JP2006339594A5 - - Google Patents
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- JP2006339594A5 JP2006339594A5 JP2005165768A JP2005165768A JP2006339594A5 JP 2006339594 A5 JP2006339594 A5 JP 2006339594A5 JP 2005165768 A JP2005165768 A JP 2005165768A JP 2005165768 A JP2005165768 A JP 2005165768A JP 2006339594 A5 JP2006339594 A5 JP 2006339594A5
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- JP
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- Prior art keywords
- pamphlet
- examples
- japanese patent
- international publication
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Description
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005165768A JP2006339594A (ja) | 2005-06-06 | 2005-06-06 | 半導体用研磨剤 |
PCT/JP2006/309578 WO2006132055A1 (ja) | 2005-06-06 | 2006-05-12 | 半導体用研磨剤 |
EP06732559A EP1890321A1 (en) | 2005-06-06 | 2006-05-12 | Semiconductor abrasive |
CNA2006800195183A CN101189706A (zh) | 2005-06-06 | 2006-05-12 | 半导体用研磨剂 |
KR1020077025527A KR20080012864A (ko) | 2005-06-06 | 2006-05-12 | 반도체용 연마제 |
TW095118884A TW200712185A (en) | 2005-06-06 | 2006-05-26 | Abrasive agent for semiconductor |
US11/951,540 US20080086950A1 (en) | 2005-06-06 | 2007-12-06 | Semiconductor polishing compound |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005165768A JP2006339594A (ja) | 2005-06-06 | 2005-06-06 | 半導体用研磨剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006339594A JP2006339594A (ja) | 2006-12-14 |
JP2006339594A5 true JP2006339594A5 (ja) | 2008-04-10 |
Family
ID=37498261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005165768A Withdrawn JP2006339594A (ja) | 2005-06-06 | 2005-06-06 | 半導体用研磨剤 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080086950A1 (ja) |
EP (1) | EP1890321A1 (ja) |
JP (1) | JP2006339594A (ja) |
KR (1) | KR20080012864A (ja) |
CN (1) | CN101189706A (ja) |
TW (1) | TW200712185A (ja) |
WO (1) | WO2006132055A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2003281655A1 (en) * | 2002-07-22 | 2004-02-09 | Asahi Glass Company, Limited | Semiconductor abrasive, process for producing the same and method of polishing |
US8759216B2 (en) * | 2006-06-07 | 2014-06-24 | Cabot Microelectronics Corporation | Compositions and methods for polishing silicon nitride materials |
EP2061070A4 (en) * | 2006-09-11 | 2010-06-02 | Asahi Glass Co Ltd | POLISHING AGENT FOR AN INTEGRATED SEMICONDUCTOR ELEMENTS, POLISHING METHOD AND METHOD FOR PRODUCING AN INTEGRATED SEMICONDUCTOR EQUIPMENT |
WO2008032681A1 (fr) * | 2006-09-13 | 2008-03-20 | Asahi Glass Co., Ltd. | Agent de polissage pour dispositif à semi-conducteur en circuit intégré, procédé de polissage, et procédé de fabrication du dispositif à semi-conducteur en circuit intégré |
DE102007062572A1 (de) * | 2007-12-22 | 2009-06-25 | Evonik Degussa Gmbh | Ceroxid und kolloidales Siliciumdioxid enthaltende Dispersion |
KR101075491B1 (ko) | 2009-01-16 | 2011-10-21 | 주식회사 하이닉스반도체 | 반도체 소자의 제조방법 |
US8551887B2 (en) | 2009-12-22 | 2013-10-08 | Air Products And Chemicals, Inc. | Method for chemical mechanical planarization of a copper-containing substrate |
JP4784694B1 (ja) * | 2010-05-27 | 2011-10-05 | 横浜ゴム株式会社 | 液状凝固剤およびタイヤパンクシール材セット |
MY164859A (en) * | 2010-09-08 | 2018-01-30 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices |
CN103155112B (zh) * | 2010-12-24 | 2016-10-12 | 日立化成株式会社 | 研磨液及使用该研磨液的基板的研磨方法 |
JP6051632B2 (ja) * | 2011-07-20 | 2016-12-27 | 日立化成株式会社 | 研磨剤及び基板の研磨方法 |
KR102198376B1 (ko) * | 2012-11-02 | 2021-01-04 | 로렌스 리버모어 내쇼날 시큐리티, 엘엘시 | 표면 활성의 손실없이 대전된 콜로이드의 응집을 방지하는 방법 |
CN104726028A (zh) * | 2013-12-18 | 2015-06-24 | 安集微电子(上海)有限公司 | 一种化学机械抛光液及其使用方法 |
CN105778774A (zh) * | 2014-12-23 | 2016-07-20 | 安集微电子(上海)有限公司 | 一种化学机械抛光液 |
KR102514041B1 (ko) * | 2015-12-09 | 2023-03-24 | 삼성전자주식회사 | 반도체 소자 제조 방법 |
JP6602720B2 (ja) * | 2016-04-04 | 2019-11-06 | グローバルウェーハズ・ジャパン株式会社 | 半導体基板の保護膜形成方法 |
CN107369618B (zh) * | 2017-07-07 | 2020-02-21 | 上海华虹宏力半导体制造有限公司 | 晶圆的平坦化方法 |
JPWO2019043890A1 (ja) * | 2017-08-31 | 2020-08-06 | 株式会社Sumco | 半導体ウェーハの製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5759917A (en) * | 1996-12-30 | 1998-06-02 | Cabot Corporation | Composition for oxide CMP |
US6432828B2 (en) * | 1998-03-18 | 2002-08-13 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
JP2002198331A (ja) * | 2000-12-26 | 2002-07-12 | Jsr Corp | 研磨方法 |
EP1505639B1 (en) * | 2002-04-30 | 2008-08-06 | Hitachi Chemical Company, Ltd. | Polishing fluid and polishing method |
AU2003281655A1 (en) * | 2002-07-22 | 2004-02-09 | Asahi Glass Company, Limited | Semiconductor abrasive, process for producing the same and method of polishing |
JP2004123931A (ja) * | 2002-10-03 | 2004-04-22 | Hitachi Chem Co Ltd | 研磨液及び研磨方法 |
JP2004273547A (ja) * | 2003-03-05 | 2004-09-30 | Kao Corp | 研磨速度選択比向上剤 |
-
2005
- 2005-06-06 JP JP2005165768A patent/JP2006339594A/ja not_active Withdrawn
-
2006
- 2006-05-12 KR KR1020077025527A patent/KR20080012864A/ko not_active Application Discontinuation
- 2006-05-12 WO PCT/JP2006/309578 patent/WO2006132055A1/ja active Application Filing
- 2006-05-12 CN CNA2006800195183A patent/CN101189706A/zh active Pending
- 2006-05-12 EP EP06732559A patent/EP1890321A1/en not_active Withdrawn
- 2006-05-26 TW TW095118884A patent/TW200712185A/zh unknown
-
2007
- 2007-12-06 US US11/951,540 patent/US20080086950A1/en not_active Abandoned
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