JP2005158883A - 回路基板 - Google Patents
回路基板 Download PDFInfo
- Publication number
- JP2005158883A JP2005158883A JP2003392676A JP2003392676A JP2005158883A JP 2005158883 A JP2005158883 A JP 2005158883A JP 2003392676 A JP2003392676 A JP 2003392676A JP 2003392676 A JP2003392676 A JP 2003392676A JP 2005158883 A JP2005158883 A JP 2005158883A
- Authority
- JP
- Japan
- Prior art keywords
- metal piece
- circuit board
- solder layer
- substrate
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims abstract description 90
- 229910000679 solder Inorganic materials 0.000 claims abstract description 64
- 238000003466 welding Methods 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000005530 etching Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 230000001965 increasing effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000003825 pressing Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Battery Mounting, Suspending (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
Abstract
【解決手段】 基板1と、基板1に形成された導電性を有するパッド4aと、パッド4aにハンダ層6を介して接合され、かつその表面には溶接対象部材5が溶接される金属片3とを備えた回路基板A1であって、金属片3の溶接対象部3aと基板1との間の少なくとも一部は、空隙部7として形成されており、溶接対象部3aとハンダ層6とは空隙部7を介して離間している。
【選択図】 図2
Description
1 基板
2 電子部品
3 金属片
3a 溶接対象部
4 配線パターン
4a パッド
5 端子部材(溶接対象部材)
6 ハンダ層
7 空隙部
Claims (8)
- 基板と、
上記基板に形成された導電性を有するパッドと、
上記パッドにハンダ層を介して接合され、かつその表面には溶接対象部材が溶接される金属片とを備えた回路基板であって、
上記金属片の溶接対象部と上記基板との間の少なくとも一部は、空隙部として形成されており、上記溶接対象部と上記ハンダ層とは上記空隙部を介して離間していることを特徴とする、回路基板。 - 上記金属片の裏面側には、凹部が形成されており、上記凹部が上記空隙部もしくはその一部となっている、請求項1に記載の回路基板。
- 上記金属片は、その両側縁部が裏面側に折り返された構造を有し、かつこれら折り返された部分どうしの間が上記凹部とされている、請求項2に記載の回路基板。
- 上記金属片は、その両側縁部と中央部とに段差を生じるように折り曲げられており、上記両側縁部間が上記凹部とされている、請求項2に記載の回路基板。
- 上記凹部は、エッチングにより形成されている、請求項2に記載の回路基板。
- 上記金属片は、偏平なパイプ状であり、上記金属片の中空部が上記空隙部となっている、請求項1に記載の回路基板。
- 上記ハンダ層は、互いに離間した複数の領域に分割されており、これら複数の領域間が上記空隙部もしくはその一部となっている、請求項1ないし6のいずれかに記載の回路基板。
- 上記パッドは、上記ハンダ層の複数の領域に対応した複数のパッドに分割されている、請求項7に記載の回路基板。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003392676A JP3776907B2 (ja) | 2003-11-21 | 2003-11-21 | 回路基板 |
CNB2004800343275A CN100566512C (zh) | 2003-11-21 | 2004-11-19 | 电路基板 |
KR1020067009766A KR100820517B1 (ko) | 2003-11-21 | 2004-11-19 | 회로 기판 |
TW093135599A TWI281372B (en) | 2003-11-21 | 2004-11-19 | Circuit board |
US10/580,157 US7439625B2 (en) | 2003-11-21 | 2004-11-19 | Circuit board |
PCT/JP2004/017276 WO2005051057A1 (ja) | 2003-11-21 | 2004-11-19 | 回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003392676A JP3776907B2 (ja) | 2003-11-21 | 2003-11-21 | 回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005158883A true JP2005158883A (ja) | 2005-06-16 |
JP3776907B2 JP3776907B2 (ja) | 2006-05-24 |
Family
ID=34616460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003392676A Expired - Fee Related JP3776907B2 (ja) | 2003-11-21 | 2003-11-21 | 回路基板 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7439625B2 (ja) |
JP (1) | JP3776907B2 (ja) |
KR (1) | KR100820517B1 (ja) |
CN (1) | CN100566512C (ja) |
TW (1) | TWI281372B (ja) |
WO (1) | WO2005051057A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005322568A (ja) * | 2004-05-11 | 2005-11-17 | Nec Tokin Corp | 端子の接続方法及び回路基板 |
JP2007005471A (ja) * | 2005-06-22 | 2007-01-11 | Mitsumi Electric Co Ltd | 回路基板装置 |
JP2007088031A (ja) * | 2005-09-20 | 2007-04-05 | Nec Saitama Ltd | 回路基板 |
JP2009259920A (ja) * | 2008-04-15 | 2009-11-05 | Nec Tokin Corp | 回路基板および回路基板の製造方法 |
JP2013086427A (ja) * | 2011-10-20 | 2013-05-13 | Japan Steel Works Ltd:The | 薄膜を有する成形品の製造方法および製造装置 |
WO2014188860A1 (ja) * | 2013-05-22 | 2014-11-27 | 日立マクセル株式会社 | 保護回路を有する二次電池パック |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101065963B1 (ko) * | 2009-07-28 | 2011-09-19 | 삼성에스디아이 주식회사 | 배터리팩 및 그 제조방법 |
JP5647194B2 (ja) * | 2012-08-09 | 2014-12-24 | 日本メクトロン株式会社 | フレキシブルプリント基板及びその製造方法 |
CN105472879A (zh) * | 2016-01-12 | 2016-04-06 | 深圳市立洋光电子股份有限公司 | 一种alc pcb板的辅助焊接结构及其制备工艺 |
CN113709970B (zh) * | 2021-07-16 | 2022-03-04 | 北京金百泽科技有限公司 | 电子设备、pcb板及其芯片封装结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002050884A (ja) * | 2000-07-31 | 2002-02-15 | Rohm Co Ltd | 回路基板、およびこの回路基板と充電池との接続方法 |
JP2003168407A (ja) * | 2001-11-30 | 2003-06-13 | Toshiba Corp | 電池パック |
JP2004304019A (ja) * | 2003-03-31 | 2004-10-28 | Mitsumi Electric Co Ltd | 回路基板の接続パターン構造及び回路基板 |
JP2004348980A (ja) * | 2003-05-19 | 2004-12-09 | Sony Corp | 端子部材の構造 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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US3793064A (en) * | 1971-11-15 | 1974-02-19 | Du Pont | Product and process for cavity metallization of semiconductor packages |
US3823468A (en) * | 1972-05-26 | 1974-07-16 | N Hascoe | Method of fabricating an hermetically sealed container |
JPS59180514A (ja) * | 1983-03-31 | 1984-10-13 | Toshiba Corp | 光受信モジユ−ル |
US5168344A (en) * | 1990-08-15 | 1992-12-01 | W. R. Grace & Co. Conn. | Ceramic electronic package design |
US5410451A (en) * | 1993-12-20 | 1995-04-25 | Lsi Logic Corporation | Location and standoff pins for chip on tape |
WO1997002596A1 (fr) * | 1995-06-30 | 1997-01-23 | Kabushiki Kaisha Toshiba | Composant electronique et son procede de fabrication |
JP3184929B2 (ja) * | 1996-05-29 | 2001-07-09 | ローム株式会社 | 回路基板への端子の実装方法、および回路基板 |
CN1164153C (zh) | 1996-05-29 | 2004-08-25 | 罗姆股份有限公司 | 电路板上接线端的安装方法以及电路板 |
JP3198331B2 (ja) * | 1997-01-23 | 2001-08-13 | ローム株式会社 | 金属端子片を有する回路基板の製造方法、この製造方法により得られる回路基板、およびこの回路基板に対する導体片の接続方法 |
EP0893945B1 (en) * | 1997-01-23 | 2007-10-24 | Rohm Co., Ltd. | Printed board and manufacturing method therefor |
JP3982876B2 (ja) * | 1997-06-30 | 2007-09-26 | 沖電気工業株式会社 | 弾性表面波装置 |
US7126161B2 (en) * | 1998-10-13 | 2006-10-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having El layer and sealing material |
US6734781B1 (en) * | 1999-04-30 | 2004-05-11 | Rohm Co., Ltd. | Mounting structure for temperature-sensitive fuse on circuit board |
EP1130642A4 (en) * | 1999-07-26 | 2008-01-09 | Tdk Corp | HIGH FREQUENCY MODULE |
US6700061B2 (en) * | 2000-10-17 | 2004-03-02 | Murata Manufacturing Co., Ltd. | Composite electronic component |
JP5034137B2 (ja) | 2000-11-01 | 2012-09-26 | ソニー株式会社 | 溶接物の製造方法,台座および電池の製造方法 |
EP1267429B1 (en) | 2000-11-01 | 2017-03-15 | Sony Corporation | Battery cell and production method therefor |
JP2002208788A (ja) | 2001-01-12 | 2002-07-26 | Rohm Co Ltd | 回路基板、およびその製造方法 |
JP3714545B2 (ja) * | 2001-12-25 | 2005-11-09 | ローム株式会社 | 保護回路モジュールおよびこれを備える電池パック |
-
2003
- 2003-11-21 JP JP2003392676A patent/JP3776907B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-19 TW TW093135599A patent/TWI281372B/zh not_active IP Right Cessation
- 2004-11-19 US US10/580,157 patent/US7439625B2/en not_active Expired - Fee Related
- 2004-11-19 WO PCT/JP2004/017276 patent/WO2005051057A1/ja active Application Filing
- 2004-11-19 KR KR1020067009766A patent/KR100820517B1/ko not_active IP Right Cessation
- 2004-11-19 CN CNB2004800343275A patent/CN100566512C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002050884A (ja) * | 2000-07-31 | 2002-02-15 | Rohm Co Ltd | 回路基板、およびこの回路基板と充電池との接続方法 |
JP2003168407A (ja) * | 2001-11-30 | 2003-06-13 | Toshiba Corp | 電池パック |
JP2004304019A (ja) * | 2003-03-31 | 2004-10-28 | Mitsumi Electric Co Ltd | 回路基板の接続パターン構造及び回路基板 |
JP2004348980A (ja) * | 2003-05-19 | 2004-12-09 | Sony Corp | 端子部材の構造 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005322568A (ja) * | 2004-05-11 | 2005-11-17 | Nec Tokin Corp | 端子の接続方法及び回路基板 |
JP2007005471A (ja) * | 2005-06-22 | 2007-01-11 | Mitsumi Electric Co Ltd | 回路基板装置 |
JP2007088031A (ja) * | 2005-09-20 | 2007-04-05 | Nec Saitama Ltd | 回路基板 |
JP4677865B2 (ja) * | 2005-09-20 | 2011-04-27 | 日本電気株式会社 | 回路基板 |
JP2009259920A (ja) * | 2008-04-15 | 2009-11-05 | Nec Tokin Corp | 回路基板および回路基板の製造方法 |
JP2013086427A (ja) * | 2011-10-20 | 2013-05-13 | Japan Steel Works Ltd:The | 薄膜を有する成形品の製造方法および製造装置 |
US9168561B2 (en) | 2011-10-20 | 2015-10-27 | The Japan Steel Works, Ltd. | Apparatus including a fixed temporary stage for manufacturing molded product |
WO2014188860A1 (ja) * | 2013-05-22 | 2014-11-27 | 日立マクセル株式会社 | 保護回路を有する二次電池パック |
JP2014229474A (ja) * | 2013-05-22 | 2014-12-08 | 日立マクセル株式会社 | 保護回路を有する二次電池パック |
Also Published As
Publication number | Publication date |
---|---|
US20070108254A1 (en) | 2007-05-17 |
KR100820517B1 (ko) | 2008-04-07 |
KR20060086970A (ko) | 2006-08-01 |
CN1883241A (zh) | 2006-12-20 |
TW200533270A (en) | 2005-10-01 |
TWI281372B (en) | 2007-05-11 |
JP3776907B2 (ja) | 2006-05-24 |
US7439625B2 (en) | 2008-10-21 |
WO2005051057A1 (ja) | 2005-06-02 |
CN100566512C (zh) | 2009-12-02 |
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