JP2006073872A5

JP2006073872A5 -

Info

Publication number: JP2006073872A5
Application number: JP2004257016A
Authority: JP
Filing date: 2004-09-03
Publication date: 2006-10-19
Anticipated expiration: 2024-09-03

Claims

被処理基板を下からの支持でほぼ水平に保つステージと、
前記基板上に処理液を塗布するために前記ステージ上の基板に対して上方から処理液を吐出する塗布ノズルと、
前記塗布ノズルと前記基板とを水平な第１の方向で相対的に移動させる水平移動部と、
前記塗布ノズルと前記基板とを鉛直方向で相対的に移動させる昇降部と、
前記基板の厚みを光学的に測定するために前記塗布ノズルに取り付けられた基板厚み測定部と
を有し、
前記基板厚み測定部で得られる厚み測定値に基づいて前記塗布ノズルの下端の吐出口と前記基板との間に設定距離のギャップを形成する塗布装置。 A stage that holds the substrate to be processed almost horizontally with support from below ;
An application nozzle for discharging the processing liquid from above to the substrate on the stage in order to apply the processing liquid on the substrate;
A horizontal movement unit that relatively moves the application nozzle and the substrate in a horizontal first direction;
An elevating part for relatively moving the coating nozzle and the substrate in the vertical direction;
A substrate thickness measuring unit attached to the coating nozzle for optically measuring the thickness of the substrate;
A coating apparatus that forms a gap of a set distance between a discharge port at a lower end of the coating nozzle and the substrate based on a thickness measurement value obtained by the substrate thickness measuring unit.

前記ステージ上の基板に対して塗布開始位置の上方から前記昇降部により前記塗布ノズルを下降させ、その下降の最中または途中で前記基板厚み測定部により前記基板の厚みを測定し、その厚み測定値に基づいて前記塗布ノズルの吐出口と前記基板との間に前記設定距離のギャップが形成されるように前記塗布ノズルの高さ位置を調整して前記塗布開始位置とし、前記塗布開始位置から前記塗布ノズルによる処理液の吐出を開始するとともに前記水平移動部による前記塗布ノズルの水平移動を開始する請求項１に記載の塗布装置。 The coating nozzle is lowered by the elevating unit from above the coating start position with respect to the substrate on the stage, and the thickness of the substrate is measured by the substrate thickness measuring unit during or during the lowering. Based on the value, the height position of the application nozzle is adjusted to form the application start position so that a gap of the set distance is formed between the discharge port of the application nozzle and the substrate, and from the application start position. The coating apparatus according to claim 1, wherein discharge of the processing liquid by the coating nozzle is started and horizontal movement of the coating nozzle by the horizontal movement unit is started.

前記昇降部により前記塗布ノズルの下降を開始してから完了するまでの間に、前記基板厚み測定部が異なる位置で前記基板の厚みを複数回測定し、その結果得られる複数の測定値の中で最大の値を前記ギャップ調整に用いる厚み測定値とする請求項２に記載の塗布装置。 The substrate thickness measurement unit measures the thickness of the substrate a plurality of times at different positions from the start of the descent of the coating nozzle by the elevating unit to the completion of the measurement values. The coating apparatus according to claim 2, wherein the maximum value is a thickness measurement value used for the gap adjustment.

前記昇降部により前記塗布ノズルの下降を開始してから完了するまでの間に、前記基板厚み測定部が異なる位置で前記基板の厚みを複数回測定し、その結果得られる複数の測定値の平均値を前記ギャップ調整に用いる厚み測定値とする請求項２に記載の塗布装置。 The substrate thickness measurement unit measures the thickness of the substrate a plurality of times at different positions from the start of the descent of the coating nozzle by the elevating unit to the completion, and the average of the plurality of measurement values obtained as a result The coating apparatus according to claim 2, wherein the value is a thickness measurement value used for the gap adjustment.

前記塗布ノズルが前記第１の方向と直交する水平な第２の方向に延びる長尺型で、前記吐出口がスリット状または多孔配列型に形成され、塗布処理時の進行方向で後方を向くノズル背面の下端部が前記吐出口に向かってテーパ面に形成され、
前記塗布ノズルが処理液を吐出しながら前記水平移動を行う際に、前記吐出口より出た処理液が前記ノズル背面側に回り込んでから前記基板上に塗布される請求項１〜４のいずれか一項に記載の塗布装置。 The coating nozzle is a long type extending in a second horizontal direction perpendicular to the first direction, and the discharge ports are formed in a slit shape or a porous array type, and the nozzles face backward in the traveling direction during the coating process. The lower end of the back is formed in a tapered surface toward the discharge port,
5. The method according to claim 1, wherein when the coating nozzle performs the horizontal movement while discharging the processing liquid, the processing liquid that has come out of the discharge port wraps around the nozzle back side and is then applied onto the substrate. A coating apparatus according to claim 1.

塗布処理に先立って前記塗布ノズルの背面下端部に処理液を下塗りするためのプライミング処理部を前記ステージの近くに設置し、前記水平移動部および前記昇降部により前記塗布ノズルを前記プライミング処理部と前記ステージとの間で移動させる請求項５に記載の塗布装置。 Prior to the coating process, a priming processing unit for undercoating a treatment liquid on the lower end of the back surface of the coating nozzle is installed near the stage, and the coating nozzle is connected to the priming processing unit by the horizontal moving unit and the lifting unit. The coating apparatus according to claim 5, wherein the coating apparatus is moved between the stage.

前記プライミング処理部が、前記塗布ノズルの背面下端部に処理液を前記第２の方向でほぼ均一に塗る請求項６に記載の塗布装置。 The coating apparatus according to claim 6, wherein the priming processing unit applies the processing liquid almost uniformly in the second direction to the lower back end portion of the coating nozzle.

前記プライミング処理部が、前記第２の方向に延びる円筒状または円柱状の回転可能なローラを有し、前記ローラの頂上部付近に微小なギャップを空けて前記塗布ノズルの吐出口から処理液を吐出させ、前記吐出口から出た処理液が前記塗布ノズルの背面側に回り込む方向に前記ローラを回転させる請求項７に記載の塗布装置。 The priming processing unit has a cylindrical or columnar rotatable roller extending in the second direction, and a processing liquid is supplied from the discharge port of the coating nozzle with a small gap near the top of the roller. The coating apparatus according to claim 7, wherein the coating liquid is ejected and the roller is rotated in a direction in which the processing liquid exiting from the ejection port wraps around the back side of the coating nozzle.

前記プライミング処理部が、
前記塗布ノズルより処理液を受け取った前記ローラの外周面を洗浄するために前記ローラの下部を溶剤の浴に浸ける洗浄バスと、
前記溶剤の浴から上がった直後の前記ローラの外周面から液を拭い取るためのワイパと
を有する請求項８に記載の塗布装置。 The priming processing unit is
A cleaning bath in which the lower part of the roller is immersed in a solvent bath to clean the outer peripheral surface of the roller that has received the treatment liquid from the application nozzle;
The coating apparatus according to claim 8, further comprising a wiper for wiping off the liquid from the outer peripheral surface of the roller immediately after rising from the solvent bath.

前記ステージの上面に前記基板を真空吸着力で固定するための吸着固定部を有する請求項１〜９のいずれか一項に記載の塗布装置。 The coating apparatus as described in any one of Claims 1-9 which has an adsorption | suction fixing | fixed part for fixing the said board | substrate with the vacuum adsorption force on the upper surface of the said stage.

前記基板がおもて面を被処理面とするガラス基板であり、
前記基板厚み測定部が、
前記ステージ上の前記基板のおもて面に対して上方から光ビームを投光する投光部と、
前記基板の裏面からの前記光ビームに対応する第１の反射光と前記基板のおもて面からの前記光ビームに対応する第２の反射光とを受光する受光部と
を有し、前記受光部において前記第１の反射光を受光した第１の受光位置と前記第２の反射光を受光した第２の受光位置とから前記厚み測定値を求める請求項１〜１０のいずれか一項に記載の塗布装置。 The substrate is a glass substrate whose front surface is a surface to be treated;
The substrate thickness measuring unit is
A light projecting unit that projects a light beam from above the front surface of the substrate on the stage;
A light receiving unit that receives first reflected light corresponding to the light beam from the back surface of the substrate and second reflected light corresponding to the light beam from the front surface of the substrate; 11. The thickness measurement value is obtained from a first light receiving position where the first reflected light is received and a second light receiving position where the second reflected light is received in a light receiving unit. The coating apparatus as described in.

前記基板の周縁部に膜無しの透明な非製品領域が設定され、前記基板厚み測定部が前記非製品領域において前記基板の厚さを測定する請求項１１に記載の塗布装置。 The coating apparatus according to claim 11, wherein a transparent non-product region without a film is set at a peripheral portion of the substrate, and the substrate thickness measurement unit measures the thickness of the substrate in the non-product region.

前記基板厚み測定部が、前記基板の前記第１の方向に延びる両端周縁部の位置で前記厚み測定値を求める請求項１２に記載の塗布装置。 The coating apparatus according to claim 12, wherein the substrate thickness measurement unit obtains the thickness measurement value at a position of a peripheral edge portion extending in the first direction of the substrate.

前記塗布ノズルが処理液を吐出しながら前記水平移動を行っている最中に、前記基板厚み測定部により前記塗布ノズルよりも前方の位置で前記基板の両端周縁部における厚み測定値を求め、各々の厚み測定値に基づいて前記昇降部により前記塗布ノズルの両端部の高さ位置を個別に調整する請求項１３に記載の塗布装置。 While the coating nozzle is performing the horizontal movement while discharging the processing liquid, the substrate thickness measurement unit obtains a thickness measurement value at both peripheral edges of the substrate at a position in front of the coating nozzle, The coating apparatus of Claim 13 which adjusts individually the height position of the both ends of the said coating nozzle by the said raising / lowering part based on the thickness measurement value of this.

被処理基板を下からの支持でほぼ水平に保つステージと、A stage that holds the substrate to be processed almost horizontally with support from below;
前記基板上に処理液を塗布するために前記ステージ上の前記基板に対して上方から処理液を吐出する塗布ノズルと、An application nozzle for discharging a processing liquid from above to the substrate on the stage in order to apply the processing liquid on the substrate;
前記塗布ノズルと前記基板とを水平な第１の方向で相対的に移動させる水平移動部と、A horizontal movement unit that relatively moves the application nozzle and the substrate in a horizontal first direction;
前記塗布ノズルと前記基板とを鉛直方向で相対的に移動させる昇降部と、An elevating part for relatively moving the coating nozzle and the substrate in a vertical direction;
前記基板の厚みを光学的に測定するために前記塗布ノズルに取り付けられた基板厚み測定部とA substrate thickness measuring unit attached to the coating nozzle for optically measuring the thickness of the substrate;
を有し、Have
前記厚み測定部において、光ビームを２段階の光強度で投光して反射光をモニタして基板の厚みを測定し、この厚み測定値に基づいて前記塗布ノズルの下端の吐出口と前記基板との間に設定距離のギャップを形成する塗布装置。In the thickness measuring unit, the light beam is projected at two levels of light intensity, the reflected light is monitored to measure the thickness of the substrate, and the discharge port at the lower end of the coating nozzle and the substrate are measured based on the measured thickness value. A coating device that forms a gap of a set distance between them.

被処理基板を下からの支持でほぼ水平に保つステージと、A stage that holds the substrate to be processed almost horizontally with support from below;
前記基板上に処理液を塗布するために前記ステージ上の前記基板のおもて面に向けて上方から処理液を吐出する塗布ノズルと、An application nozzle for discharging the processing liquid from above toward the front surface of the substrate on the stage in order to apply the processing liquid on the substrate;
前記塗布ノズルと前記基板とを水平な第１の方向で相対的に移動させる水平移動部と、A horizontal movement unit that relatively moves the application nozzle and the substrate in a horizontal first direction;
前記塗布ノズルと前記基板とを鉛直方向で相対的に移動させる昇降部と、An elevating part for relatively moving the coating nozzle and the substrate in a vertical direction;
前記基板の厚みを光学的に測定するために前記塗布ノズルに取り付けられた基板厚み測定部とA substrate thickness measuring unit attached to the coating nozzle for optically measuring the thickness of the substrate;
を有し、Have
前記基板厚み測定部において、前記基板のおもて面の反射率と裏面の反射率とが異なる場合に、光ビームを２段階の光強度で投光し、光強度の大きい方で反射率の低い方の反射光をモニタし、光強度の小さい方で反射率の高い方の反射光をモニタして前記基板の厚みを測定し、この厚み測定値に基づいて前記塗布ノズルの下端の吐出口と前記基板との間に設定距離のギャップを形成する塗布装置。In the substrate thickness measurement unit, when the reflectance of the front surface and the reflectance of the back surface of the substrate are different, the light beam is projected at two levels of light intensity, and the reflectance of the light intensity is larger. The lower reflected light is monitored, the reflected light having the lower light intensity and the higher reflectance is monitored, and the thickness of the substrate is measured. Based on the measured thickness, the discharge port at the lower end of the coating nozzle is measured. A coating apparatus that forms a gap of a set distance between the substrate and the substrate.

被処理基板を下からの支持でほぼ水平に保つステージと、A stage that holds the substrate to be processed almost horizontally with support from below;
前記基板上に処理液を塗布するために前記ステージ上の基板に対して上方から処理液を吐出する塗布ノズルと、An application nozzle for discharging the processing liquid from above to the substrate on the stage in order to apply the processing liquid on the substrate;
前記塗布ノズルと前記基板とを水平な第１の方向で相対的に移動させる水平移動部と、A horizontal movement unit that relatively moves the application nozzle and the substrate in a horizontal first direction;
前記塗布ノズルと前記基板とを鉛直方向で相対的に移動させる昇降部と、An elevating part for relatively moving the coating nozzle and the substrate in a vertical direction;
前記基板の厚みを光学的に測定するために前記塗布ノズルに取り付けられた基板厚み測定部とA substrate thickness measuring unit attached to the coating nozzle for optically measuring the thickness of the substrate;
を有し、Have
前記水平移動部および前記昇降部により、前記ステージ上の前記基板に対して前記塗布ノズルを相対的に斜め下方に降ろしながら塗布開始位置まで前記塗布ノズルを移動させ、その斜め下方に降ろす最中または途中で、前記基板厚み測定部が異なる位置で前記基板の厚みを複数回測定し、その測定値に基づいて前記塗布ノズルの下端の吐出口と前記基板との間に設定距離のギャップを形成する塗布装置。While moving the application nozzle to the application start position while lowering the application nozzle obliquely downward relative to the substrate on the stage by the horizontal moving part and the elevating part, In the middle, the thickness of the substrate is measured a plurality of times at different positions of the substrate thickness measurement unit, and a gap of a set distance is formed between the discharge port at the lower end of the coating nozzle and the substrate based on the measured value. Coating device.

前記基板がガラス基板であり、The substrate is a glass substrate;
前記基板の周縁部に膜無しの透明な非製品領域が設定され、A transparent non-product area without a film is set on the peripheral edge of the substrate,
前記基板厚み測定部が前記非製品領域において前記基板の厚さを測定する請求項１５〜１７のいずれか一項に記載の塗布装置。The coating apparatus according to any one of claims 15 to 17, wherein the substrate thickness measuring unit measures the thickness of the substrate in the non-product region.

被処理基板を下からの支持でほぼ水平に保つ第１の工程と、A first step of keeping the substrate to be processed substantially horizontal with support from below;
前記基板に処理液を供給するための塗布ノズルを前記基板の上方で相対的に移動させて、前記塗布ノズルに取り付けた基板厚み測定部により前記基板の厚みを測定する第２の工程と、A second step of measuring a thickness of the substrate by a substrate thickness measuring unit attached to the coating nozzle by relatively moving an application nozzle for supplying a processing liquid to the substrate above the substrate;
前記基板厚み測定部で得られた厚み測定値に基づき、前記塗布ノズルを前記基板の上方で鉛直方向に相対的に移動させて、前記塗布ノズルの下端の吐出口と前記基板との間に設定距離のギャップを形成する第３の工程と、Based on the thickness measurement value obtained by the substrate thickness measurement unit, the coating nozzle is moved relative to the vertical direction above the substrate and set between the discharge port at the lower end of the coating nozzle and the substrate. A third step of forming a distance gap;
前記塗布ノズルより前記基板に対して処理液を吐出させながら、前記塗布ノズルと前記基板とを所定の水平方向で相対的に移動させて、前記基板上に処理液を塗布する第４の工程とA fourth step of applying the treatment liquid onto the substrate by causing the application nozzle and the substrate to move relatively in a predetermined horizontal direction while discharging the treatment liquid from the application nozzle to the substrate;
を有する塗布方法。A coating method comprising:

被処理基板を下からの支持でほぼ水平に保つ第１の工程と、A first step of keeping the substrate to be processed substantially horizontal with support from below;
前記基板に処理液を供給するための塗布ノズルの下端部に処理液の液膜を付ける第２の工程と、A second step of attaching a liquid film of the processing liquid to the lower end of the coating nozzle for supplying the processing liquid to the substrate;
前記塗布ノズルを前記基板の上方で相対的に移動させて、前記塗布ノズルに取り付けた基板厚み測定部により前記基板の厚みを測定する第３の工程と、A third step of relatively moving the coating nozzle above the substrate and measuring the thickness of the substrate by a substrate thickness measuring unit attached to the coating nozzle;
前記基板厚み測定部で得られた厚み測定値に基づき、前記塗布ノズルを前記基板の上方で鉛直方向に相対的に移動させて、前記塗布ノズルの下端の吐出口と前記基板との間に設定距離のギャップを形成する第４の工程と、Based on the thickness measurement value obtained by the substrate thickness measurement unit, the coating nozzle is moved relative to the vertical direction above the substrate and set between the discharge port at the lower end of the coating nozzle and the substrate. A fourth step of forming a distance gap;
前記塗布ノズルより前記基板に対して処理液を吐出させながら、前記塗布ノズルと前記基板とを所定の水平方向で相対的に移動させて、前記基板上に処理液を塗布する第５の工程とA fifth step of applying the treatment liquid onto the substrate by causing the application nozzle and the substrate to move relatively in a predetermined horizontal direction while discharging the treatment liquid from the application nozzle to the substrate;
を有する塗布方法。A coating method comprising: