JP2006527498A - 集積回路の電力分配網 - Google Patents
集積回路の電力分配網 Download PDFInfo
- Publication number
- JP2006527498A JP2006527498A JP2006516633A JP2006516633A JP2006527498A JP 2006527498 A JP2006527498 A JP 2006527498A JP 2006516633 A JP2006516633 A JP 2006516633A JP 2006516633 A JP2006516633 A JP 2006516633A JP 2006527498 A JP2006527498 A JP 2006527498A
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- JP
- Japan
- Prior art keywords
- power
- integrated circuit
- bus
- ground
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003068 static effect Effects 0.000 claims abstract description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (10)
- 電力分配網を有する集積回路であって、前記電力分配網は、電力及びグランドパッドから各々電力を前記集積回路上の複数回路要素に供給する電力バス及びグランドバスを備え、前記電力分配網は前記電力パッド及びグランドパッド間に静的電流の流れをもたらす複数デカップリングセルを備え、前記集積回路上の如何なる回路要素に対し、前記電力パッドと前記如何なる回路要素との間の、そして、前記グランドパッドと前記如何なる回路要素との間の組み合わせ距離が一定となるように前記電力分配網が構成されていることを特徴とする集積回路。
- 前記電力パッドから如何なる回路要素への距離が増すと前記グランドパッドの距離が減るように前記電力分配網が構成されている請求項1に記載の集積回路。
- 前記電力パッド及びグランドパッドは前記集積回路の対角線上の対向する角部に配されている請求項1又は2に記載の集積回路。
- 前記先行する請求項いずれか1項に記載の集積回路であって、前記電力分配網は、
前記電力パッドに接続された垂直部と該垂直部に接続された一つ以上の水平部とを備えた電力バスと、
前記グランドパッドに接続された垂直部と該垂直部に接続された一つ以上の水平部とを備えたグランドバスとを備え、
前記電力バスの前記一つ以上の水平部と前記グランドバスの前記一つ以上の水平部とが交互になるように前記電力バスの前記垂直部が前記グランドバスの前記垂直部と平行に配されている集積回路。 - 前記電力バスの水平部とグランドバスの水平部とが前記複数回路要素の一つ以上に電力を供給するローを形成している請求項4に記載の集積回路。
- 前記電力バスの水平部と前記グランドバスの水平部との間に一つ以上の回路要素が設置されている請求項5に記載の集積回路。
- 前記複数デカップリングセルは複数デカップリングキャパシタを含む前記先行する請求項いずれか1項に記載の集積回路。
- 前記複数デカップリングセルは前記複数回路要素と同じ高さになるように構成されている請求項7に記載の集積回路。
- 前記複数デカップリングセルは前記集積回路上の前記複数回路要素間に配されている請求項8に記載の集積回路。
- 前記電力分配網は同じ構成の一つ以上のより小さい複数電力分配網を備えている前記先行する請求項いずれか1項に記載の集積回路。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03101700 | 2003-06-11 | ||
PCT/IB2004/050814 WO2004109799A1 (en) | 2003-06-11 | 2004-06-01 | Power distribution network of an integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006527498A true JP2006527498A (ja) | 2006-11-30 |
Family
ID=33495646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006516633A Pending JP2006527498A (ja) | 2003-06-11 | 2004-06-01 | 集積回路の電力分配網 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7827511B2 (ja) |
EP (1) | EP1636841A1 (ja) |
JP (1) | JP2006527498A (ja) |
KR (1) | KR20060021354A (ja) |
CN (1) | CN1802745A (ja) |
TW (1) | TW200503227A (ja) |
WO (1) | WO2004109799A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8321170B2 (en) * | 2010-02-19 | 2012-11-27 | Freescale Semiconductor, Inc. | Offset error automatic calibration integrated circuit |
TWI491034B (zh) * | 2010-04-21 | 2015-07-01 | Au Optronics Corp | 有機發光二極體顯示器 |
KR20150000951A (ko) | 2013-06-25 | 2015-01-06 | 삼성전자주식회사 | 전원 공급 네트워크 설계 방법 |
TWI527392B (zh) | 2014-01-14 | 2016-03-21 | 財團法人工業技術研究院 | 建置電源網路之裝置與方法 |
CN111063670B (zh) * | 2018-10-17 | 2022-03-18 | 奇景光电股份有限公司 | 电路布线方法、电路布线***以及集成电路 |
US20230288635A1 (en) * | 2022-03-10 | 2023-09-14 | Ii-Vi Delaware, Inc. | Trimming of optical response for tunable photonic devices |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5946044A (ja) * | 1982-09-08 | 1984-03-15 | Nec Corp | 半導体装置 |
JPH06334157A (ja) * | 1993-05-21 | 1994-12-02 | Sony Corp | 集積回路とその製造方法 |
JPH0778877A (ja) * | 1993-09-08 | 1995-03-20 | Fujitsu Ltd | 半導体装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4612618A (en) * | 1983-06-10 | 1986-09-16 | Rca Corporation | Hierarchical, computerized design of integrated circuits |
JPS61241964A (ja) * | 1985-04-19 | 1986-10-28 | Hitachi Ltd | 半導体装置 |
US4978633A (en) * | 1989-08-22 | 1990-12-18 | Harris Corporation | Hierarchical variable die size gate array architecture |
JPH04255246A (ja) * | 1991-02-07 | 1992-09-10 | Toshiba Corp | 半導体集積回路及びその設計方法 |
JP3052519B2 (ja) * | 1992-01-14 | 2000-06-12 | 日本電気株式会社 | 集積回路の電源配線設計方法 |
US5656834A (en) * | 1994-09-19 | 1997-08-12 | Philips Electronics North America Corporation | IC standard cell designed with embedded capacitors |
US6618847B1 (en) * | 1998-11-13 | 2003-09-09 | Stmicroelectronics, Inc. | Power stabilizer using under-utilized standard cells |
US6388332B1 (en) * | 1999-08-10 | 2002-05-14 | Philips Electronics North America Corporation | Integrated circuit power and ground routing |
US6370678B1 (en) * | 2000-04-27 | 2002-04-09 | Agilent Technologies, Inc. | System and method for adjusting logic synthesis based on power supply circuit models |
JP2001351979A (ja) * | 2000-06-05 | 2001-12-21 | Fujitsu Ltd | 半導体装置設計支援装置 |
ATE279787T1 (de) * | 2001-02-10 | 2004-10-15 | Toshiba Electronics Europ Gmbh | Stromversorgungsleiter-struktur in einer integrierten halbleiterschaltung |
US6346721B1 (en) * | 2001-03-12 | 2002-02-12 | Lsi Logic Corporation | Integrated circuit having radially varying power bus grid architecture |
JP2004070721A (ja) * | 2002-08-07 | 2004-03-04 | Renesas Technology Corp | 自動配置配線装置 |
US6898769B2 (en) * | 2002-10-10 | 2005-05-24 | International Business Machines Corporation | Decoupling capacitor sizing and placement |
US7047515B1 (en) * | 2003-04-04 | 2006-05-16 | Extreme Networks | Method for selecting and placing bypass capacitors on multi-layer printed circuit boards |
US7272803B1 (en) * | 2003-06-01 | 2007-09-18 | Cadence Design Systems, Inc. | Methods and apparatus for defining manhattan power grid structures having a reduced number of vias |
-
2004
- 2004-06-01 US US10/559,913 patent/US7827511B2/en active Active
- 2004-06-01 JP JP2006516633A patent/JP2006527498A/ja active Pending
- 2004-06-01 CN CNA2004800161116A patent/CN1802745A/zh active Pending
- 2004-06-01 KR KR1020057023633A patent/KR20060021354A/ko not_active Application Discontinuation
- 2004-06-01 EP EP04735638A patent/EP1636841A1/en not_active Withdrawn
- 2004-06-01 WO PCT/IB2004/050814 patent/WO2004109799A1/en not_active Application Discontinuation
- 2004-06-08 TW TW093116443A patent/TW200503227A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5946044A (ja) * | 1982-09-08 | 1984-03-15 | Nec Corp | 半導体装置 |
JPH06334157A (ja) * | 1993-05-21 | 1994-12-02 | Sony Corp | 集積回路とその製造方法 |
JPH0778877A (ja) * | 1993-09-08 | 1995-03-20 | Fujitsu Ltd | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2004109799A1 (en) | 2004-12-16 |
US20060175636A1 (en) | 2006-08-10 |
TW200503227A (en) | 2005-01-16 |
KR20060021354A (ko) | 2006-03-07 |
US7827511B2 (en) | 2010-11-02 |
CN1802745A (zh) | 2006-07-12 |
EP1636841A1 (en) | 2006-03-22 |
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