JP2005515441A - 電気的測定用プローブとその製造方法 - Google Patents
電気的測定用プローブとその製造方法 Download PDFInfo
- Publication number
- JP2005515441A JP2005515441A JP2003560573A JP2003560573A JP2005515441A JP 2005515441 A JP2005515441 A JP 2005515441A JP 2003560573 A JP2003560573 A JP 2003560573A JP 2003560573 A JP2003560573 A JP 2003560573A JP 2005515441 A JP2005515441 A JP 2005515441A
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- JP
- Japan
- Prior art keywords
- probe
- probe according
- flexible
- substrate
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
- G01N27/9013—Arrangements for scanning
- G01N27/902—Arrangements for scanning by moving the sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims (13)
- 基板を備え、該基板上に少なくとも1つの電気部品が設けられ、被試験体上に載置して用いられる電気的測定用プローブにおいて、
基板(16)を有するプローブ(1)が種々の曲率半径を有する被試験体(10)に適合するように全体として可撓性であることを特徴とする電気的測定用プローブ。 - 基板(16)が可撓性箔であることを特徴とする請求項1記載のプローブ。
- 箔(16)がポリイミドからなることを特徴とする請求項2記載のプローブ。
- 基板(16)上に、電気部品として少なくとも1つのコイル(4、7)、特に銅コイル(4、7)が設けられたことを特徴とする請求項1記載のプローブ。
- 少なくとも1つの電気部品(4、7)を少なくとも部分的に覆う可撓性裏張り(22)を備えることを特徴とする請求項1記載のプローブ。
- 可撓性裏張り(22)がフェライトを混入したポリマー箔により形成されたことを特徴とする請求項5記載のプローブ。
- 可撓性裏張り(22)がフェライト材料からなる可撓性シートにより形成されたことを特徴とする請求項5記載のプローブ。
- 可撓性裏張り(22)が塑性変形の可能な注型樹脂(34)により形成されたことを特徴とする請求項5記載のプローブ。
- 電気部品として、基板(16)上に平坦に配置された少なくとも1つのコイル(4、7)を備えることを特徴とする請求項1記載のプローブ。
- 渦電流測定用プローブ(1)であることを特徴とする請求項1記載のプローブ。
- 強磁性信号増幅部(22)を備えることを特徴とする請求項1記載のプローブ。
- 50mm迄の曲率半径に適応可能であることを特徴とする請求項1記載のプローブ。
- 硬化し得る可撓性の注型樹脂を裏張り(22)として備えた可撓性プローブが、湾曲表面に適応した形状で硬化する、剛性のプローブを作るために使用される請求項1から12の1つに記載の可撓性プローブの使用方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02001268A EP1329730A1 (de) | 2002-01-17 | 2002-01-17 | Wirbelstromsonde auf einem flexiblen Substrat |
PCT/EP2002/014738 WO2003060530A1 (de) | 2002-01-17 | 2002-12-23 | Sonde für elektrische messverfahren und verwendung einer flexiblen sonde zur herstellung einer unflexiblen sonde |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005515441A true JP2005515441A (ja) | 2005-05-26 |
JP2005515441A5 JP2005515441A5 (ja) | 2005-12-22 |
Family
ID=8185297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003560573A Pending JP2005515441A (ja) | 2002-01-17 | 2002-12-23 | 電気的測定用プローブとその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7688067B2 (ja) |
EP (2) | EP1329730A1 (ja) |
JP (1) | JP2005515441A (ja) |
DE (1) | DE50211376D1 (ja) |
WO (1) | WO2003060530A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1496355A1 (de) * | 2003-07-09 | 2005-01-12 | Siemens Aktiengesellschaft | Sonde für elektrische Messverfahren, insbesondere für Wirbelstrommessungen |
US7888932B2 (en) * | 2007-11-05 | 2011-02-15 | General Electric Company | Surface flaw detection system to facilitate nondestructive inspection of a component and methods of assembling the same |
US7688089B2 (en) * | 2008-01-25 | 2010-03-30 | International Business Machines Corporation | Compliant membrane thin film interposer probe for intergrated circuit device testing |
US8269489B2 (en) * | 2008-11-25 | 2012-09-18 | General Electric Company | System and method for eddy current inspection of parts with complex geometries |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58153157A (ja) | 1982-03-05 | 1983-09-12 | Shimadzu Corp | 磁気探傷装置の磁気検出器 |
GB8513006D0 (en) * | 1985-05-22 | 1985-06-26 | Raychem Gmbh | Encapsulating electrical components |
EP0228177A3 (en) * | 1985-11-19 | 1988-11-02 | Electric Power Research Institute, Inc | Flexible eddy-current coil and coil array for nondestructive testing |
US5389876A (en) | 1991-05-06 | 1995-02-14 | General Electric Company | Flexible eddy current surface measurement array for detecting near surface flaws in a conductive part |
JP3208158B2 (ja) | 1991-09-06 | 2001-09-10 | 株式会社東立エンジニアリング | 溶接棒位置決め装置 |
DE4204643C1 (ja) * | 1992-02-15 | 1993-05-19 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De | |
US5315234A (en) | 1992-04-03 | 1994-05-24 | General Electric Company | Eddy current device for inspecting a component having a flexible support with a plural sensor array |
JPH0738956A (ja) | 1993-07-14 | 1995-02-07 | Toshiba Corp | 移動無線通信装置 |
US5510709A (en) * | 1993-09-27 | 1996-04-23 | General Electric Company | Eddy current surface inspection probe for aircraft fastener inspection, and inspection method |
US5467775A (en) * | 1995-03-17 | 1995-11-21 | University Research Engineers & Associates | Modular auscultation sensor and telemetry system |
JPH0983104A (ja) * | 1995-09-12 | 1997-03-28 | Murata Mfg Co Ltd | コイル内蔵回路基板 |
US6002251A (en) | 1995-12-15 | 1999-12-14 | Sun; Yu-Shi | Electromagnetic-field-focusing remote-field eddy-current probe system and method for inspecting anomalies in conducting plates |
JPH10197492A (ja) | 1997-01-08 | 1998-07-31 | Toshiba Corp | 電磁誘導薄膜プローブ |
WO1999023484A1 (de) * | 1997-11-04 | 1999-05-14 | Siemens Aktiengesellschaft | Tastkopf zur wirbelstromprüfung, verfahren zur herstellung eines tastkopfes für eine wirbelstromprüfung und wirbelstromprüfverfahren |
DE19748556A1 (de) | 1997-11-04 | 1999-05-20 | Siemens Ag | Magnetfluß-Meßsystem zur Wirbelstromprüfung und Verfahren zur Wirbelstromprüfung |
US6198280B1 (en) * | 1998-04-27 | 2001-03-06 | Siemens Westinghouse Power Corporation | Eddy current flexible field probe deployed through a loading platform |
US6838890B2 (en) * | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
EP1496355A1 (de) * | 2003-07-09 | 2005-01-12 | Siemens Aktiengesellschaft | Sonde für elektrische Messverfahren, insbesondere für Wirbelstrommessungen |
JP3812559B2 (ja) * | 2003-09-18 | 2006-08-23 | Tdk株式会社 | 渦電流プローブ |
-
2002
- 2002-01-17 EP EP02001268A patent/EP1329730A1/de not_active Withdrawn
- 2002-12-23 JP JP2003560573A patent/JP2005515441A/ja active Pending
- 2002-12-23 DE DE50211376T patent/DE50211376D1/de not_active Expired - Lifetime
- 2002-12-23 WO PCT/EP2002/014738 patent/WO2003060530A1/de active IP Right Grant
- 2002-12-23 US US10/501,724 patent/US7688067B2/en not_active Expired - Fee Related
- 2002-12-23 EP EP02801068A patent/EP1466181B1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1466181B1 (de) | 2007-12-12 |
EP1329730A1 (de) | 2003-07-23 |
US20050140366A1 (en) | 2005-06-30 |
DE50211376D1 (de) | 2008-01-24 |
WO2003060530A1 (de) | 2003-07-24 |
US7688067B2 (en) | 2010-03-30 |
EP1466181A1 (de) | 2004-10-13 |
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