JP2003332794A - Circuit component having positional mark and mounting method - Google Patents
Circuit component having positional mark and mounting methodInfo
- Publication number
- JP2003332794A JP2003332794A JP2002134623A JP2002134623A JP2003332794A JP 2003332794 A JP2003332794 A JP 2003332794A JP 2002134623 A JP2002134623 A JP 2002134623A JP 2002134623 A JP2002134623 A JP 2002134623A JP 2003332794 A JP2003332794 A JP 2003332794A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- circuit component
- component
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Structure Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、印刷回路基板とそ
の搭載部品との位置合わせに好適な、回路部品およびそ
の実装方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit component suitable for alignment between a printed circuit board and its mounted components and a mounting method thereof.
【０００２】[0002]
【従来の技術】携帯電話やパソコンなどの電子機器は益
々高性能化が求められている。小型化、軽量化と同時に
高速化が極めて重要となってきている。各種部品を実装
する印刷回路基板（マザーボード）の小型化は、単に電
子機器の小型化のためだけではなく高速化を達成するた
めにも重要である。この問題を解決するには、回路部品
の動作周波数を高めることと回路部品の超小型化などと
共に、印刷回路基板上の回路部品間の配線を最短にする
必要がある。最短の配線を可能とする高密度実装技術に
非常に関心が高まり、携帯電話器やパソコンなどの電子
機器に使用する印刷回路基板は、一段と高密度実装が要
求されるようになってきた。2. Description of the Related Art Electronic devices such as mobile phones and personal computers are required to have higher performance. Higher speed is becoming more important as well as smaller size and lighter weight. The miniaturization of a printed circuit board (motherboard) on which various components are mounted is important not only for the miniaturization of electronic devices but also for achieving high speed. In order to solve this problem, it is necessary to increase the operating frequency of the circuit components, miniaturize the circuit components, and minimize the wiring between the circuit components on the printed circuit board. As the high-density mounting technology that enables the shortest wiring has become very popular, the printed circuit boards used for electronic devices such as mobile phones and personal computers are required to have higher density mounting.
【０００３】印刷回路基板に搭載されるチップ抵抗器や
チップコンデンサの外形寸法は１．０ｍｍ×０.５ｍｍ
程度が普通となり、さらに微細化する傾向にある。しか
も、これら回路部品を実装する印刷回路基板上の隣接す
る搭載部品間の距離（以下、隣接間隔と記述する）は、
１２０μｍへ、更にＬＳＩ等のキー・デバイスの隣接間
隔は８０μｍに近づこうとしている。このような状況の
中、ハンダ処理工程後における回路部品などの搭載部品
電極部と印刷回路基板導体パターンとの接触不良や短絡
など電気的接続の不良の発生確率が高くなってきてい
る。The external dimensions of chip resistors and chip capacitors mounted on a printed circuit board are 1.0 mm × 0.5 mm.
The degree is normal, and there is a tendency for further miniaturization. In addition, the distance between the adjacent mounting components on the printed circuit board on which these circuit components are mounted (hereinafter referred to as the adjacent spacing) is
The distance between key devices such as LSIs is approaching 80 μm, further toward 120 μm. Under such circumstances, the probability of occurrence of a defective electrical connection such as a defective contact or a short circuit between the electrode part of the mounted component such as a circuit component and the printed circuit board conductor pattern after the soldering process is increasing.
【０００４】その不良原因のほとんどは、印刷回路基板
上のパッドに搭載した部品の3次元的な（Ｘ軸、Ｙ軸、
Ｚ軸方向の）位置ずれに起因している。つまり、不良
は、ハンダ印刷工程で実装部品の3次元的な位置ずれに
起因して発生することが多い。Most of the causes of the defects are three-dimensional (X-axis, Y-axis, etc.) of the components mounted on the pads on the printed circuit board.
This is due to the positional shift (in the Z-axis direction). That is, a defect often occurs due to a three-dimensional displacement of a mounted component in a solder printing process.
【０００５】[0005]
【発明が解決しようとする課題】本発明は上述した事情
に鑑みて為されたもので、高密度実装の印刷回路基板に
回路部品を搭載する際に、正確な位置に回路部品を配置
することができる回路部品とその実装方法を提供するこ
とを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and is to arrange circuit components at accurate positions when mounting the circuit components on a high-density printed circuit board. It is an object of the present invention to provide a circuit component that can be manufactured and a mounting method thereof.
【０００６】[0006]
【課題を解決するための手段】本発明の回路部品は、印
刷回路基板へ搭載する回路部品において、前記回路部品
の表面に位置マークを少なくとも２個備えたことを特徴
とする。また、表面に位置マークを少なくとも２個備え
た回路部品を搭載する印刷回路基板に、位置マークを少
なくとも２個備えたことを特徴とする。The circuit component of the present invention is a circuit component mounted on a printed circuit board, characterized in that at least two position marks are provided on the surface of the circuit component. Further, a printed circuit board on which a circuit component having at least two position marks on its surface is mounted is provided with at least two position marks.
【０００７】印刷回路基板への高密度実装では、回路部
品間の間隔（部品ギャップ）を設計値に保ち、かつ印刷
回路基板上の正確な位置に搭載することが極めて重要で
ある。本発明の位置マーク方式による回路部品と印刷回
路基板との位置合わせは、印刷回路基板に搭載する抵抗
器やコンデンサなどの回路部品並びにＬＳＩなど回路部
品のそれぞれの表面に正確な位置情報を示す位置マーク
（印）を付与する。さらに、回路部品を搭載する印刷回
路基板の表面にも同様に正確な位置情報を示す位置マー
ク（印）を付与する。In high-density mounting on a printed circuit board, it is extremely important to keep the distance between circuit components (component gap) at a design value and to mount the circuit components at accurate positions on the printed circuit board. The alignment of the circuit component and the printed circuit board by the position mark method of the present invention is performed by positioning the circuit components such as resistors and capacitors mounted on the printed circuit board and the surface of each of the circuit components such as LSI showing accurate position information. Add a mark. Further, a position mark (mark) indicating accurate position information is also provided on the surface of the printed circuit board on which the circuit component is mounted.
【０００８】そして、回路部品の位置マークと印刷回路
基板上のマークをＣＣＤカメラなどで測定し、設計値と
比較して3次元的な位置ずれ（Ｘ軸、Ｙ軸、Ｚ軸）情報
を得る。ずれが生じている場合には、まだハンダ工程が
済んでいないならば、位置ずれ情報をフィードバックし
て回路部品の搭載位置を修正して固定することができ
る。これにより、高密度実装が必要とする回路部品の印
刷回路基板上への配置・搭載の正確度を著しく向上させ
ることができる。Then, the position mark of the circuit component and the mark on the printed circuit board are measured with a CCD camera or the like, and compared with the design value to obtain three-dimensional positional deviation (X axis, Y axis, Z axis) information. . When the displacement occurs, if the soldering process has not been completed yet, the displacement information can be fed back to correct and fix the mounting position of the circuit component. As a result, it is possible to remarkably improve the accuracy of arrangement and mounting of circuit components required for high-density mounting on the printed circuit board.
【０００９】[0009]
【発明の実施の形態】以下、本発明の実施形態に係る位
置マーク方式による回路部品を、印刷回路基板へ実装す
る際の位置合わせについて、図１乃至図４を参照して説
明する。図１（ａ）は、位置マークを付与した印刷回路
基板を示す図であり、図１（ｂ）は、位置マークを付与
したチップ抵抗器を示す図であり、図１（ｃ）は、位置
マークを付与した集積回路チップを示す図である。位置
マークとして＋印を用いているが、これに限定するもの
でなく、例えば、＊印や×印や○印などの使用も考えら
れる。BEST MODE FOR CARRYING OUT THE INVENTION Positioning when mounting a circuit component by a position mark method according to an embodiment of the present invention on a printed circuit board will be described below with reference to FIGS. 1 to 4. 1A is a diagram showing a printed circuit board provided with position marks, FIG. 1B is a diagram showing a chip resistor provided with position marks, and FIG. It is a figure which shows the integrated circuit chip with which the mark was added. The + mark is used as the position mark, but the position mark is not limited to this and, for example, the use of * mark, X mark, and O mark is also conceivable.
【００１０】図示するように、位置マーク（＋印）２，
３は、印刷回路基板１上に少なくとも２個設けられ、基
準となる位置を表示する。このため、対角線の隅部に設
けることが好ましい。この位置マークは、印刷回路基板
の表示の一つとして予め形成しておくことが好ましい
が、捺印等により後から形成するようにしてもよい。ま
た、印刷回路基板上にある導体パターンの角部等の特徴
がある部分を位置マークとして用いてもよい。As shown, the position mark (+) 2,
At least two 3 are provided on the printed circuit board 1 and display a reference position. For this reason, it is preferable to provide them at the corners of the diagonal line. This position mark is preferably formed in advance as one of the indications on the printed circuit board, but may be formed later by marking or the like. Further, a characteristic portion such as a corner portion of the conductor pattern on the printed circuit board may be used as the position mark.
【００１１】印刷回路基板に搭載する回路部品に設ける
位置マークも、予め捺印等によりデバイスの製造段階で
形成しておくことが好ましいが、実装に先立ってマーク
を捺印等により付するようにしてもよい。この位置マー
クは、搭載部品の位置ずれ（ＸＹ軸面内の並進移動や回
転移動）およびＺ軸方向の傾きを検出するために設けら
れたもので、少なくとも２個配置しておくことが必要で
ある。チップ抵抗器７は、両端部に電極８，９が配置さ
れ、その裏面が印刷回路基板のランドにはんだにより固
定される。この実施形態においては絶縁被膜１０に２個
の位置マーク（＋印）１１，１２が設けられている。It is preferable that the position mark provided on the circuit component mounted on the printed circuit board is also formed in advance by a marking or the like at the stage of manufacturing the device, but the mark may be attached by a marking or the like before the mounting. Good. This position mark is provided to detect the positional deviation (translational movement or rotational movement in the XY axis plane) and the inclination in the Z axis direction of the mounted component, and it is necessary to dispose at least two of them. is there. The chip resistor 7 has electrodes 8 and 9 arranged at both ends, and the back surface thereof is fixed to the land of the printed circuit board by soldering. In this embodiment, the insulating coating 10 is provided with two position marks (+ marks) 11 and 12.
【００１２】集積回路チップ１４は、端子１６が印刷回
路基板の導体パターンのランドにそれぞれ接続される。
このチップ１４においても２個の位置マーク（＋印）１
７，１８を備えている。In the integrated circuit chip 14, the terminals 16 are respectively connected to the lands of the conductor pattern of the printed circuit board.
Also in this chip 14, two position marks (+ marks) 1
7 and 18 are provided.
【００１３】図２は、チップ抵抗器７を印刷回路基板１
の上に搭載している図である。印刷回路基板１の２つの
隅に、位置マーク（＋印）２，３を付与しているので、
座標（ｘ１，ｙ１）および（ｘ２，ｙ２）が示されてい
る。搭載された回路部品にも位置マーク（＋印）１１，
１２が付与されている。この両者をＣＣＤカメラなどの
撮像装置を使用して、両者のマークの位置を正確に測定
する。即ち、印刷回路基板１上の位置マーク２，３の座
標（ｘ１，ｙ１）および（ｘ２，ｙ２）を基準として、
搭載部品の位置マークの座標を精密に計測する。FIG. 2 shows the chip resistor 7 as a printed circuit board 1.
It is the figure mounted on top. Since the position marks (+ marks) 2 and 3 are provided in the two corners of the printed circuit board 1,
The coordinates (x1, y1) and (x2, y2) are shown. Position mark (+) on the mounted circuit components,
12 is assigned. The positions of both marks are accurately measured by using an image pickup device such as a CCD camera. That is, with reference to the coordinates (x1, y1) and (x2, y2) of the position marks 2 and 3 on the printed circuit board 1,
Precisely measure the coordinates of the position marks of the mounted parts.
【００１４】もし回路部品がＺ軸である垂直方向にずれ
た時、そのＣＣＤカメラで測定した２点間の計測値が設
計上の値と合わなくなってくる。その許容差がある限度
を超えた場合は2点間の付与された位置マーク（印）か
ら計算でその中心値を求め、これを原点としてＸ軸やＹ
軸やＺ軸のずれを求めていく。If the circuit component is displaced in the vertical direction, which is the Z axis, the measured value between the two points measured by the CCD camera will not match the designed value. If the tolerance exceeds a certain limit, the center value is calculated from the position mark (mark) given between the two points, and this is used as the origin for the X-axis and Y-axis.
The deviation of the axis and the Z axis is calculated.
【００１５】上述したように、各搭載部品には複数の位
置マークを備えるので、印刷回路基板の基準となる位置
マークに対して相対的な位置ずれを検出することが出来
る。図３（ａ）に示すように、位置マーク１１，１２の
正規位置に対する相対的なずれΔＸ１，ΔＹ１およびΔ
Ｘ２，ΔＹ２を計測可能である。これにより、搭載部品
のＸＹ軸面内の位置ずれや曲がりがデータとして得られ
る。従って、印刷回路基板に搭載される回路部品の設計
位置情報と印刷回路基板上の回路部品の計測位置データ
（実際値）を比較して良否を判定することができ、回路
部品を搭載した印刷回路基板の搭載部品の位置ずれを検
査することができる。位置ずれの良否判定で用いる許容
範囲については、曲がりや浮きや位置ずれやハンダの流
れの範囲などを予め設定しておくことが必要である。As described above, since each mounted component is provided with the plurality of position marks, it is possible to detect the positional deviation relative to the position mark serving as the reference of the printed circuit board. As shown in FIG. 3A, the relative deviations ΔX 1 , ΔY 1 and Δ of the position marks 11 and 12 with respect to the normal position.
It is possible to measure X 2 and ΔY 2 . As a result, positional deviation and bending of the mounted component in the XY axis plane can be obtained as data. Therefore, the quality can be determined by comparing the design position information of the circuit component mounted on the printed circuit board and the measured position data (actual value) of the circuit component on the printed circuit board, and the printed circuit mounting the circuit component can be determined. It is possible to inspect the displacement of mounted components on the board. As for the allowable range used in the quality judgment of the positional deviation, it is necessary to preset the range of bending, floating, positional deviation, solder flow, and the like.
【００１６】ＣＣＤカメラなどで計測された回路部品上
の位置マーク（＋印）データには3次元情報（Ｘ軸、Ｙ
軸、Ｚ軸）が含まれている。つまり、回路部品に位置マ
ーク（＋印）を着ける設計上のデータと実際観測したデ
ータとが異なる場合がある。これは回路部品が印刷回路
基板面に対してＺ軸方向に傾いている為である。図３
（ｂ）に示すように計測データＸ１’，Ｙ１’、
Ｘ２’，Ｙ２’と位置マークデータＸ１，Ｙ１、Ｘ２，
Ｙ２との計算でこの傾きθを求め、ある値以上の場合は
この部品を正確な位置になるように修正していく。この
様にして、3次元的な補正にも応用できる。The position mark (+) data on the circuit component measured by a CCD camera or the like has three-dimensional information (X axis, Y
Axis, Z-axis). In other words, the design data for attaching the position mark (+) to the circuit component may differ from the actually observed data. This is because the circuit components are tilted in the Z-axis direction with respect to the printed circuit board surface. Figure 3
As shown in (b), the measurement data X 1 ′, Y 1 ′,
X 2 ', Y 2 ' and position mark data X 1 , Y 1 , X 2 ,
This inclination θ is obtained by calculation with Y 2, and when it is a certain value or more, the component is corrected so as to be in an accurate position. In this way, it can be applied to three-dimensional correction.
【００１７】次に、図４を参照して本発明の位置マーク
方式による回路部品を印刷回路基板へ搭載する際の位置
合わせ例について説明する。位置マーク（＋印）を付与
したチップ抵抗器７等を印刷回路基板１上の所定の位置
にマウンタ（自動搭載機）により搭載する。チップ抵抗
器７等の回路部品が搭載されるランドにはクリームハン
ダが予め印刷されているので、マウンタにより搭載され
た回路部品は、クリームハンダにより仮固定される。Next, with reference to FIG. 4, an example of alignment when mounting a circuit component by the position mark method of the present invention on a printed circuit board will be described. A chip resistor 7 or the like having a position mark (+ mark) is mounted at a predetermined position on the printed circuit board 1 by a mounter (automatic mounting machine). Since cream solder is printed in advance on the land on which circuit components such as the chip resistor 7 are mounted, the circuit components mounted by the mounter are temporarily fixed by the cream solder.
【００１８】撮像装置２１は、ＣＣＤカメラなどが使用
され、印刷回路基板上に搭載された回路部品の位置情報
を撮像により取り込み、位置ずれ検出装置２２にデータ
を蓄積する。印刷回路基板１は、２つの角部（隅）に位
置マーク（＋印）が付与されている。そして、印刷回路
基板１の位置マーク２，３とチップ抵抗器７の位置マー
ク１１，１２を利用して、自動搭載機により仮固定され
たチップ抵抗器７の位置が正確に検出される。As the image pickup device 21, a CCD camera or the like is used, and the positional information of the circuit components mounted on the printed circuit board is picked up by image pickup, and the data is stored in the position shift detection device 22. The printed circuit board 1 is provided with position marks (+ marks) at two corners. Then, using the position marks 2 and 3 of the printed circuit board 1 and the position marks 11 and 12 of the chip resistor 7, the position of the chip resistor 7 temporarily fixed by the automatic mounting machine is accurately detected.
【００１９】もし、図３に示すようにチップ抵抗器７が
印刷回路基板１にずれをもって配置された場合には、位
置ずれがゼロになるように、制御装置２３の指令により
位置ずれ補正装置２４で修正する。即ち、制御装置２３
は、位置ずれ補正装置２４へ収集した位置ずれ情報を伝
える。位置ずれ補正装置２４は、設計値の位置データな
どを予め記憶していて、位置ずれ検出装置２４から送ら
れた実際位置情報と位置データ（設計値）と比較して位
置ずれを補正するようにＸＹ微動調整機構２５へ補正量
を出力する。ＸＹ微動調整機構２５は、微動調整が可能
なＸＹステージであり、固定部２６が位置ずれを生じた
搭載部品７を拘束し、ＸＹ微動調整ステージ２５が位置
ずれを生じた回路部品の位置を修正して正しい位置また
は向きに修正する。この後、搭載部品７は、ハンダリフ
ロー工程で予定のランドに正しい位置でハンダ付けさ
れ、電気的に接続されて固定される。If the chip resistors 7 are arranged on the printed circuit board 1 with a shift as shown in FIG. 3, the position shift correction unit 24 is instructed by the control unit 23 so that the position shift becomes zero. Correct with. That is, the control device 23
Transmits the collected positional deviation information to the positional deviation correction device 24. The positional deviation correcting device 24 stores position data of design values in advance, and compares the actual positional information and the positional data (design value) sent from the positional deviation detecting device 24 to correct the positional deviation. The correction amount is output to the XY fine movement adjustment mechanism 25. The XY fine movement adjustment mechanism 25 is an XY stage capable of fine movement adjustment, and the fixing portion 26 restrains the mounted component 7 in which the positional deviation has occurred, and the XY fine movement adjustment stage 25 corrects the position of the circuit component in which the positional deviation has occurred. The correct position or orientation. After that, the mounted component 7 is soldered to a predetermined land at a correct position in a solder reflow process, electrically connected and fixed.
【００２０】なお、マウンタにより印刷回路基板に仮固
定した回路部品の位置ずれの補正は、位置ずれ自動補正
装置を用いることなく、手動で行うようにしても勿論よ
い。The positional deviation of the circuit component temporarily fixed to the printed circuit board by the mounter may be manually corrected without using the automatic positional deviation correcting device.
【００２１】これまで本発明の一実施形態について説明
したが、本発明は上述の実施形態に限定されず、その技
術的思想の範囲内において種々異なる形態にて実施され
てよいことは言うまでもない。Although one embodiment of the present invention has been described so far, it goes without saying that the present invention is not limited to the above-mentioned embodiment and may be implemented in various different forms within the scope of the technical idea thereof.
【００２２】[0022]
【発明の効果】上述したように、本発明によれば、回路
部品および印刷回路基板に位置マークを付与することに
より、搭載される回路部品の位置及び向きの把握・認識
が簡単で且つ正確にできる。これにより、印刷回路基板
における回路部品の高密度実装が容易となり、位置ずれ
に基づく不良の発生を低減できる。As described above, according to the present invention, by providing the position mark on the circuit component and the printed circuit board, the position and orientation of the mounted circuit component can be grasped and recognized easily and accurately. it can. This facilitates high-density mounting of circuit components on the printed circuit board and reduces the occurrence of defects due to misalignment.
【図１】（ａ）は、本発明の実施形態における位置マー
クを付与した印刷回路基板を示す図であり、（ｂ）は、
位置マークを付与したチップ抵抗器を示す図であり、
（ｃ）は、位置マークを付与した集積回路を示す図であ
る。FIG. 1A is a diagram showing a printed circuit board provided with position marks according to an embodiment of the present invention, and FIG.
It is a diagram showing a chip resistor with a position mark,
(C) is a diagram showing an integrated circuit provided with a position mark.
【図２】（ａ）は、チップ抵抗器を印刷回路基板上に搭
載した図であり、（ｂ）はそのチップ抵抗器の拡大図を
示している。FIG. 2A is a diagram in which a chip resistor is mounted on a printed circuit board, and FIG. 2B is an enlarged view of the chip resistor.
【図３】搭載した回路部品の位置ずれを説明する図であ
り、（ａ）はＸＹ軸面内の位置ずれを示し、（ｂ）は垂
直（Ｚ軸）方向への傾きを示す図である。3A and 3B are diagrams illustrating a positional shift of mounted circuit components, FIG. 3A is a positional shift in an XY axis plane, and FIG. 3B is a diagram showing a tilt in a vertical (Z axis) direction. .
【図４】位置ずれ検出装置と位置ずれ補正装置の概略を
示した図である。FIG. 4 is a diagram schematically showing a positional deviation detection device and a positional deviation correction device.
１ 印刷回路基板 ２，３ 位置マーク ７ チップ抵抗器 １１，１２ チップ抵抗器の位置マーク １４ 集積回路 １６，１７ 集積回路チップの位置マーク ２１ 撮像素子（ＣＣＤカメラなど） ２２ 位置ずれ検出装置 ２３ 制御装置 ２４ 位置ずれ補正装置 ２５ ＸＹ微動調整機構 ２６ 固定部 1 printed circuit board A few position marks 7 chip resistors 11,12 Chip resistor position mark 14 integrated circuits 16, 17 Position mark of integrated circuit chip 21 Image sensor (CCD camera etc.) 22 Positional deviation detector 23 Control device 24 Misalignment correction device 25 XY fine adjustment mechanism 26 Fixed part
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E313 AA01 AA11 CC04 EE03 EE06 FF32 FG06 FG09 5E338 DD12 DD18 DD32 EE43 EE44 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 5E313 AA01 AA11 CC04 EE03 EE06 FF32 FG06 FG09 5E338 DD12 DD18 DD32 EE43 EE44
Claims (4)
て、前記回路部品の表面に位置マークを少なくとも２個
備えたことを特徴とする回路部品。1. A circuit component to be mounted on a printed circuit board, wherein at least two position marks are provided on the surface of the circuit component.
た回路部品を搭載する印刷回路基板に、位置マークを少
なくとも２個備えたことを特徴とする印刷回路基板。2. A printed circuit board on which a circuit component having at least two position marks on its surface is mounted and at least two position marks.
なくとも２個の位置マークを付与して、前記回路部品を
前記印刷回路基板に搭載して、前記回路部品の位置マー
クの印刷回路基板の位置マークに対する相対的な位置を
測定して、前記回路部品の印刷回路基板に対する搭載位
置のずれを検出することを特徴とする回路部品の実装方
法。3. A circuit component mounted on the printed circuit board is provided with at least two position marks, the circuit component is mounted on the printed circuit board, and the printed circuit board is marked with the position mark of the circuit component. A method of mounting a circuit component, comprising measuring a relative position with respect to a position mark to detect a displacement of a mounting position of the circuit component with respect to a printed circuit board.
なくとも２個の位置マークを付与して、前記回路部品を
前記印刷回路基板に搭載して、前記印刷回路基板に対し
て垂直方向から前記回路部品の２個の位置マーク間の距
離を測定して、前記回路部品の印刷回路基板に対する傾
きを検出することを特徴とする回路部品の実装方法。4. A circuit component mounted on the printed circuit board is provided with at least two position marks, the circuit component is mounted on the printed circuit board, and the circuit component is mounted on the printed circuit board in a direction perpendicular to the printed circuit board. A method of mounting a circuit component, comprising measuring a distance between two position marks of the circuit component to detect an inclination of the circuit component with respect to a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002134623A JP2003332794A (en) | 2002-05-09 | 2002-05-09 | Circuit component having positional mark and mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002134623A JP2003332794A (en) | 2002-05-09 | 2002-05-09 | Circuit component having positional mark and mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003332794A true JP2003332794A (en) | 2003-11-21 |
Family
ID=29697210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002134623A Pending JP2003332794A (en) | 2002-05-09 | 2002-05-09 | Circuit component having positional mark and mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003332794A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007057756A (en) * | 2005-08-24 | 2007-03-08 | Seiko Epson Corp | Method of manufacturing diffusing plate, diffusing plate, method of adjusting arrangement position of diffusing plate, backlight unit and electro-optic device, electronic equipment |
| JP2008227069A (en) * | 2007-03-12 | 2008-09-25 | Yamaha Motor Co Ltd | Component transfer equipment and surface mounting machine |
| JP2015133357A (en) * | 2014-01-09 | 2015-07-23 | ヤマハ発動機株式会社 | Surface mounter, component supplier and positional deviation detection method |
-
2002
- 2002-05-09 JP JP2002134623A patent/JP2003332794A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007057756A (en) * | 2005-08-24 | 2007-03-08 | Seiko Epson Corp | Method of manufacturing diffusing plate, diffusing plate, method of adjusting arrangement position of diffusing plate, backlight unit and electro-optic device, electronic equipment |
| JP2008227069A (en) * | 2007-03-12 | 2008-09-25 | Yamaha Motor Co Ltd | Component transfer equipment and surface mounting machine |
| JP2015133357A (en) * | 2014-01-09 | 2015-07-23 | ヤマハ発動機株式会社 | Surface mounter, component supplier and positional deviation detection method |
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