ATE367079T1 - Bestückvorrichtung für elektronische bauteile und verfahren zum bestücken elektronischer bauteile - Google Patents

Bestückvorrichtung für elektronische bauteile und verfahren zum bestücken elektronischer bauteile

Info

Publication number
ATE367079T1
ATE367079T1 AT05729207T AT05729207T ATE367079T1 AT E367079 T1 ATE367079 T1 AT E367079T1 AT 05729207 T AT05729207 T AT 05729207T AT 05729207 T AT05729207 T AT 05729207T AT E367079 T1 ATE367079 T1 AT E367079T1
Authority
AT
Austria
Prior art keywords
electronic components
substrate
mounting
assembling
moment
Prior art date
Application number
AT05729207T
Other languages
English (en)
Inventor
Hiroshi Haji
Mitsuru Ozono
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of ATE367079T1 publication Critical patent/ATE367079T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Burglar Alarm Systems (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
AT05729207T 2004-04-15 2005-04-08 Bestückvorrichtung für elektronische bauteile und verfahren zum bestücken elektronischer bauteile ATE367079T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004120166A JP4372605B2 (ja) 2004-04-15 2004-04-15 電子部品搭載装置および電子部品搭載方法

Publications (1)

Publication Number Publication Date
ATE367079T1 true ATE367079T1 (de) 2007-08-15

Family

ID=35064760

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05729207T ATE367079T1 (de) 2004-04-15 2005-04-08 Bestückvorrichtung für elektronische bauteile und verfahren zum bestücken elektronischer bauteile

Country Status (9)

Country Link
US (1) US7409761B2 (de)
EP (1) EP1661442B1 (de)
JP (1) JP4372605B2 (de)
KR (1) KR100738769B1 (de)
CN (1) CN100461998C (de)
AT (1) ATE367079T1 (de)
DE (1) DE602005001602T2 (de)
TW (1) TW200539282A (de)
WO (1) WO2005101943A2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4539454B2 (ja) * 2005-06-20 2010-09-08 パナソニック株式会社 電子部品の熱圧着ツールおよび電子部品の実装装置ならびに実装方法
JP5003350B2 (ja) * 2007-08-23 2012-08-15 パナソニック株式会社 電子部品実装装置および電子部品実装方法
US20100024968A1 (en) * 2008-07-30 2010-02-04 United Technologies Corporation Adhesive installation tool
JP4766144B2 (ja) * 2009-04-08 2011-09-07 パナソニック株式会社 電子部品実装装置
US7845543B1 (en) * 2009-11-17 2010-12-07 Asm Assembly Automation Ltd Apparatus and method for bonding multiple dice
US20110182701A1 (en) * 2010-01-28 2011-07-28 Ui Holding Co. Method and apparatus for transferring die from a wafer
KR101870241B1 (ko) * 2012-05-14 2018-06-25 삼성디스플레이 주식회사 표시 장치용 본딩 장치 및 그 방법
JP6045310B2 (ja) * 2012-11-13 2016-12-14 ヤマハファインテック株式会社 小片部材の貼り付け装置
US9252130B2 (en) * 2013-03-29 2016-02-02 Stats Chippac, Ltd. Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding
EP3125661B1 (de) * 2014-03-24 2020-09-23 FUJI Corporation Formmontagesystem und formmontageverfahren
DE102014114732B4 (de) * 2014-10-10 2016-06-02 Trumpf Laser Gmbh Verfahren zum anbringen eines sättigbaren halbleiter-absorberelements auf einem träger und halbleiter-absorberelement-einheit
KR20160048301A (ko) * 2014-10-23 2016-05-04 삼성전자주식회사 본딩 장치 및 그를 포함하는 기판 제조 설비
WO2017017718A1 (ja) * 2015-07-24 2017-02-02 富士機械製造株式会社 部品実装機および部品実装システム
KR102180449B1 (ko) * 2016-05-13 2020-11-19 에이에스엠엘 네델란즈 비.브이. 구성요소 스태킹 및/또는 픽-앤드-플레이스 공정을 위한 다수 미니어처 픽업 요소들
WO2017205167A1 (en) * 2016-05-27 2017-11-30 Universal Instruments Corporation Dispensing head having a nozzle heater device, system and method
CH714090B1 (de) 2016-07-13 2022-07-15 Universal Instruments Corp Modulares Die-Handhabungssystem.
CN107072045A (zh) * 2016-11-30 2017-08-18 合肥瑞硕科技有限公司 一种电路板专用吸取装置
TW202119533A (zh) * 2019-11-04 2021-05-16 台灣愛司帝科技股份有限公司 具有晶片吸附功能的晶片承載結構

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5092510A (en) * 1990-11-20 1992-03-03 International Business Machines Corporation Method and apparatus for circuit board support during component mounting
US5172469A (en) * 1991-05-08 1992-12-22 Hughes Aircraft Company Advanced part removal and torque shear station
JP3324468B2 (ja) * 1997-10-09 2002-09-17 松下電器産業株式会社 ワークの熱圧着装置および熱圧着方法
JP3365278B2 (ja) * 1997-10-29 2003-01-08 松下電器産業株式会社 電子部品の熱圧着装置および熱圧着方法
JP4240711B2 (ja) * 1999-12-27 2009-03-18 日立化成工業株式会社 ダイボンディング用接着フィルム及び半導体装置の製造方法
JP2001313493A (ja) * 2000-04-27 2001-11-09 Sony Corp 電子部品の実装システム
KR20010114161A (ko) * 2000-06-21 2001-12-29 마츠시타 덴끼 산교 가부시키가이샤 부품의 장착 장치 및 장착 방법
KR200213106Y1 (ko) 2000-08-30 2001-02-15 엠피아이주식회사 다기능 표면실장부품 마운터
WO2002026011A2 (en) * 2000-09-19 2002-03-28 Matsushita Electric Industrial Co., Ltd. Component suction device, component mounting apparatus and component mounting method
JP4663184B2 (ja) * 2001-09-26 2011-03-30 パナソニック株式会社 半導体装置の製造方法
JP4409136B2 (ja) * 2001-12-18 2010-02-03 パナソニック株式会社 電子部品搭載装置および電子部品搭載方法
US7356918B2 (en) * 2002-12-02 2008-04-15 Matsushita Electric Industrial Co., Ltd. Component mounting method

Also Published As

Publication number Publication date
JP2005303180A (ja) 2005-10-27
KR20060087513A (ko) 2006-08-02
CN1843069A (zh) 2006-10-04
DE602005001602D1 (de) 2007-08-23
WO2005101943A3 (en) 2006-01-12
US20080104831A1 (en) 2008-05-08
US7409761B2 (en) 2008-08-12
EP1661442B1 (de) 2007-07-11
EP1661442A2 (de) 2006-05-31
JP4372605B2 (ja) 2009-11-25
DE602005001602T2 (de) 2007-11-22
WO2005101943A2 (en) 2005-10-27
TW200539282A (en) 2005-12-01
CN100461998C (zh) 2009-02-11
KR100738769B1 (ko) 2007-07-12

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