JP2005142384A - 検査データ解析プログラム - Google Patents
検査データ解析プログラム Download PDFInfo
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- JP2005142384A JP2005142384A JP2003377735A JP2003377735A JP2005142384A JP 2005142384 A JP2005142384 A JP 2005142384A JP 2003377735 A JP2003377735 A JP 2003377735A JP 2003377735 A JP2003377735 A JP 2003377735A JP 2005142384 A JP2005142384 A JP 2005142384A
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- 238000012360 testing method Methods 0.000 title claims abstract description 26
- 238000005259 measurement Methods 0.000 claims abstract description 78
- 238000012545 processing Methods 0.000 claims abstract description 16
- 238000003860 storage Methods 0.000 claims abstract description 14
- 238000007689 inspection Methods 0.000 claims description 88
- 238000000034 method Methods 0.000 claims description 39
- 230000008569 process Effects 0.000 claims description 25
- 230000010365 information processing Effects 0.000 claims description 6
- 230000005856 abnormality Effects 0.000 claims description 2
- 239000010409 thin film Substances 0.000 abstract description 9
- 238000007405 data analysis Methods 0.000 abstract description 7
- 230000002950 deficient Effects 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 28
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000000528 statistical test Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000000540 analysis of variance Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010219 correlation analysis Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000012353 t test Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31318—Data analysis, using different formats like table, chart
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Engineering & Computer Science (AREA)
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- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
薄膜デバイスの不良品を低減するために行うデータ解析を迅速かつ効率的に実行できるようにする。これにより、歩留りが向上させるとともに、顧客へ不良品を出荷する可能性を低減させる。
【解決手段】
情報処理装置で検査データを解析するための検査データ解析プログラムであって、記憶装置から、複数の検査対象物の複数箇所で測定した複数の測定項目を備えた検査データを読み込む処理と、測定項目別に測定箇所毎の検査データの有意差を検定する処理と、該有意差を基に測定項目を選択し、その選択した測定項目毎の検査データを表示装置に表示させる処理とを有することを特徴とする検査データ解析プログラムを実行することにより達成できる。
【選択図】 図1
Description
Claims (5)
- 情報処理装置で検査データを解析するための検査データ解析プログラムであって、
記憶装置から、複数の検査対象物の複数箇所で測定した複数の測定項目を備えた検査データを読み込む処理と、
測定項目別に測定箇所毎の検査データの有意差を検定する処理と、
該有意差を基に測定項目を選択し、その選択した測定項目毎の検査データを表示装置に表示させる処理とを有することを特徴とする検査データ解析プログラム。 - 情報処理装置で検査データを解析するための検査データ解析プログラムであって、
記憶装置から、複数の検査対象物の複数箇所で測定した複数の測定項目を備えた検査データを読み込む処理と、
測定項目別に測定箇所毎の検査データの有意差を検定する処理と、
該有意差を基に測定項目毎の検査データを表示する順序又は表示位置を決めて表示装置に表示させるか、又は測定箇所毎の有意差を視覚的に識別できる表示様式で検査データを表示装置に表示させる処理とを有することを特徴とする検査データ解析プログラム。 - 情報処理装置で検査データを解析するための検査データ解析プログラムであって、
記憶装置から、複数の検査対象物の複数箇所で測定した複数の測定項目を備えた検査データを読み込む処理と、
測定項目別に測定箇所毎の検査データの有意差を検定し、該有意差を規格化する処理と、
該規格化した有意差と予め規定したしきい値とを比較し、その大小関係で異常を検知する処理とを有することを特徴とする特性データ解析プログラム。 - 請求項1、2又は3において、
前記検査対象物は電気特性測定専用回路を備えたウェハであり、
その検査データは電気特性測定専用回路に対してテスタで測定した電気特性データであることを特徴とする検査データ解析プログラム。 - 請求項1、2又は3において、
前記規格化した有意差は、有意確率であることを特徴とする検査データ解析プログラム。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003377735A JP4051332B2 (ja) | 2003-11-07 | 2003-11-07 | 検査データ解析システム |
US10/981,661 US20050114058A1 (en) | 2003-11-07 | 2004-11-05 | Method for analyzing inspected data, apparatus and its program |
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JP2003377735A JP4051332B2 (ja) | 2003-11-07 | 2003-11-07 | 検査データ解析システム |
Publications (2)
Publication Number | Publication Date |
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JP2005142384A true JP2005142384A (ja) | 2005-06-02 |
JP4051332B2 JP4051332B2 (ja) | 2008-02-20 |
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JP2003377735A Expired - Fee Related JP4051332B2 (ja) | 2003-11-07 | 2003-11-07 | 検査データ解析システム |
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US (1) | US20050114058A1 (ja) |
JP (1) | JP4051332B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007073886A (ja) * | 2005-09-09 | 2007-03-22 | Shin Etsu Handotai Co Ltd | Soiウエーハの評価方法 |
JP2011014800A (ja) * | 2009-07-03 | 2011-01-20 | Sumco Corp | エピタキシャル層の膜厚測定方法、エピタキシャルウェーハの製造方法およびエピタキシャルウェーハの製造工程管理方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080241486A1 (en) * | 2007-03-30 | 2008-10-02 | Seiji Ishikawa | Liquid Crystal Display Device with Evaluation Patterns Disposed Thereon, and Method for Manufacturing the Same |
CN102928683A (zh) * | 2011-08-10 | 2013-02-13 | 鸿富锦精密工业(深圳)有限公司 | 测试监控*** |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002024204A (ja) * | 2000-07-03 | 2002-01-25 | Hitachi Ltd | 相関解析方法、相関解析装置および記憶媒体 |
JP2003289025A (ja) * | 2002-03-28 | 2003-10-10 | Toshiba Corp | 半導体処理装置管理システムおよび半導体処理装置管理方法 |
Family Cites Families (6)
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US5719796A (en) * | 1995-12-04 | 1998-02-17 | Advanced Micro Devices, Inc. | System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback |
US5991707A (en) * | 1998-03-09 | 1999-11-23 | Hydrotec Systems Company, Inc. | Method and system for predictive diagnosing of system reliability problems and/or system failure in a physical system |
US6618692B2 (en) * | 2000-09-20 | 2003-09-09 | Hitachi, Ltd. | Remote diagnostic system and method for semiconductor manufacturing equipment |
JP2002149222A (ja) * | 2000-11-08 | 2002-05-24 | Mitsubishi Electric Corp | 製品の生産ラインにおける品質管理方法および品質管理システム |
US6777972B2 (en) * | 2001-04-27 | 2004-08-17 | Interuniversitair Microelektronica Centrum (Imec, Vzw) | Method and apparatus for detecting breakdown in ultra thin dielectric layers |
US6792366B2 (en) * | 2001-12-11 | 2004-09-14 | Hitachi, Ltd. | Method and apparatus for inspecting defects in a semiconductor wafer |
-
2003
- 2003-11-07 JP JP2003377735A patent/JP4051332B2/ja not_active Expired - Fee Related
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2004
- 2004-11-05 US US10/981,661 patent/US20050114058A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002024204A (ja) * | 2000-07-03 | 2002-01-25 | Hitachi Ltd | 相関解析方法、相関解析装置および記憶媒体 |
JP2003289025A (ja) * | 2002-03-28 | 2003-10-10 | Toshiba Corp | 半導体処理装置管理システムおよび半導体処理装置管理方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007073886A (ja) * | 2005-09-09 | 2007-03-22 | Shin Etsu Handotai Co Ltd | Soiウエーハの評価方法 |
JP2011014800A (ja) * | 2009-07-03 | 2011-01-20 | Sumco Corp | エピタキシャル層の膜厚測定方法、エピタキシャルウェーハの製造方法およびエピタキシャルウェーハの製造工程管理方法 |
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Publication number | Publication date |
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US20050114058A1 (en) | 2005-05-26 |
JP4051332B2 (ja) | 2008-02-20 |
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