JP2005064423A - Chip-type electronic component and its identifying method - Google Patents

Chip-type electronic component and its identifying method Download PDF

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JP2005064423A
JP2005064423A JP2003296234A JP2003296234A JP2005064423A JP 2005064423 A JP2005064423 A JP 2005064423A JP 2003296234 A JP2003296234 A JP 2003296234A JP 2003296234 A JP2003296234 A JP 2003296234A JP 2005064423 A JP2005064423 A JP 2005064423A
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electronic component
chip
type electronic
component
polarity
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Koji Fukuzawa
康志 福澤
Takeo Inoue
武夫 井上
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Tokin Corp
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NEC Tokin Toyama Ltd
NEC Tokin Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip-type electronic component whose misalignment and inverse polarity are detected easily and surely in the state wherein an absorption pad of a mounter absorbs the electronic component, and also to provide its identifying method. <P>SOLUTION: In the chip-type electronic component 1, a polarity 5 is indicated on an upper surface and a side face or a lower surface (mounted side on a printed circuit board), or a central point 7 or a position identifying line 8 is indicated on the upper surface and the lower surface. Moreover, in the method of mounting the chip-type electronic component on the printed circuit board, while absorbing the upper surface of the chip-type electronic component 1 by the absorption pad of the component mounter, the polarity 5, the component position and the orientation of the chip-type electronic component are recognized by detecting the indication on the side face or the lower surface of the chip-type electronic component. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、チップ型電子部品に関し、特に表面に表示を設けたチップ型電子部品及びその識別方法に関する。   The present invention relates to a chip-type electronic component, and more particularly to a chip-type electronic component having a display on its surface and a method for identifying the chip-type electronic component.

従来、チップ型セラミックコンデンサやチップ型抵抗器等のチップ型電子部品は、その上面（プリント基板実装面の反対側）にのみ容量値や抵抗値、定格電圧等の表示が設けられ、プリント基板に実装の前後で前記チップ型電子部品の上面の表示を画像認識等の検査装置で検査し、部品の間違いが無いことを確認しているのが一般的である。   Conventionally, chip-type electronic components such as chip-type ceramic capacitors and chip-type resistors are provided with a display of capacitance value, resistance value, rated voltage, etc. only on the upper surface (opposite side of the printed-circuit board mounting surface). Generally, the display on the upper surface of the chip-type electronic component is inspected by an inspection device such as image recognition before and after mounting to confirm that there is no mistake in the component.

また、チップ型タンタル電解コンデンサやチップ型フィルム電解コンデンサ等の有極性のチップ型電子部品は、プリント基板等に実装されたとき、実装状態で部品配置や極性を確認できるように、上面のみに極性表示が設けられ、プリント基板に実装の前後で前記チップ型電子部品の上面の表示を画像認識等の検査装置で検査し、極性の間違いが無いことを確認しているのが一般的である。   In addition, polar chip-type electronic components such as chip-type tantalum electrolytic capacitors and chip-type film electrolytic capacitors are polar only on the top surface so that when they are mounted on a printed circuit board, the component arrangement and polarity can be confirmed in the mounted state. Generally, a display is provided, and the display on the upper surface of the chip-type electronic component is inspected by an inspection device such as image recognition before and after mounting on a printed circuit board to confirm that there is no error in polarity.

更に、チップ型電子部品の中心点や、位置識別線についても同様に、上面のみに表示が設けられ、プリント基板に実装の後に前記チップ型電子部品の上面の表示を画像認識等の検査装置で検査し、実装部品の位置ずれが無いかどうかを確認しているのが一般的である。   Further, the center point of the chip-type electronic component and the position identification line are similarly provided only on the upper surface, and the display on the upper surface of the chip-type electronic component is mounted on a printed circuit board by an inspection device such as image recognition. In general, it is checked whether there is any displacement of the mounted components.

チップ型電子部品の供給は、テーピングの形態が多く採られ、実装機の吸着パッドがテーピングの部品上面に吸い付き、電子部品を取り出し、基板に実装する。この際、極めて稀な現象ではあるが、テーピングエンボスの変形、トップテープの剥がれ不良、電子部品の傾き等の影響により、テーピングからの位置がずれて吸着パッドが部品上面に吸い付き、プリント基板上の正規の位置からずれて電子部品が実装される場合が有る。このような場合、電子部品の電極とプリント基板上のランド電極の位置がずれてしまい、ランド電極と電子部品の電極が接続不良となり、電子部品が機能しないという問題点がある。   The supply of chip-type electronic components is often in the form of taping. The suction pad of the mounting machine sticks to the upper surface of the taping component, and the electronic component is taken out and mounted on the substrate. At this time, although it is an extremely rare phenomenon, due to the influence of deformation of the taping emboss, poor peeling of the top tape, tilt of the electronic component, etc., the position from the taping shifts and the suction pad sticks to the upper surface of the component, In some cases, the electronic component is mounted out of the normal position. In such a case, the position of the electrode of the electronic component and the land electrode on the printed circuit board is shifted, and there is a problem that the connection between the land electrode and the electrode of the electronic component becomes poor and the electronic component does not function.

また、有極性チップ型電子部品の供給は、極性を同一方向に揃えて整列したテーピングの形態が採られ、実装機の吸着パッドがテーピングの部品上面に吸い付き、電子部品を取り出し、基板に実装する。この際、極めて稀な現象ではあるが、電子部品が反転し、極性が逆になることがある。逆極性の状態で基板に実装された有極性チップ型電子部品に通電した場合、有極性のチップ型電子部品が発熱し、電子部品としての機能を損なう恐れがあるという問題点がある。   In addition, the supply of polarized chip-type electronic components takes the form of taping in which the polarities are aligned in the same direction, the suction pad of the mounting machine sticks to the upper surface of the taping component, and the electronic component is taken out and mounted on the board To do. At this time, although it is an extremely rare phenomenon, the electronic component may be reversed and the polarity may be reversed. When the polarized chip type electronic component mounted on the substrate in the reverse polarity state is energized, there is a problem that the polarized chip type electronic component generates heat and may impair the function as the electronic component.

テーピングの中で電子部品の位置を強制的に修正する方法としては、外部磁場や重力を利用したものがある。（例えば、特許文献１参照）しかし、テーピングエンボスの変形やトップテープの剥がれ不良により、実装機の吸着パッドに吸着する直前の電子部品の極性反転や位置ずれはこの方法では解決できない。   As a method for forcibly correcting the position of an electronic component in taping, there is a method using an external magnetic field or gravity. (For example, refer to Patent Document 1) However, the polarity reversal or misalignment of the electronic component just before adsorbing to the suction pad of the mounting machine due to deformation of the taping emboss or poor top tape peeling cannot be solved by this method.

更に、電子部品をプリント基板に実装後に、基板を撮像装置を用いて画像処理し、半田の有無や電子部品の位置ずれを検査する方法もある。（例えば、特許文献２参照）しかし、この検査方法では、撮像装置や高度な画像処理装置を用いるために、装置が大かがりになり、また、装置が高価であるという問題点がある。   Furthermore, after mounting an electronic component on a printed circuit board, there is also a method in which the substrate is subjected to image processing using an imaging device, and the presence or absence of solder and the positional deviation of the electronic component are inspected. (For example, see Patent Document 2) However, since this inspection method uses an imaging device or an advanced image processing device, there is a problem that the device becomes large and the device is expensive.

特開２００３−１２１３６９号 公報JP 2003-121369 A 特開平６−１６００３５号 公報JP-A-6-160035

実装機の吸着パッドが電子部品を吸着した状態では、部品上面が吸着パッドで隠れるため、部品上面のみの表示では部品の位置ずれや逆極性を検出できない。また、実装機の吸着パッドで吸着した部品の位置は、画像処理装置により検出しているが、画像処理装置で部品を識別するためには、それぞれの部品について、部品下面・側面方向からの外形や端子形状を個々に画像処理装置に入力・識別させる必要があり、多大な工数がかかる。   In a state where the suction pad of the mounting machine sucks the electronic component, the upper surface of the component is hidden by the suction pad, so that it is not possible to detect the positional deviation or reverse polarity of the component by displaying only the upper surface of the component. In addition, the position of the component sucked by the suction pad of the mounting machine is detected by the image processing device. In order to identify the component by the image processing device, the outer shape of each component from the bottom and side directions of the component is used. Further, it is necessary to individually input and identify the terminal shape to the image processing apparatus, which takes a lot of man-hours.

そこで、本発明は、実装機の吸着パッドが電子部品を吸着した状態で、容易に、確実に電子部品の位置ずれや逆極性を検出することが出来るチップ型電子部品及びその識別方法を提供することを目的とするものである。   Therefore, the present invention provides a chip-type electronic component and a method for identifying the same, which can easily and reliably detect the positional deviation and reverse polarity of the electronic component in a state in which the electronic component is adsorbed by the suction pad of the mounting machine. It is for the purpose.

本発明によれば、上面に極性が表示してあるとともに、側面または下面（プリント基板実装面側）の少なくともいずれかに極性が表示してあることを特徴とするチップ型電子部品が得られる。また、本発明によれば、下面に中心点または位置識別線が表示してあることを特徴とするチップ型電子部品が得られる。さらに、本発明によれば、プリント基板に実装するときのチップ型電子部品の識別方法において、部品実装機の吸着パッドでチップ型電子部品の上面を吸着し、チップ型電子部品の側面または下面の表示を検出することでチップ型電子部品の極性や部品位置、及び向きを認識することを特徴とするチップ型電子部品の識別方法が得られる。   According to the present invention, it is possible to obtain a chip-type electronic component in which the polarity is displayed on the upper surface and the polarity is displayed on at least one of the side surface and the lower surface (printed board mounting surface side). Further, according to the present invention, a chip-type electronic component can be obtained in which a center point or a position identification line is displayed on the lower surface. Further, according to the present invention, in the chip type electronic component identification method when mounted on the printed circuit board, the upper surface of the chip type electronic component is sucked by the suction pad of the component mounting machine, and the side surface or the lower surface of the chip type electronic component is By detecting the display, there is obtained a chip type electronic component identification method characterized by recognizing the polarity, component position and orientation of the chip type electronic component.

上述したように、本発明のチップ型電子部品及びその識別方法によれば、表示を部品側面または下面にも付加することにより、実装機の吸着パッドが電子部品を吸着した状態で、画像認識装置で部品側面または下面の表示を読み取ることで、チップ型電子部品の極性、位置ずれを容易に確実に識別識別することが出来る。また、本発明は、有極性チップ部品、チップ型電子部品に限らず、複合電子部品などにも応用できることは当然である。   As described above, according to the chip-type electronic component and the identification method thereof of the present invention, an image recognition device can be used in a state where the suction pad of the mounting machine sucks the electronic component by adding a display to the side surface or the lower surface of the component. By reading the display on the side surface or the lower surface of the component, it is possible to easily identify and identify the polarity and positional deviation of the chip-type electronic component. Further, the present invention is naturally applicable not only to polarized chip components and chip-type electronic components but also to composite electronic components.

以下、本発明の実施の形態を図１〜図３に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

図１は、上面及び側面及び下面に極性５を表示した有極性のチップ型電子部品１である。図１（ａ）は上面図、図１（ｂ）は正面図、図１（ｃ）は底面（プリント基板実装面側）図をそれぞれ示す。図１において、陽極リード端子２の近傍のモールド樹脂４の上に陽極の極性５が設けられている。極性５の表示はインク捺印機やレーザー捺印機等を用い、有極性のチップ型電子部品１の特定の極性側に、その先端から製品寸法の１／３〜１／４程度の幅まで表示した。図１では、上面及び側面及び下面に極性５を表示した有極性のチップ型電子部品１を示したが、実装機の吸着パッドにチップ型電子部品を吸着した状態で、画像認識装置で極性を検査するためには、極性５の表示はチップ型電子部品１の側面または下面の何れかに設けても良い。   FIG. 1 shows a polar chip-type electronic component 1 with polarity 5 displayed on the top, side, and bottom surfaces. 1A is a top view, FIG. 1B is a front view, and FIG. 1C is a bottom view (printed circuit board mounting surface side). In FIG. 1, an anode polarity 5 is provided on a mold resin 4 in the vicinity of the anode lead terminal 2. The polarity 5 is displayed using an ink stamping machine, a laser stamping machine, or the like on the specific polarity side of the polar chip-type electronic component 1 from the tip to a width of about 1/3 to 1/4 of the product size. . In FIG. 1, the polar chip-type electronic component 1 having polarity 5 displayed on the upper surface, the side surface, and the lower surface is shown. However, in the state where the chip-type electronic component is attracted to the suction pad of the mounting machine, In order to inspect, the indication of polarity 5 may be provided on either the side surface or the lower surface of the chip-type electronic component 1.

図２及び図３は、下面に中心点７や、位置識別線８を部品下面に設けたチップ型電子部品１の底面図である。中心点７や、位置識別線８はインク捺印機、レーザー捺印機等を用いて表示できる。点や線の組み合わせや表示場所を工夫することにより、極性・中心・部品角度等の検出も可能である。また、単純な表記である中心点表示を部品側に付加することにより、部品個々のデータを実装機へ入力・識別させる必要がなくなる利点もある。   2 and 3 are bottom views of the chip-type electronic component 1 in which the center point 7 and the position identification line 8 are provided on the lower surface of the component. The center point 7 and the position identification line 8 can be displayed using an ink stamping machine, a laser stamping machine, or the like. By devising combinations and display locations of points and lines, it is possible to detect polarity, center, component angle, and the like. In addition, by adding a center point display, which is a simple notation, to the component side, there is an advantage that it is not necessary to input / identify data of each component to the mounting machine.

更に、中心点表示を画像処理等で識別することにより、吸着エラーしても実装位置の補正が行え、より高密度な実装が可能となり、任意に部品を回転させ実装するような場合、位置識別線表示を画像処理装置で識別することにより、補正が行え、より確実な実装が可能である。   Furthermore, by identifying the center point display by image processing, etc., it is possible to correct the mounting position even if a suction error occurs, enabling higher-density mounting. By identifying the line display with the image processing apparatus, correction can be performed and more reliable mounting is possible.

実際にチップ型固体電解コンデンサをプリント基板に実装する工程において、従来、１日に数回の逆極性実装や位置ずれ実装が発生していたが、本発明の表示と識別方法を採用した結果、逆極性実装や位置ずれ実装の発生が１日に１回以下となり、改善の効果が確認された。   In the process of actually mounting the chip-type solid electrolytic capacitor on the printed circuit board, the reverse polarity mounting and the misalignment mounting have occurred several times a day, but as a result of adopting the display and identification method of the present invention, The occurrence of reverse polarity mounting and misalignment mounting was less than once a day, confirming the improvement effect.

以上、本発明の実施の形態を説明したが、本発明は、この実施の形態に限られるものではなく、この発明の要旨を逸脱しない範囲の設計変更があっても、本発明に含まれる。すなわち、当業者であれば、なしえるであろう各種変形、修正を含むことはもちろんである。   As mentioned above, although embodiment of this invention was described, this invention is not restricted to this embodiment, Even if there is a design change of the range which does not deviate from the summary of this invention, it is included in this invention. That is, it goes without saying that various modifications and corrections that can be made by those skilled in the art are included.

本発明に関わる有極性のチップ型電子部品、図１（ａ）は上面図、図１（ｂ）は正面図、図１（ｃ）は底面図。FIG. 1A is a top view, FIG. 1B is a front view, and FIG. 1C is a bottom view. 下面に中心点を設けたチップ型電子部品の底面図。The bottom view of the chip type electronic component which provided the center point in the lower surface. 下面に位置識別線を設けたチップ型電子部品の底面図。The bottom view of the chip type electronic component which provided the position identification line in the lower surface.

符号の説明Explanation of symbols

１ チップ型電子部品
２ 陽極リード端子
３ 陰極リード端子
４ モールド樹脂
５ 極性
６ 仕様表示
７ 中心点
８ 位置識別線 1 Chip-type electronic component 2 Anode lead terminal 3 Cathode lead terminal 4 Mold resin 5 Polarity 6 Specification display 7 Center point 8 Position identification line

Claims (3)

上面に極性が表示してあるとともに、側面または下面（プリント基板実装面側）の少なくともいずれかに極性が表示してあることを特徴とするチップ型電子部品。   A chip-type electronic component having a polarity displayed on an upper surface and a polarity displayed on at least one of a side surface and a lower surface (printed circuit board mounting surface side). 下面（プリント基板実装面側）に中心点または位置識別線が表示してあることを特徴とするチップ型電子部品。   A chip-type electronic component, wherein a center point or a position identification line is displayed on a lower surface (printed circuit board mounting surface side). プリント基板に実装するときのチップ型電子部品の識別方法において、部品実装機の吸着パッドでチップ型電子部品の上面を吸着し、チップ型電子部品の側面または下面（プリント基板実装面側）の表示を検出することでチップ型電子部品の極性や部品位置、及び向きを認識することを特徴とするチップ型電子部品の識別方法。   In the chip type electronic component identification method when mounted on a printed circuit board, the upper surface of the chip type electronic component is sucked by the suction pad of the component mounting machine, and the side surface or lower surface (printed circuit board mounting surface side) of the chip type electronic component is displayed. The chip type electronic component identification method is characterized by recognizing the polarity, component position, and orientation of the chip type electronic component by detecting.
JP2003296234A 2003-08-20 2003-08-20 Chip-type electronic component and its identifying method Pending JP2005064423A (en)

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Publication number Priority date Publication date Assignee Title
WO2018158948A1 (en) * 2017-03-03 2018-09-07 株式会社Ｆｕｊｉ Work machine and mounting method
JP2020537358A (en) * 2017-10-19 2020-12-17 上海望友信息科技有限公司 Component polarity detection methods, systems, computer-readable storage media and devices

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JPS61117256U (en) * 1985-01-08 1986-07-24
JPH04277608A (en) * 1991-03-06 1992-10-02 Matsushita Electric Ind Co Ltd Chip type solid electrolytic capacitor
JPH05327293A (en) * 1992-05-26 1993-12-10 Matsushita Electric Ind Co Ltd Mounting accuracy confirming land for chip
JPH06188150A (en) * 1992-12-22 1994-07-08 Hitachi Ltd Electronic component
JPH06252013A (en) * 1993-03-02 1994-09-09 Nec Corp Chip-type capacitor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6127229U (en) * 1984-07-17 1986-02-18 マルコン電子株式会社 chip capacitor
JPS61117256U (en) * 1985-01-08 1986-07-24
JPH04277608A (en) * 1991-03-06 1992-10-02 Matsushita Electric Ind Co Ltd Chip type solid electrolytic capacitor
JPH05327293A (en) * 1992-05-26 1993-12-10 Matsushita Electric Ind Co Ltd Mounting accuracy confirming land for chip
JPH06188150A (en) * 1992-12-22 1994-07-08 Hitachi Ltd Electronic component
JPH06252013A (en) * 1993-03-02 1994-09-09 Nec Corp Chip-type capacitor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018158948A1 (en) * 2017-03-03 2018-09-07 株式会社Ｆｕｊｉ Work machine and mounting method
JPWO2018158948A1 (en) * 2017-03-03 2019-11-14 株式会社Ｆｕｊｉ Working machine and mounting method
CN110547057A (en) * 2017-03-03 2019-12-06 株式会社富士 working machine and mounting method
US11432451B2 (en) 2017-03-03 2022-08-30 Fuji Corporation Work machine and mounting method
JP2020537358A (en) * 2017-10-19 2020-12-17 上海望友信息科技有限公司 Component polarity detection methods, systems, computer-readable storage media and devices
JP7097587B2 (en) 2017-10-19 2022-07-08 上海望友信息科技有限公司 Part Symbol Polarity Symbol Detection Methods, Systems, Computer-readable Storage Media and Devices

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