JP2004111964A - 表面実装型電子デバイス - Google Patents
表面実装型電子デバイス Download PDFInfo
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- JP2004111964A JP2004111964A JP2003316609A JP2003316609A JP2004111964A JP 2004111964 A JP2004111964 A JP 2004111964A JP 2003316609 A JP2003316609 A JP 2003316609A JP 2003316609 A JP2003316609 A JP 2003316609A JP 2004111964 A JP2004111964 A JP 2004111964A
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- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 55
- 239000000758 substrate Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- 238000005476 soldering Methods 0.000 description 6
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 4
- 230000000875 corresponding effect Effects 0.000 description 4
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- 238000000742 single-metal deposition Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910005540 GaP Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- AJGDITRVXRPLBY-UHFFFAOYSA-N aluminum indium Chemical compound [Al].[In] AJGDITRVXRPLBY-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
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- 229910052733 gallium Inorganic materials 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- 238000003672 processing method Methods 0.000 description 1
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Abstract
【解決手段】表面実装型デバイスは、デバイス実装の為の第1の面(410)を有する本体(402)と、第1の面(410)に形成される窪み部分(420、421)と、第1の面(410)に位置する複数の電気接触部材(404、406)とを備える。電気接触部材(404、406)は、窪み部分(420、421)の少なくとも1つの内表面の少なくとも一部分を構成する第1の部分(412、414)を含む。
【選択図】図4
Description
12、14 プリント回路基板の端子
400、500、600、700、800、900 表面実装型電子デバイス
402、502、602、702、802、902 本体
404、406、504、506、507、604、606、704、706、707、804、806、904、906、907 電気接触部材
410、510、610、710、810、910 本体の第1の面
412、414、416、418、512、514、516〜519、616、618、716、718、719、816、818、916、918、919 電気接触部材の第1の部分
420、421、520、521、620、621、720、721、820、821、920、921 窪み
422、424、522、524、525、622、624、722、724、725、822、824、922、924、925 電気接触部材の第2の部分
Claims (10)
- デバイスを実装する為の第1の面を有する本体と、前記第1の面に形成される窪み部分と、前記第1の面に位置する複数の電気接触部材とを備え、該電気接触部材が、前記窪み部分の内表面の少なくとも一部分を構成する第1の部分を有することを特徴とする表面実装型電子デバイス。
- 前記電気接触部材の各々は、少なくとも部分的に前記第1の面に延び、該第1の面が平坦面上に実装されるとき、前記第1の部分が前記平坦面から間隔を空けた位置に置かれることを特徴とする請求項1に記載の表面実装型デバイス。
- 前記窪み部分にある前記第1の部分の少なくとも一部は、前記第1の面に対して実質的に平行であることを特徴とする請求項1に記載の表面実装型デバイス。
- 前記窪み部分にある前記第1の部分の少なくとも一部は、前記第1の面に対して非平行とされることを特徴とする請求項1に記載の表面実装型デバイス。
- 前記窪み部分にある前記第1の部分の少なくとも一部は、前記第1の面に対して垂直とされることを特徴とする請求項4に記載の表面実装型デバイス。
- 前記窪み部分にある前記第1の部分の少なくとも一部は、傾斜部分を有し、前記第1の面から斜めに遠ざかる方向に延びていることを特徴とする請求項4に記載の表面実装型デバイス。
- 前記窪み部分にある前記第1の部分は、前記第1の面から斜めに遠ざかる方向に延びる傾斜部分と、前記第1の面に実質的に平行に延び、前記第1の面から最も遠い前記傾斜部分の端部に結合する平行部分とを有することを特徴とする請求項1に記載の表面実装型デバイス。
- 前記電気接触部材は、前記第1の面の前記窪み部分から外れて位置する第2の部分を有することを特徴とする請求項1に記載の表面実装型デバイス。
- 前記電気接触部材は、前記本体の前記第1の面に沿って外側に向かって延びており、前記第1の部分が前記本体の前記第1の面の外側端部に向かって配置されていることを特徴とする請求項1に記載の表面実装型デバイス。
- 前記デバイスがプリント回路基板上に実装されており、前記電気接触部材が前記プリント回路基板の端子と直接接触した状態にあり、前記第1の部分と前記プリント回路基板との間に接着剤が設けられており、前記電気接触部材がヒートシンクとして機能することを特徴とする請求項1に記載の表面実装型デバイス。
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Application Number | Priority Date | Filing Date | Title |
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MYPI20023479 | 2002-09-18 |
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JP2004111964A true JP2004111964A (ja) | 2004-04-08 |
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JP2003316609A Pending JP2004111964A (ja) | 2002-09-18 | 2003-09-09 | 表面実装型電子デバイス |
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US (1) | US6879040B2 (ja) |
JP (1) | JP2004111964A (ja) |
DE (1) | DE10340069B4 (ja) |
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Also Published As
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DE10340069B4 (de) | 2010-01-21 |
DE10340069A1 (de) | 2004-04-08 |
US20040051171A1 (en) | 2004-03-18 |
US6879040B2 (en) | 2005-04-12 |
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