JP2006324228A - Icソケット - Google Patents
Icソケット Download PDFInfo
- Publication number
- JP2006324228A JP2006324228A JP2006055429A JP2006055429A JP2006324228A JP 2006324228 A JP2006324228 A JP 2006324228A JP 2006055429 A JP2006055429 A JP 2006055429A JP 2006055429 A JP2006055429 A JP 2006055429A JP 2006324228 A JP2006324228 A JP 2006324228A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- contact pin
- contact
- circuit board
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000005219 brazing Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000005524 ceramic coating Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Connecting Device With Holders (AREA)
- Measuring Leads Or Probes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
【解決手段】ICの複数のリード端子をそれぞれ挟持する挟持部14aを有する導電性の各ソケット導通部14と、ソケット導通部14に固定されかつソケット導通部14よりも回路基板30側に突出する導電性の各コイルバネ15とを備えている。
【選択図】図1
Description
本発明の一実施形態について図1ないし図12に基づいて説明すれば、以下の通りである。なお、本実施の形態のICソケットは、例えば400℃の高温状態でも回路基板への接続が可能であり、かつICソケットの交換を容易とするものである。
本発明の他の実施形態を図13及び図14に基づいて以下に説明する。なお、説明の便宜上、前記実施の形態1にて示した各部材と同一の機能を有する部材には、同一の符号を付記し、その説明を省略する。
10a 上層本体部(上層ソケット本体)
10b 下層本体部(下層ソケット本体)
12 内部空間部(凹部)
12a 上層内部空間部(凹部)
12b 下層内部空間部(凹部)
12d 接触ピン突出用孔
14 ソケット導通部(連結部)
14a 挟持部
14b 接触ピン
14d 溝部(溝)
15 コイルバネ(バネ)
16 ボルト
20 IC
21 リード端子
30 回路基板
31 パッド
41 狭幅部41
42 曲がり部
45a 線状バネ(バネ)
45b 線状バネ(バネ)
50 ICソケット
51 柱状部材
52 柱状部材
52a 接触子部
52b バネ巻回部
52c 貫通孔(孔)
Claims (10)
- ICの複数のリード端子をそれぞれ挟持する挟持部を有する導電性の各連結部と、
上記連結部に固定されかつ該連結部よりも回路基板側に突出する導電性の各バネとを備えていることを特徴とするICソケット。 - 前記各連結部は、回路基板側に突出する接触ピンをそれぞれ有すると共に、
前記各バネは、上記接触ピンに固定されかつ該接触ピンよりも回路基板側に突出していることを特徴とする請求項1記載のICソケット。 - 前記バネの回路基板側の先端には、導電性の柱状部材が固定されていることを特徴とする請求項1又は2記載のICソケット。
- 前記柱状部材には、前記連結部を挿入する孔が形成されていると共に、
前記バネは、上記柱状部材の表面に巻きつけられていることを特徴とする請求項3記載のICソケット。 - 前記連結部の挟持部と接触ピンとは一体に形成されていることを特徴とする請求項1〜4のいずれか1項に記載のICソケット。
- ICソケット本体は、上層ICソケット本体と下層ソケット本体との分離可能な2層からなり、
上記上層ICソケット本体及び下層ソケット本体には、前記連結部を収容する凹部がそれぞれ形成されていることを特徴とする請求項1〜5のいずれか1項に記載のICソケット。 - 前記連結部の接触ピンには、前記バネを固定するための溝が形成されていることを特徴とする請求項2〜6のいずれか1項に記載のICソケット。
- 前記バネは、金メッキ線にてなっていることを特徴とする請求項1〜7のいずれか1項に記載のICソケット。
- 前記柱状部材は、表面に金メッキがなされていることを特徴とする請求項3〜8のいずれか1項に記載のICソケット。
- 前記接触ピンは弾性を有していることを特徴とする請求項2〜9のいずれか1項に記載のICソケット。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006055429A JP4304189B2 (ja) | 2005-04-20 | 2006-03-01 | Icソケット |
TW095113463A TWI333304B (en) | 2005-04-20 | 2006-04-14 | Ic socket |
US11/406,385 US7311528B2 (en) | 2005-04-20 | 2006-04-19 | IC socket |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005122953 | 2005-04-20 | ||
JP2006055429A JP4304189B2 (ja) | 2005-04-20 | 2006-03-01 | Icソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006324228A true JP2006324228A (ja) | 2006-11-30 |
JP4304189B2 JP4304189B2 (ja) | 2009-07-29 |
Family
ID=37187518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006055429A Active JP4304189B2 (ja) | 2005-04-20 | 2006-03-01 | Icソケット |
Country Status (3)
Country | Link |
---|---|
US (1) | US7311528B2 (ja) |
JP (1) | JP4304189B2 (ja) |
TW (1) | TWI333304B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014127407A (ja) * | 2012-12-27 | 2014-07-07 | Enplas Corp | 電気接触子及び電気部品用ソケット |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITTO20060876A1 (it) * | 2006-12-11 | 2008-06-12 | Vhit Spa | Pompa a vuoto con dispositivo per la sua disattivazione |
JP2009124234A (ja) * | 2007-11-12 | 2009-06-04 | Panasonic Corp | 電子部品、電子部品ユニット、スピーカ、及び、該スピーカを備えた携帯端末 |
WO2009084085A1 (ja) * | 2007-12-27 | 2009-07-09 | Yamaichi Electronics Co., Ltd. | 半導体装置用ソケット |
US20130134553A1 (en) * | 2011-11-30 | 2013-05-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interposer and semiconductor package with noise suppression features |
CN104662471A (zh) * | 2012-06-05 | 2015-05-27 | Sage电致变色显示有限公司 | 电气馈通间隔件和连通性 |
JP2019060819A (ja) * | 2017-09-28 | 2019-04-18 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板 |
CN115207664B (zh) * | 2022-09-13 | 2023-07-25 | 东莞市鸿儒连接器有限公司 | 一种方便正反插拔的小型化继电器连接插座 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3742742B2 (ja) | 2000-03-15 | 2006-02-08 | 株式会社エンプラス | 電気部品用ソケット |
JP2002231399A (ja) * | 2001-02-02 | 2002-08-16 | Fujitsu Ltd | 半導体装置試験用コンタクタ及びその製造方法 |
US6937045B2 (en) * | 2002-07-18 | 2005-08-30 | Aries Electronics, Inc. | Shielded integrated circuit probe |
US6746252B1 (en) * | 2002-08-01 | 2004-06-08 | Plastronics Socket Partners, L.P. | High frequency compression mount receptacle with lineal contact members |
US6846184B2 (en) * | 2003-01-24 | 2005-01-25 | High Connection Density Inc. | Low inductance electrical contacts and LGA connector system |
-
2006
- 2006-03-01 JP JP2006055429A patent/JP4304189B2/ja active Active
- 2006-04-14 TW TW095113463A patent/TWI333304B/zh active
- 2006-04-19 US US11/406,385 patent/US7311528B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014127407A (ja) * | 2012-12-27 | 2014-07-07 | Enplas Corp | 電気接触子及び電気部品用ソケット |
Also Published As
Publication number | Publication date |
---|---|
JP4304189B2 (ja) | 2009-07-29 |
TW200640093A (en) | 2006-11-16 |
TWI333304B (en) | 2010-11-11 |
US20060240686A1 (en) | 2006-10-26 |
US7311528B2 (en) | 2007-12-25 |
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