４を積重ねていくことにより、多層化された多層回路基板２を構成する。   FIG. 2 is a front sectional view of an essential part of the multilayer circuit board. The multilayer circuit board 2 is composed of a plurality of circuit boards 14. The circuit board 14 includes a wafer 16, an integrated circuit 17 that is an electric circuit formed on one surface of the wafer 16, and an insulating layer 18 that covers and protects the integrated circuit 17. Further, the circuit board 14 is provided with a conduction hole 19 in the stacking direction penetrating the front and back. Then, by stacking the circuit boards 14 in a state where the integrated circuit formation side (front side) of each circuit board 14 is directed in the stacking direction, the multilayered circuit board 2 is formed.

上記導通孔１９は回路基板１４が多層化されると、導通孔１９同士が連通されて多層回路基板２全体を積層方向に貫く貫通孔３を形成するように構成されている。そして、上記貫通孔３内に溶融半田４を充填して凝固させて凝固半田４’とすることにより、各層の回路基板１４に形成された集積回路１７同士を電気的に接続させる。   When the circuit board 14 is multilayered, the conduction hole 19 is configured such that the conduction holes 19 communicate with each other to form the through hole 3 penetrating the entire multilayer circuit board 2 in the stacking direction. Then, the molten solder 4 is filled into the through hole 3 and solidified to obtain a solidified solder 4 ', thereby electrically connecting the integrated circuits 17 formed on the circuit boards 14 of the respective layers.

回路基板１４の導通孔１９は、他の回路基板１４の導通孔１９と連通する２つの連通部２１（連通口）の径がその他の部分（中途部）の径に対して大きくなるように形成されている。これによって、凝固半田４’が充填された際、各導通孔１９間の接合強度が向上し、各回路基板１４の集積回路１７同士を電気的に確実に接続せしめることが可能になる。   The conductive hole 19 of the circuit board 14 is formed so that the diameters of the two communication portions 21 (communication ports) communicating with the conductive holes 19 of the other circuit boards 14 are larger than the diameters of the other portions (midway portions). Has been. Thereby, when the solidified solder 4 ′ is filled, the bonding strength between the conduction holes 19 is improved, and the integrated circuits 17 of the circuit boards 14 can be electrically connected to each other reliably.

また、上記２つの連通部２１における回路基板の表面側の連通部２１ａ（表面連通部）と裏面側の連通部２１ｂ（裏面連通部）とは径が異なるように形成されている（図示する例では、裏面連通部２１ｂに対して表面連通部２１ａの径が大きくなるように形成されている）。このため、一方の回路基板１４の連通部２１で凝固した半田の一部が他方の回路基板１４の表面又は裏面に固着（図示する例では、表面連通部２１ａの凝固半田４’の一部が他方の回路基板１４のウエハー１６に固着）され、回路基板１４同士の付着強度が向上する。   Further, in the two communication portions 21, the communication portion 21a (front surface communication portion) on the front surface side of the circuit board and the communication portion 21b (back surface communication portion) on the back surface side are formed to have different diameters (example shown in the figure). Then, the diameter of the front surface communication portion 21a is larger than that of the back surface communication portion 21b). For this reason, a part of the solder solidified at the communication part 21 of one circuit board 14 is fixed to the front or back surface of the other circuit board 14 (in the example shown, a part of the solidified solder 4 ′ of the surface communication part 21a is fixed. The adhesion strength between the circuit boards 14 is improved by being fixed to the wafer 16 of the other circuit board 14.

ちなみに、導通孔１９の絶縁層１８部分が中途部に対して径が大きく形成されることにより、導通孔１９の表面連連通部２１ａの径が中途部の径に対して大きくなっている。くわえて、導通孔１９の絶縁層１８部分においても、回路基板１４の表面に向かって次第に径が大きくなるテーパ状に形成されている。このため、導通孔１９の絶縁層１８部分に溶融半田４が充填されると、集積回路が確実に溶融半田に導通せしめられる。   Incidentally, the diameter of the surface communication portion 21a of the conduction hole 19 is larger than the diameter of the midway portion because the insulating layer 18 portion of the conduction hole 19 is formed larger in diameter than the midway portion. In addition, the insulating layer 18 portion of the conduction hole 19 is also formed in a tapered shape whose diameter gradually increases toward the surface of the circuit board 14. For this reason, when the molten solder 4 is filled in the insulating layer 18 portion of the conduction hole 19, the integrated circuit is reliably conducted to the molten solder.

次に、図１及図２に基づいて、多層回路基板１４の貫通孔３に溶融半田４を充填させる方法について説明する。
まず、多層回路基板１４における最下層の回路基板１４のウエハー１６側の面（下面）がホーン７の振動面７ａに接触するようにして、多層回路基板１４をホーン７の振動面７ａに載置する。そして、多層回路基板１４に穿設された複数の積層方向の挿通孔２ａに固定棒（図示しない）をそれぞれ挿通させ、該固定棒を振動面７ａに対して固定することにより、多層回路基板２の振動面７ａ上での水平方向の移動を規制するとともに、多層回路基板２の各層間のずれを防止している。（図１参照） Next, a method for filling the through hole 3 of the multilayer circuit board 14 with the molten solder 4 will be described with reference to FIGS.
First, the multilayer circuit board 14 is placed on the vibration surface 7 a of the horn 7 so that the surface (lower surface) of the lowermost circuit board 14 of the multilayer circuit board 14 on the wafer 16 side is in contact with the vibration surface 7 a of the horn 7. To do. Then, a fixing bar (not shown) is inserted into the plurality of stacking direction insertion holes 2a formed in the multilayer circuit board 14, and the fixing bar is fixed to the vibration surface 7a, whereby the multilayer circuit board 2 is fixed. The horizontal movement on the vibration surface 7a is restricted and displacement between the layers of the multilayer circuit board 2 is prevented. (See Figure 1)

なお、多層回路基板１２の外側周に沿う複数の外形枠２０を設け、該外形枠２０を振動面７ａに固設することにより、振動面７ａ上に載置された多層回路基板２の水平方向の移動を規制させてもよい（図１参照）。これによって、多層回路基板２の各層間のずれも防止される。   In addition, by providing a plurality of outer frames 20 along the outer periphery of the multilayer circuit board 12, and fixing the outer frames 20 to the vibration surface 7a, the horizontal direction of the multilayer circuit board 2 placed on the vibration surface 7a. May be restricted (see FIG. 1). As a result, displacement between the layers of the multilayer circuit board 2 is also prevented.

そして、上記のように水平方向の移動が規制された多層回路基板１４を任意の押接手段手段により振動面７ａに押接し、多層回路基板１２の積層方向の移動も規制する。この際、多層回路基板１４の下面と振動面７ａとは面接触している状態であることが好ましい。   Then, the multilayer circuit board 14 in which the movement in the horizontal direction is restricted as described above is pressed against the vibration surface 7a by any pressing means, and the movement of the multilayer circuit board 12 in the stacking direction is also restricted. At this time, it is preferable that the lower surface of the multilayer circuit board 14 and the vibration surface 7a are in surface contact.

なお、振動面７ａと多層回路基板１４との間に板状のスペーサ（図示しない）等を介在させてもよい。この場合に、スペーサ上の溶融半田４を充填させる必要がある貫通孔３が位置する箇所には該貫通孔３と連通する孔を穿設する一方で、溶融半田４を充填させる必要がない貫通孔３をスペーサによって塞ぐことにより、溶融半田４を充填させる貫通孔３を自由に設定することが可能になる。   A plate-like spacer (not shown) or the like may be interposed between the vibration surface 7a and the multilayer circuit board 14. In this case, a hole communicating with the through-hole 3 is formed at a position where the through-hole 3 that needs to be filled with the molten solder 4 on the spacer is formed, while the molten solder 4 need not be filled. By closing the hole 3 with a spacer, the through hole 3 for filling the molten solder 4 can be freely set.

上記セッティングをした後、作業空間Ｓに不活性ガスを供給するか、作業空間Ｓを真空雰囲気にし、上記ホーン７を軸方向に超音波振動させる。すると、振動面７ａが溶融半田４の液面下にある場合には、振動面７ａの超音波振動により、多層回路基板１４の下面と振動面７ａとの間に形成される微小な隙間（図示しない）が変化し、ポンピング作用によって上記隙間に振動面７ａ上の溶融半田４が入り込み、多層回路基板１４に形成された上記貫通孔３の一方の開口部３ａ（導入口）まで溶融半田４が導入される。   After the above setting, an inert gas is supplied to the working space S or the working space S is set in a vacuum atmosphere, and the horn 7 is ultrasonically vibrated in the axial direction. Then, when the vibration surface 7a is below the liquid surface of the molten solder 4, a minute gap (illustrated) is formed between the lower surface of the multilayer circuit board 14 and the vibration surface 7a by ultrasonic vibration of the vibration surface 7a. The melted solder 4 on the vibration surface 7a enters the gap by the pumping action, and the molten solder 4 reaches the one opening 3a (introduction port) of the through hole 3 formed in the multilayer circuit board 14. be introduced.

一方、振動面７ａがケース９の溶融半田４に浸漬されておらず、溶融半田４の液面からホーン７の上端部が突出している場合には、ホーン７の超音波振動により、ホーン７の上端部外周面に発生する表面波その他の作用によりホーン７の上端部外周面付近の溶融半田４がその外周面に沿って上昇して振動面７ａにまで達し、振動面７ａ上に溶融半田４の被膜を形成する。そして、前述した場合と同様に超音波振動のポンピング作用によって、貫通孔３の導入口３ａまで溶融半田４が導入される。   On the other hand, when the vibration surface 7 a is not immersed in the molten solder 4 of the case 9 and the upper end portion of the horn 7 protrudes from the liquid surface of the molten solder 4, Due to surface waves and other actions generated on the outer peripheral surface of the upper end, the molten solder 4 near the outer peripheral surface of the upper end of the horn 7 rises along the outer peripheral surface to reach the vibration surface 7a, and the molten solder 4 on the vibration surface 7a. Form a coating. As in the case described above, the molten solder 4 is introduced to the introduction port 3a of the through hole 3 by the pumping action of ultrasonic vibration.

続いて、同じく超音波振動のポンピング作用により上記導入口３ａに導入された溶融半田４が他方の開口部３ｂ（排出口）に向かって移送される。上記溶融半田４が排出口３ａにまで達すると、貫通孔３内に溶融半田４が供給充填された状態になる。さらに、多層回路基板１４に超音波振動を付加し続けると、排出口３ｂから多層回路基板外２に溶融半田４が排出される。作業空間Ｓが非酸化雰囲気であるため、排出された溶融半田４は表面張力によって球状をなして排出口３ｂ付近に溜まる。   Subsequently, the molten solder 4 introduced into the introduction port 3a by the pumping action of ultrasonic vibration is transferred toward the other opening 3b (discharge port). When the molten solder 4 reaches the discharge port 3a, the molten solder 4 is supplied and filled into the through hole 3. Further, when ultrasonic vibration is continuously applied to the multilayer circuit board 14, the molten solder 4 is discharged out of the multilayer circuit board 2 from the discharge port 3b. Since the working space S is in a non-oxidizing atmosphere, the discharged molten solder 4 forms a sphere due to surface tension and accumulates in the vicinity of the discharge port 3b.

画像処理等により充填作業の終了状態が検知されると、キャップ孔１２ａを介して、ピンセット等により振動面７ａ上から多層回路基板２を摘み上げ、溶融半田４を冷却して凝固させる。すると、多層回路基板１４の上記排出口３ｂ付近に球状のバンプ２２が形成され、貫通孔３内の溶解半田４が凝固半田４’となり、各層の回路基板１４同士が電気的、機械的に強固に接続される。なお、上記バンプ２２は他の多層回路基板等との接続コネクタ又は接続用予備半田として利用できる。   When the completion state of the filling operation is detected by image processing or the like, the multilayer circuit board 2 is picked up from the vibration surface 7a by tweezers or the like through the cap hole 12a, and the molten solder 4 is cooled and solidified. Then, a spherical bump 22 is formed in the vicinity of the discharge port 3b of the multilayer circuit board 14, the molten solder 4 in the through hole 3 becomes solidified solder 4 ', and the circuit boards 14 of each layer are electrically and mechanically strong. Connected to. The bump 22 can be used as a connector for connection to another multilayer circuit board or the like, or a spare solder for connection.

上記構成の液状粘性材料の充填方法によれば、超音波振動の脱泡効果によって、貫通孔３内に充填した溶融半田４内にボイドが形成されることを防止できる。   According to the filling method of the liquid viscous material having the above-described configuration, it is possible to prevent voids from being formed in the molten solder 4 filled in the through holes 3 due to the defoaming effect of ultrasonic vibration.

次に、図３に示す他の実施形態について前述の実施形態と異なる部分を説明する。
図３は他の実施形態を示す多層回路基板の要部正断面図である。同図に示された多層回路基板２においては、導通路１９が中途部から裏面連通部２１ｂに向かって次第に径が大きくなるテーパ状に形成されている。このような形状に成形するのは比較的容易であるため、裏面連通部２１ｂに対して中途部の径を大きくすることも容易になる。 Next, with respect to another embodiment shown in FIG. 3, portions different from the above-described embodiment will be described.
FIG. 3 is a front sectional view of a principal part of a multilayer circuit board showing another embodiment. In the multilayer circuit board 2 shown in the figure, the conduction path 19 is formed in a tapered shape having a diameter that gradually increases from the midway portion toward the back surface communication portion 21b. Since it is relatively easy to mold into such a shape, it is easy to increase the diameter of the midway portion with respect to the back surface communication portion 21b.

本発明の方法に用いられる充填装置の要部正断面図である。It is a principal part front sectional view of the filling apparatus used for the method of this invention. 多層回路基板の要部正断面図である。It is a principal part front sectional view of a multilayer circuit board. 他の実施形態を示す多層回路基板の要部正断面図である。It is a principal part front sectional view of the multilayer circuit board which shows other embodiment. （Ａ）は各層をワイヤーによって電気的に接続する従来公知の多層回路基板の要部正面図であり、（Ｂ）は各層を貫通孔の充填される導電性の液状粘性材料によって接続する従来公知の多層回路基板の要部正面図である。(A) is a principal part front view of the conventionally well-known multilayer circuit board which electrically connects each layer with a wire, (B) is a conventionally well-known which connects each layer with the electroconductive liquid viscous material with which a through-hole is filled. It is a principal part front view of this multilayer circuit board.

符号の説明Explanation of symbols

２ 多層回路基板
３ 貫通孔
３ａ 導入口（開口部）
３ｂ 排出口（開口部）
４ 溶融半田（液状粘性材料）
７ ホーン（振動体）
７ａ 振動面 2 Multilayer circuit board 3 Through hole 3a Inlet (opening)
3b Discharge port (opening)
4 Molten solder (liquid viscous material)
7 Horn (vibrating body)
7a Vibration surface

Claims (6)

表裏面間に貫通する貫通孔（３）を穿設した多層回路基板（２）の上記貫通孔（３）に超音波振動を利用して液状粘性材料（４）を充填する液状粘性材料の充填方法において、上記貫通孔（３）の一方の開口部（３ａ）を液状粘性材料（４）に浸漬し該貫通孔（３）の軸心方向に超音波振動を与えることにより貫通孔（３）の他方の開口部（３ｂ）に向かって液状粘性材料（４）を供給して充填する液状粘性材料の充填方法。   Filling the through-hole (3) of the multilayer circuit board (2) with a through-hole (3) penetrating between the front and back surfaces by filling the liquid viscous material (4) using ultrasonic vibration. In the method, the through hole (3) is obtained by immersing one opening (3a) of the through hole (3) in the liquid viscous material (4) and applying ultrasonic vibration in the axial direction of the through hole (3). The liquid viscous material is charged by supplying the liquid viscous material (4) toward the other opening (3b). 超音波振動する振動体（７）の振動面（７ａ）に多層回路基板（２）の開口部（３ａ）を対向させ、前記多層回路基板（２）を前記振動面（７ａ）側に押接するとともに、該開口部（３ａ）と前記振動面（７ａ）との間に液状粘性材料（４）を介在させた請求項１の液状粘性材料の充填方法。   The opening (3a) of the multilayer circuit board (2) is opposed to the vibration surface (7a) of the vibrating body (7) that vibrates ultrasonically, and the multilayer circuit board (2) is pressed against the vibration surface (7a) side. In addition, the liquid viscous material filling method according to claim 1, wherein a liquid viscous material (4) is interposed between the opening (3a) and the vibration surface (7a). 液状粘性材料（４）の液面より上下方向のホーン（７）の上端部を突出させて上記ホーン（７）に超音波振動を与え、ホーン（７）の上端部外周面に沿って液状粘性材料（４）を上昇移動させることにより、ホーン（７）上端面の振動面（７ａ）を液状粘性材料（４）で覆う請求項２の液状粘性材料の充填方法。   The upper end portion of the horn (7) in the vertical direction is projected from the liquid surface of the liquid viscous material (4) to give ultrasonic vibration to the horn (7), and the liquid viscosity along the outer peripheral surface of the upper end portion of the horn (7). The filling method of the liquid viscous material of Claim 2 which covers the vibration surface (7a) of a horn (7) upper end surface with a liquid viscous material (4) by raising and moving material (4). 貫通孔（３）が多層回路基板（２）の各層導通用の孔であり、液状粘性材料（４）が導電性の材料である請求項１，２又は３の液状粘性材料の充填方法。   The method for filling a liquid viscous material according to claim 1, 2 or 3, wherein the through hole (3) is a hole for conducting each layer of the multilayer circuit board (2), and the liquid viscous material (4) is a conductive material. 液状粘性材料（４）が溶融金属である請求項４の液状粘性材料の充填方法。   The method for filling a liquid viscous material according to claim 4, wherein the liquid viscous material (4) is a molten metal. 非酸化雰囲気下で行われる請求項１，２，３，４又は５の液状粘性材料の充填方法。   The method for filling a liquid viscous material according to claim 1, 2, 3, 4, or 5 performed in a non-oxidizing atmosphere.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6221110A (en) * 1985-07-20 1987-01-29 Nippon Telegr & Teleph Corp <Ntt> Ultrasonic soldering device
JPH07321453A (en) * 1994-05-26 1995-12-08 Ibiden Co Ltd Soldering method and device of lead pin
JPH09293958A (en) * 1996-04-26 1997-11-11 Senju Metal Ind Co Ltd Soldering method and device of printed board
JP2007073918A (en) * 2005-09-02 2007-03-22 Napura:Kk Method of filling piercing hole or non-piercing hole formed in multilayer circuit board or wafer with filler

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6221110A (en) * 1985-07-20 1987-01-29 Nippon Telegr & Teleph Corp <Ntt> Ultrasonic soldering device
JPH07321453A (en) * 1994-05-26 1995-12-08 Ibiden Co Ltd Soldering method and device of lead pin
JPH09293958A (en) * 1996-04-26 1997-11-11 Senju Metal Ind Co Ltd Soldering method and device of printed board
JP2007073918A (en) * 2005-09-02 2007-03-22 Napura:Kk Method of filling piercing hole or non-piercing hole formed in multilayer circuit board or wafer with filler

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