JP2004079730A - Flexible circuit board - Google Patents

Flexible circuit board Download PDF

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Publication number
JP2004079730A
JP2004079730A JP2002236967A JP2002236967A JP2004079730A JP 2004079730 A JP2004079730 A JP 2004079730A JP 2002236967 A JP2002236967 A JP 2002236967A JP 2002236967 A JP2002236967 A JP 2002236967A JP 2004079730 A JP2004079730 A JP 2004079730A
Authority
JP
Japan
Prior art keywords
cable
circuit board
flexible circuit
cable portion
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002236967A
Other languages
Japanese (ja)
Inventor
Tsutomu Saito
斎　藤　　　勉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP2002236967A priority Critical patent/JP2004079730A/en
Publication of JP2004079730A publication Critical patent/JP2004079730A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible circuit board in which compressive strains caused by bending hardly occur in the inside cable section of overlapping cable sections. <P>SOLUTION: On the flexible circuit board on which component mounting sections 11 and 12 are connected to each other through the cable sections 21 and 22, notches 21A are provided along the side edges of the cable sections 21 and 22 in the root portions of the sections 21 and 22. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【産業上の利用分野】
本発明は、可撓性回路基板に係り、とくに部品実装部とケーブル部とを有する可撓性回路基板における部品実装部とケーブル部との連結部の構造に関する。
【０００２】
【従来の技術】
小型電子機器における回路基板としては、可撓性回路基板が汎用されている。そして、小型電子機器には、たとえば携帯電話、携帯情報端末のように、筐体が折り畳み構造であって一方の筐体部分と他方の筐体部分とを結ぶヒンジに、可撓性回路基板の一部を組み込んで、回路接続を行うものがある。このような可撓性回路基板は、筐体内に収容される部品実装部と筐体間を結ぶケーブル部とによって基板が構成され、ケーブル部がヒンジ内に組み込まれる。
【０００３】
ここにおいて、電子機器は高機能化の一途を辿っており、回路基板が益々高密度化しており、ケーブル部に設けられる回路配線パターンも多数の線路を要するようになっている。一方で、電子機器は小型化が要請されており、回路基板はケーブル部を含めてコンパクトに構成する必要がある。このような状況の下で、ケーブル部を複数の部分により構成し、これら複数の部分が互いに重なり合った構造として、小型でありながら線路数を増大することが行われている。
【０００４】
図１０は、この重なり合った構造のケーブル部２１，２２を有する可撓性回路基板を展開して示したものであり、部品実装部１１，１２を結ぶ一点鎖線が折り畳み線である。
【０００５】
【発明が解決しようとする課題】
この折り畳み線に沿ってケーブル部を折り畳んで重なり状態とした上で、電子機器のヒンジ部にα字状に巻き付けると、ケーブル部の内径側、外径側の長さが同一であるため、内径側に撓みが生じる。この結果、電子機器のヒンジ部の屈曲に影響を及ぼし、他方、ケーブル部には局部的な歪みを生じさせてしまう。
【０００６】
本発明は上述の点を考慮してなされたもので、重なり構造のケーブル部における内径側ケーブル部に屈曲による圧縮歪みを生じ難い可撓性回路基板を提供することを目的とする。
【０００７】
【課題を解決するための手段】
上記目的達成のため、本発明では、
部品実装部間をケーブル部により接続する可撓性回路基板において、前記部品実装部におけるケーブル部の根元部分に、前記ケーブル部の側縁に沿う方向の切り込みが設けられたことを特徴とする可撓性回路基板、
を提供するものである。
【０００８】
【発明の実施の形態】
図１は、本発明の一実施例におけるケーブル部２２の折り畳み前の展開状態を、また図２は、折り畳み後のケーブル部２１，２２の重なり状態の形状をそれぞれ示している。図１における部品実装部１１，１２を結ぶ一点鎖線はケーブル部２２の畳み込み線であり、図２における破線は畳み込み後のケーブル部２２の輪郭線を示している。
【０００９】
ケーブル部２１の部品実装部１１に寄った根元部分には、切り込み２１Ａが設けられている。この切り込み２１Ａが設けられたことで、ケーブル部２１の屈曲自由度が高まり、圧縮力が作用したときの逃げ余地が生じる。そして、切り込み２１Ａの最奥部と入り口部とでそれぞれ反対向きに折り曲げられて、横から見るとＺ字型をなすように折り曲げ部２１Ｂが形成されている。この折り曲げ部２１Ｂが、切り込み２１Ａと協働して屈曲自由度を一層高めることができる。
【００１０】
この結果、ケーブル部２１は、もう一つのケーブル部２２に比べて折り曲げによる屈曲性を備えており、長手方向の縮み代があるようになる。
【００１１】
そこで、ケーブル部２１を内径側としケーブル部２２を外径側として電子機器のヒンジ部に組み込むと、電子機器の折り畳み時にヒンジ内での巻き込みを強めるにしたがって、外径側のケーブル部２２に張力がかかる一方、内径側のケーブル部２１が圧縮されるようになる。
【００１２】
そして、内径側のケーブル部２１の圧縮度合いがさらに強まると、折り曲げ部２１Ｂが屈曲されてケーブル部２１に長さ方向の圧縮作用を吸収し、縮み効果を与える。この折り曲げ部２１Ｂの縮み効果がある分だけ、ケーブル部２１，２２を電子機器のヒンジ内で円滑に巻き込むことができる。このため、電子機器の使用に際しての、ヒンジを中心にした開閉操作を円滑に行うことができて、電子機器が使い易くなる。
【００１３】
図３は、本発明の他の実施例を示したもので、切り込み２１Ａをケーブル部２１の延長線およびこの延長線に接するように円形の穴との組合せとして構成している。
【００１４】
図４は、本発明のさらに他の実施例を示したもので、切り込み２１Ａをケーブル部２１の延長線およびこの延長線が円の中心に向うように円形の穴との組合せとして構成している。
【００１５】
図５ないし図９は、本発明のもう一つの実施例を製造するための工程を順次示したものである。図５は、図１に示した実施例の折り曲げ部２１Ｂを形成する前の状態であり、図６に示すように治具３１，３２を用いてプレスすることにより折り曲げ部２１Ｂ（図７）を形成する。そして、図７は、ケーブル部２２をケーブル部２１に重なるように畳み込む工程を経た状態を示している。
【００１６】
この図７の状態を側面から見ると、図８に示すようにケーブル部２１ともう一つのケーブル部２２との間には隙間がある。この隙間がなくなるように、ケーブル部２１をケーブル部２２に押付けた上で接着剤２３により固着する。
【００１７】
（変形例）
上記実施例では、２つの部品実装部を結ぶケーブル部の一方の端部に、切り込み２１Ａおよび屈曲部２１Ｂを設けたが、これらの少なくとも一方を必要に応じて両端に設けてもよい。
【００１８】
【発明の効果】
本発明は上述のように、部品実装部を結ぶケーブル部の根元に切り込みを設けたため、ケーブル部の屈曲に自由度が増し重なり構造のケーブル部を重ねたときでも外径側と内径側とがともに調和の取れた状態で屈曲できる。
【００１９】
さらに、内径側のケーブル部に折り曲げ部を設けたため、内径側のケーブル部が折り畳まれる分だけ屈曲時の自由度が増し、電子機器の操作性が改善される。
【図面の簡単な説明】
【図１】本発明の一実施例におけるケーブル部を折り畳む前の状態を示す説明図。
【図２】同実施例におけるケーブル部を折り畳む前の状態を示す説明図。
【図３】本発明の他の実施例における要部を示す説明図。
【図４】本発明のさらに他の実施例における要部を示す説明図。
【図５】本発明のもう一つの実施例における第１の工程を示す説明図。
【図６】図５に続く工程を示す説明図。
【図７】図６に続く工程を示す説明図。
【図８】図７に続く工程を示す説明図。
【図９】図８に続く工程を示す説明図。
【図１０】従来の重なり部を持った可撓性回路基板を示す説明図。
【符号の説明】
１１　部品実装部
１２　部品実装部
２１　ケーブル部
２１Ａ　切り込み
２１Ｂ　折り曲げ部
２２　ケーブル部
２３　接着剤
３１，３２　治具[0001]
[Industrial applications]
The present invention relates to a flexible circuit board, and more particularly to a structure of a connecting portion between a component mounting section and a cable section in a flexible circuit board having a component mounting section and a cable section.
[0002]
[Prior art]
Flexible circuit boards are widely used as circuit boards in small electronic devices. In a small electronic device, for example, a mobile phone or a portable information terminal, a housing has a folding structure and a hinge connecting one housing portion and the other housing portion has a flexible circuit board. There is a device that incorporates a part to perform circuit connection. In such a flexible circuit board, a board is configured by a component mounting section housed in the housing and a cable section connecting the housing, and the cable section is incorporated in the hinge.
[0003]
Here, the electronic devices are continually becoming more sophisticated, the circuit boards are becoming more and more dense, and the circuit wiring patterns provided in the cable section also require a large number of lines. On the other hand, there is a demand for miniaturization of electronic devices, and it is necessary to make a circuit board compact including a cable portion. Under such circumstances, the cable section is constituted by a plurality of portions, and the number of lines is increased while having a small size as a structure in which the plurality of portions overlap each other.
[0004]
FIG. 10 is an exploded view of the flexible circuit board having the cable portions 21 and 22 having the overlapping structure, and a dashed line connecting the component mounting portions 11 and 12 is a folding line.
[0005]
[Problems to be solved by the invention]
After folding the cable portion along the folding line to make it overlapped, and winding it in an α-shape around the hinge portion of the electronic device, the inner and outer diameter sides of the cable portion are the same. Side deflection. As a result, the bending of the hinge portion of the electronic device is affected, while the cable portion is locally distorted.
[0006]
The present invention has been made in consideration of the above points, and has as its object to provide a flexible circuit board in which compression distortion due to bending does not easily occur in an inner diameter side cable part of a cable part having an overlapping structure.
[0007]
[Means for Solving the Problems]
To achieve the above object, the present invention provides:
In a flexible circuit board for connecting between component mounting portions by a cable portion, a cut in a direction along a side edge of the cable portion is provided at a root portion of the cable portion in the component mounting portion. Flexible circuit board,
Is provided.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 shows the unfolded state of the cable portion 22 in one embodiment of the present invention, and FIG. 2 shows the shape of the overlapped state of the cable portions 21 and 22 after folding. A dashed line connecting the component mounting portions 11 and 12 in FIG. 1 is a fold line of the cable portion 22, and a broken line in FIG. 2 shows an outline of the cable portion 22 after folding.
[0009]
A cut 21 </ b> A is provided in a root portion of the cable portion 21 near the component mounting portion 11. By providing the cut 21A, the degree of freedom of bending of the cable portion 21 is increased, and there is room for escape when a compressive force is applied. The cut portion 21A is bent in opposite directions at the innermost portion and the entrance portion, and a bent portion 21B is formed so as to form a Z shape when viewed from the side. The bent portion 21B can further increase the degree of freedom of bending in cooperation with the cut 21A.
[0010]
As a result, the cable portion 21 has flexibility by bending as compared with the other cable portion 22, and has a shrinkage in the longitudinal direction.
[0011]
Therefore, when the cable portion 21 is set to the inside diameter side and the cable portion 22 is set to the outside diameter side and incorporated in the hinge portion of the electronic device, the tension on the outside diameter side cable portion 22 increases as the winding inside the hinge increases when the electronic device is folded. On the other hand, the cable portion 21 on the inner diameter side is compressed.
[0012]
Then, when the degree of compression of the cable portion 21 on the inner diameter side is further increased, the bent portion 21B is bent to absorb the compressive action in the length direction on the cable portion 21 to give a contraction effect. The cable portions 21 and 22 can be smoothly wound in the hinge of the electronic device by the amount of the contraction effect of the bent portion 21B. Therefore, when the electronic device is used, opening and closing operations centering on the hinge can be performed smoothly, and the electronic device is easy to use.
[0013]
FIG. 3 shows another embodiment of the present invention, in which the cut 21A is formed as a combination of an extension of the cable section 21 and a circular hole so as to be in contact with the extension.
[0014]
FIG. 4 shows still another embodiment of the present invention, in which the cut 21A is formed as a combination of an extension of the cable portion 21 and a circular hole such that the extension is directed to the center of the circle. .
[0015]
5 to 9 sequentially show steps for manufacturing another embodiment of the present invention. FIG. 5 shows a state before the bent portion 21B of the embodiment shown in FIG. 1 is formed, and the bent portion 21B (FIG. 7) is pressed by using jigs 31 and 32 as shown in FIG. Form. FIG. 7 shows a state after the step of folding the cable portion 22 so as to overlap the cable portion 21.
[0016]
When the state of FIG. 7 is viewed from the side, there is a gap between the cable portion 21 and another cable portion 22 as shown in FIG. The cable portion 21 is pressed against the cable portion 22 and fixed with an adhesive 23 so as to eliminate the gap.
[0017]
(Modification)
In the above embodiment, the notch 21A and the bent portion 21B are provided at one end of the cable portion connecting the two component mounting portions, but at least one of them may be provided at both ends as necessary.
[0018]
【The invention's effect】
As described above, since the notch is provided at the base of the cable portion connecting the component mounting portions, the degree of freedom in bending the cable portion is increased, and the outer diameter side and the inner diameter side are even when the overlapped cable portion is stacked. Both can bend in a harmonious state.
[0019]
Further, since the bent portion is provided in the cable portion on the inner diameter side, the degree of freedom at the time of bending is increased by an amount corresponding to the folding of the cable portion on the inner diameter side, and the operability of the electronic device is improved.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing a state before a cable unit is folded in an embodiment of the present invention.
FIG. 2 is an explanatory diagram showing a state before folding a cable unit in the embodiment.
FIG. 3 is an explanatory view showing a main part in another embodiment of the present invention.
FIG. 4 is an explanatory view showing a main part in still another embodiment of the present invention.
FIG. 5 is an explanatory view showing a first step in another embodiment of the present invention.
FIG. 6 is an explanatory view showing a step following FIG. 5;
FIG. 7 is an explanatory view showing a step following FIG. 6;
FIG. 8 is an explanatory view showing a step following FIG. 7;
FIG. 9 is an explanatory view showing a step following FIG. 8;
FIG. 10 is an explanatory view showing a conventional flexible circuit board having an overlapping portion.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Component mounting part 12 Component mounting part 21 Cable part 21A Notch 21B Folding part 22 Cable part 23 Adhesive 31, 32 Jig

Claims (4)

部品実装部間をケーブル部により接続する可撓性回路基板において、
前記部品実装部におけるケーブル部の根元部分に、前記ケーブル部の側縁に沿う方向の切り込みが設けられたことを特徴とする可撓性回路基板。In a flexible circuit board that connects between component mounting parts by a cable part,
A flexible circuit board, characterized in that a cut in a direction along a side edge of the cable portion is provided at a root portion of the cable portion in the component mounting portion. 請求項１記載の可撓性回路基板において、
前記ケーブル部は、複数の互いに重なり合った部分からなる構造である可撓性回路基板。The flexible circuit board according to claim 1,
A flexible circuit board, wherein the cable portion has a structure including a plurality of overlapping portions. 請求項１記載の可撓性回路基板において、
前記ケーブル部における前記切り込みの近傍に、前記ケーブルの長さを調節するための折り曲げ部が設けられた可撓性回路基板。The flexible circuit board according to claim 1,
A flexible circuit board provided with a bent portion for adjusting the length of the cable near the cut in the cable portion. 請求項２および３記載の可撓性回路基板において、
前記折り曲げ部近傍の前記ケーブル部が互いに重なり合った部分を接着剤等により固着した可撓性回路基板。The flexible circuit board according to claim 2, wherein
A flexible circuit board in which portions where the cable portions near the bent portions overlap each other are fixed with an adhesive or the like.
JP2002236967A 2002-08-15 2002-08-15 Flexible circuit board Pending JP2004079730A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002236967A JP2004079730A (en) 2002-08-15 2002-08-15 Flexible circuit board

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Application Number Priority Date Filing Date Title
JP2002236967A JP2004079730A (en) 2002-08-15 2002-08-15 Flexible circuit board

Publications (1)

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Family

ID=32020928

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173406A (en) * 2004-12-16 2006-06-29 Nippon Mektron Ltd Method of manufacturing printed circuit board having cabling
JP2006196590A (en) * 2005-01-12 2006-07-27 Nippon Mektron Ltd Multilayer flexible printed board and manufacturing method thereof
KR100716828B1 (en) * 2005-03-26 2007-05-09 삼성전기주식회사 Flexible PCB with surplus bent for electronic equipments
JP2007114485A (en) * 2005-10-20 2007-05-10 Ricoh Co Ltd Imaging device with camera-shake compensation function
JP2007287963A (en) * 2006-04-18 2007-11-01 Nippon Mektron Ltd Hybrid multilayer circuit board and its manufacturing method
JP2008258644A (en) * 2004-10-07 2008-10-23 Nec Saitama Ltd Flexible substrate, electronic equipment, and method of connecting electronic equipment
KR101098132B1 (en) 2004-07-06 2011-12-26 스미토모 덴코 프린트 써키트 가부시키가이샤 Flexible printed circuit board

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101098132B1 (en) 2004-07-06 2011-12-26 스미토모 덴코 프린트 써키트 가부시키가이샤 Flexible printed circuit board
JP2008258644A (en) * 2004-10-07 2008-10-23 Nec Saitama Ltd Flexible substrate, electronic equipment, and method of connecting electronic equipment
JP4683072B2 (en) * 2004-10-07 2011-05-11 日本電気株式会社 Flexible substrate, electronic device, and method of connecting electronic device
JP2006173406A (en) * 2004-12-16 2006-06-29 Nippon Mektron Ltd Method of manufacturing printed circuit board having cabling
JP4515242B2 (en) * 2004-12-16 2010-07-28 日本メクトロン株式会社 Printed circuit board having cable portion and manufacturing method thereof
JP2006196590A (en) * 2005-01-12 2006-07-27 Nippon Mektron Ltd Multilayer flexible printed board and manufacturing method thereof
JP4558516B2 (en) * 2005-01-12 2010-10-06 日本メクトロン株式会社 Printed board
KR100716828B1 (en) * 2005-03-26 2007-05-09 삼성전기주식회사 Flexible PCB with surplus bent for electronic equipments
JP2007114485A (en) * 2005-10-20 2007-05-10 Ricoh Co Ltd Imaging device with camera-shake compensation function
JP2007287963A (en) * 2006-04-18 2007-11-01 Nippon Mektron Ltd Hybrid multilayer circuit board and its manufacturing method

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