JP2006024584A - Flexible printed board - Google Patents

Flexible printed board Download PDF

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JP2006024584A
JP2006024584A JP2004198734A JP2004198734A JP2006024584A JP 2006024584 A JP2006024584 A JP 2006024584A JP 2004198734 A JP2004198734 A JP 2004198734A JP 2004198734 A JP2004198734 A JP 2004198734A JP 2006024584 A JP2006024584 A JP 2006024584A
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flexible printed
printed circuit
circuit board
substrate
substrates
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JP4398311B2 (en
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Shingo Ueda
信吾 上田
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Sumitomo Electric Printed Circuits Inc
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Sumitomo Electric Printed Circuits Inc
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Priority to JP2004198734A priority Critical patent/JP4398311B2/en
Priority to KR1020050054288A priority patent/KR101098132B1/en
Priority to TW094121553A priority patent/TWI368464B/en
Priority to CN2005100814015A priority patent/CN1725931B/en
Publication of JP2006024584A publication Critical patent/JP2006024584A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible printed board having a conductor portion for interconnecting circuit members and produced by laying a plurality of substrates in layers in which frictional sound is not generated at the time of bending even if releasable resin is not applied to the contact surface between the substrates. <P>SOLUTION: In the flexible printed board, protrusions and recesses are provided on the contacting side surface of the substrate especially by polishing or embossing. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、折畳み式携帯電話のヒンジ部等に使用されるフレキシブルプリント基板に関する。   The present invention relates to a flexible printed circuit board used for a hinge portion of a folding cellular phone.

折畳み式携帯電話や折畳み式パソコン等のような、ヒンジ部にて回動可能に軸支される２つの筐体からなる電気機器において、２つの筐体のそれぞれに設けられた回路部材を電気的に接続するために、ベースフィルムに導線部を備えた可撓性のフレキシブルプリント基板が用いられる。このフレキシブルプリント基板は、折畳み式電気機器の開閉に伴い大きな屈曲が繰り返される。   In an electric device composed of two housings pivotally supported by a hinge portion, such as a folding mobile phone or a folding personal computer, the circuit members provided in each of the two housings are electrically connected. In order to connect to the base, a flexible flexible printed circuit board having a lead wire portion on the base film is used. The flexible printed circuit board is repeatedly bent greatly as the folding electric device is opened and closed.

そこで、屈曲に伴い発生する応力を低減するため、例えば、図１に示されるように、ヒンジ部の回動軸の周囲を一周するように螺旋状に巻付けられて設置されている。なお、図１（及び後述する図２、３）中の接続部とは、フレキシブルプリント基板の導線部と回路部材を電気的に接続する部分である。   Therefore, in order to reduce the stress generated due to the bending, for example, as shown in FIG. 1, it is wound and installed so as to make a round around the rotation shaft of the hinge portion. In addition, the connection part in FIG. 1 (and FIG. 2, 3 mentioned later) is a part which electrically connects the conducting wire part and circuit member of a flexible printed circuit board.

しかし、このような設置方法によっても、巻付けの内周側と外周側との間で、屈曲の際の伸びの大きさが異なるので、基板内に応力が発生しやすい。そこで、内周側と外周側とを２枚の基板に分離し、この２枚を重ね合わせたフレキシブルプリント基板が提案され、使用されている。   However, even with such an installation method, since the magnitude of elongation at the time of bending differs between the inner peripheral side and the outer peripheral side of the winding, stress is easily generated in the substrate. Therefore, a flexible printed circuit board in which the inner peripheral side and the outer peripheral side are separated into two substrates and the two substrates are superposed has been proposed and used.

例えば、特許第３５１５４９０号公報には、図２で示されるような基板を、折曲げ線に沿って二つ折りにし、図３で示すように２枚の基板を重ね合わせたフレキシブルプリント基板が開示されている（特許第３５１５４９０号公報の図１、図２）。このように、内周側と外周側とを独立したフィルムからなる基板とすることにより、折畳み式電気機器の開閉の際でも、屈曲の応力を分散することができる。   For example, Japanese Patent No. 3515490 discloses a flexible printed circuit board in which a substrate as shown in FIG. 2 is folded in two along a fold line and two substrates are overlapped as shown in FIG. (FIGS. 1 and 2 of Japanese Patent No. 3515490). In this way, by using a substrate made of independent films on the inner peripheral side and the outer peripheral side, bending stress can be dispersed even when the folding electric device is opened and closed.

又、特開２００４−７９７３０号公報（請求項１）にも、２枚の基板を重ね合わせたフレキシブルプリント基板が開示されている。このフレキシブルプリント基板では、一方の基板のフィルムに切り込みを入れ、屈曲されやすいようにされている。   Japanese Patent Laying-Open No. 2004-79730 (Claim 1) also discloses a flexible printed circuit board in which two substrates are superimposed. In this flexible printed circuit board, a film on one of the substrates is cut to be easily bent.

しかし、このような複数枚の基板を重ね合わせたフレキシブルプリント基板は、その屈曲時に、重なり合った基板の互いに接触する面同士がこすれあうことによって摩擦音が発生するとの問題があった。そこで、この問題を解決するため、現状では、フィルムの表面にシリコン系樹脂等の離型性のある樹脂を塗布する等の対策を行っている。   However, such a flexible printed circuit board in which a plurality of substrates are overlapped has a problem that frictional noise is generated when the surfaces of the overlapping substrates that are in contact with each other are rubbed when bent. Therefore, in order to solve this problem, currently, measures such as applying a releasable resin such as a silicon-based resin to the surface of the film are being taken.

しかし、フレキシブルプリント基板は、通常、部品実装するため部分、例えばランド等を有し、又補強板が接着剤で貼り付けられる。このランド窓等の部分や、補強板が貼り付けられる部分には、離型性のある樹脂の塗布は避けなければならない。そこで、これらの部分を避けて離型性のある樹脂を塗布する必要があるが、この結果、塗布の作業性が非常に低下するとの問題があった。   However, the flexible printed board usually has a part for mounting components, such as a land, and a reinforcing plate is attached with an adhesive. Application of releasable resin should be avoided on the land window and other parts and on the part where the reinforcing plate is attached. Therefore, it is necessary to apply a resin having a releasability while avoiding these portions, but as a result, there is a problem that the workability of the application is extremely lowered.

又、これらの部分を避けて離型性のある樹脂を塗布しても、塗布された部分よりランド窓や補強板の貼り付け部分に、樹脂がシミ出すこともあり、その結果、付着不良等の発生要因ともなった。そこで、離型性のある樹脂を塗布することなく、屈曲時の摩擦音の発生がないフレキシブルプリント基板が望まれていた。
特許第３５１５４９０号公報 特開２００４−７９７３０号公報（請求項１） In addition, even if a resin having releasability is applied while avoiding these parts, the resin may bleed out from the applied part to the land window or the reinforcement plate, resulting in poor adhesion, etc. It became the cause of the occurrence. Therefore, there has been a demand for a flexible printed circuit board that does not generate frictional sound during bending without applying a resin having releasability.
Japanese Patent No. 3515490 JP 2004-79730 A (Claim 1)

本発明は、回路部材間を接続するための導線部を備え、複数枚の基板を重ね合わせてなるフレキシブルプリント基板であって、基板間の互いに接触する面に離型性のある樹脂を塗布しなくても、屈曲時の摩擦音の発生がないフレキシブルプリント基板を提供することを課題とする。   The present invention is a flexible printed circuit board having a conductive wire part for connecting circuit members and having a plurality of substrates stacked on top of each other. It is an object of the present invention to provide a flexible printed circuit board that does not generate frictional noise when bent.

本発明者は、基板のベースフィルム表面の摩擦力と摩擦音との関係を検討した結果、摩擦力が小さい程、摩擦音が小さくなるとともに、この摩擦力を下げるためにはこすれ合う面側の基板同士の接触面積を小さくすることが有効であること、その接触面積を小さくするためには、基板のベースフィルム表面に凹凸を付けることが有効であることを見出し、本発明を完成した。   As a result of examining the relationship between the frictional force and the frictional sound of the base film surface of the substrate, the present inventor found that the smaller the frictional force, the smaller the frictional noise. The present inventors have found that it is effective to reduce the contact area of the substrate, and that it is effective to provide unevenness on the surface of the base film of the substrate in order to reduce the contact area.

本発明は、回路部材間を接続するための導線部を備え、複数枚の基板を重ね合わせてなるフレキシブルプリント基板であって、互いに接触する側の基板表面に凹凸をつけたことを特徴とするフレキシブルプリント基板を提供するものである。   The present invention is a flexible printed circuit board having a conductor portion for connecting circuit members and having a plurality of substrates stacked thereon, wherein the substrate surfaces on the side in contact with each other are uneven. A flexible printed circuit board is provided.

このフレキシブルプリント基板は、通常、可撓性のベースフィルムと、このベースフィルム上の片面又は両面やベースフィルム内に設けられた導線部からなる。導線部は、ヒンジ部にて回動可能に軸支される２つの筐体のそれぞれに設けられた回路部材間を電気的に接続するものである。ベースフィルムとしては、耐熱性や機械的強度に優れたポリイミド樹脂が好適に用いられている。   This flexible printed circuit board is usually composed of a flexible base film and one or both surfaces of the base film or a conductor portion provided in the base film. The conducting wire portion electrically connects circuit members provided in each of the two housings pivotally supported by the hinge portion. As the base film, a polyimide resin excellent in heat resistance and mechanical strength is suitably used.

２枚の基板の重ね合わせは、図２、図３で示されるように、折曲げ線に沿って二つ折りする方法によってもよいし、他の方法によってもよい。又、折曲げ線も、図２、図３の例のような、フレキシブルプリント基板の長さ方向に平行な線に限定されない。例えば長さ方向に垂直な線に沿って二つ折りする方法でもよい。   As shown in FIG. 2 and FIG. 3, the two substrates may be overlapped by a method of folding them in two along a fold line or by another method. Further, the folding line is not limited to a line parallel to the length direction of the flexible printed circuit board as in the examples of FIGS. For example, a method of folding in half along a line perpendicular to the length direction may be used.

凹凸の大きさとしては、０．５〜６．０μｍの範囲が好ましい。凹凸の大きさが、６．０μｍを越えると、基板同士のすべりが悪くなり、かえって引っかかりによる摩擦音が生じる場合があり、又屈曲性が悪くなる。一方、凹凸の大きさが、０．５μｍ未満の場合は、摩擦音の防止効果が充分でない場合がある。請求項２は、この好ましい態様に該当し、前記のフレキシブルプリント基板であって、基板表面の凹凸の大きさが、０．５〜６．０μｍであることを特徴とするフレキシブルプリント基板を提供するものである。凹凸を付けることにより、摩擦音の発生を防ぐことができるとともに、補強板を接着剤で付ける際等の密着力を低下することはなく、かえって向上させることができる。   The size of the irregularities is preferably in the range of 0.5 to 6.0 μm. If the size of the irregularities exceeds 6.0 μm, the slippage between the substrates is deteriorated, and frictional noise due to catching may be generated, and the flexibility is deteriorated. On the other hand, when the size of the unevenness is less than 0.5 μm, the effect of preventing frictional noise may not be sufficient. A second aspect of the present invention corresponds to this preferred embodiment, and provides the flexible printed board, wherein the size of the irregularities on the surface of the board is 0.5 to 6.0 μm. Is. By providing the unevenness, it is possible to prevent the generation of frictional noise and to improve the adhesion without reducing the adhesion when attaching the reinforcing plate with an adhesive.

互いに接触する側の基板表面に凹凸をつける方法としては、表面を研磨剤等で研磨する方法が例示される。請求項３は、この態様に該当し、前記のフレキシブルプリント基板であって、基板表面の凹凸が、基板表面を研磨する方法により形成されたことを特徴とするフレキシブルプリント基板を提供するものである。   Examples of a method for forming irregularities on the substrate surfaces that are in contact with each other include a method of polishing the surface with an abrasive or the like. A third aspect of the present invention corresponds to this aspect, and provides the flexible printed circuit board according to the above-described flexible printed circuit board, wherein the unevenness of the substrate surface is formed by a method of polishing the substrate surface. .

用いられる研磨剤としては、極小のアルミナ、シリカ、化学繊維等が挙げられる。又、研磨は、サンドブラスト、すなわち極小のアルミナ、シリカ粒等を風圧で、前記の基板表面のような被研磨材にぶつける装置、ウェットブラスト、すなわち極小のアルミナ、シリカ粒等を水に混ぜ込み、水圧で被研磨材にぶつける装置、ブラシ研磨、すなわち化学繊維のロールブラシが回転している中に被研磨材を通して、表面に凹凸を作る装置、等を用いて行うことができる。   Examples of the abrasive used include extremely small alumina, silica, and chemical fiber. Also, the polishing is sand blasting, that is, a device that hits the material to be polished such as the above substrate surface with wind pressure by sandblast, that is, wet blasting, that is, extremely small alumina, silica particles, etc. It can be carried out using a device that strikes the material to be polished with water pressure, a brush polishing, that is, a device that makes the surface to be polished while the chemical fiber roll brush is rotating, and the like.

基板表面に凹凸をつける方法としては、他に、表面のエンボス加工による方法が例示される。請求項４は、この態様に該当し、前記のフレキシブルプリント基板であって、基板表面の凹凸が、エンボス加工により形成されたことを特徴とするフレキシブルプリント基板を提供するものである。   As another method for making the substrate surface uneven, a method by embossing the surface is exemplified. A fourth aspect of the present invention corresponds to this aspect, and provides the flexible printed board described above, wherein the irregularities on the surface of the board are formed by embossing.

ここでエンボス加工とは、フィルムである被加工材の表面に凹凸をつける加工を言い、例えば、加熱された凹凸のついた金属ロールとフィルムを接触させて、フィルム表面に凹凸をつける方法により行われる。加熱温度が高い方が加工性は良いが、高すぎるとフィルムが熱により変形して寸法変化を起したり焦げたりするので、通常加熱温度は１５０〜２５０℃程度である。   Here, embossing refers to a process of forming irregularities on the surface of a workpiece, which is a film. Is called. The higher the heating temperature, the better the workability. However, if the heating temperature is too high, the film is deformed by heat and causes dimensional change or scorching.

研磨やエンボス加工は、フレキシブルプリント基板形成前のベースフィルム及びカバーレイフィルムに使用されているポリイミドフィルム上に行うことができる。更に、サンドブラスト、ウェットブラスト、ブラシ研磨はベースフィルム及びカバーレイに加工した後のフィルムにも行うことができる。又、このようにして、ベースフィルム上に研磨やエンボス加工を施した後、ベースフィルムの反対の面に導線部を形成することができる。これらの処理は容易であり、これらの処理に伴い生産性が低下することはない。   Polishing and embossing can be performed on the polyimide film used for the base film and coverlay film before forming the flexible printed circuit board. Furthermore, sandblasting, wet blasting, and brush polishing can also be performed on a base film and a film after processing into a coverlay. In addition, in this way, after conducting polishing or embossing on the base film, a conductor portion can be formed on the opposite surface of the base film. These processes are easy, and productivity does not fall with these processes.

本発明のフレキシブルプリント基板は、互いに接触する側の基板表面に離型性のある樹脂を塗布しなくても、屈曲時における基板表面間の摩擦音を生じない。離型性のある樹脂の塗布が必要ないので、部分的に塗布の処理を施すという作業性の低い製造方法を採る必要はない。又、先行技術で問題であったランド窓等へのシミ出しの問題もなく、この問題に伴う付着不良等は発生しない。さらに、表面に凹凸を付けることにより基板表面間の摩擦力が低下し、ヒンジ屈曲時の基板相互間の自由度が増して応力が分散することから、屈曲性も向上する。   The flexible printed circuit board of the present invention does not generate frictional sound between the substrate surfaces when bent without applying a resin having releasability to the substrate surfaces that are in contact with each other. Since it is not necessary to apply a resin having releasability, it is not necessary to adopt a manufacturing method with low workability in which a coating process is partially performed. Further, there is no problem of smearing on the land window or the like, which was a problem in the prior art, and no adhesion failure or the like associated with this problem occurs. Further, by providing unevenness on the surface, the frictional force between the substrate surfaces is reduced, the degree of freedom is increased between the substrates when the hinge is bent, and the stress is dispersed, so that the flexibility is improved.

次に本発明を実施するための最良の形態を、実施例により説明する。なお、本発明はこの形態に限定されるものではなく、本発明の趣旨を損なわない限り、他の形態へ変更することができる。   Next, the best mode for carrying out the present invention will be described by way of examples. Note that the present invention is not limited to this form, and can be changed to other forms as long as the gist of the present invention is not impaired.

実施例１
ポリイミド樹脂（カプトンＨＡ、厚み２５μｍ）フィルムの片面を、♯８００のアルミナを用い１０〜３０ｍｍ／秒で研磨し、高さ及び繰返しが２μｍの凹凸を形成した。このポリイミド樹脂フィルムを用い、図２で表わされる基板を作製した。なお、基板の長さ（接続部間の間隔）は５５ｍｍであり、基板の幅は８ｍｍであった。 Example 1
One side of a polyimide resin (Kapton HA, thickness 25 μm) film was polished at 10 to 30 mm / second using # 800 alumina to form irregularities having a height and repetition of 2 μm. A substrate represented in FIG. 2 was prepared using this polyimide resin film. The length of the substrate (interval between connecting portions) was 55 mm, and the width of the substrate was 8 mm.

導線部は、研磨した面とは反対の面に銅箔を積層した後エッチングにより形成し、その上にポリイミド樹脂（カプトンＨＡ、厚み２５μｍ）フィルムであるカバーレイを積層した。得られた基板を図２の折曲げ線に沿って二つ折りし、図３で示すフレキシブルプリント基板を得た。この基板を、図１で示すように、折畳み式携帯電話のヒンジ部に巻付け、折畳み式携帯電話のそれぞれの筐体内の回路部材を接続した。   The conducting wire part was formed by etching after laminating a copper foil on the surface opposite to the polished surface, and a cover lay made of a polyimide resin (Kapton HA, thickness 25 μm) film was laminated thereon. The obtained substrate was folded in two along the fold line in FIG. 2 to obtain a flexible printed substrate shown in FIG. As shown in FIG. 1, this board was wound around a hinge part of a foldable mobile phone, and circuit members in respective cases of the foldable mobile phone were connected.

巻付け後、折畳み式携帯電話の開閉を行い、摩擦音の有無を、耳で聞き取る方法により確認して評価した。その結果を表１に示す。又、折畳み式携帯電話の開閉を繰返し、導線部の断線が生じるまでの回数を測定し、屈曲性を評価した。その結果も表１に示す。   After winding, the folding cellular phone was opened and closed, and the presence or absence of frictional sound was confirmed and evaluated by a method of listening with the ear. The results are shown in Table 1. Further, the folding cellular phone was repeatedly opened and closed, and the number of times until the conductor part was broken was measured to evaluate the flexibility. The results are also shown in Table 1.

実施例２
研磨の代りに、以下の条件で、熱ラミによるエンボス加工を行った以外は実施例１と同様にして、ポリイミド樹脂の片面に、高さ及び繰返しが２μｍの凹凸を形成し、フレキシブルプリント基板を作製した。その後、実施例１と同様にして摩擦音の有無及び屈曲性を評価した。その結果も表１に示す。 Example 2
Instead of polishing, except for embossing by thermal lamination under the following conditions, in the same manner as in Example 1, irregularities with a height and repetition of 2 μm were formed on one side of the polyimide resin, and a flexible printed circuit board was formed. Produced. Thereafter, in the same manner as in Example 1, the presence or absence of frictional noise and the flexibility were evaluated. The results are also shown in Table 1.

エンボス加工の条件：２μｍの凹凸をつけた金属ロールを１９０℃に加熱し、フィルムをその間に１０ｍｍ／分で流して加工した。 Embossing conditions: A metal roll with 2 μm irregularities was heated to 190 ° C., and the film was processed at a rate of 10 mm / min.

比較例
凹凸を形成しない以外は実施例１と同様にして、フレキシブルプリント基板を作製した。その後、実施例１と同様にして摩擦音の有無及び屈曲性を評価した。その結果も表１に示す。 Comparative Example A flexible printed circuit board was produced in the same manner as in Example 1 except that the unevenness was not formed. Thereafter, in the same manner as in Example 1, the presence or absence of frictional noise and the flexibility were evaluated. The results are also shown in Table 1.

Figure 2006024584
Figure 2006024584

表１の結果より明らかなように、凹凸を形成しなかった比較例のフレキシブルプリント基板では、屈曲の際摩擦音が発生するのに対し、本発明のフレキシブルプリント基板では、摩擦音の発生はない。又、屈曲性についても、比較例と同等以上が得られている。   As is clear from the results in Table 1, in the flexible printed circuit board of the comparative example in which the unevenness was not formed, frictional sound was generated during bending, whereas in the flexible printed circuit board of the present invention, no frictional sound was generated. In addition, the flexibility is equal to or higher than that of the comparative example.

フレキシブルプリント基板の一使用例を示す平面図である。It is a top view which shows one example of use of a flexible printed circuit board. フレキシブルプリント基板の製造の一過程の例を示す平面図である。It is a top view which shows the example of one process of manufacture of a flexible printed circuit board. フレキシブルプリント基板の一例を示す平面図である。It is a top view which shows an example of a flexible printed circuit board.

Claims (4)

回路部材間を接続するための導線部を備え、複数枚の基板を重ね合わせてなるフレキシブルプリント基板であって、互いに接触する側の基板表面に凹凸をつけたことを特徴とするフレキシブルプリント基板。   A flexible printed circuit board comprising a conductive wire part for connecting circuit members, wherein a plurality of printed circuit boards are overlapped, and uneven surfaces are provided on the surfaces of the printed circuit boards that come into contact with each other. 基板表面の凹凸の大きさが、０．５〜６．０μｍであることを特徴とする請求項１に記載のフレキシブルプリント基板。   The flexible printed circuit board according to claim 1, wherein the size of the irregularities on the surface of the substrate is 0.5 to 6.0 μm. 基板表面の凹凸が、基板表面を研磨する方法により形成されたことを特徴とする請求項１又は請求項２に記載のフレキシブルプリント基板。   The flexible printed board according to claim 1, wherein the unevenness of the substrate surface is formed by a method of polishing the substrate surface. 基板表面の凹凸が、基板表面をエンボス加工する方法により形成されたことを特徴とする請求項１又は請求項２に記載のフレキシブルプリント基板。

The flexible printed circuit board according to claim 1, wherein the unevenness of the substrate surface is formed by a method of embossing the substrate surface.

JP2004198734A 2004-07-06 2004-07-06 Flexible printed circuit board Expired - Lifetime JP4398311B2 (en)

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TW094121553A TWI368464B (en) 2004-07-06 2005-06-28 Flexible print circuit board
CN2005100814015A CN1725931B (en) 2004-07-06 2005-06-30 Flexible printing substrate

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JP2007299623A (en) * 2006-04-28 2007-11-15 Optrex Corp Connecting board of folding-back type electric equipment
JP2008153478A (en) * 2006-12-19 2008-07-03 Nitto Denko Corp Printed wiring board, manufacturing method thereof and electronic apparatus
WO2009037976A1 (en) * 2007-09-20 2009-03-26 Omron Corporation Optical wiring arrangement and optical transmission module
JP2011129725A (en) * 2009-12-18 2011-06-30 Sumitomo Electric Printed Circuit Inc Flexible printed wiring board, housing structure, electronic equipment
KR20160121914A (en) * 2015-04-13 2016-10-21 (주) 액트 Flexible Bonding Structure including Flexible-Joints and FPCB

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CN108400180B (en) * 2018-01-25 2020-06-16 北京工业大学 Textured substrate enhances electrical stability of flexible devices under mechanical stress

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JP3515490B2 (en) * 2000-06-30 2004-04-05 三洋電機株式会社 Flexible printed circuit board and foldable mobile phone terminal having flexible printed circuit board
JP2002368440A (en) * 2001-06-06 2002-12-20 Toshiba Corp Folding type electronic device and its flexible board
TW591671B (en) * 2001-06-27 2004-06-11 Shinetsu Chemical Co Substrate for flexible printed wiring
JP2004079730A (en) 2002-08-15 2004-03-11 Nippon Mektron Ltd Flexible circuit board

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007299623A (en) * 2006-04-28 2007-11-15 Optrex Corp Connecting board of folding-back type electric equipment
JP2008153478A (en) * 2006-12-19 2008-07-03 Nitto Denko Corp Printed wiring board, manufacturing method thereof and electronic apparatus
WO2009037976A1 (en) * 2007-09-20 2009-03-26 Omron Corporation Optical wiring arrangement and optical transmission module
JP2009075365A (en) * 2007-09-20 2009-04-09 Omron Corp Optical wiring and light transmission module
JP2011129725A (en) * 2009-12-18 2011-06-30 Sumitomo Electric Printed Circuit Inc Flexible printed wiring board, housing structure, electronic equipment
KR20160121914A (en) * 2015-04-13 2016-10-21 (주) 액트 Flexible Bonding Structure including Flexible-Joints and FPCB
KR101676747B1 (en) 2015-04-13 2016-11-16 (주) 액트 Flexible Bonding Structure including Flexible-Joints and FPCB

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