JP2005303180A - 電子部品搭載装置および電子部品搭載方法 - Google Patents
電子部品搭載装置および電子部品搭載方法 Download PDFInfo
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
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- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Burglar Alarm Systems (AREA)
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Abstract
【解決手段】基板13との接合面に接着層を有する電子部品6を加熱ヒータ49を個別に備えた吸着ノズル33aによって保持して基板13に搭載する構成の電子部品搭載において、吸着ノズル33aが電子部品6を保持するために電子部品6に接触した時点から、基板13への搭載動作Mを開始する直前までの第1の加熱時間T1を、搭載動作Mを開始した時点から当該吸着ノズル33aが基板13に搭載された電子部品6から離れる時点までの第2の加熱時間T2より長くなるように、搭載作業動作の時間配分を決定する。これにより、電子部品6を基板13に対して押圧した状態での加熱時間を極小にすることができ、電子部品搭載作業を効率化し実装工程の生産性向上を実現することができる。
【選択図】図7
Description
ら基板に搭載する電子部品搭載装置であって、前記電子部品を供給する電子部品供給部と、前記基板を保持する基板保持部と、前記電子部品を個別に保持する複数の保持ツールおよびこれらの保持ツールに保持された複数の電子部品を加熱する電子部品加熱手段とを備えた搭載ヘッドを有し、前記搭載ヘッドを前記電子部品供給部から前記基板保持部へ移動させ、複数の保持ツールを用いて複数の電子部品を基板に搭載する搭載機構と、前記搭載機構を制御する制御部とを備え、前記電子部品加熱手段は、前記保持ツールが前記電子部品供給部において電子を保持した時点から当該保持ツールによる前記基板に搭載された電子部品の保持を解除する時点まで当該電子部品を加熱するものであり、前記制御部は、前記保持ツールが電子部品を保持するために電子部品に接触した時点から基板への搭載動作を開始する直前までの第1の加熱時間が、前記搭載動作を開始した時点から当該保持ツールが基板に搭載された電子部品から離れる時点までの第2の加熱時間よりも長くなるように、前記搭載機構を制御する。
れた状態で貼着されており、治具ホルダ3に治具4が保持された状態では、電子部品供給部2は平面配列で粘着シート5に貼付けられた状態の電子部品6を供給する。
ーム部材31,第2ビーム部材32はY方向ガイド21に沿ってY方向に水平移動する。
て制御部50による動作制御が行われる。すなわち電子部品供給部2から電子部品6を取り出す際には、ウェハ認識処理部56による電子部品6の位置検出結果に基づいて搭載ヘッド33および搭載ヘッド移動機構51より成る搭載機構を制御する。そして基板13へ電子部品6を搭載する際には、電子部品認識処理部54による電子部品6の位置検出結果および基板認識処理部55による基板13の位置検出結果に基づいて、搭載機構を制御する。
5に示す移動行程D1)。
3 治具ホルダ
4 治具
5 粘着シート
6 チップ
10 基板保持部
13 基板
15 電子部品観察カメラ
33 搭載ヘッド
34 基板観察カメラ
35 ウェハ観察カメラ
Claims (10)
- 基板との接合面に接着層を有する電子部品を加熱しながら基板に搭載する電子部品搭載装置であって、
前記電子部品を供給する電子部品供給部と、前記基板を保持する基板保持部と、前記電子部品を個別に保持する複数の保持ツールおよびこれらの保持ツールに保持された複数の電子部品を加熱する電子部品加熱手段とを備えた搭載ヘッドを有し、前記搭載ヘッドを前記電子部品供給部から前記基板保持部へ移動させ、複数の保持ツールを用いて複数の電子部品を基板に搭載する搭載機構と、前記搭載機構を制御する制御部とを備え、
前記電子部品加熱手段は、前記保持ツールが前記電子部品供給部において電子を保持した時点から当該保持ツールによる前記基板に搭載された電子部品の保持を解除する時点まで当該電子部品を加熱するものであり、
前記制御部は、前記保持ツールが電子部品を保持するために電子部品に接触した時点から基板への搭載動作を開始する直前までの第1の加熱時間が、前記搭載動作を開始した時点から当該保持ツールが基板に搭載された電子部品から離れる時点までの第2の加熱時間よりも長くなるように、前記搭載機構を制御することを特徴とする電子部品搭載装置。 - 前記電子部品加熱手段は、前記保持ツールに個別に設けた加熱ヒータであることを特徴とする請求項1記載の電子部品搭載装置。
- 前記電子部品加熱手段は、非接触方式で複数の保持ツールを加熱する非接触加熱手段であることを特徴とする請求項1記載の電子部品搭載装置。
- 前記基板保持部に、基板を加熱する基板加熱ヒータを備えたことを特徴とする請求項1記載の電子部品搭載装置。
- さらに、保持ツールに保持された複数の電子部品を撮像してこれらの電子部品の位置を認識する電子部品認識手段を備え、前記第1の加熱時間内に前記電子部品認識手段による複数の電子部品の撮像を行うことを特徴とする請求項1記載の電子部品搭載装置。
- 基板との接合面に接着層を有する電子部品を加熱しながら基板に搭載する電子部品搭載方法であって、
電子部品供給部によって供給された前記電子部品を複数の保持ツールによってピックアップするピックアップ動作を搭載ヘッドの複数の保持ツールについて順次行う電子部品保持工程と、前記電子部品保持工程の後、前記搭載ヘッドを前記基板を保持した基板保持部の上方へ移動させる搭載ヘッド移動工程と、前記搭載ヘッド移動工程の後、前記保持ツールを昇降させて電子部品を基板に搭載する搭載動作を複数の保持ツールについて順次行う電子部品搭載工程と、保持ツールが前記電子部品供給部において電子部品に接触して保持した時点から前記基板保持部に保持された基板に搭載された電子部品から当該保持ツールが離れて保持を解除した時点まで当該電子部品を加熱する電子部品加熱工程とを含み、
前記電子部品加熱工程のうち、前記保持ツールが電子部品を保持するために電子部品に接触した時点から基板への搭載動作を開始する直前までの第1の加熱時間を、前記搭載動作を開始した時点から当該保持ツールが基板に搭載された電子部品から離れる時点までの第2の加熱時間よりも長くしたことを特徴とする電子部品搭載方法。 - 前記電子部品加熱工程は、前記保持ツールに個別に設けた加熱ヒータによって行うことを特徴とする請求項6記載の電子部品搭載方法。
- 前記電子部品加熱工程は、非接触方式で複数の保持ツールを加熱する非接触加熱手段であることを特徴とする請求項6記載の電子部品搭載方法。
- 前記電子部品搭載工程において、加熱された基板に対して電子部品を搭載することを特徴とする請求項6記載の電子部品搭載方法。
- さらに、電子部品認識手段により保持ツールに保持された複数の電子部品を撮像してこれらの電子部品の位置を認識する電子部品認識工程を含み、前記第1の加熱時間内に電子部品認識手段による複数の電子部品の撮像を行うことを特徴とする請求項6記載の電子部品搭載方法。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004120166A JP4372605B2 (ja) | 2004-04-15 | 2004-04-15 | 電子部品搭載装置および電子部品搭載方法 |
TW094111119A TW200539282A (en) | 2004-04-15 | 2005-04-08 | Electronic component mounting apparatus and method of mounting electronic components |
KR1020067003544A KR100738769B1 (ko) | 2004-04-15 | 2005-04-08 | 전자부품 장착장치 및 전자부품 장착방법 |
EP05729207A EP1661442B1 (en) | 2004-04-15 | 2005-04-08 | Electronic component mounting apparatus and method of mounting electronic components |
US10/571,289 US7409761B2 (en) | 2004-04-15 | 2005-04-08 | Electronic component mounting apparatus and method of mounting electronic components |
CNB2005800010021A CN100461998C (zh) | 2004-04-15 | 2005-04-08 | 电子部件安装装置以及安装电子部件的方法 |
PCT/JP2005/007276 WO2005101943A2 (en) | 2004-04-15 | 2005-04-08 | Electronic component mounting apparatus and method of mounting electronic components |
AT05729207T ATE367079T1 (de) | 2004-04-15 | 2005-04-08 | Bestückvorrichtung für elektronische bauteile und verfahren zum bestücken elektronischer bauteile |
DE602005001602T DE602005001602T2 (de) | 2004-04-15 | 2005-04-08 | Bestückvorrichtung für elektronische bauteile und verfahren zum bestücken elektronischer bauteile |
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Application Number | Priority Date | Filing Date | Title |
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JP2004120166A JP4372605B2 (ja) | 2004-04-15 | 2004-04-15 | 電子部品搭載装置および電子部品搭載方法 |
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JP2005303180A true JP2005303180A (ja) | 2005-10-27 |
JP4372605B2 JP4372605B2 (ja) | 2009-11-25 |
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JP2004120166A Expired - Fee Related JP4372605B2 (ja) | 2004-04-15 | 2004-04-15 | 電子部品搭載装置および電子部品搭載方法 |
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Country | Link |
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US (1) | US7409761B2 (ja) |
EP (1) | EP1661442B1 (ja) |
JP (1) | JP4372605B2 (ja) |
KR (1) | KR100738769B1 (ja) |
CN (1) | CN100461998C (ja) |
AT (1) | ATE367079T1 (ja) |
DE (1) | DE602005001602T2 (ja) |
TW (1) | TW200539282A (ja) |
WO (1) | WO2005101943A2 (ja) |
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CN103429005A (zh) * | 2012-05-14 | 2013-12-04 | 三星显示有限公司 | 用于显示装置的结合设备和方法 |
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JP4539454B2 (ja) * | 2005-06-20 | 2010-09-08 | パナソニック株式会社 | 電子部品の熱圧着ツールおよび電子部品の実装装置ならびに実装方法 |
JP5003350B2 (ja) * | 2007-08-23 | 2012-08-15 | パナソニック株式会社 | 電子部品実装装置および電子部品実装方法 |
US20100024968A1 (en) * | 2008-07-30 | 2010-02-04 | United Technologies Corporation | Adhesive installation tool |
JP4766144B2 (ja) | 2009-04-08 | 2011-09-07 | パナソニック株式会社 | 電子部品実装装置 |
US7845543B1 (en) * | 2009-11-17 | 2010-12-07 | Asm Assembly Automation Ltd | Apparatus and method for bonding multiple dice |
US20110182701A1 (en) * | 2010-01-28 | 2011-07-28 | Ui Holding Co. | Method and apparatus for transferring die from a wafer |
JP6045310B2 (ja) * | 2012-11-13 | 2016-12-14 | ヤマハファインテック株式会社 | 小片部材の貼り付け装置 |
US9252130B2 (en) * | 2013-03-29 | 2016-02-02 | Stats Chippac, Ltd. | Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding |
CN106134307B (zh) * | 2014-03-24 | 2019-04-19 | 株式会社富士 | 裸片安装***及裸片安装方法 |
DE102014114732B4 (de) * | 2014-10-10 | 2016-06-02 | Trumpf Laser Gmbh | Verfahren zum anbringen eines sättigbaren halbleiter-absorberelements auf einem träger und halbleiter-absorberelement-einheit |
KR20160048301A (ko) * | 2014-10-23 | 2016-05-04 | 삼성전자주식회사 | 본딩 장치 및 그를 포함하는 기판 제조 설비 |
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CN103429005A (zh) * | 2012-05-14 | 2013-12-04 | 三星显示有限公司 | 用于显示装置的结合设备和方法 |
Also Published As
Publication number | Publication date |
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CN1843069A (zh) | 2006-10-04 |
ATE367079T1 (de) | 2007-08-15 |
EP1661442B1 (en) | 2007-07-11 |
DE602005001602D1 (de) | 2007-08-23 |
WO2005101943A2 (en) | 2005-10-27 |
DE602005001602T2 (de) | 2007-11-22 |
WO2005101943A3 (en) | 2006-01-12 |
KR100738769B1 (ko) | 2007-07-12 |
KR20060087513A (ko) | 2006-08-02 |
US20080104831A1 (en) | 2008-05-08 |
US7409761B2 (en) | 2008-08-12 |
JP4372605B2 (ja) | 2009-11-25 |
EP1661442A2 (en) | 2006-05-31 |
CN100461998C (zh) | 2009-02-11 |
TW200539282A (en) | 2005-12-01 |
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