JP2004326979A - Electrodeposition plating bath for forming magnetic film and electrodeposition plating method using the same - Google Patents
Electrodeposition plating bath for forming magnetic film and electrodeposition plating method using the same Download PDFInfo
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- JP2004326979A JP2004326979A JP2003123229A JP2003123229A JP2004326979A JP 2004326979 A JP2004326979 A JP 2004326979A JP 2003123229 A JP2003123229 A JP 2003123229A JP 2003123229 A JP2003123229 A JP 2003123229A JP 2004326979 A JP2004326979 A JP 2004326979A
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- magnetic film
- electrodeposition plating
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- electrodeposition
- cobalt
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- 238000007747 plating Methods 0.000 title claims abstract description 33
- 238000004070 electrodeposition Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 15
- 229910001260 Pt alloy Inorganic materials 0.000 claims abstract description 11
- 239000002253 acid Substances 0.000 claims abstract description 4
- NGPGDYLVALNKEG-UHFFFAOYSA-N azanium;azane;2,3,4-trihydroxy-4-oxobutanoate Chemical compound [NH4+].[NH4+].[O-]C(=O)C(O)C(O)C([O-])=O NGPGDYLVALNKEG-UHFFFAOYSA-N 0.000 claims abstract description 4
- GFHNAMRJFCEERV-UHFFFAOYSA-L cobalt chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Co+2] GFHNAMRJFCEERV-UHFFFAOYSA-L 0.000 claims abstract description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 11
- GUBSQCSIIDQXLB-UHFFFAOYSA-N cobalt platinum Chemical compound [Co].[Pt].[Pt].[Pt] GUBSQCSIIDQXLB-UHFFFAOYSA-N 0.000 abstract description 8
- 239000010408 film Substances 0.000 description 56
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 36
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- 229910020707 Co—Pt Inorganic materials 0.000 description 17
- 239000013078 crystal Substances 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000005185 salting out Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910003771 Gold(I) chloride Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000001255 X-ray photoelectron diffraction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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Abstract
Description
【０００１】
【発明の属する技術分野】
本発明は、磁気記録媒体を構成する磁性膜の形成に関し、特に、コバルト−白金合金（以下、Ｃｏ−Ｐｔ合金と略す場合もある）磁性膜を電析めっきにより形成する技術に関する。
【０００２】
【従来の技術】
近年、磁気記録媒体の製造においては、記録密度の高密度化のため、スパッタリング法や真空蒸着法のような乾式法によりディスク基板上に形成した磁性膜を記録層とする薄膜型の磁気記録媒体の研究開発が盛んに行われている。
【０００３】
この磁気記録媒体の磁性膜材料としては、コバルトを含むコバルト系合金が一般的に知られている。これらの磁性膜は高記録密度特性を有し、乾式法により形成した薄膜の記録層はその記録密度を飛躍的に向上させているのが現状である。
【０００４】
しかしながら、乾式法により磁性膜を形成する場合、大量生産性の観点からすると、十分に満足するものとはいえない。いわゆるブロードバンド化による大量情報通信技術の進展を考慮すると、今後、高密度の記録媒体は必須であり、このような高密度記録媒体を大量且つ低コストで提供できる製造技術が必要となる。このようなことから、大量生産が可能となる電析めっきという湿式法による磁性膜製造技術が現在注目されている。
【０００５】
このコバルト系合金磁性膜としては、例えばＣｏ−Ｐｔ合金磁性膜形成用のめっき浴が知られている（特許文献１参照）。
【０００６】
【特許文献１】特開平４−３０７４１９号公報
【０００７】
このＣｏ−Ｐｔ合金磁性膜は原子組成比が１：１である場合、高密度の磁気記録媒体への応用としての可能性があり、近年特に注目されている。それは、Ｃｏ−Ｐｔ合金磁性膜が通常不規則なｆｃｃ構造をとっているものの、６００〜７００℃付近で熱処理を行うと、ＡｕＣｌ型、Ｌ１０のｆｃｔ構造の規則構造となり、高い一軸結晶磁気異方性を有するためである。
【０００８】
【発明の解決する課題】
しかしながら、特許文献１の先行技術の電解めっき液は、酸性の電解めっき液であり、析出物の合金比率の安定性などの点において検討する余地がある。また、Ｃｏ−Ｐｔ合金磁性膜を湿式法により形成する技術開発は注目されているものの、めっき浴の種類やその条件等について、あまり多く報告されていない。そのため、現在も、乾式法による磁性膜形成が主流であり、飛躍的な生産性の向上や低コスト化への対応が今ひとつ十分であるとはいえない状況である。
【０００９】
本発明は、以上のような事情のもとになされたもので、磁気記録媒体をコバルト−白金合金磁性膜で構成する際に、湿式法により形成するために、新たな組成のコバルト−白金合金磁性膜形成用電析めっき浴を提供せんとするものである。
【００１０】
【課題を解決するための手段】
かかる課題を解決するため、本発明のＣｏ−Ｐｔ合金磁性膜形成用電析めっき浴は、塩化コバルト六水和物を０．５〜２０ｇ／Ｌと、塩化白金酸（ＩＶ）を２〜６０ｇ／Ｌと、酒石酸アンモニウムを０．５〜５０ｇ／Ｌとを含有するものとした。
【００１１】
塩化コバルト六水和物は、０．５ｇ／Ｌ未満であると、コバルトが共析不可能となり、２０ｇ／Ｌを超えるとめっき液中で不安定となり、沈殿しやすくなる傾向となる。塩化白金酸（ＩＶ）は、２ｇ／Ｌ未満であると、白金が共析しづらくなり、５０ｇ／Ｌを超えるとめっき液中から塩析が発生し易くなる傾向となる。
【００１２】
酒石酸アンモニウムは、コバルトの錯化剤の役割をし、０．５ｇ／Ｌ未満であると、コバルトが沈殿しやすくなり、５０ｇ／Ｌを超えるとめっき液中から塩析が発生し易くなる傾向となる。
【００１３】
本発明に係るコバルト−白金合金の磁性膜形成用電析めっき浴により磁性膜を形成する場合、電析電流密度を１００〜２０００Ａ／ｍ２、液温５０〜７０℃でめっき処理を行うことが好ましい。電流密度が１００Ａ／ｍ２未満であると、析出物の外観が不均一となり、２０００Ａ／ｍ２を超えると、析出物の外観が焼け状態になる傾向がある。そして、液温が５０℃未満であると白金が共析しづらくなり、７０℃を超えるとアンモニアが揮発し、めっき液の安定性が悪くなる傾向とある。
【００１４】
本発明に係るコバルト−白金合金磁性膜形成用電析めっき浴により磁性膜を形成すると、得られる磁性膜は微細な結晶により構成されており、磁性膜中の白金濃度が増加するに従い、膜の構造は微細化されるものとなる。そして、本発明のコバルト−白金合金磁性膜形成用電析めっき浴によれば、１０ａｔ％〜６０ａｔ％Ｐｔの組成範囲を有するＣｏ−Ｐｔ合金磁性膜を形成することができる。
【００１５】
【発明の実施の形態】
以下に、本発明の好ましい実施形態について説明する。
【００１６】
本実施形態は、表１に示す組成の各めっき浴により、Ｃｏ−Ｐｔ合金磁性膜を形成した結果である。磁性膜の形成は、表１に示す各組成のめっき浴を準備し、チタン製のメッシュコーティングがされたＰｔアノード電極と、Ｃｕカソード電極とを用いて電析めっきすることで行った。めっき処理は、液温６０℃、電流密度を１００、４００、６００、８００、１０００、１２００、１５００、２０００Ａ／ｍ２の８つの条件で行い、電析厚み０．２〜０．５μｍの磁性膜を形成した。また、電析中にめっき液の撹拌を行った。
【００１７】
【表１】
実施例１〜４の各めっき浴において、８つの電流密度条件により得られた各Ｃｏ−Ｐｔ合金磁性膜をそれぞれエネルギー分散型Ｘ線分光器（ＥＤＳ）により分析し、磁性膜のＰｔ比率（ａｔ％）を調べた。その結果を図１に示す。図１より、電流密度が大きくなると、磁性膜中でのＰｔの占める割合が増加していることが判明した。また、めっき浴中のＰｔ濃度が高いほど磁性膜中でのＰｔの占める割合が増加することも確認された。この結果より、めっき浴の組成や電流密度を変化させることにより、組成の異なるＣｏ−Ｐｔ合金磁性膜（Ｐｔ １０ａｔ％〜６０ａｔ％）が得られることが判明した。
【００１９】
次に、本実施形態で得られたＣｏ−Ｐｔ合金磁性膜の化学結合状態をＸ線光電子回折法（ＸＰＳ）により調べた結果について説明する。この測定は、実施例３の電流密度４００Ａ／ｍ２（Ｐｔ３７．２ａｔ％、図１参照）で得られた膜により行った。その結果、膜中のＣｏ、Ｐｔは、ともに金属状態のものであることが判明した。
【００２０】
続いて、本実施形態で得られたＣｏ−Ｐｔ合金磁性膜の結晶構造をＸ線回折（ＸＲＤ）により調べた結果について説明する。この測定は、Ｐｔが５７ａｔ％（実施例１）、５１ａｔ％（実施例２）、４１ａｔ％（実施例２）、２５ａｔ％（実施例４）、１６ａｔ％（実施例４）の組成を有する５つの膜により行った。その結果、膜中のＰｔ濃度が低いとき（２５ａｔ％、１６ａｔ％）はｈｃｐ構造をしており、膜中のＰｔ濃度が高いとき（５７ａｔ％、５１ａｔ％、４１ａｔ％、）はｆｃｃ構造をしていることが判明した。
【００２１】
そして、本実施形態で得られたＣｏ−Ｐｔ合金磁性膜の結晶粒径を透過電子顕微鏡（ＴＥＭ、倍率６０万倍）により観察した結果について説明する。この観察は、Ｐｔが５７ａｔ％（実施例１）、５１ａｔ％（実施例２）、４１ａｔ％（実施例２）、３７ａｔ％（実施例３）、１６ａｔ％（実施例４）の組成を有する５つの膜により行った。その結果、電析めっきにより得られたＣｏ−Ｐｔ合金磁性膜は、５〜１０ｎｍオーダーの非常に微細化した結晶であり、膜中のＰｔ比率が高くなると結晶粒径が小さくなる傾向も判明した。また、Ｐｔが１６ａｔ％の低い比率の磁性膜ではｈｃｐ構造をしており、それ以上の高いＰｔ比率の磁性膜ではｆｃｃ構造であることが確認された。
【００２２】
さらに、本実施形態で得られたＣｏ−Ｐｔ合金磁性膜の磁気的性質を振動型磁気天秤（ＶＳＭ）により調査した結果について説明する。この測定は、実施例２の電流密度１５００Ａ／ｍ２（Ｐｔ５１ａｔ％、図１参照）で得られた膜を、真空下（１０−５〜１０−６Ｐａ）４５０℃、６時間のアニール処理をした磁性膜について行った。Ｘ線回折（ＸＲＤ）、透過電子顕微鏡（ＴＥＭ、倍率６０万倍）により、アニール処理した磁性膜の構造の規則化を調べたところ、アニール処理した磁性膜は、規則ｆｃｔ構造に変化していることが判った。そして、保持力は、面内方向で２４４Ｏｅで、面垂直方向で６７３Ｏｅであった。
【００２３】
最後に、本実施形態で得られたＣｏ−Ｐｔ合金磁性膜の表面状態を操作電子顕微鏡（ＳＥＭ、傾斜角３０°倍率６５０００倍）により観察した結果について説明する。この観察は、実施例４の電流密度４００Ａ／ｍ２（Ｐｔ１６ａｔ％、）、実施例４の電流密度６００Ａ／ｍ２（Ｐｔ２５ａｔ％）、実施例３の電流密度４００Ａ／ｍ２（Ｐｔ３７ａｔ％）、実施例２の電流密度６００Ａ／ｍ２（Ｐｔ４１ａｔ％）、実施例２の電流密度１５００Ａ／ｍ２（Ｐｔ５１ａｔ％）、実施例１の電流密度８００Ａ／ｍ２（Ｐｔ５７ａｔ％）で得られた６つの膜について行った。その結果、実施例４の電流密度４００Ａ／ｍ２（Ｐｔ１６ａｔ％）、実施例４の電流密度６００Ａ／ｍ２（Ｐｔ２５ａｔ％）、実施例２の電流密度１５００Ａ／ｍ２（Ｐｔ５１ａｔ％）、実施例１の電流密度８００Ａ／ｍ２（Ｐｔ５７ａｔ％）の磁性膜の表面には若干の起伏が見られるものの、その状態は滑らかであることが判った。また、実施例３の電流密度４００Ａ／ｍ２（Ｐｔ３７ａｔ％）、実施例２の電流密度６００Ａ／ｍ２（Ｐｔ４１ａｔ％）、表面に起伏がほとんど認められず、表面状態は非常に滑らかであることが観察された。
【００２４】
【発明の効果】
以上説明したように、本発明の磁性膜形成用電析めっき浴によれば、異なる組成（Ｐｔ１０ａｔ％〜６０ａｔ％）のＣｏ−Ｐｔ合金磁性膜を形成することができ、高保持力を有するＣｏ−Ｐｔ合金磁性膜を得ることができる。
【図面の簡単な説明】
【図１】本実施形態の電流密度とＰｔ比率の関係を示すグラフ。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to the formation of a magnetic film constituting a magnetic recording medium, and more particularly to a technique of forming a cobalt-platinum alloy (hereinafter sometimes abbreviated as a Co-Pt alloy) magnetic film by electrodeposition plating.
[0002]
[Prior art]
In recent years, in the production of magnetic recording media, in order to increase the recording density, a thin film type magnetic recording medium in which a magnetic film formed on a disk substrate by a dry method such as a sputtering method or a vacuum evaporation method is used as a recording layer. R & D is actively conducted.
[0003]
As a magnetic film material of the magnetic recording medium, a cobalt alloy containing cobalt is generally known. At present, these magnetic films have high recording density characteristics, and the recording layer of a thin film formed by a dry method has dramatically improved the recording density.
[0004]
However, when a magnetic film is formed by a dry method, it cannot be said that it is sufficiently satisfactory from the viewpoint of mass productivity. In consideration of the progress of mass information communication technology due to the so-called broadband technology, a high-density recording medium will be indispensable in the future, and a manufacturing technology capable of providing such a high-density recording medium in large quantities at low cost will be required. For this reason, a magnetic film manufacturing technique by a wet method called electrodeposition plating, which enables mass production, has attracted attention at present.
[0005]
As this cobalt-based alloy magnetic film, for example, a plating bath for forming a Co—Pt alloy magnetic film is known (see Patent Document 1).
[0006]
[Patent Document 1] Japanese Patent Application Laid-Open No. 4-307419
When the atomic composition ratio of the Co—Pt alloy magnetic film is 1: 1, the magnetic film has a possibility of being applied to a high-density magnetic recording medium, and has been particularly noted in recent years. It although Co-Pt alloy magnetic film is normally taken irregular fcc structure, when subjected to heat treatment at around 600 to 700 ° C., AuCl type becomes the ordered structure of the fct structure L1 0, high uniaxial crystal magnetic anisotropy This is because it has anisotropy.
[0008]
[Problems to be solved by the invention]
However, the prior art electrolytic plating solution of Patent Document 1 is an acidic electrolytic plating solution, and there is room for study in terms of the stability of the alloy ratio of precipitates and the like. Although the development of technology for forming a Co—Pt alloy magnetic film by a wet method has attracted attention, there have been few reports on the type of plating bath and its conditions. For this reason, the magnetic film formation by the dry method is still the mainstream even today, and it cannot be said that a drastic improvement in productivity and a reduction in cost are sufficiently satisfactory.
[0009]
The present invention has been made in view of the above circumstances, and when forming a magnetic recording medium with a cobalt-platinum alloy magnetic film, a cobalt-platinum alloy having a new composition to form by a wet method. An object of the present invention is to provide an electrodeposition plating bath for forming a magnetic film.
[0010]
[Means for Solving the Problems]
In order to solve such problems, the electrodeposition plating bath for forming a Co—Pt alloy magnetic film of the present invention comprises 0.5 to 20 g / L of cobalt chloride hexahydrate and 2 to 60 g of chloroplatinic acid (IV). / L and 0.5 to 50 g / L of ammonium tartrate.
[0011]
If the cobalt chloride hexahydrate is less than 0.5 g / L, cobalt cannot be co-deposited, and if it exceeds 20 g / L, it will become unstable in the plating solution and tend to precipitate. When the amount of chloroplatinic acid (IV) is less than 2 g / L, it is difficult for eutectoid of platinum, and when it exceeds 50 g / L, salting out tends to occur easily in the plating solution.
[0012]
Ammonium tartrate acts as a complexing agent for cobalt. When the amount is less than 0.5 g / L, cobalt tends to precipitate, and when the amount exceeds 50 g / L, salting out tends to occur easily from the plating solution. Become.
[0013]
When the magnetic film is formed by the electrodeposition plating bath for forming a magnetic film of a cobalt-platinum alloy according to the present invention, the plating treatment may be performed at an electrodeposition current density of 100 to 2000 A / m 2 and a liquid temperature of 50 to 70 ° C. preferable. When the current density is less than 100 A / m 2 , the appearance of the precipitate becomes non-uniform, and when the current density exceeds 2000 A / m 2 , the appearance of the precipitate tends to be burnt. If the solution temperature is less than 50 ° C., it is difficult for eutectoid of platinum, and if it exceeds 70 ° C., ammonia tends to evaporate and the stability of the plating solution tends to deteriorate.
[0014]
When a magnetic film is formed by the electrodeposition plating bath for forming a cobalt-platinum alloy magnetic film according to the present invention, the obtained magnetic film is composed of fine crystals, and as the platinum concentration in the magnetic film increases, the film becomes The structure will be miniaturized. According to the electrodeposition plating bath for forming a cobalt-platinum alloy magnetic film of the present invention, a Co-Pt alloy magnetic film having a composition range of 10 at% to 60 at% Pt can be formed.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described.
[0016]
The present embodiment is a result of forming a Co—Pt alloy magnetic film using each plating bath having the composition shown in Table 1. The formation of the magnetic film was performed by preparing a plating bath having each composition shown in Table 1, and performing electrodeposition plating using a Pt anode electrode coated with titanium mesh and a Cu cathode electrode. The plating process is performed under eight conditions of a liquid temperature of 60 ° C. and current densities of 100, 400, 600, 800, 1000, 1200, 1500 and 2000 A / m 2 , and a magnetic film having an electrodeposition thickness of 0.2 to 0.5 μm. Was formed. Further, the plating solution was stirred during the electrodeposition.
[0017]
[Table 1]
In each of the plating baths of Examples 1 to 4, each of the Co—Pt alloy magnetic films obtained under the eight current density conditions was analyzed by an energy dispersive X-ray spectrometer (EDS), and the Pt ratio (at %). The result is shown in FIG. From FIG. 1, it was found that as the current density increased, the proportion of Pt in the magnetic film increased. It was also confirmed that the higher the Pt concentration in the plating bath, the higher the proportion of Pt in the magnetic film. From this result, it was found that Co-Pt alloy magnetic films (Pt 10 at% to 60 at%) having different compositions can be obtained by changing the composition of the plating bath and the current density.
[0019]
Next, the result of examining the chemical bonding state of the Co—Pt alloy magnetic film obtained in the present embodiment by X-ray photoelectron diffraction (XPS) will be described. This measurement was performed using the film obtained in Example 3 at a current density of 400 A / m 2 (Pt 37.2 at%, see FIG. 1). As a result, it was found that both Co and Pt in the film were in a metal state.
[0020]
Subsequently, the result of examining the crystal structure of the Co—Pt alloy magnetic film obtained in the present embodiment by X-ray diffraction (XRD) will be described. In this measurement, Pt has a composition of 57 at% (Example 1), 51 at% (Example 2), 41 at% (Example 2), 25 at% (Example 4), and 16 at% (Example 4). Performed with one membrane. As a result, when the Pt concentration in the film is low (25 at%, 16 at%), the film has the hcp structure, and when the Pt concentration in the film is high (57 at%, 51 at%, 41 at%), the film has the fcc structure. Turned out to be.
[0021]
The results obtained by observing the crystal grain size of the Co—Pt alloy magnetic film obtained in the present embodiment with a transmission electron microscope (TEM, magnification: 600,000) will be described. This observation shows that Pt has a composition of 57 at% (Example 1), 51 at% (Example 2), 41 at% (Example 2), 37 at% (Example 3), and 16 at% (Example 4). Performed with one membrane. As a result, the Co—Pt alloy magnetic film obtained by electrodeposition plating was a very fine crystal of the order of 5 to 10 nm, and it was also found that the crystal grain size tended to decrease as the Pt ratio in the film increased. . It was also confirmed that the magnetic film having a low Pt ratio of 16 at% had an hcp structure, and the magnetic film having a higher Pt ratio had an fcc structure.
[0022]
Further, the results of investigating the magnetic properties of the Co—Pt alloy magnetic film obtained in this embodiment using a vibration type magnetic balance (VSM) will be described. In this measurement, the film obtained at a current density of 1500 A / m 2 (Pt 51 at%, see FIG. 1) of Example 2 was annealed at 450 ° C. for 6 hours under vacuum (10 −5 to 10 −6 Pa). The test was performed on the magnetic film. X-ray diffraction (XRD) and transmission electron microscopy (TEM, magnification: 600,000 times) were examined to determine the ordering of the structure of the annealed magnetic film. The annealed magnetic film changed to a regular fct structure. It turns out. The holding force was 244 Oe in the in-plane direction and 673 Oe in the direction perpendicular to the plane.
[0023]
Finally, the result of observing the surface state of the Co—Pt alloy magnetic film obtained in the present embodiment with an operation electron microscope (SEM, tilt angle 30 °, magnification 65,000 times) will be described. This observation was made at a current density of 400 A / m 2 (Pt 16 at%) of Example 4, a current density of 600 A / m 2 (Pt 25 at%) of Example 4, a current density of 400 A / m 2 (Pt 37 at%) of Example 3, Six current density obtained at a current density of 600 A / m 2 (Pt 41 at%) of Example 2, 1500 A / m 2 (Pt 51 at%) of Example 2, and 800 A / m 2 (Pt 57 at%) of Example 1 Performed on membrane. As a result, the current density of Example 4 was 400 A / m 2 (Pt 16 at%), the current density of Example 4 was 600 A / m 2 (Pt 25 at%), and the current density of Example 2 was 1500 A / m 2 (Pt 51 at%). Although the surface of the magnetic film having a current density of 800 A / m 2 (Pt 57 at%) was slightly uneven, the state was found to be smooth. In addition, the current density of Example 3 was 400 A / m 2 (Pt 37 at%), the current density of Example 2 was 600 A / m 2 (Pt 41 at%), the surface showed almost no undulation, and the surface state was very smooth. Was observed.
[0024]
【The invention's effect】
As described above, according to the electrodeposition plating bath for forming a magnetic film of the present invention, a Co—Pt alloy magnetic film having a different composition (10 at% to 60 at%) can be formed, and Co having high coercive force can be formed. -A Pt alloy magnetic film can be obtained.
[Brief description of the drawings]
FIG. 1 is a graph showing a relationship between a current density and a Pt ratio according to the embodiment.
Claims (2)
電流密度１００〜２０００Ａ／ｍ２、液温５０〜７０℃でめっき処理を行う電析めっき方法。An electrodeposition plating method for performing a plating process for forming a magnetic film using the electrodeposition plating bath for forming a magnetic film according to claim 1,
An electrodeposition plating method in which plating is performed at a current density of 100 to 2000 A / m 2 and a liquid temperature of 50 to 70 ° C.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2007154285A (en) * | 2005-12-07 | 2007-06-21 | Electroplating Eng Of Japan Co | Method for producing magnetic film of cobalt-platinum alloy |
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| JP2007154285A (en) * | 2005-12-07 | 2007-06-21 | Electroplating Eng Of Japan Co | Method for producing magnetic film of cobalt-platinum alloy |
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