ATE367079T1 - Bestückvorrichtung für elektronische bauteile und verfahren zum bestücken elektronischer bauteile - Google Patents
Bestückvorrichtung für elektronische bauteile und verfahren zum bestücken elektronischer bauteileInfo
- Publication number
- ATE367079T1 ATE367079T1 AT05729207T AT05729207T ATE367079T1 AT E367079 T1 ATE367079 T1 AT E367079T1 AT 05729207 T AT05729207 T AT 05729207T AT 05729207 T AT05729207 T AT 05729207T AT E367079 T1 ATE367079 T1 AT E367079T1
- Authority
- AT
- Austria
- Prior art keywords
- electronic components
- substrate
- mounting
- assembling
- moment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Burglar Alarm Systems (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004120166A JP4372605B2 (ja) | 2004-04-15 | 2004-04-15 | 電子部品搭載装置および電子部品搭載方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE367079T1 true ATE367079T1 (de) | 2007-08-15 |
Family
ID=35064760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05729207T ATE367079T1 (de) | 2004-04-15 | 2005-04-08 | Bestückvorrichtung für elektronische bauteile und verfahren zum bestücken elektronischer bauteile |
Country Status (9)
Country | Link |
---|---|
US (1) | US7409761B2 (de) |
EP (1) | EP1661442B1 (de) |
JP (1) | JP4372605B2 (de) |
KR (1) | KR100738769B1 (de) |
CN (1) | CN100461998C (de) |
AT (1) | ATE367079T1 (de) |
DE (1) | DE602005001602T2 (de) |
TW (1) | TW200539282A (de) |
WO (1) | WO2005101943A2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4539454B2 (ja) * | 2005-06-20 | 2010-09-08 | パナソニック株式会社 | 電子部品の熱圧着ツールおよび電子部品の実装装置ならびに実装方法 |
JP5003350B2 (ja) * | 2007-08-23 | 2012-08-15 | パナソニック株式会社 | 電子部品実装装置および電子部品実装方法 |
US20100024968A1 (en) * | 2008-07-30 | 2010-02-04 | United Technologies Corporation | Adhesive installation tool |
JP4766144B2 (ja) * | 2009-04-08 | 2011-09-07 | パナソニック株式会社 | 電子部品実装装置 |
US7845543B1 (en) * | 2009-11-17 | 2010-12-07 | Asm Assembly Automation Ltd | Apparatus and method for bonding multiple dice |
US20110182701A1 (en) * | 2010-01-28 | 2011-07-28 | Ui Holding Co. | Method and apparatus for transferring die from a wafer |
KR101870241B1 (ko) * | 2012-05-14 | 2018-06-25 | 삼성디스플레이 주식회사 | 표시 장치용 본딩 장치 및 그 방법 |
JP6045310B2 (ja) * | 2012-11-13 | 2016-12-14 | ヤマハファインテック株式会社 | 小片部材の貼り付け装置 |
US9252130B2 (en) * | 2013-03-29 | 2016-02-02 | Stats Chippac, Ltd. | Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding |
EP3125661B1 (de) * | 2014-03-24 | 2020-09-23 | FUJI Corporation | Formmontagesystem und formmontageverfahren |
DE102014114732B4 (de) * | 2014-10-10 | 2016-06-02 | Trumpf Laser Gmbh | Verfahren zum anbringen eines sättigbaren halbleiter-absorberelements auf einem träger und halbleiter-absorberelement-einheit |
KR20160048301A (ko) * | 2014-10-23 | 2016-05-04 | 삼성전자주식회사 | 본딩 장치 및 그를 포함하는 기판 제조 설비 |
WO2017017718A1 (ja) * | 2015-07-24 | 2017-02-02 | 富士機械製造株式会社 | 部品実装機および部品実装システム |
KR102180449B1 (ko) * | 2016-05-13 | 2020-11-19 | 에이에스엠엘 네델란즈 비.브이. | 구성요소 스태킹 및/또는 픽-앤드-플레이스 공정을 위한 다수 미니어처 픽업 요소들 |
WO2017205167A1 (en) * | 2016-05-27 | 2017-11-30 | Universal Instruments Corporation | Dispensing head having a nozzle heater device, system and method |
CH714090B1 (de) | 2016-07-13 | 2022-07-15 | Universal Instruments Corp | Modulares Die-Handhabungssystem. |
CN107072045A (zh) * | 2016-11-30 | 2017-08-18 | 合肥瑞硕科技有限公司 | 一种电路板专用吸取装置 |
TW202119533A (zh) * | 2019-11-04 | 2021-05-16 | 台灣愛司帝科技股份有限公司 | 具有晶片吸附功能的晶片承載結構 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5092510A (en) * | 1990-11-20 | 1992-03-03 | International Business Machines Corporation | Method and apparatus for circuit board support during component mounting |
US5172469A (en) * | 1991-05-08 | 1992-12-22 | Hughes Aircraft Company | Advanced part removal and torque shear station |
JP3324468B2 (ja) * | 1997-10-09 | 2002-09-17 | 松下電器産業株式会社 | ワークの熱圧着装置および熱圧着方法 |
JP3365278B2 (ja) * | 1997-10-29 | 2003-01-08 | 松下電器産業株式会社 | 電子部品の熱圧着装置および熱圧着方法 |
JP4240711B2 (ja) * | 1999-12-27 | 2009-03-18 | 日立化成工業株式会社 | ダイボンディング用接着フィルム及び半導体装置の製造方法 |
JP2001313493A (ja) * | 2000-04-27 | 2001-11-09 | Sony Corp | 電子部品の実装システム |
KR20010114161A (ko) * | 2000-06-21 | 2001-12-29 | 마츠시타 덴끼 산교 가부시키가이샤 | 부품의 장착 장치 및 장착 방법 |
KR200213106Y1 (ko) | 2000-08-30 | 2001-02-15 | 엠피아이주식회사 | 다기능 표면실장부품 마운터 |
WO2002026011A2 (en) * | 2000-09-19 | 2002-03-28 | Matsushita Electric Industrial Co., Ltd. | Component suction device, component mounting apparatus and component mounting method |
JP4663184B2 (ja) * | 2001-09-26 | 2011-03-30 | パナソニック株式会社 | 半導体装置の製造方法 |
JP4409136B2 (ja) * | 2001-12-18 | 2010-02-03 | パナソニック株式会社 | 電子部品搭載装置および電子部品搭載方法 |
US7356918B2 (en) * | 2002-12-02 | 2008-04-15 | Matsushita Electric Industrial Co., Ltd. | Component mounting method |
-
2004
- 2004-04-15 JP JP2004120166A patent/JP4372605B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-08 KR KR1020067003544A patent/KR100738769B1/ko not_active IP Right Cessation
- 2005-04-08 WO PCT/JP2005/007276 patent/WO2005101943A2/en active IP Right Grant
- 2005-04-08 EP EP05729207A patent/EP1661442B1/de not_active Not-in-force
- 2005-04-08 DE DE602005001602T patent/DE602005001602T2/de active Active
- 2005-04-08 CN CNB2005800010021A patent/CN100461998C/zh not_active Expired - Fee Related
- 2005-04-08 TW TW094111119A patent/TW200539282A/zh unknown
- 2005-04-08 AT AT05729207T patent/ATE367079T1/de not_active IP Right Cessation
- 2005-04-08 US US10/571,289 patent/US7409761B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005303180A (ja) | 2005-10-27 |
KR20060087513A (ko) | 2006-08-02 |
CN1843069A (zh) | 2006-10-04 |
DE602005001602D1 (de) | 2007-08-23 |
WO2005101943A3 (en) | 2006-01-12 |
US20080104831A1 (en) | 2008-05-08 |
US7409761B2 (en) | 2008-08-12 |
EP1661442B1 (de) | 2007-07-11 |
EP1661442A2 (de) | 2006-05-31 |
JP4372605B2 (ja) | 2009-11-25 |
DE602005001602T2 (de) | 2007-11-22 |
WO2005101943A2 (en) | 2005-10-27 |
TW200539282A (en) | 2005-12-01 |
CN100461998C (zh) | 2009-02-11 |
KR100738769B1 (ko) | 2007-07-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |