JP4051332B2 - 検査データ解析システム - Google Patents
検査データ解析システム Download PDFInfo
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- JP4051332B2 JP4051332B2 JP2003377735A JP2003377735A JP4051332B2 JP 4051332 B2 JP4051332 B2 JP 4051332B2 JP 2003377735 A JP2003377735 A JP 2003377735A JP 2003377735 A JP2003377735 A JP 2003377735A JP 4051332 B2 JP4051332 B2 JP 4051332B2
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- 238000007689 inspection Methods 0.000 title claims description 96
- 238000007405 data analysis Methods 0.000 title claims description 19
- 238000005259 measurement Methods 0.000 claims description 83
- 238000000034 method Methods 0.000 claims description 38
- 235000012431 wafers Nutrition 0.000 claims description 37
- 230000008569 process Effects 0.000 claims description 24
- 238000012360 testing method Methods 0.000 claims description 16
- 239000010409 thin film Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000004364 calculation method Methods 0.000 claims description 7
- 238000004458 analytical method Methods 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 3
- 238000003860 storage Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 8
- 230000002950 deficient Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 238000000528 statistical test Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000000540 analysis of variance Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010219 correlation analysis Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000012353 t test Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31318—Data analysis, using different formats like table, chart
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
Claims (2)
- 薄膜デバイスが形成された複数のウエハ、又はモジュール上の複数箇所に、前記薄膜デバイスと重ならない位置に形成されたTEGに対して、電気特性検査を行ったデータを解析して、面内ばらつきが大きい電気特性パラメータを検出する検査データ解析システムであって、
識別データにより管理された前記ウエハ、又はモジュールを、検査工程において、前記TEGに対して複数種の測定項目の電気特性検査を実行して得られた検査データを、ネットワークを介して収集して、記録するデータベースと、
解析時に、対象のウエハ、又はモジュールを複数指定する識別データの入力に従って、前記データベースに記録された検査データを検索して、読み出す検索手段と、
前記読み出した検査データより、測定項目別に同一測定箇所毎の全てのTEGの検査データをグループに分けて、各グループに属する検査データのヒストグラムを作成し、測定項目別に、測定箇所毎のヒストグラムを比較し、ヒストグラム間の統計的な違いを有意確率P値として算出し、前記算出した測定項目別の有意確率P値を、小さい方から順に整列するデータ解析演算手段と、
前記整列した最も小さい有意確率P値となる測定項目の検査データより優先順序を付けて、および測定箇所毎の有意差を明度や彩度の変化を付けて、または箱ひげ図による表示態様で、検査データをユーザへ提示する表示手段と、
を備えたことを特徴とする検査データ解析システム。 - 薄膜デバイスが形成された複数のウエハ、又はモジュール上の複数箇所に、前記薄膜デバイスと重ならない位置に形成されたTEGに対して、電気特性検査を行ったデータを解析して、面内ばらつきが所定値より大きくなった電気特性パラメータを検出して、ユーザに通知する検査データ解析システムであって、
製造工程中のロット単位の前記ウエハ、又はモジュールを、検査工程において、前記TEGに対して複数種の測定項目の電気特性検査を実行して得られたロット単位の検査データを、ネットワークを介して収集して、記録するデータベースと、
前記ロット単位の検査データを前記データベースより読み出し、測定項目別に同一測定箇所毎の全てのTEGの検査データをグループに分けて、各グループに属する検査データのヒストグラムを作成し、測定項目別に、測定箇所毎のヒストグラムを比較し、ヒストグラム間の統計的な違いを有意確率P値として算出し、前記算出した有意確率P値を前記測定項目ごとに設定されたしきい値と比較判定をするデータ解析演算手段と、
前記比較判定処理において、前記算出した有意確率P値が設定されているしきい値より小さい値となった時点で、該当するロット、および測定項目をユーザへ通知する表示手段と、
を備えたことを特徴とする検査データ解析システム。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003377735A JP4051332B2 (ja) | 2003-11-07 | 2003-11-07 | 検査データ解析システム |
US10/981,661 US20050114058A1 (en) | 2003-11-07 | 2004-11-05 | Method for analyzing inspected data, apparatus and its program |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003377735A JP4051332B2 (ja) | 2003-11-07 | 2003-11-07 | 検査データ解析システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005142384A JP2005142384A (ja) | 2005-06-02 |
JP4051332B2 true JP4051332B2 (ja) | 2008-02-20 |
Family
ID=34587227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003377735A Expired - Fee Related JP4051332B2 (ja) | 2003-11-07 | 2003-11-07 | 検査データ解析システム |
Country Status (2)
Country | Link |
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US (1) | US20050114058A1 (ja) |
JP (1) | JP4051332B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007073886A (ja) * | 2005-09-09 | 2007-03-22 | Shin Etsu Handotai Co Ltd | Soiウエーハの評価方法 |
US20080241486A1 (en) * | 2007-03-30 | 2008-10-02 | Seiji Ishikawa | Liquid Crystal Display Device with Evaluation Patterns Disposed Thereon, and Method for Manufacturing the Same |
JP2011014800A (ja) * | 2009-07-03 | 2011-01-20 | Sumco Corp | エピタキシャル層の膜厚測定方法、エピタキシャルウェーハの製造方法およびエピタキシャルウェーハの製造工程管理方法 |
CN102928683A (zh) * | 2011-08-10 | 2013-02-13 | 鸿富锦精密工业(深圳)有限公司 | 测试监控*** |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5719796A (en) * | 1995-12-04 | 1998-02-17 | Advanced Micro Devices, Inc. | System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback |
US5991707A (en) * | 1998-03-09 | 1999-11-23 | Hydrotec Systems Company, Inc. | Method and system for predictive diagnosing of system reliability problems and/or system failure in a physical system |
JP2002024204A (ja) * | 2000-07-03 | 2002-01-25 | Hitachi Ltd | 相関解析方法、相関解析装置および記憶媒体 |
US6618692B2 (en) * | 2000-09-20 | 2003-09-09 | Hitachi, Ltd. | Remote diagnostic system and method for semiconductor manufacturing equipment |
JP2002149222A (ja) * | 2000-11-08 | 2002-05-24 | Mitsubishi Electric Corp | 製品の生産ラインにおける品質管理方法および品質管理システム |
EP1276144B1 (en) * | 2001-04-27 | 2019-02-27 | IMEC vzw | A method and apparatus for detecting breakdown in ultra thin dielectric layers. |
US6792366B2 (en) * | 2001-12-11 | 2004-09-14 | Hitachi, Ltd. | Method and apparatus for inspecting defects in a semiconductor wafer |
JP2003289025A (ja) * | 2002-03-28 | 2003-10-10 | Toshiba Corp | 半導体処理装置管理システムおよび半導体処理装置管理方法 |
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2003
- 2003-11-07 JP JP2003377735A patent/JP4051332B2/ja not_active Expired - Fee Related
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2004
- 2004-11-05 US US10/981,661 patent/US20050114058A1/en not_active Abandoned
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Publication number | Publication date |
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JP2005142384A (ja) | 2005-06-02 |
US20050114058A1 (en) | 2005-05-26 |
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