JP2003273490A - Board-joining structure and electronic equipment having the same - Google Patents
Board-joining structure and electronic equipment having the sameInfo
- Publication number
- JP2003273490A JP2003273490A JP2002066689A JP2002066689A JP2003273490A JP 2003273490 A JP2003273490 A JP 2003273490A JP 2002066689 A JP2002066689 A JP 2002066689A JP 2002066689 A JP2002066689 A JP 2002066689A JP 2003273490 A JP2003273490 A JP 2003273490A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrode terminals
- insulating partition
- conductive particles
- bonding structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、相互に間隔をおい
て設けられた複数の第１電極端子を有する第１基板と、
その第１基板の複数の第１電極端子に対応するように設
けられた複数の第２電極端子を有する第２基板と、を備
え、各第１電極端子とそれに対応する第２電極端子とが
導電性粒子を含む異方性導電接着剤を介して対向するよ
うに第１基板と第２基板とが接合された基板接合構造、
及びそれを備えた電子装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a first substrate having a plurality of first electrode terminals spaced apart from each other,
A second substrate having a plurality of second electrode terminals provided so as to correspond to the plurality of first electrode terminals of the first substrate, and each first electrode terminal and a corresponding second electrode terminal are A substrate bonding structure in which a first substrate and a second substrate are bonded to face each other with an anisotropic conductive adhesive containing conductive particles interposed therebetween,
And an electronic device including the same.
【０００２】[0002]
【従来の技術】従来から液晶表示装置の表示エリアを最
大限に活用するため、電極端子を設ける部位を縮小する
ことが行われている。特開２０００−２７６０７０号公
報には、単純マトリクス方式の液晶表示装置であって、
第１基板（コモン基板）に設けられた電極をその基板の
シール材外側の側辺に沿って設けられた電極端子に接続
し、第２基板（セグメント基板）に設けられた電極をそ
の基板の側辺に沿って設けられた電極端子に接続すると
共にその電極端子を導電性のシール材を介して一方の基
板のシール材外側の側辺に沿って設けられた電極端子に
接続することにより、一対の基板のうち一方の基板のみ
に外部回路への接続用の電極端子を設けることが開示さ
れている（同公報の図２参照）。ここで、一対の基板
は、一般に、シール材として導電性粒子を含む異方性導
電接着剤がスクリーン印刷法などによりいずれかの基板
に設けられ、プレス機等により熱圧着して接着される。2. Description of the Related Art Conventionally, in order to make the most of the display area of a liquid crystal display device, the area where the electrode terminals are provided has been reduced. Japanese Unexamined Patent Publication No. 2000-276070 discloses a simple matrix type liquid crystal display device,
The electrodes provided on the first substrate (common substrate) are connected to the electrode terminals provided along the outer sides of the sealing material of the substrate, and the electrodes provided on the second substrate (segment substrate) are connected to the electrodes of the substrate. By connecting to the electrode terminal provided along the side edge and connecting the electrode terminal to the electrode terminal provided along the outer side edge of the seal material of one substrate through the conductive seal material, It is disclosed that only one of the pair of substrates is provided with an electrode terminal for connection to an external circuit (see FIG. 2 of the publication). In this case, the pair of substrates is generally provided with an anisotropic conductive adhesive containing conductive particles as a sealing material on one of the substrates by a screen printing method or the like, and is thermocompression-bonded by a press machine or the like to be bonded.
【０００３】また、特開平１１−１３５９０９号公報に
は、図７に示すように、液晶表示装置の一方の基板（第
２基板７２）に複数の接続用電極（第２電極端子７４）
が設けられている一方、フレキシブル配線基板（ＦＰ
Ｃ）（第１基板７１）にそれらの複数の接続用電極（第
１電極端子７３）に対応する複数の接続端子（第２電極
端子７４）と各接続端子（第２電極端子）間のダミー電
極７９とが設けられ、接続用電極（第１電極端子７３）
とそれに対応する接続端子（第２電極端子７４）とが異
方性導電接着剤を介して対向して設けられるように一方
の基板（第２基板７２）とフレキシブル配線基板（第１
基板７１）とが接合された基板接合構造７０とすること
により、導電性粒子の偏りを防止し、接着強度と導通信
頼性を向上させることが開示されている。同公報に開示
されているものは、基板接着時に加熱加圧用ヘッドの押
し圧により、接続用電極及び接続端子の無い部分のフレ
キシブル配線基板が押し潰され、押し潰された部分の異
方性導電接着剤がヘッド領域外（同公報図３の符号３
８）に押し出され、それによって起こる導電性粒子の滞
留（接着剤は押し出されるが導電性粒子がうまく排出さ
れずに残存する）による電極間リークを防止することを
目的とし、そして、接続端子間にダミー電極（信号伝達
に無関係な無効配線電極）を形成することで、ダミー電
極が柱となり加熱加圧用ヘッドによる異方性導電接着剤
の押し出しを接着剤及び導電性粒子共にスムーズにさ
せ、導電粒子の滞留を防止するものである。Further, in JP-A-11-135909, as shown in FIG. 7, a plurality of connecting electrodes (second electrode terminals 74) are provided on one substrate (second substrate 72) of the liquid crystal display device.
While the flexible wiring board (FP
C) A dummy between the plurality of connection terminals (second electrode terminals 74) corresponding to the plurality of connection electrodes (first electrode terminals 73) and each connection terminal (second electrode terminal) on the (first substrate 71). An electrode 79 is provided and a connection electrode (first electrode terminal 73)
And one of the boards (second board 72) and the flexible wiring board (first board) so that the corresponding connection terminals (second electrode terminals 74) are provided to face each other with an anisotropic conductive adhesive interposed therebetween.
It is disclosed that the substrate bonding structure 70 in which the substrate 71) is bonded prevents the bias of the conductive particles and improves the adhesive strength and the conduction reliability. What is disclosed in the publication is that the flexible wiring board in a portion having no connection electrode and no connection terminal is crushed by the pressing force of the heating and pressing head at the time of adhering the substrate, and the anisotropic conductive portion of the crushed portion is crushed. The adhesive is outside the head area (reference numeral 3 in FIG.
8) The purpose is to prevent inter-electrode leakage due to the retention of conductive particles (adhesive is extruded but the conductive particles remain without being discharged) caused by being extruded to 8), and between the connection terminals. By forming dummy electrodes (ineffective wiring electrodes unrelated to signal transmission) on the electrodes, the dummy electrodes become pillars and the extrusion of anisotropic conductive adhesive by the heating / pressing head is made smooth for both the adhesive and conductive particles, and It is intended to prevent the retention of particles.
【０００４】[0004]
【発明が解決しようとする課題】ところで、近年のよう
に表示の高解像度化が強く望まれるようになると、隣接
電極端子間の間隔を狭くする設計を採用する必要が出て
くる。このように電極端子のファインピッチ化を図る
と、図８に示すように、隣接電極端子間に存在する導電
性粒子８６の存在確率が高くなり、導電性粒子８６によ
り隣接電極端子間が短絡される、すなわち、リーク不良
を生じる可能性が極端に高くなる。By the way, when there is a strong demand for higher display resolution as in recent years, it becomes necessary to adopt a design in which the interval between adjacent electrode terminals is narrowed. When the fine pitch of the electrode terminals is achieved in this way, as shown in FIG. 8, the existence probability of the conductive particles 86 existing between the adjacent electrode terminals increases, and the conductive particles 86 short-circuit the adjacent electrode terminals. That is, the possibility of leak failure is extremely high.
【０００５】特開平１１−１３５９０９号公報に開示の
ものは、接着部外への異方性導電接着剤をスムーズに排
出することを目的として、各接続端子間に導電性のダミ
ー電極を設けたものであり、隣接電極端子間のファイン
ピッチ化が図られた設計（電極端子間隔が導電性粒子の
粒径の５倍以下）では、図７に示すように、導電性のダ
ミー電極７９を介して導電性粒子７６の凝集によるリー
ク不良が発生する可能性がある。In the one disclosed in JP-A-11-135909, a conductive dummy electrode is provided between the connection terminals for the purpose of smoothly discharging the anisotropic conductive adhesive to the outside of the bonded portion. In the design in which the fine pitch between the adjacent electrode terminals is achieved (the electrode terminal interval is 5 times or less of the particle diameter of the conductive particles), as shown in FIG. As a result, a leak failure may occur due to the aggregation of the conductive particles 76.
【０００６】本発明は、かかる点に鑑みてなされたもの
であり、その目的とするところは、導電性粒子が隣接電
極端子間を短絡することを防止することができると共
に、導電性粒子が対向する電極端子間を確実且つ良好に
導通させることができる基板接合構造及びそれを備えた
電子装置を提供することにある。The present invention has been made in view of the above points, and an object of the present invention is to prevent conductive particles from short-circuiting between adjacent electrode terminals and to prevent conductive particles from facing each other. An object of the present invention is to provide a substrate bonding structure capable of reliably and satisfactorily conducting electrical connection between electrode terminals and an electronic device including the same.
【０００７】[0007]
【課題を解決するための手段】本発明は、複数の第１及
び第２電極端子の各隣接電極端子間に、各隣接電極端子
間の導電性粒子による短絡を阻止する絶縁隔壁を設けた
ものである。According to the present invention, an insulating partition wall is provided between adjacent electrode terminals of a plurality of first and second electrode terminals to prevent a short circuit due to conductive particles between the adjacent electrode terminals. Is.
【０００８】具体的には、本発明の基板接合構造は、相
互に間隔をおいて設けられた複数の第１電極端子を有す
る第１基板と、該第１基板の複数の第１電極端子に対応
するように設けられた複数の第２電極端子を有する第２
基板と、を備え、各第１電極端子とそれに対応する第２
電極端子とが導電性粒子を含む異方性導電接着剤を介し
て対向するように該第１基板と該第２基板とが接合され
たものであって、上記複数の第１及び第２電極端子の各
隣接電極端子間に、該各隣接電極端子間の上記導電性粒
子による短絡を阻止する絶縁隔壁が設けられていること
を特徴とする。Specifically, the substrate bonding structure of the present invention includes a first substrate having a plurality of first electrode terminals spaced apart from each other and a plurality of first electrode terminals of the first substrate. Second having a plurality of second electrode terminals provided correspondingly
A first electrode terminal and a second electrode corresponding to the first electrode terminal.
The first substrate and the second substrate are bonded so that the electrode terminals face each other through an anisotropic conductive adhesive containing conductive particles, and the plurality of first and second electrodes are provided. An insulating partition for preventing a short circuit due to the conductive particles between the adjacent electrode terminals is provided between the adjacent electrode terminals of the terminal.
【０００９】上記の構成によれば、第１及び第２電極端
子の各隣接電極端子間に絶縁隔壁を設けることにより異
方性導電接着剤に含まれた導電性粒子が隣接電極端子間
に配置させることを防ぐことができ、プレス加工等によ
り熱圧着する際でも絶縁隔壁付近の導電性粒子も第１及
び第２電極端子上に安定的に配置されるので、導電性粒
子が隣接電極端子間を短絡することが防止されてリーク
不良の発生を大幅に改善することができ、また、第１電
極端子とそれに対応する第２電極端子とが導電性粒子を
含む異方性導電接着剤を介して対向するように設けられ
ているので、それらの間を確実且つ良好に導通させるこ
とができる。According to the above construction, by providing an insulating partition between the adjacent electrode terminals of the first and second electrode terminals, the conductive particles contained in the anisotropic conductive adhesive are arranged between the adjacent electrode terminals. Since the conductive particles near the insulating partition are also stably arranged on the first and second electrode terminals even when they are thermocompression bonded by press working, etc. Can be prevented from being short-circuited, and the occurrence of leakage failure can be significantly improved. Further, the first electrode terminal and the corresponding second electrode terminal are connected via an anisotropic conductive adhesive containing conductive particles. Since they are provided so as to face each other, it is possible to surely and satisfactorily conduct electricity between them.
【００１０】ここで、絶縁隔壁は、第１基板に立設され
たものでも、また、第２基板に立設されたものでも、さ
らに、両方に立設されたものでもよい。Here, the insulating partition may be erected on the first substrate, erected on the second substrate, or further erected on both.
【００１１】本発明の基板接合構造は、上記複数の第１
及び第２電極端子の隣接電極端子間隔が上記導電性粒子
の粒径の１〜５倍であるものであってもよい。かかる構
成によれば、隣接電極端子間隔が極めて狭いファインピ
ッチ化されたものであるので、隣接電極端子間の短絡防
止効果をより有効に得ることができる。The substrate bonding structure of the present invention is the above-mentioned first plurality.
The interval between the adjacent electrode terminals of the second electrode terminal may be 1 to 5 times the particle diameter of the conductive particles. According to such a configuration, the interval between adjacent electrode terminals is extremely narrowed to a fine pitch, so that the effect of preventing a short circuit between adjacent electrode terminals can be more effectively obtained.
【００１２】本発明の基板接合構造は、上記絶縁隔壁の
高さが上記導電性粒子の粒径の５〜２０％であるもので
あることが好ましい。かかる構成によれば、絶縁隔壁の
高さが相対的に低いものの、隣接電極端子間での導電性
粒子の凝集を防止することができると共に両基板の電極
端子間を導通させるのに十分な電気抵抗を得ることがで
き、また、絶縁隔壁を設けることによる基板間ギャップ
に及ぼす影響を小さいものとすることができる。In the substrate bonding structure of the present invention, it is preferable that the height of the insulating partition is 5 to 20% of the particle diameter of the conductive particles. According to this configuration, although the height of the insulating partition is relatively low, it is possible to prevent the aggregation of the conductive particles between the adjacent electrode terminals, and it is possible to obtain sufficient electrical conductivity to electrically connect the electrode terminals of both substrates. Resistance can be obtained, and the influence of the provision of the insulating partition on the inter-substrate gap can be reduced.
【００１３】本発明の基板接合構造は、上記絶縁隔壁の
幅が上記導電性粒子の粒径の１．５倍以下であることが
好ましい。かかる構成によれば、絶縁隔壁の幅が相対的
に狭いものの、隣接電極端子間での導電性粒子の凝集を
防止することができると共に両基板の電極端子間を導通
させるのに十分な電気抵抗を得ることができ、また、絶
縁隔壁を設けることによる基板間ギャップに及ぼす影響
を小さいものとすることができる。In the substrate bonding structure of the present invention, the width of the insulating partition is preferably 1.5 times or less the particle diameter of the conductive particles. According to this structure, although the width of the insulating partition is relatively narrow, it is possible to prevent the aggregation of the conductive particles between the adjacent electrode terminals and to provide an electric resistance sufficient to electrically connect the electrode terminals of both substrates. In addition, it is possible to reduce the influence of the provision of the insulating partition on the inter-substrate gap.
【００１４】本発明の基板接合構造は、上記絶縁隔壁の
両壁面のそれぞれの少なくとも上部が上方から下方へ外
向きに傾斜したテーパ状に形成されているものであって
もよい。かかる構成によれば、絶縁隔壁のテーパ面に沿
って導電性粒子が円滑に電極端子側に流動するため、壁
面上部が断面直角に形成された場合に比較すると導電性
粒子が絶縁隔壁上に存在しにくくなる。従って、これに
より、導電性粒子が隣接電極端子間に存在する確率が低
くなるので、リーク不良を防ぐ効果が高くなり、また、
絶縁隔壁上に導電性粒子が存在することによる基板間ギ
ャップのムラの発生も抑制することができる。The substrate bonding structure of the present invention may be such that at least an upper portion of each wall surface of the insulating partition wall is formed in a taper shape that is inclined outward from the upper side to the lower side. According to this structure, the conductive particles smoothly flow to the electrode terminal side along the tapered surface of the insulating partition, so that the conductive particles are present on the insulating partition as compared with the case where the upper wall surface is formed at a right angle to the cross section. Hard to do. Therefore, this reduces the probability that the conductive particles are present between the adjacent electrode terminals, and thus the effect of preventing a leak failure is enhanced, and
It is also possible to suppress the occurrence of unevenness in the gap between the substrates due to the presence of the conductive particles on the insulating partition.
【００１５】以上のような本発明の基板接合構造を備え
た本発明の電子装置として、特に分野、用途は限定され
ない。The electronic device of the present invention having the above-described substrate bonding structure of the present invention is not particularly limited in fields and applications.
【００１６】本発明の電子装置は、上記第１又は第２基
板にカラーフィルタ及び／又はオーバーコート層が設け
られていると共に、上記絶縁隔壁が該カラーフィルタ及
び／又はオーバーコート層により構成されている液晶表
示装置であってもよい。かかる構成によれば、カラーフ
ィルタ又はオーバーコート層の形成と同時に絶縁隔壁の
形成が可能であるので、絶縁隔壁を形成するための工程
を必要とせず、製造上のメリットがある。In the electronic device of the present invention, a color filter and / or an overcoat layer is provided on the first or second substrate, and the insulating partition wall is composed of the color filter and / or the overcoat layer. It may be a liquid crystal display device. According to such a configuration, the insulating partition walls can be formed at the same time when the color filter or the overcoat layer is formed, so that there is no need for a step for forming the insulating partition walls, which is advantageous in manufacturing.
【００１７】本発明の電子装置は、上記絶縁隔壁の両壁
面のそれぞれの少なくとも上部が上方から下方へ外向き
に傾斜したテーパ状に形成されているものであってもよ
い。かかる構成によれば、絶縁隔壁のテーパ面に沿って
導電性粒子が円滑に電極端子側に流動するため、壁面上
部が断面直角に形成された場合に比較すると導電性粒子
が絶縁隔壁上に存在しにくくなる。従って、これによ
り、導電性粒子が隣接電極端子間に存在する確率が低く
なるので、リーク不良を防ぐ効果が高くなり、また、絶
縁隔壁上に導電性粒子が存在することによる基板間ギャ
ップのムラの発生も抑制することができる。The electronic device of the present invention may be such that at least an upper portion of each of the wall surfaces of the insulating partition wall is formed in a taper shape that is inclined outward from the upper side to the lower side. According to this structure, the conductive particles smoothly flow to the electrode terminal side along the tapered surface of the insulating partition, so that the conductive particles are present on the insulating partition as compared with the case where the upper wall surface is formed at a right angle to the cross section. Hard to do. Therefore, this reduces the probability that the conductive particles exist between the adjacent electrode terminals, so that the effect of preventing the leak failure is enhanced, and the unevenness of the gap between the substrates due to the presence of the conductive particles on the insulating partition wall. It is also possible to suppress the occurrence of
【００１８】[0018]
【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings.
【００１９】（実施形態１）図１及び２は、本発明の実
施形態１に係る基板接合構造１０を示す。この基板接合
構造１０は、その適用範囲が特に限定されるものではな
いが、例えば、一対の基板で液晶層を狭持した単純マト
リクス方式の液晶表示装置等のフラットパネルディスプ
レイであって、一方の基板に設けられた電極をその基板
のシール材外側に設けられた電極端子に接続し、他方の
基板に設けられた電極をその基板に設けられた電極端子
に接続すると共にその電極端子を導電性のシール材（異
方性導電接着剤）を介して一方の基板のシール材外側に
設けられた電極端子に接続したものや、一対の基板を備
えた液晶表示装置等のフラットパネルディスプレイであ
って、一方の基板に複数の接続用電極が設けられている
一方、フレキシブル配線基板にそれらの複数の接続用電
極に対応する複数の接続端子が設けられ、接続用電極と
それに対応する接続端子とが異方性導電接着剤１５を介
して対向して設けられるように一方の基板とフレキシブ
ル配線基板とが接合されたもの等の電子装置に適用され
る。(Embodiment 1) FIGS. 1 and 2 show a substrate bonding structure 10 according to Embodiment 1 of the present invention. Although the applicable range of the substrate bonding structure 10 is not particularly limited, for example, it is a flat panel display such as a simple matrix type liquid crystal display device in which a liquid crystal layer is sandwiched between a pair of substrates. Connect the electrode provided on the substrate to the electrode terminal provided on the outside of the sealing material of the substrate, connect the electrode provided on the other substrate to the electrode terminal provided on the substrate, and make the electrode terminal conductive. A flat panel display such as a liquid crystal display device having a pair of substrates, which is connected to an electrode terminal provided on the outer side of the sealing material of one of the substrates through the sealing material (anisotropic conductive adhesive) of , One board is provided with a plurality of connecting electrodes, while the flexible wiring board is provided with a plurality of connecting terminals corresponding to the plurality of connecting electrodes, And one of the substrates and the flexible wiring board to be opposed to the corresponding connection terminals through an anisotropic conductive adhesive 15 is applied to an electronic device, such as those joined.
【００２０】この基板接合構造１０は、第１基板１１と
第２基板１２とが接着接合された構成のものである。第
１基板１１には、その表面に酸化インジウムと酸化スズ
とを主成分とする柱状結晶質の酸化物（以下「ＩＴＯ」
という）等からなる複数の透明な第１電極端子１３が相
互に間隔をおいて設けられている。一方、第２基板１２
には、その表面に第１基板１１の複数の第１電極端子１
３に対応してＩＴＯ等からなる複数の透明な第２電極端
子１４が相互に間隔をおいて設けられていると共に、各
第２電極端子１４間にアクリルポリマー等からなる絶縁
隔壁１７が立設されている。そして、第１基板１１と第
２基板１２とは、各第１電極端子１３とそれに対応する
第２電極端子１４とが導電性粒子１６を含む異方性導電
接着剤１５を介して対向するように接合されている。The substrate bonding structure 10 has a structure in which a first substrate 11 and a second substrate 12 are adhesively bonded. On the surface of the first substrate 11, a columnar crystalline oxide containing indium oxide and tin oxide as main components (hereinafter referred to as “ITO”).
A plurality of transparent first electrode terminals 13 are provided at intervals from each other. On the other hand, the second substrate 12
Has a plurality of first electrode terminals 1 of the first substrate 11 on its surface.
3, a plurality of transparent second electrode terminals 14 made of ITO or the like are provided at intervals from each other, and insulating partition walls 17 made of acrylic polymer or the like are erected between the second electrode terminals 14. Has been done. Then, the first substrate 11 and the second substrate 12 are arranged such that each first electrode terminal 13 and the corresponding second electrode terminal 14 face each other with the anisotropic conductive adhesive 15 containing the conductive particles 16 interposed therebetween. Is joined to.
【００２１】第１及び第２基板１１，１２にそれぞれ設
けられた第１及び第２電極端子１３，１４は、その隣接
電極端子間隔が異方性導電接着剤１５の導電性粒子１６
の粒径の１〜５倍であるファインピッチで配設されたも
のである。The first and second electrode terminals 13 and 14 provided on the first and second substrates 11 and 12, respectively, have conductive particles 16 of an anisotropic conductive adhesive 15 with an interval between adjacent electrode terminals.
Are arranged at a fine pitch that is 1 to 5 times the particle size of.
【００２２】第２基板１２の第２電極端子１４間に設け
られた絶縁隔壁１７は、その断面が台形に形成され、各
壁面１８が上部から下部に向かって外向きに傾斜したテ
ーパ状に形成されたテーパ状面で構成されている。この
基板接合構造１０では、絶縁隔壁１７が複数の第１及び
第２電極端子１３，１４の各隣接電極端子間に配設され
ることとなり、それによって各隣接電極端子間が絶縁隔
壁１７で仕切られ、それらの間の導電性粒子１６による
短絡が阻止されている。The insulating partition 17 provided between the second electrode terminals 14 of the second substrate 12 has a trapezoidal cross section, and each wall 18 is formed in a taper shape which is inclined outward from the upper portion to the lower portion. It is composed of a tapered surface. In this substrate bonding structure 10, the insulating partition 17 is disposed between the adjacent electrode terminals of the plurality of first and second electrode terminals 13 and 14, whereby the insulating partition 17 separates the adjacent electrode terminals. Therefore, a short circuit due to the conductive particles 16 between them is prevented.
【００２３】この基板接合構造１０は、第１及び第２基
板１１，１２のいずれか一方にスクリーン印刷法等によ
り異方性導電接着剤１５を付着させ、他方を重ね合わせ
て加熱及び加圧することにより異方性導電接着剤１５を
硬化させて製造される。このとき、第１基板１１の各第
１電極端子１３とそれに対応する第２基板１２の第２電
極端子１４とが異方性導電接着剤１５に含まれる導電性
粒子１６により繋がれる。なお、スクリーン印刷法によ
り異方性導電接着剤１５を付着させる場合、絶縁隔壁１
７を設けた第２基板１２に異方性導電接着剤１５を付着
させることが好ましい。スクリーン印刷時にスキージ
（スクリーンの空孔間から異方性導電接着剤１５を押し
出すために用いるヘラ）が斜め方向に加圧しながら異方
性導電接着剤１５を印刷する際、絶縁隔壁１７により異
方性導電接着剤１５に含まれる導電性粒子１６が絶縁隔
壁１７を越えずに手前側に残存しやすく、また、絶縁隔
壁１７を超えたものはその反対側へ流れ落とされるた
め、導電性粒子１６の選択的な配置を有効に行うことが
できるからである。In this substrate bonding structure 10, an anisotropic conductive adhesive 15 is attached to one of the first and second substrates 11 and 12 by a screen printing method or the like, and the other is superposed and heated and pressed. Is produced by curing the anisotropic conductive adhesive 15. At this time, each first electrode terminal 13 of the first substrate 11 and the corresponding second electrode terminal 14 of the second substrate 12 are connected by the conductive particles 16 contained in the anisotropic conductive adhesive 15. When the anisotropic conductive adhesive 15 is attached by the screen printing method, the insulating partition 1
It is preferable to attach the anisotropic conductive adhesive 15 to the second substrate 12 provided with 7. When the squeegee (a spatula used to push out the anisotropic conductive adhesive 15 from between the pores of the screen) at the time of screen printing prints the anisotropic conductive adhesive 15 while pressing it in an oblique direction, it is anisotropic by the insulating partition wall 17. The conductive particles 16 contained in the conductive conductive adhesive 15 tend to remain on the front side without exceeding the insulating partition wall 17, and those exceeding the insulating partition wall 17 are dropped to the opposite side, so that the conductive particles 16 This is because the selective placement of can be effectively performed.
【００２４】上記構成の基板接合構造１０によれば、図
１及び２に示すように、第１及び第２電極端１３，１４
間が絶縁隔壁１７で仕切られて異方性導電接着剤１５に
含まれる導電性粒子１６が隣接電極端子間に配置される
のが防がれるので、両基板をプレス加工等により熱圧着
する際でも絶縁隔壁１７付近の導電性粒子１６も第１及
び第２電極端子１３，１４上に安定的に配置され、隣接
電極端子間隔が導電性粒子１６の粒径の１〜５倍と極め
て狭いファインピッチ化されたものであるにもかかわら
ず、導電性粒子１６が隣接電極端子間を短絡することが
防止されてリーク不良の発生を大幅に改善することがで
き、また、第１電極端子１３とそれに対応する第２電極
端子１４とが導電性粒子１６を含む異方性導電接着剤１
５を介して対向するように設けられているので、それら
の間を確実且つ良好に導通させることができる。According to the substrate bonding structure 10 having the above structure, as shown in FIGS. 1 and 2, the first and second electrode ends 13, 14 are formed.
When the two substrates are thermocompression-bonded by pressing or the like, the space between them is separated by the insulating partition 17 to prevent the conductive particles 16 contained in the anisotropic conductive adhesive 15 from being arranged between the adjacent electrode terminals. However, the conductive particles 16 in the vicinity of the insulating partition 17 are also stably arranged on the first and second electrode terminals 13 and 14, and the distance between adjacent electrode terminals is extremely narrow, which is 1 to 5 times the particle size of the conductive particles 16. Despite the pitch, the conductive particles 16 can be prevented from short-circuiting between the adjacent electrode terminals, and the occurrence of leak failure can be significantly improved. Anisotropic conductive adhesive 1 in which the corresponding second electrode terminal 14 contains conductive particles 16
Since they are provided so as to face each other through 5, it is possible to surely and satisfactorily conduct electricity between them.
【００２５】また、絶縁隔壁１７の両壁面１８，１８の
それぞれが外向きに傾斜したテーパ状に形成されている
ので、絶縁隔壁１７のテーパ面に沿って導電性粒子１６
が円滑に第１及び第２電極端子１３，１４側に流動する
ため、壁面１８上部が断面直角の場合に比較すると導電
性粒子１６が絶縁隔壁１７上に存在しにくくなる。従っ
て、これにより、導電性粒子１６が隣接電極端子間に存
在する確率が低くなるので、リーク不良を防ぐ効果が高
くなり、また、絶縁隔壁１７上に導電性粒子１６が存在
することによる基板間ギャップのムラの発生も抑制する
ことができる。Further, since both wall surfaces 18, 18 of the insulating partition 17 are formed in a tapered shape inclined outward, the conductive particles 16 are formed along the tapered surface of the insulating partition 17.
Flows smoothly toward the first and second electrode terminals 13 and 14, so that the conductive particles 16 are less likely to be present on the insulating partition 17 as compared with the case where the upper portion of the wall surface 18 has a right-angled cross section. Accordingly, since the probability that the conductive particles 16 exist between the adjacent electrode terminals is reduced, the effect of preventing the leak failure is enhanced, and the inter-substrate contact due to the existence of the conductive particles 16 on the insulating partition wall 17 is increased. The occurrence of unevenness in the gap can also be suppressed.
【００２６】（実施形態２）図３は、本発明の実施形態
２に係る基板接合構造２０を示す。(Second Embodiment) FIG. 3 shows a substrate bonding structure 20 according to a second embodiment of the present invention.
【００２７】この基板接合構造２０では、絶縁隔壁２７
は、横長で且つ上部の両角部が欠損された略長方形の断
面に形成されており、各壁面２８が欠損部に対応した外
向きに傾斜したテーパ状に形成されたテーパ状面部とそ
れに連続する垂直面部とで構成されている。In this substrate bonding structure 20, the insulating partition 27 is used.
Is formed in a substantially rectangular cross section that is horizontally long and has both upper corners cut off, and each wall surface 28 is continuous with a tapered surface portion that is formed in a tapered shape corresponding to the lacked portion and is inclined outwardly. It is composed of a vertical surface portion.
【００２８】その他の構成、作用及び効果は実施形態１
と同一である。Other configurations, operations and effects are the same as those of the first embodiment.
Is the same as
【００２９】（実施形態３）図４は、本発明の実施形態
３に係る基板接合構造３０を示す。(Embodiment 3) FIG. 4 shows a substrate bonding structure 30 according to Embodiment 3 of the present invention.
【００３０】この基板接合構造３０では、絶縁隔壁３７
は、斜辺が壁面３８に対応した二等辺三角形の断面に形
成されており、各壁面３８が外向きに傾斜したテーパ状
に形成されたテーパ状面で構成されている。In this substrate bonding structure 30, the insulating partition 37
Is formed in an isosceles triangular cross section corresponding to the wall surface 38, and each wall surface 38 is formed by a tapered surface that is formed in a taper shape that is inclined outward.
【００３１】その他の構成、作用及び効果は実施形態１
と同一である。Other configurations, operations and effects are the same as those of the first embodiment.
Is the same as
【００３２】（実施形態４）図５は、本発明の実施形態
４に係る基板接合構造４０を示す。(Embodiment 4) FIG. 5 shows a substrate bonding structure 40 according to Embodiment 4 of the present invention.
【００３３】この基板接合構造４０では、絶縁隔壁４７
は、上部が上に凸の略半円形で且つ下部がそれに続く長
方形の断面に形成されており、各壁面４８が外向きに凸
の湾曲面部とそれに連続する垂直面部とで構成されてい
る。In this substrate bonding structure 40, the insulating partition 47 is used.
Is formed in a substantially semicircular shape with an upper part protruding upward and a rectangular part continuing with the lower part, and each wall surface 48 is composed of an outwardly convex curved surface part and a continuous vertical surface part.
【００３４】その他の構成は実施形態１と同一である。The other structure is the same as that of the first embodiment.
【００３５】上記構成の基板接合構造４０によれば、絶
縁隔壁４７の壁面４８上部が外向きに凸の湾曲面部に形
成されているが、これによっても壁面４８上部が外向き
に傾斜したテーパ状である場合と同様の作用が営まれ、
同一の効果を得ることができる。According to the substrate bonding structure 40 having the above-mentioned structure, the upper portion of the wall surface 48 of the insulating partition 47 is formed as a curved surface portion which is convex outward, but this also causes the upper portion of the wall surface 48 to be tapered outwardly. The same effect as if
The same effect can be obtained.
【００３６】その他の作用及び効果は実施形態１と同一
である。Other functions and effects are the same as those in the first embodiment.
【００３７】（実施形態５）図６は、本発明の実施形態
５に係る基板接合構造５０を示す。(Fifth Embodiment) FIG. 6 shows a substrate bonding structure 50 according to a fifth embodiment of the present invention.
【００３８】この基板接合構造５０では、第２基板５２
上にカラーフィルタ５９ａが設けられ、そのカラーフィ
ルタ５９ａに絶縁隔壁５７を構成する断面台形の凸部が
形成されており、また、それを被覆するようにオーバー
コート層５９ｂが設けられ、さらにその上に第２電極端
子５４が設けられている。すなわち、絶縁隔壁５７がカ
ラーフィルタ５９ａ及びオーバーコート層５９ｂにより
構成されている。In this substrate bonding structure 50, the second substrate 52 is used.
A color filter 59a is provided on the color filter 59a, a convex portion having a trapezoidal cross section that forms the insulating partition 57 is formed on the color filter 59a, and an overcoat layer 59b is provided to cover the convex portion. Is provided with a second electrode terminal 54. That is, the insulating partition 57 is composed of the color filter 59a and the overcoat layer 59b.
【００３９】その他の構成は実施形態１と同一である。The other structure is the same as that of the first embodiment.
【００４０】上記構成の基板接合構造５０によれば、カ
ラーフィルタ５９ａ及びオーバーコート層５９ｂの形成
と同時に絶縁隔壁５７の形成が可能であるので、絶縁隔
壁５７を形成するための工程を必要とせず、製造上のメ
リットがある。According to the substrate bonding structure 50 having the above-described structure, the insulating partition 57 can be formed at the same time when the color filter 59a and the overcoat layer 59b are formed, so that the process for forming the insulating partition 57 is not required. , There are manufacturing advantages.
【００４１】その他の作用及び効果は実施形態１と同一
である。Other functions and effects are the same as those in the first embodiment.
【００４２】（その他の実施形態）上記実施形態１〜５
では、絶縁隔壁１７，…，５７を第２基板１２，…，５
２に設けたが、特にこれに限定されるものではなく、第
１基板１１，…，５１に設けても、また、第１及び第２
基板１１，１２，…，５１，５２の両方に設けてもよ
い。(Other Embodiments) Embodiments 1 to 5 above
Then, the insulating partitions 17, ..., 57 are connected to the second substrates 12 ,.
However, the present invention is not limited to this, and the first substrate 11, ..., 51 may be provided with the first and second substrates.
It may be provided on both the substrates 11, 12, ..., 51, 52.
【００４３】[0043]
【実施例】絶縁隔壁の幅及び高さのそれぞれについての
隣接電極端子間の短絡防止効果への影響を調べる試験を
行った。EXAMPLE A test was conducted to examine the influence of the width and height of each insulating partition on the short-circuit prevention effect between adjacent electrode terminals.
【００４４】（試験用液晶表示装置）以下の各例の液晶
表示装置を作製した。それぞれの構成を表１にも示す。(Liquid Crystal Display Device for Test) Liquid crystal display devices of the following examples were produced. The respective configurations are also shown in Table 1.
【００４５】＜例１＞上記の実施形態１に係る基板接合
構造（電極端子間隔３５μｍ）を有する液晶表示装置で
あって、第１及び第２基板が液晶を狭持する一対の基板
を構成すると共に異方性導電接着剤がシール材を構成
し、絶縁隔壁の高さが２．０μｍで且つ幅（台形断面の
下底長さ）が１０μｍであるものを例１とした。なお、
異方性導電接着剤として、接着主剤（三井東圧化学社製
商品名：ストラクトボンド）９８ｍａｓｓ％と、粒径
７．５０μｍの導電性粒子（積水化学製 商品名：ミク
ロパール）５ｍａｓｓ％と、粒径６．７μｍの間隔保持
用粒子（宇部日東化成製商品名：ハイプレシカ）３ｍａ
ｓｓ％とを攪拌混合したものを用い、また、スクリーン
印刷法により第２基板に異方性導電接着剤を付着させ
た。従って、この基板接合構造は、電極端子間隔が導電
性粒子の粒径の４．７倍であるファインピッチのもので
ある。また、絶縁隔壁の高さは導電性粒子の粒径の２
６．７％で且つ幅は導電性粒子の粒径の１．３倍であ
る。<Example 1> A liquid crystal display device having a substrate bonding structure (electrode terminal interval of 35 μm) according to the first embodiment, wherein the first and second substrates form a pair of substrates sandwiching liquid crystal. In addition, the anisotropic conductive adhesive constitutes a sealing material, and the height of the insulating partition wall is 2.0 μm and the width (lower base length of the trapezoidal section) is 10 μm. In addition,
As an anisotropic conductive adhesive, an adhesive main agent (Mitsui Toatsu Chemical Co., Inc. trade name: Struct Bond) 98 mass% and conductive particles having a particle size of 7.50 μm (Sekisui Chemical trade name: Micropearl) 5 mass%, Interval-maintaining particles with a particle size of 6.7 μm (trade name: Hipresika, manufactured by Ube Nitto Kasei)
An anisotropic conductive adhesive was adhered to the second substrate by a screen-printing method using a mixture of ss% and agitated. Therefore, this substrate bonding structure has a fine pitch in which the distance between the electrode terminals is 4.7 times the particle diameter of the conductive particles. In addition, the height of the insulating partition is 2 of the particle size of the conductive particles.
The width is 6.7% and the width is 1.3 times the particle diameter of the conductive particles.
【００４６】＜例２＞絶縁隔壁の高さを１．５μｍとし
たことを除いて例１と同一構成の液晶表示装置を例２と
した。絶縁隔壁の高さは導電性粒子の粒径の２０．０％
で且つ幅は導電性粒子の粒径の１．３倍である。<Example 2> A liquid crystal display device having the same structure as that of Example 1 was used as Example 2 except that the height of the insulating partition was 1.5 μm. The height of the insulating partition is 20.0% of the particle diameter of the conductive particles.
And the width is 1.3 times the particle size of the conductive particles.
【００４７】＜例３＞絶縁隔壁の高さを１．０μｍとし
たことを除いて例１と同一構成の液晶表示装置を例３と
した。絶縁隔壁の高さは導電性粒子の粒径の１３．３％
で且つ幅は導電性粒子の粒径の１．３倍である。<Example 3> A liquid crystal display device having the same structure as that of Example 1 was used as Example 3 except that the height of the insulating partition was 1.0 μm. The height of the insulating partition is 13.3% of the particle diameter of the conductive particles.
And the width is 1.3 times the particle size of the conductive particles.
【００４８】＜例４＞絶縁隔壁の高さを０．５μｍとし
たことを除いて例１と同一構成の液晶表示装置を例４と
した。絶縁隔壁の高さは導電性粒子の粒径の６．７％で
且つ幅は導電性粒子の粒径の１．３倍である。<Example 4> A liquid crystal display device having the same structure as that of Example 1 was used as Example 4 except that the height of the insulating partition was 0.5 μm. The height of the insulating partition is 6.7% of the particle diameter of the conductive particles, and the width thereof is 1.3 times the particle diameter of the conductive particles.
【００４９】＜例５＞絶縁隔壁の高さを０．４μｍとし
たことを除いて例１と同一構成の液晶表示装置を例５と
した。絶縁隔壁の高さは導電性粒子の粒径の５．３％で
且つ幅は導電性粒子の粒径の１．３倍である。<Example 5> A liquid crystal display device having the same structure as that of Example 1 was used as Example 5 except that the height of the insulating partition was 0.4 μm. The height of the insulating partition wall is 5.3% of the particle diameter of the conductive particles and the width thereof is 1.3 times the particle diameter of the conductive particles.
【００５０】＜例６＞絶縁隔壁の高さを０．２μｍとし
たことを除いて例１と同一構成の液晶表示装置を例６と
した。絶縁隔壁の高さは導電性粒子の粒径の２．７％で
且つ幅は導電性粒子の粒径の１．３倍である。<Example 6> A liquid crystal display device having the same configuration as that of Example 1 was used as Example 6 except that the height of the insulating partition was 0.2 μm. The height of the insulating partition wall is 2.7% of the particle diameter of the conductive particles, and the width thereof is 1.3 times the particle diameter of the conductive particles.
【００５１】＜例７＞絶縁隔壁を設けていないことを除
いて例１と同一構成の液晶表示装置を例７とした。<Example 7> A liquid crystal display device having the same structure as that of Example 1 except that an insulating partition is not provided is set as Example 7.
【００５２】＜例８＞絶縁隔壁の幅を１５μｍとしたこ
とを除いて例３と同一構成の液晶表示装置を例８とし
た。絶縁隔壁の高さは導電性粒子の粒径の１３．３％で
且つ幅は導電性粒子の粒径の２．０倍である。<Example 8> A liquid crystal display device having the same structure as that of Example 3 was used as Example 8 except that the insulating partition had a width of 15 μm. The height of the insulating partition wall is 13.3% of the particle diameter of the conductive particles, and the width thereof is 2.0 times the particle diameter of the conductive particles.
【００５３】＜例９＞絶縁隔壁の幅を５μｍとしたこと
を除いて例４と同一構成の液晶表示装置を例９とした。
絶縁隔壁の高さは導電性粒子の粒径の６．７％で且つ幅
は導電性粒子の粒径の０．６７倍である。<Example 9> A liquid crystal display device having the same structure as that of Example 4 was used as Example 9 except that the insulating partition had a width of 5 μm.
The height of the insulating partition wall is 6.7% of the particle diameter of the conductive particles, and the width thereof is 0.67 times the particle diameter of the conductive particles.
【００５４】＜例１０＞絶縁隔壁の幅を１０μｍとした
ことを除いて例４と同一構成の液晶表示装置を例１０と
した。絶縁隔壁の高さは導電性粒子の粒径の６．７％で
且つ幅は導電性粒子の粒径の１．３倍である。<Example 10> A liquid crystal display device having the same structure as that of Example 4 was used as Example 10 except that the insulating partition had a width of 10 µm. The height of the insulating partition is 6.7% of the particle diameter of the conductive particles, and the width thereof is 1.3 times the particle diameter of the conductive particles.
【００５５】＜例１１＞絶縁隔壁の幅を１５μｍとした
ことを除いて例４と同一構成の液晶表示装置を例１１と
した。絶縁隔壁の高さは導電性粒子の粒径の６．７％で
且つ幅は導電性粒子の粒径の２．０倍である。<Example 11> A liquid crystal display device having the same structure as that of Example 4 was used as Example 11 except that the insulating partition had a width of 15 μm. The height of the insulating partition wall is 6.7% of the particle diameter of the conductive particles, and the width thereof is 2.0 times the particle diameter of the conductive particles.
【００５６】[0056]
【表１】 [Table 1]
【００５７】（試験方法）例１〜１１の各液晶表示装置
について、１０万箇所の第１及び第２電極端子間のリー
クの有無を測定した。また、液晶表示の表示ムラ（色ム
ラ）の有無を観察した。(Test Method) For each of the liquid crystal display devices of Examples 1 to 11, the presence / absence of a leak between 100,000 locations of the first and second electrode terminals was measured. Further, the presence or absence of display unevenness (color unevenness) on the liquid crystal display was observed.
【００５８】（試験結果）試験結果を表１に示す。(Test Results) The test results are shown in Table 1.
【００５９】絶縁隔壁の幅が同一である例１〜６及び絶
縁隔壁のない例７を比較すると、絶縁隔壁の高さが低く
なるとリークが発生することが分かる。これは、絶縁隔
壁の高さが低いと導電性粒子がそれを容易に乗り越えて
連なり、第１及び第２電極端子間を短絡させるためであ
ると考えられる。かかる導電性粒子の絶縁隔壁の乗り越
えが生じるか否かは導電性粒子の粒径と絶縁隔壁の高さ
との関係に依存すると考えられ、絶縁隔壁の高さが導電
性粒子の粒径の５．３％である例５でリークが生じなか
ったのに対し、絶縁隔壁の高さが導電性粒子の粒径の
２．７％である例６でリークが生じたことから、絶縁隔
壁の高さが導電性粒子の粒径の５％以上程度あればリー
クの発生を抑えることができると推測される。Comparing Examples 1 to 6 in which the widths of the insulating barrier ribs are the same as those of Example 7 in which the insulating barrier ribs are not formed, it can be seen that leakage occurs when the height of the insulating barrier ribs becomes low. It is considered that this is because when the height of the insulating partition wall is low, the conductive particles easily get over it and are connected to each other to short-circuit the first and second electrode terminals. It is considered that whether or not the conductive particles pass over the insulating partition depends on the relationship between the particle size of the conductive particles and the height of the insulating partition. The height of the insulating partition is the particle size of the conductive particles. The leakage did not occur in Example 5 with 3%, whereas the leakage occurred in Example 6 in which the height of the insulating partition was 2.7% of the particle diameter of the conductive particles. It is presumed that the occurrence of leak can be suppressed if the above is about 5% or more of the particle diameter of the conductive particles.
【００６０】一方、絶縁隔壁の高さが高くなると液晶表
示の表示ムラが生じやすくなることが分かる。これは、
絶縁隔壁が高いとそれが基板間ギャップに与える影響が
大きくなるためであると考えられる。絶縁隔壁の高さが
導電性粒子の粒径の２０．０％である例２で殆ど表示ム
ラが生じなかったのに対し、絶縁隔壁の高さが導電性粒
子の粒径の２６．７％である例１で表示ムラが生じたこ
とから、絶縁隔壁の高さが導電性粒子の粒径の２０％以
下であれば表示ムラの発生を抑えることができると考え
られる。On the other hand, it can be seen that as the height of the insulating partition increases, display unevenness of the liquid crystal display is likely to occur. this is,
It is considered that this is because when the insulating partition wall is high, it has a great influence on the gap between the substrates. In Example 2, in which the height of the insulating partition was 20.0% of the particle diameter of the conductive particles, almost no display unevenness occurred, whereas the height of the insulating partition was 26.7% of the particle diameter of the conductive particles. Since the display unevenness occurs in Example 1, it is considered that the display unevenness can be suppressed if the height of the insulating partition is 20% or less of the particle diameter of the conductive particles.
【００６１】絶縁隔壁の高さが同一である例３及び８、
並びに、例４及び９〜１１を比較すると、絶縁隔壁の幅
が広くなると液晶表示の表示ムラが生じやすくなること
が分かる。これは、絶縁隔壁の幅が広いとそれが基板間
ギャップに与える影響が大きくなるためであると考えら
れる。絶縁隔壁の幅が導電性粒子の粒径の１．３倍であ
る例３及び１０で殆ど表示ムラが生じなかったのに対
し、絶縁隔壁の幅が導電性粒子の粒径の２．０倍である
例８及び１１で表示ムラが生じたことから、絶縁隔壁の
幅が導電性粒子の粒径の１．５倍以下程度であれば表示
ムラの発生を抑えることができると推測される。Examples 3 and 8 in which the heights of the insulating barriers are the same,
Also, comparing Examples 4 and 9 to 11, it can be seen that the display unevenness of the liquid crystal display is likely to occur when the width of the insulating partition wall is wide. It is considered that this is because if the width of the insulating partition wall is large, the influence on the inter-substrate gap becomes large. In Examples 3 and 10 in which the width of the insulating partition was 1.3 times the particle size of the conductive particles, almost no display unevenness occurred, whereas the width of the insulating partition was 2.0 times the particle size of the conductive particles. Since the display unevenness was generated in Examples 8 and 11, it is presumed that the display unevenness can be suppressed if the width of the insulating partition is about 1.5 times or less the particle diameter of the conductive particles.
【００６２】[0062]
【発明の効果】以上説明したように、本発明によれば、
第１及び第２電極端間に絶縁隔壁が設けられているの
で、導電性粒子が隣接電極端子間を短絡することが防止
されてリーク不良の発生を大幅に改善することができ、
また、第１電極端子とそれに対応する第２電極端子とが
導電性粒子を含む異方性導電接着剤を介して対向するよ
うに設けられているので、それらの間を確実且つ良好に
導通させることができる。As described above, according to the present invention,
Since the insulating partition wall is provided between the ends of the first and second electrodes, it is possible to prevent conductive particles from short-circuiting between the adjacent electrode terminals, and it is possible to significantly improve the occurrence of leakage failure.
Further, since the first electrode terminal and the corresponding second electrode terminal are provided so as to face each other with the anisotropic conductive adhesive containing the conductive particles interposed therebetween, it is possible to surely and satisfactorily conduct them. be able to.
【図１】本発明の実施形態１に係る基板接合構造の断面
図である。FIG. 1 is a sectional view of a substrate bonding structure according to a first embodiment of the present invention.
【図２】本発明の実施形態１に係る基板接合構造の平面
図である。FIG. 2 is a plan view of the substrate bonding structure according to the first embodiment of the present invention.
【図３】本発明の実施形態２に係る基板接合構造の断面
図である。FIG. 3 is a sectional view of a substrate bonding structure according to a second embodiment of the present invention.
【図４】本発明の実施形態３に係る基板接合構造の断面
図である。FIG. 4 is a sectional view of a substrate bonding structure according to a third embodiment of the present invention.
【図５】本発明の実施形態４に係る基板接合構造の断面
図である。FIG. 5 is a sectional view of a substrate bonding structure according to a fourth embodiment of the present invention.
【図６】本発明の実施形態５に係る基板接合構造の断面
図である。FIG. 6 is a sectional view of a substrate bonding structure according to a fifth embodiment of the present invention.
【図７】従来の基板接合構造の断面図である。FIG. 7 is a cross-sectional view of a conventional substrate bonding structure.
【図８】従来の他の基板接合構造の断面図である。FIG. 8 is a cross-sectional view of another conventional substrate bonding structure.
１０，２０，３０，４０，５０，７０，８０ 基板接合
構造
１１，２１，３１，４１，５１，７１，８１ 第１基板
１２，２２，３２，４２，５２，７２，８２ 第２基板
１３，２３，３３，４３，５３，７３，８３ 第１電極
端子
１４，２４，３４，４４，５４，７４，８４ 第２電極
端子
１５，２５，３５，４５，５５，７５，８５ 異方性導
電接着剤
１６，２６，３６，４６，５６，７６，８６ 導電性粒
子
１７，２７，３７，４７，５７ 絶縁隔壁
１８，２８，３８，４８，５８ 壁面
５９ａ カラーフィルタ
５９ｂ オーバーコート層
７９ ダミー電極10, 20, 30, 40, 50, 70, 80 Substrate bonding structure 11, 21, 31, 41, 51, 71, 81 First substrate 12, 22, 32, 42, 52, 72, 82 Second substrate 13, 23, 33, 43, 53, 73, 83 First electrode terminal 14, 24, 34, 44, 54, 74, 84 Second electrode terminal 15, 25, 35, 45, 55, 75, 85 Anisotropic conductive adhesion Agents 16, 26, 36, 46, 56, 76, 86 Conductive particles 17, 27, 37, 47, 57 Insulating partition walls 18, 28, 38, 48, 58 Wall surface 59a Color filter 59b Overcoat layer 79 Dummy electrode
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｇ０９Ｆ 9/30 ３４９ Ｇ０９Ｆ 9/30 ３４９Ｂ ５Ｇ４３５ 9/35 9/35 (72)発明者 吉水 敏幸 大阪府大阪市阿倍野区長池町22番22号 シ ャープ株式会社内 Ｆターム(参考） 2H090 HA01 HA05 HB07X HB08X HB13X HC06 HC10 HC11 HD01 HD05 HD07 HD08 LA01 2H091 FA02X FA02Y GA01 GA02 GA07 GA17 KA10 LA02 LA04 LA11 LA30 2H092 GA40 GA41 GA43 GA44 GA45 GA48 GA50 GA51 GA59 GA60 HA12 HA18 HA25 HA26 HA27 HA28 JB22 JB23 JB25 JB26 JB31 JB32 JB35 JB36 MA10 MA14 MA17 MA32 NA16 NA29 PA01 PA06 5C094 AA15 AA25 AA53 BA01 BA21 BA41 BA43 DB02 EA05 ED03 FA02 FA03 FB15 HA08 JA01 5E344 AA02 AA12 AA22 AA23 BB02 BB04 CC07 CD04 DD06 DD16 EE06 EE17 EE21 5G435 AA14 AA16 BB12 EE42 EE47 HH14 KK05 KK09 LL06 LL07 LL08 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) G09F 9/30 349 G09F 9/30 349B 5G435 9/35 9/35 (72) Inventor Toshiyuki Yoshimizu Osaka Prefecture Osaka 22-22 Nagaike-cho, Abeno-ku, Yokohama-shi, F-term (reference) within SHARP Co., Ltd. 2H090 HA01 HA05 HB07X HB08X HB13X HC06 HC10 HC11 HD01 HD05 HD07 HD08 LA01 2H091 FA02X FA02Y GA01 GA02 GA07 GA17 KA10 LA02 LA04 LA11 LA30 2H092 GA44 GA41 GA41 GA48 GA50 GA51 GA59 GA60 HA12 HA18 HA25 HA26 HA27 HA28 JB22 JB23 JB25 JB26 JB31 JB32 JB35 JB36 MA10 MA14 MA17 MA32 NA16 NA29 PA01 PA06 5C094 AA15 AA25 AA53 BA01 BA21 BA41 BA43 DB02 EA05 ED03 FA02 FA03 FB15 HA08 JA01 5E344 AA02 AA12 AA22 AA23 BB02 BB04 CC07 CD04 DD06 DD16 EE06 EE17 EE21 5G435 AA14 AA16 BB12 EE42 EE47 HH14 KK05 KK09 LL06 LL07 LL08
Claims (8)
１電極端子を有する第１基板と、該第１基板の複数の第
１電極端子に対応するように設けられた複数の第２電極
端子を有する第２基板と、を備え、各第１電極端子とそ
れに対応する第２電極端子とが導電性粒子を含む異方性
導電接着剤を介して対向するように該第１基板と該第２
基板とが接合された基板接合構造であって、 上記複数の第１及び第２電極端子の各隣接電極端子間
に、該各隣接電極端子間の上記導電性粒子による短絡を
阻止する絶縁隔壁が設けられていることを特徴とする基
板接合構造。1. A first substrate having a plurality of first electrode terminals spaced apart from each other, and a plurality of second substrates provided so as to correspond to the plurality of first electrode terminals of the first substrate. A second substrate having an electrode terminal, and the first substrate and the corresponding second electrode terminal are opposed to each other via an anisotropic conductive adhesive containing conductive particles. The second
A substrate bonding structure in which a substrate is bonded, wherein an insulating partition for preventing a short circuit due to the conductive particles between the adjacent electrode terminals is provided between the adjacent electrode terminals of the plurality of first and second electrode terminals. A substrate bonding structure characterized by being provided.
いて、 上記複数の第１及び第２電極端子は、その隣接電極端子
間隔が上記導電性粒子の粒径の１〜５倍であることを特
徴とする基板接合構造。2. The substrate bonding structure according to claim 1, wherein the plurality of first and second electrode terminals have an interval between adjacent electrode terminals which is 1 to 5 times the particle diameter of the conductive particles. Substrate bonding structure characterized by.
いて、 上記絶縁隔壁は、その高さが上記導電性粒子の粒径の５
〜２０％であることを特徴とする基板接合構造。3. The substrate bonding structure according to claim 1, wherein the height of the insulating partition is 5 times the particle size of the conductive particles.
Substrate bonding structure characterized by being ˜20%.
いて、 上記絶縁隔壁は、その幅が上記導電性粒子の粒径の１．
５倍以下であることを特徴とする基板接合構造。4. The substrate bonding structure according to claim 1, wherein the insulating partition has a width of 1.
A substrate bonding structure characterized by being 5 times or less.
いて、 上記絶縁隔壁は、その両壁面のそれぞれの少なくとも上
部が上方から下方へ外向きに傾斜したテーパ状に形成さ
れていることを特徴とする基板接合構造。5. The substrate bonding structure according to claim 1, wherein the insulating partition wall is formed in a tapered shape in which at least upper portions of both wall surfaces of the insulating partition wall are inclined outward from the upper side to the lower side. And board bonding structure.
基板接合構造を備えたことを特徴とする電子装置。6. An electronic device comprising the substrate bonding structure according to any one of claims 1 to 4.
て、 上記第１又は第２基板にカラーフィルタ及び／又はオー
バーコート層が設けられていると共に、上記絶縁隔壁が
該カラーフィルタ及び／又はオーバーコート層により構
成されている液晶表示装置であることを特徴とする電子
装置。7. The electronic device according to claim 6, wherein the first or second substrate is provided with a color filter and / or an overcoat layer, and the insulating partition is provided with the color filter and / or the overcoat layer. An electronic device, which is a liquid crystal display device including a coat layer.
て、 上記絶縁隔壁は、その両壁面のそれぞれの少なくとも上
部が上方から下方へ外向きに傾斜したテーパ状に形成さ
れていることを特徴とする電子装置。8. The electronic device according to claim 6, wherein the insulating partition wall has a tapered shape in which at least upper portions of both wall surfaces of the insulating partition wall are inclined outward from the upper side to the lower side. Electronic device to do.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002066689A JP2003273490A (en) | 2002-03-12 | 2002-03-12 | Board-joining structure and electronic equipment having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002066689A JP2003273490A (en) | 2002-03-12 | 2002-03-12 | Board-joining structure and electronic equipment having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003273490A true JP2003273490A (en) | 2003-09-26 |
Family
ID=29198353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002066689A Pending JP2003273490A (en) | 2002-03-12 | 2002-03-12 | Board-joining structure and electronic equipment having the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003273490A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005062112A1 (en) * | 2003-12-19 | 2005-07-07 | Bridgestone Corporation | Method for manufacturing information display |
| JP2006012992A (en) * | 2004-06-23 | 2006-01-12 | Sharp Corp | Electrode connection structure of circuit board |
| JP2009010061A (en) * | 2007-06-27 | 2009-01-15 | Panasonic Corp | Electrode junction structure |
| JP2013207115A (en) * | 2012-03-28 | 2013-10-07 | Dexerials Corp | Connection structure and manufacturing method of the same, electronic component and manufacturing method of the same, connection method of electronic component |
| CN110531546A (en) * | 2019-07-26 | 2019-12-03 | 深圳市唯酷光电有限公司 | The cutting method and the hand-written film of liquid crystal of the hand-written film of liquid crystal |
| WO2020133260A1 (en) * | 2018-12-28 | 2020-07-02 | 深圳市柔宇科技有限公司 | Fpc capable of improving aggregation of conductive particles, conductive bonding structure, and touch sensor |
| KR20210001894A (en) * | 2019-06-28 | 2021-01-06 | 엘지디스플레이 주식회사 | Electronic device and manufacturing method thereof, and display device and manufacturing method thereof |
| JP2022028636A (en) * | 2020-07-31 | 2022-02-16 | シトロニックス テクノロジー コーポレーション | Flow guiding structure of chip |
-
2002
- 2002-03-12 JP JP2002066689A patent/JP2003273490A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1712949A1 (en) * | 2003-12-19 | 2006-10-18 | Bridgestone Corporation | Method for manufacturing information display |
| JPWO2005062112A1 (en) * | 2003-12-19 | 2007-07-19 | 株式会社ブリヂストン | Manufacturing method of information display device |
| EP1712949A4 (en) * | 2003-12-19 | 2007-08-22 | Bridgestone Corp | Method for manufacturing information display |
| US7580179B2 (en) | 2003-12-19 | 2009-08-25 | Bridgestone Corporation | Method of manufacturing information display device |
| WO2005062112A1 (en) * | 2003-12-19 | 2005-07-07 | Bridgestone Corporation | Method for manufacturing information display |
| JP2006012992A (en) * | 2004-06-23 | 2006-01-12 | Sharp Corp | Electrode connection structure of circuit board |
| JP2009010061A (en) * | 2007-06-27 | 2009-01-15 | Panasonic Corp | Electrode junction structure |
| JP2013207115A (en) * | 2012-03-28 | 2013-10-07 | Dexerials Corp | Connection structure and manufacturing method of the same, electronic component and manufacturing method of the same, connection method of electronic component |
| WO2020133260A1 (en) * | 2018-12-28 | 2020-07-02 | 深圳市柔宇科技有限公司 | Fpc capable of improving aggregation of conductive particles, conductive bonding structure, and touch sensor |
| KR102377755B1 (en) * | 2019-06-28 | 2022-03-22 | 엘지디스플레이 주식회사 | Electronic device and manufacturing method thereof, and display device and manufacturing method thereof |
| KR20210001894A (en) * | 2019-06-28 | 2021-01-06 | 엘지디스플레이 주식회사 | Electronic device and manufacturing method thereof, and display device and manufacturing method thereof |
| CN110531546A (en) * | 2019-07-26 | 2019-12-03 | 深圳市唯酷光电有限公司 | The cutting method and the hand-written film of liquid crystal of the hand-written film of liquid crystal |
| JP2022028636A (en) * | 2020-07-31 | 2022-02-16 | シトロニックス テクノロジー コーポレーション | Flow guiding structure of chip |
| TWI806112B (en) * | 2020-07-31 | 2023-06-21 | 矽創電子股份有限公司 | Flow guiding structure of chip |
| JP7394273B2 (en) | 2020-07-31 | 2023-12-08 | シトロニックス テクノロジー コーポレーション | Chip flow guiding structure |
| KR102663115B1 (en) * | 2020-07-31 | 2024-05-21 | 시트로닉스 테크놀로지 코퍼레이션 | Flow guiding structure of chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20010033355A1 (en) | Mounting structure for semiconductor device, electro-optical device, and electronic apparatus | |
| JP3503597B2 (en) | Liquid crystal panel and manufacturing method thereof | |
| JP2003332386A (en) | Integrated circuit chip, electronic device and its manufacturing method, electronic apparatus | |
| KR100637429B1 (en) | Plasma display device | |
| JP2003273490A (en) | Board-joining structure and electronic equipment having the same | |
| KR100907576B1 (en) | Semiconductor device for prevention short circuit between electrode and semiconductor package using the same | |
| JP3048197B2 (en) | Anisotropic conductive film | |
| JP2002063958A (en) | Electro-optical device and electronic equipment | |
| JP3433836B2 (en) | Anisotropic conductive film and liquid crystal display panel connected by anisotropic conductive film | |
| JPH0529386A (en) | Connection structure of connecting terminal part of element to be adhered | |
| JPH0775177B2 (en) | Junction structure | |
| CN101539690A (en) | Substrate electrode structure and connected structure using same and drive element | |
| JPH1062735A (en) | Method of manufacturing liquid crystal display and liquid crystal display device | |
| JP2000171823A (en) | Liquid crystal display element | |
| JP3954152B2 (en) | Connection structure of panel substrate and flexible wiring board, and liquid crystal display device using the same | |
| CN103278972B (en) | A kind of array base palte and display device | |
| JPH06308516A (en) | Liquid crystal display device | |
| JP3336531B2 (en) | Anisotropic conductive member | |
| JP2002217239A (en) | Anisotropic conductive film | |
| JP3100436B2 (en) | Anisotropic conductive film | |
| JPH11326934A (en) | Liquid crystal display panel and its production | |
| JPH06102523A (en) | Liquid crystal display device | |
| JP2005252134A (en) | Joining method and structure of film substrate | |
| JP2000165022A (en) | Electrode terminal connecting structure | |
| JP2638197B2 (en) | Connection structure between electrode terminal rows |