JP2003205458A - Bore polishing method and bore polishing device - Google Patents

Bore polishing method and bore polishing device

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Publication number
JP2003205458A
JP2003205458A JP2002005571A JP2002005571A JP2003205458A JP 2003205458 A JP2003205458 A JP 2003205458A JP 2002005571 A JP2002005571 A JP 2002005571A JP 2002005571 A JP2002005571 A JP 2002005571A JP 2003205458 A JP2003205458 A JP 2003205458A
Authority
JP
Japan
Prior art keywords
polishing
tool
work
polishing tool
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002005571A
Other languages
Japanese (ja)
Inventor
Kozo Fujita
幸三 藤田
Takanori Inoue
隆典 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Priority to JP2002005571A priority Critical patent/JP2003205458A/en
Publication of JP2003205458A publication Critical patent/JP2003205458A/en
Pending legal-status Critical Current

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  • Mechanical Coupling Of Light Guides (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bore polishing method and bore polishing device capable of preventing reduction in finish inside diameter even if abrasion of the polishing tool progresses, and machining a number of works with one polishing tool. <P>SOLUTION: This bore polishing device includes a holding means for holding a work having a prepared hole, a polishing tool disposed so that the axis of the prepared hole and the axis of the tool itself exist on the substantially same line, a rotating means for rotating at least one of the work and the polishing tool around the axis, and a driving means for moving at least one of the work and the polishing tool along the axis. The device includes a control means for moving the polishing end position of the driving means according to the abrasion of the polishing tool. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明はワークの内面を研磨
する穴研磨方法および穴研磨装置に関し、特に小径穴の
内面研磨に好適な穴研磨方法および穴研磨装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hole polishing method and a hole polishing apparatus for polishing an inner surface of a work, and more particularly to a hole polishing method and a hole polishing apparatus suitable for polishing the inner surface of a small diameter hole.

【０００２】[0002]

【従来の技術】穴内面を研削する加工方法としては、穴
内径より径の小さい円筒状の砥石を挿入して研削する内
面研削加工が一般的である。この方法では、研削しよう
とする穴内径が小さいほどワークと砥石の相対速度を得
るために砥石をより高回転しなければならない。一方
で、穴内径が小さいほど砥石径も細くなるため砥石軸の
剛性が低下する結果、穴の仕上げ精度が悪化してしま
う。穴内面をより高精度研削する加工方法としてホーニ
ング加工があるが、複数個の砥石を一定圧力で穴内面に
押付ける機構を有するため、やはり小径穴には適応が困
難である。2. Description of the Related Art As a processing method for grinding the inner surface of a hole, an inner surface grinding processing in which a cylindrical grindstone having a diameter smaller than the inner diameter of the hole is inserted and ground is generally used. In this method, the smaller the inner diameter of the hole to be ground, the higher the rotation speed of the grindstone in order to obtain the relative speed between the work and the grindstone. On the other hand, the smaller the inner diameter of the hole, the smaller the diameter of the grindstone, so that the rigidity of the grindstone shaft decreases, and as a result, the finishing accuracy of the hole deteriorates. Honing is a processing method for grinding the inner surface of the hole with higher precision, but it is difficult to adapt to small diameter holes because it has a mechanism for pressing a plurality of grindstones against the inner surface of the hole with a constant pressure.

【０００３】小径穴の内面を高精度に仕上げる従来技術
として図２に示す方法がある。図２に示される研磨工具
は仕上げたい穴内径に略一致する径の円柱部と仕上げ前
の穴に挿入するためのテーパ部から構成される。この研
磨工具は自らの軸心周りに回転し、研磨工具テーパ部端
から挿入したワークを研磨工具テーパ部に研磨材を塗布
しながら繰返し突き当てワーク内径を研磨し、ワークが
円柱部まで挿入されたら加工終了となる。なお、電着な
どの手段によって砥粒を固定した研磨工具を使用するこ
ともある。As a conventional technique for finishing the inner surface of a small diameter hole with high accuracy, there is a method shown in FIG. The polishing tool shown in FIG. 2 is composed of a cylindrical portion having a diameter substantially corresponding to the inner diameter of the hole to be finished and a taper portion to be inserted into the hole before finishing. This polishing tool rotates around its own axis and repeatedly abuts the workpiece inserted from the end of the polishing tool taper part while applying abrasive material to the polishing tool taper part to polish the inner diameter of the work and insert the work up to the cylindrical part. The processing ends. A polishing tool having abrasive grains fixed by means such as electrodeposition may be used.

【０００４】図２に示される加工方法を、例えば光通信
に用いられるコネクタ部品であるスリーブに適応し、か
つ自動化を目指した従来技術の例として、特許２５２０
０６９号に見られるものを図３に基いて詳述すると以下
の通りである。As an example of the prior art aiming at automation by applying the processing method shown in FIG. 2 to a sleeve which is a connector part used for optical communication, for example, Japanese Patent No. 2520
Details of what is found in No. 069 are as follows based on FIG.

【０００５】ガイドレールに移動自在に組み付けられた
スライダと、このスライダをガイドレールに沿って直進
運動させる駆動機構と、スライダ上にガイドレールの長
手方向に沿って設けられ、モータによって回転される研
磨用工具と、この研磨用工具の軸心の延長上に設けら
れ、所定の内径を有するスリーブに研磨する前の中心孔
が穿設されたワークを保持するチャックと、チャックに
保持されたワークに掛かる研磨時の負荷を検出する負荷
センサと、スライダの移動位置を検出する位置センサと
を有し、この位置センサからの検出出力に基いて上記駆
動機構によるスライダの移動が制御されるとともに、上
記負荷センサからの検出出力に基づいて上記研磨用工具
によるワークの研磨速度が制御される構成としてある。A slider movably mounted on the guide rail, a drive mechanism for linearly moving the slider along the guide rail, and a polishing provided on the slider along the longitudinal direction of the guide rail and rotated by a motor. Tool, a chuck for holding a work provided on an extension of the axis of the polishing tool and having a center hole before polishing in a sleeve having a predetermined inner diameter, and a work held by the chuck. A load sensor for detecting a load during polishing and a position sensor for detecting a moving position of the slider are provided, and movement of the slider by the drive mechanism is controlled based on a detection output from the position sensor, and The polishing rate of the workpiece by the polishing tool is controlled based on the detection output from the load sensor.

【０００６】上述した構成によれば、位置センサによっ
てスライダのスタート位置、研磨開始位置および研磨終
了位置を検出させることにより、駆動機構によって直進
運動されるスライダの移動位置をこの位置センサからの
検出出力に基づいて制御される。また負荷センサからの
検出出力をフィードバックして研磨用工具によるワーク
の研磨速度を制御することにより、常に適正な負荷によ
りワークが研磨される。しだがって、従来手作業でスリ
ーブの製作を行っていた場合と比べ、格段に生産効率が
高められるとともに、製作されるスリーブの精度を向上
できるという効果がある。According to the above arrangement, the position sensor detects the start position, the polishing start position, and the polishing end position of the slider, so that the moving position of the slider which is linearly moved by the drive mechanism is detected by the position sensor. Controlled based on. Further, by feeding back the detection output from the load sensor to control the polishing rate of the work by the polishing tool, the work is always polished with an appropriate load. However, as compared with the case where the sleeve is manually manufactured in the related art, the production efficiency is significantly improved and the accuracy of the manufactured sleeve can be improved.

【０００７】[0007]

【発明が解決しようとする課題】特許２５２００６９号
に見られる発明では、図２に示される研磨工具のテーパ
部側からワークＷを挿入していき、研磨材を供給しなが
ら回転する研磨工具のテーパ部にワークを断続的突き当
て研磨を進行させ、研磨工具円柱部の所定の位置までワ
ークが挿入されたことを近接スイッチ２６によって検出
して研磨終了となる。In the invention seen in Japanese Patent No. 2520069, the work W is inserted from the taper portion side of the polishing tool shown in FIG. 2 and the taper of the polishing tool which rotates while supplying the abrasive is supplied. The workpiece is intermittently abutted against the portion to progress the polishing, and the proximity switch 26 detects that the workpiece is inserted to a predetermined position of the polishing tool columnar portion, and the polishing is completed.

【０００８】しかし、近接スイッチ２６は基台１に固定
されているので研磨終了位置は毎回同じ位置となる。多
数のワークを研磨していくと、研磨工具は図４に示すよ
うに摩耗して径が細くなり、その結果、ワークの仕上り
内径が徐々に小さくなる問題が有った。このため、ワー
クの内径を狭い公差内に納めようとすると頻繁に研磨工
具を交換することになり、多くの研磨工具が必要になる
と共に工具交換の手間も多大となる。However, since the proximity switch 26 is fixed to the base 1, the polishing end position is the same every time. When a large number of workpieces are polished, the polishing tool is worn and the diameter is reduced as shown in FIG. 4, resulting in a problem that the finished inner diameter of the workpiece is gradually reduced. For this reason, if the inner diameter of the work is to be kept within a narrow tolerance, the polishing tool will be frequently replaced, and a large number of polishing tools will be required and the time and effort required for tool replacement will be great.

【０００９】本発明は上記課題を解決するためになされ
たもので、本発明の目的は、研磨工具の摩耗が進行して
もワークの仕上り内径が小さくなることが無く、１本の
研磨工具でより多数のワークを加工できる穴研磨方法お
よび穴研磨装置を提供することにある。The present invention has been made to solve the above problems, and an object of the present invention is to provide a single polishing tool that does not reduce the finished inner diameter of the workpiece even if the abrasion of the polishing tool progresses. An object of the present invention is to provide a hole polishing method and a hole polishing apparatus capable of processing a larger number of works.

【００１０】[0010]

【課題を解決するための手段】上記課題を解決するた
め、本発明の請求項１は、下穴を有するワークを保持す
る保持手段と、前記下穴の軸心と自らの軸心が略同一線
上に存在するように配置される研磨工具と、前記ワーク
と前記研磨工具の少なくとも一方を前記軸心を中心とし
て回転させる回転手段と、前記ワークと前記研磨工具の
少なくとも一方を前記軸心に沿って移動させる駆動手段
とを備えた穴研磨装置において、前記研磨工具の摩耗を
検出する工具摩耗検出手段を備え、前記工具摩耗検出手
段の出力に基いて前記駆動手段の研磨終了位置を移動さ
せるようにした。これにより、研磨工具の摩耗が進行し
ても、研磨工具円柱部のまだ摩耗していない部分までワ
ークを挿入してから研磨を終了するので、ワークの仕上
り内径が小さくなることが無く、１本の研磨工具でより
多数のワークを加工することが可能となる。In order to solve the above problems, according to claim 1 of the present invention, a holding means for holding a work having a prepared hole and a shaft center of the prepared hole are substantially the same. A polishing tool arranged to be present on a line, a rotating means for rotating at least one of the work and the polishing tool about the axis, and at least one of the work and the polishing tool along the axis. In a hole polishing apparatus having a driving means for moving the polishing tool, a tool wear detecting means for detecting wear of the polishing tool is provided, and a polishing end position of the driving means is moved based on an output of the tool wear detecting means. I chose As a result, even if the wear of the polishing tool progresses, the work is inserted until the part of the polishing tool column that has not yet been worn, and then the polishing is finished. It becomes possible to process a large number of works with the polishing tool of.

【００１１】また、請求項２は、工具摩耗検出手段が、
研磨したワークの数に基いて研磨工具の摩耗を推測する
ようにした。これにより、研磨工具の摩耗は研磨したワ
ークの数に略比例して進行するので、研磨したワークの
数に基いて推測される研磨工具に応じて研磨終了位置を
移動させることにより、研磨工具の摩耗進行状況を確認
しながら研磨終了位置を移動させる必要が無く、１本の
研磨工具でより多数のワークを安定した内径に加工する
ことが可能となる。According to a second aspect of the present invention, the tool wear detecting means is
The wear of the polishing tool was estimated based on the number of polished works. As a result, the abrasion of the polishing tool progresses substantially in proportion to the number of the polished works, and therefore, by moving the polishing end position according to the polishing tool estimated based on the number of the polished works, It is not necessary to move the polishing end position while checking the progress of wear, and it is possible to process a larger number of works with a stable inner diameter with one polishing tool.

【００１２】また、請求項３は、工具摩耗検出手段が、
ワークの研磨に費やした積算時間に基いて研磨工具の摩
耗を推測するようにした。これにより、研磨工具の摩耗
はワークの研磨に費やした積算時間に略比例して進行す
るので、ワークの研磨に費やした積算時間に基いて推測
される工具摩耗に応じて研磨終了位置を移動させること
により、研磨工具の摩耗進行状況を確認しながら研磨終
了位置を移動させる必要が無く、１本の研磨工具でより
多数のワークを安定した内径に加工することが可能とな
る。また、ワークの下穴径やワークの長さが変わって
も、研磨時間と研磨工具摩耗量の略比例関係は維持され
る結果、研磨工具摩耗を確実に推測できるのでので好適
である。According to a third aspect of the present invention, the tool wear detecting means is
The wear of the polishing tool was estimated based on the accumulated time spent polishing the work. As a result, the wear of the polishing tool progresses substantially in proportion to the accumulated time spent polishing the workpiece, and therefore the polishing end position is moved according to the tool wear estimated based on the accumulated time spent polishing the workpiece. As a result, it is not necessary to move the polishing end position while checking the progress of wear of the polishing tool, and it is possible to process a larger number of workpieces with a stable inner diameter with one polishing tool. Further, even if the prepared hole diameter of the work and the length of the work change, the polishing time and the wear amount of the polishing tool are maintained in a substantially proportional relationship, so that the wear of the polishing tool can be reliably estimated, which is preferable.

【００１３】また、請求項４は、研磨中にワークもしく
は研磨工具にかかる研磨負荷を検知する負荷検知手段を
備え、工具摩耗検出手段は、研磨負荷の低下に基いて研
磨工具の摩耗を推測するようにした。これにより、ワー
クが研磨工具テーパ部に断続的に突き当てられる研磨中
盤は研磨負荷が大きいが、ワークが研磨工具円柱部に挿
入される研磨終盤は研磨負荷が低下するので、研磨負荷
の低下を検出することで研磨終盤に来たことを認識でき
る。研磨工具の摩耗進行によって研磨工具円柱部が短く
なり、それに伴い研磨負荷の低下位置も移動するので、
研磨負荷の低下に基いて推測される工具摩耗に応じて研
磨終了位置を移動させることにより、研磨工具の摩耗進
行状況を確認しながら研磨終了位置を移動させる必要が
無く、１本の研磨工具でより多数のワークを安定した内
径に加工することが可能となる。また、ワークの下穴
径、ワークの長さ、ワークの材質、使用する砥粒径、使
用する砥粒材質等が変わっても、研磨工具摩耗を確実に
推測できるので好適である。According to a fourth aspect of the present invention, there is provided load detecting means for detecting a polishing load applied to the work or the polishing tool during polishing, and the tool wear detecting means estimates the wear of the polishing tool based on the reduction of the polishing load. I did it. As a result, the polishing load is large in the middle polishing plate where the workpiece is intermittently abutted against the polishing tool taper portion, but the polishing load decreases in the polishing end plate where the workpiece is inserted into the polishing tool columnar portion, so the polishing load is reduced. By detecting it, it is possible to recognize that it has reached the end of polishing. As the abrasion of the polishing tool progresses, the columnar portion of the polishing tool becomes shorter, and the lowering position of the polishing load moves accordingly.
By moving the polishing end position according to the tool wear estimated based on the reduction of the polishing load, it is not necessary to move the polishing end position while checking the progress of wear of the polishing tool, and one polishing tool can be used. It becomes possible to process a larger number of workpieces to a stable inner diameter. Further, even if the prepared hole diameter of the work, the length of the work, the material of the work, the abrasive grain size to be used, the abrasive grain material to be used, and the like are changed, the abrasion of the polishing tool can be reliably estimated, which is preferable.

【００１４】また、請求項５は、負荷検知手段は、ワー
クあるいは研磨工具にかかる軸心方向の力あるいは軸心
周方向の力の少なくとも一方を検知するようにした。こ
れにより、負荷検知手段はワークと研磨工具間に作用す
る研磨中の力を研磨負荷として検知するので、回転手段
のモータ電流等の間接的な検知手段に比べ、より正確か
つ瞬時に研磨中の負荷を検知することができる。その結
果、研磨負荷の低下、すなわちワークが研磨工具の未摩
耗部まで挿入されたことを正確かつ瞬時に検出すること
が可能となる。According to a fifth aspect of the present invention, the load detecting means detects at least one of the axial force and the axial force applied to the work or the polishing tool. As a result, the load detection means detects the force during polishing that acts between the workpiece and the polishing tool as the polishing load. The load can be detected. As a result, it becomes possible to accurately and instantaneously detect a decrease in the polishing load, that is, that the work is inserted into the non-wearing portion of the polishing tool.

【００１５】また、請求項６は、下穴を有するワークと
研磨工具とを下穴と研磨工具の軸心が略同一線上に存在
するように配置し、ワークと研磨工具の少なくとも一方
を軸心を中心として回転させ、ワークと研磨工具の少な
くとも一方を軸心に沿って移動させるとともに、研磨工
具円柱部の未摩耗部までワークを挿入してから研磨を終
了するようにした。これにより、研磨工具の摩耗が進行
しても、研磨工具円柱部のまだ摩耗していない部分まで
ワークを挿入してから研磨を終了するので、ワークの仕
上り内径が小さくなることが無く、１本の研磨工具でよ
り多数のワークを加工することが可能となる。According to a sixth aspect of the present invention, the work having the prepared hole and the polishing tool are arranged so that the axes of the prepared hole and the polishing tool are substantially on the same line, and at least one of the work and the polishing tool is provided as the axis center. At least one of the work and the polishing tool is moved along the axis, and the work is inserted to the non-abraded portion of the polishing tool columnar portion, and then the polishing is completed. As a result, even if the wear of the polishing tool progresses, the work is inserted until the part of the polishing tool column that has not yet been worn, and then the polishing is finished. It becomes possible to process a large number of works with the polishing tool of.

【００１６】[0016]

【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings.

【００１７】[0017]

【実施例】図１に本発明による穴研磨装置の一実施例を
示す。ワークＷは、例えば光通信に用いられるコネクタ
部品であるスリーブであって、内径１．２４６ｍｍある
いは内径２．５００ｍｍに仕上げるための下穴を有して
おり、材質はセラミックである。ワークＷはチャック１
によって保持され、スピンドル２とタイミングプーリ３
とタイミングベルト４を介してモータＭ１によってワー
クＷの下穴軸心を中心に回転する。チャック１には図示
されないワーク給排機構によってワークＷが供給、排出
され、また図示されない開閉機構によってワークＷの保
持、開放を切替えることが出来る。FIG. 1 shows an embodiment of the hole polishing apparatus according to the present invention. The work W is, for example, a sleeve which is a connector component used for optical communication, has a prepared hole for finishing the inner diameter of 1.246 mm or the inner diameter of 2.500 mm, and is made of ceramic. Work W is chuck 1
Held by the spindle 2 and timing pulley 3
Then, the work M is rotated about the prepared hole axis by the motor M1 via the timing belt 4. The work W is supplied to and discharged from the chuck 1 by a work supply / discharge mechanism (not shown), and holding / release of the work W can be switched by an opening / closing mechanism (not shown).

【００１８】研磨工具５は図２に示すように円柱部とテ
ーパ部で構成され、円柱部側の端が工具ホルダ６に固定
される。工具ホルダ６には軸７が差込まれ、軸７と研磨
工具５の軸心は略同一線上にあり、工具ホルダ６は軸７
に対し軸心回りに回転自在であるとともに軸心方向には
拘束されている。なお、本実施例では研磨工具とワーク
の間に研磨材を介在させて研磨しているが、電着等の手
段によって砥粒を固定した研磨工具を用いても良い。As shown in FIG. 2, the polishing tool 5 is composed of a cylindrical portion and a tapered portion, and the end on the cylindrical portion side is fixed to the tool holder 6. A shaft 7 is inserted into the tool holder 6, the shaft 7 and the polishing tool 5 are substantially coaxial with each other, and the tool holder 6 has a shaft 7
On the other hand, it is rotatable about the axis and is restrained in the axial direction. In this embodiment, an abrasive is interposed between the polishing tool and the workpiece for polishing, but a polishing tool having abrasive grains fixed thereto by means such as electrodeposition may be used.

【００１９】工具ホルダ６は図５に示すように糸８とバ
ネ９を介して軸心回りに微小な力が加えられ、ストッパ
１０に微小な力で押付けられている。従って工具ホルダ
６は研磨工具５に加わる軸心回りの力に応じて図５の矢
印方向に回転し、その回転量すなわち研磨負荷は工具ホ
ルダ６に刻まれた切欠きＫ１、Ｋ２と光学センサＳ１、
Ｓ２によって検出される。As shown in FIG. 5, the tool holder 6 is pressed against the stopper 10 with a small force by applying a small force around the axis through the thread 8 and the spring 9. Therefore, the tool holder 6 rotates in the direction of the arrow in FIG. 5 according to the force around the axis applied to the polishing tool 5, and the amount of rotation, that is, the polishing load, is notched in the tool holder 6, the notches K1 and K2, and the optical sensor S1. ,
It is detected by S2.

【００２０】軸７はモータＭ２とクランク機構１１によ
って軸心方向に往復動する。また、軸７は図示されない
拘束手段によって軸心回りの回転を拘束されるととも
に、支持ブロック１２に軸心方向の運動自在に支持さ
れ、支持ブロック１２はモータＭ２とともにプレート１
３に固定されている。プレート１３は図示されないガイ
ドに支持案内され、モータＭ３とボールネジ１４によっ
て研磨工具５の軸心方向に任意に駆動される。本実施例
ではモータＭ２およびクランク機構１１と、モータＭ３
とボールネジ１４をもって研磨工具５の軸心方向駆動手
段としているが、これはモータＭ３とボールネジ１４に
よる駆動速度が遅いためであり、十分な速度が得られれ
ばモータＭ２およびクランク機構１１は不要である。The shaft 7 reciprocates in the axial direction by the motor M2 and the crank mechanism 11. The shaft 7 is restrained from rotating about its axis by a restraint means (not shown), and is supported by a support block 12 so as to be freely movable in the axial direction.
It is fixed at 3. The plate 13 is supported and guided by a guide (not shown), and is arbitrarily driven by the motor M3 and the ball screw 14 in the axial direction of the polishing tool 5. In this embodiment, the motor M2 and the crank mechanism 11, and the motor M3
And the ball screw 14 are used as the driving means in the axial direction of the polishing tool 5. This is because the driving speed by the motor M3 and the ball screw 14 is slow, and the motor M2 and the crank mechanism 11 are unnecessary if a sufficient speed is obtained. .

【００２１】ワーク給排機構、チャック開閉機構、モー
タＭ１、モータＭ２、モータＭ３は図示されない制御手
段によって制御される。The work feeding / discharging mechanism, the chuck opening / closing mechanism, the motor M1, the motor M2, and the motor M3 are controlled by a control means (not shown).

【００２２】次に、上記構成例の穴研磨装置について動
作を説明する。まずチャック１に内面を研磨されるため
の下穴を有するワークＷが供給され、図示されない開閉
機構によって保持される。次にモータＭ３によってボー
ルネジ１４が回転されることで研磨工具５がプレート１
３ごと図１の矢印Ａ側に移動し、研磨工具５の先端がワ
ークＷの下穴に数ｍｍ挿入されてモータＭ３は停止す
る。この時、円錐状のガイド穴を有する挿入ガイド１５
によって研磨工具５の先端が確実にワークＷの下穴に挿
入されるよう案内される。Next, the operation of the hole polishing apparatus having the above configuration example will be described. First, a work W having a prepared hole for polishing the inner surface is supplied to the chuck 1 and held by an opening / closing mechanism (not shown). Then, the ball screw 14 is rotated by the motor M3 so that the polishing tool 5 moves to the plate 1
1, the tip of the polishing tool 5 is inserted into the prepared hole of the work W by several mm, and the motor M3 is stopped. At this time, the insertion guide 15 having the conical guide hole
Thus, the tip of the polishing tool 5 is guided so as to be surely inserted into the prepared hole of the work W.

【００２３】ワークＷの下穴へ研磨工具５の先端が挿入
されると、モータＭ３とボールネジ１４によって研磨工
具５が図１のＡ側に送られる。前述のように研磨工具５
の円柱部はワーク下穴より径が大きいので、ワークＷは
研磨工具５のテーパ部のどこかで干渉し、研磨工具に軸
心方向の力が作用する。この力がクランク機構１１に伝
わり図６に示すように停止状態のモータＭ２の軸が回転
させられたことをセンサＳ３で検知して研磨開始位置に
来たことを判定する。なお、クランク機構１１はモータ
Ｍ２とセンサＳ３によって予め定められた原点で停止し
ており、この原点は図６で示す破線以外の位置にしてい
る。When the tip of the polishing tool 5 is inserted into the prepared hole of the workpiece W, the polishing tool 5 is sent to the side A in FIG. 1 by the motor M3 and the ball screw 14. As mentioned above, the polishing tool 5
Since the cylindrical portion has a larger diameter than the workpiece prepared hole, the workpiece W interferes with somewhere in the tapered portion of the polishing tool 5, and a force in the axial direction acts on the polishing tool. This force is transmitted to the crank mechanism 11, and as shown in FIG. 6, the sensor S3 detects that the shaft of the motor M2 in the stopped state is rotated and determines that the polishing start position has been reached. The crank mechanism 11 is stopped at an origin predetermined by the motor M2 and the sensor S3, and this origin is located at a position other than the broken line shown in FIG.

【００２４】研磨開始位置に来たと判定されると、モー
タＭ３とボールネジ１４によって研磨工具５が図１のＢ
側に所定距離（後述の往復動幅＋余裕）移動後、モータ
Ｍ１によってワークＷが回転を始めるとともに、モータ
Ｍ２によって研磨工具が往復動を始め、さらにモータＭ
３によって研磨工具５が図１のＡ側に送られる。なお、
研磨材とオイルからなる研磨液は研磨液供給部１６から
供給される。研磨液は常時循環供給していてもよいし、
この時供給開始してもよい。When it is determined that the polishing start position has been reached, the polishing tool 5 is moved by the motor M3 and the ball screw 14 as shown in FIG.
After a predetermined distance (reciprocal movement width + margin described later) to the side, the work M starts rotating by the motor M1, the polishing tool starts reciprocating movement by the motor M2, and the motor M further
The polishing tool 5 is sent to the side A of FIG. In addition,
A polishing liquid composed of an abrasive and oil is supplied from the polishing liquid supply unit 16. The polishing liquid may be constantly circulated and supplied,
At this time, the supply may be started.

【００２５】往復動を繰返す研磨工具５は断続的にワー
クＷの内面に突き当てられて研磨が開始されるが、この
時、研磨工具５にかかる軸心回りの力Ｆを光学センサＳ
１、Ｓ２で監視し、この力Ｆが過大にならないように研
磨工具５の送り、すなわちモータＭ３が制御される。こ
れによって、ワークＷに過大な力で研磨工具５が突き当
てられてワークＷと研磨工具５が固着すること無く研磨
が進行していく。The polishing tool 5 which repeats reciprocating motion is intermittently abutted against the inner surface of the work W to start polishing. At this time, the force F about the axial center applied to the polishing tool 5 is detected by the optical sensor S.
1 and S2, the feed of the polishing tool 5, that is, the motor M3 is controlled so that the force F does not become excessive. As a result, the polishing tool 5 is abutted against the work W with an excessive force, and the polishing progresses without the work W and the polishing tool 5 sticking together.

【００２６】さらに研磨が進み、ワークＷが研磨工具５
の円柱部の予め定められた研磨終了位置まで挿入される
と研磨終了となる。研磨を終了する時はモータＭ３によ
り研磨工具５を図１のＢ側に移動しワークＷから研磨工
具５を抜くとともに、モータＭ１、Ｍ２を停止すること
でワークＷの回転と研磨工具５の往復動が停止する。The polishing progresses further, and the work W is polished by the polishing tool 5.
When the cylindrical portion is inserted up to a predetermined polishing end position, the polishing ends. When finishing the polishing, the polishing tool 5 is moved to the B side in FIG. 1 by the motor M3 to remove the polishing tool 5 from the workpiece W, and the motors M1 and M2 are stopped to rotate the workpiece W and reciprocate the polishing tool 5. Motion stops.

【００２７】上述の動作でワークの研磨を続けると、図
４に示すように研磨工具５の摩耗は進行する。研磨終了
位置が毎回同じであると、研磨工具５が摩耗によって細
くなるため、ワークＷの仕上り内径は図７に示すように
加工数と共に小さくなる。研磨工具５の摩耗は加工数に
略比例して進行するので、加工数に基いて推測される研
磨工具５の摩耗に応じて研磨終了位置を研磨工具５円柱
部の未摩耗部方向へ移動させている。これにより図８に
示すように、１本の研磨工具で、より多数のワークを安
定した内径に加工することが可能となる。また、加工数
に基いて研磨終了位置を移動させているので、研磨工具
の摩耗進行状況を計測する必要が無い。なお、研磨工具
５を新品に交換する場合は、リセットボタンを押して、
加工終了位置を初期値に戻している。When the polishing of the work is continued by the above operation, the abrasion of the polishing tool 5 progresses as shown in FIG. If the polishing end position is the same every time, the polishing tool 5 becomes thin due to wear, so that the finished inner diameter of the work W becomes smaller with the number of machining as shown in FIG. 7. Since the abrasion of the polishing tool 5 progresses substantially in proportion to the number of machining, the polishing end position is moved toward the non-abraded portion of the cylindrical portion of the polishing tool 5 according to the abrasion of the polishing tool 5 estimated based on the number of machining. ing. As a result, as shown in FIG. 8, a single polishing tool can process a larger number of workpieces with stable inner diameters. Further, since the polishing end position is moved based on the number of processes, it is not necessary to measure the wear progress of the polishing tool. When replacing the polishing tool 5 with a new one, press the reset button and
The machining end position is returned to the initial value.

【００２８】研磨終了位置を移動させるにあたり、研磨
工具５の円柱部を長くしておく必要が有るが、研磨工具
５は全長に対しテーパ部長さの割合が多いので円柱部を
長くしても全長はあまり長くならない。実際に、研磨工
具５の全長が３割程度長くなるまで円柱部を長くして、
研磨終了位置を移動させながら研磨を繰返すことで、図
８に示すように５倍以上のワーク数を安定した内径に加
工することができた。To move the polishing end position, it is necessary to lengthen the cylindrical portion of the polishing tool 5. However, since the polishing tool 5 has a large ratio of the length of the taper portion to the total length, even if the cylindrical portion is lengthened, the entire length is increased. Does not grow too long. Actually, lengthen the cylindrical part until the total length of the polishing tool 5 becomes about 30% longer,
By repeating the polishing while moving the polishing end position, as shown in FIG. 8, it was possible to process five times or more workpieces into a stable inner diameter.

【００２９】ワークのロットや品番によって、ワーク下
穴径、ワーク長さ、ワーク材質、使用する砥粒径、使用
する砥粒材質等が変わる場合は、それらに応じて加工数
に対する研磨終了位置の移動割合を変更すればよい。例
えば、ワークの下穴径が小さく、ワーク長さが長く、ワ
ーク材質が固く、使用する砥粒径が大きい場合、ワーク
１個当りの研磨工具の摩耗量が多くなるので、研磨終了
位置の移動量も多くすればよい。When the work hole diameter, work length, work material, abrasive grain size to be used, abrasive grain material to be used, etc. are changed depending on the lot or part number of the work, the polishing end position relative to the number of machining is correspondingly changed. Change the moving ratio. For example, when the prepared hole diameter of the work is small, the work length is long, the work material is hard, and the abrasive grain size used is large, the amount of wear of the polishing tool per work increases, so the movement of the polishing end position You can increase the amount.

【００３０】本実施例では、研磨したワークの数に基い
て推測される研磨工具の摩耗に応じて研磨終了位置を移
動させているが、、ワークの研磨に費やした積算時間に
基いて推測される研磨工具の摩耗に応じて研磨終了位置
を移動させてもよい。例えば、ワークのロットや品番に
よって、ワーク下穴径、ワーク長さが変わる場合は、研
磨したワークの数と研磨工具の摩耗の比例関係も変化し
てしまう。しかし、研磨時間はワーク下穴径、ワーク長
さに応じて変化するので、ワークの研磨に費やした積算
時間と研磨工具の摩耗には略比例関係が維持される結
果、ワークの研磨に費やした積算時間に基いて推測され
る研磨工具の摩耗に応じて駆動手段の研磨終了位置を移
動させておけば、研磨終了位置の移動割合を変更する必
要が無く好適である。In the present embodiment, the polishing end position is moved according to the abrasion of the polishing tool estimated based on the number of polished works, but it is estimated based on the accumulated time spent polishing the works. The polishing end position may be moved according to the wear of the polishing tool. For example, when the diameter of the prepared hole and the length of the work change depending on the lot or the product number of the work, the proportional relationship between the number of the works polished and the wear of the polishing tool also changes. However, since the polishing time changes depending on the diameter of the prepared hole and the length of the workpiece, a roughly proportional relationship is maintained between the cumulative time spent polishing the workpiece and the wear of the polishing tool. If the polishing end position of the drive means is moved according to the abrasion of the polishing tool estimated based on the accumulated time, it is not necessary to change the movement ratio of the polishing end position, which is preferable.

【００３１】本実施例では、研磨したワークの数に基い
て推測される研磨工具の摩耗に応じて研磨終了位置を移
動させているが、研磨負荷の低下に基いて推測される工
具摩耗に応じて研磨終了位置を移動させてもよい。図９
にワーク１個を研磨した場合の時間と研磨負荷（研磨工
具にかかる軸心周りの力）の関係、および時間と研磨工
具５の送り位置の関係を示す。ワークＷが研磨工具５の
テーパ部に断続的に突き当てられる研磨中盤は研磨負荷
が大きいが、ワークＷが研磨工具５の円柱部に挿入され
る研磨終盤は研磨負荷が低下することがわかる。研磨工
具５の摩耗進行によって円柱部が短くなり、それに伴い
研磨負荷の出力低下位置も移動するので、研磨負荷の低
下を検出することにより研磨工具５の摩耗進行状況を把
握することが可能となり、ワークＷを研磨工具５の未摩
耗部まで確実に挿入してから研磨を終了させることがで
きる。In the present embodiment, the polishing end position is moved according to the abrasion of the polishing tool estimated based on the number of polished workpieces. However, according to the tool abrasion estimated based on the reduction of the polishing load. Alternatively, the polishing end position may be moved. Figure 9
2 shows the relationship between the time and the polishing load (a force applied to the polishing tool around the axis) when polishing one workpiece, and the relationship between the time and the feed position of the polishing tool 5. It can be seen that the polishing load is large in the middle polishing plate where the work W is intermittently abutted against the taper portion of the polishing tool 5, but the polishing load decreases in the polishing end plate in which the work W is inserted into the cylindrical portion of the polishing tool 5. The progress of wear of the polishing tool 5 shortens the columnar portion, and the position at which the output of the polishing load decreases is also moved accordingly. Therefore, it is possible to grasp the progress of wear of the polishing tool 5 by detecting the decrease in the polishing load, The polishing can be finished after the work W is surely inserted into the unworn portion of the polishing tool 5.

【００３２】なお、研磨負荷が低下した時点では、ワー
クＷの内面に若干のテーパが残っているので、研磨工具
５の円柱部未摩耗部での研磨をおこなってから終了する
ことが望ましい。また、ワークのロットや品番によっ
て、ワーク下穴径、ワーク長さ、ワーク材質、使用する
砥粒径、使用する砥粒材質等が変わる場合でも、確実に
研磨工具５の摩耗進行状況を把握することが可能であ
り、研磨終了位置の移動割合を変更する必要が無く好適
である。Since a slight taper remains on the inner surface of the work W when the polishing load is reduced, it is desirable to finish after polishing the non-wearing portion of the cylindrical portion of the polishing tool 5. Further, even if the workpiece pilot hole diameter, workpiece length, workpiece material, abrasive grain size used, abrasive grain material used, etc. change depending on the lot or part number of the workpiece, the progress of wear of the polishing tool 5 can be reliably grasped. This is preferable because it is not necessary to change the movement ratio of the polishing end position.

【００３３】[0033]

【発明の効果】本発明は上記構成により次の効果を発揮
する。研磨工具の摩耗に応じて駆動手段の研磨終了位置
を移動させることにより、研磨工具円柱部のまだ摩耗し
ていない部分までワークを挿入してから研磨を終了する
ことができるので、研磨工具の摩耗が進行してもワーク
の仕上り内径が小さくなることが無く、１本の研磨工具
で、より多数のワークを加工することが可能な穴研磨方
法および穴研磨装置を提供できる。The present invention has the following effects due to the above configuration. By moving the polishing end position of the drive means according to the wear of the polishing tool, it is possible to finish the polishing after inserting the work up to the part of the polishing tool column which has not been worn yet. It is possible to provide a hole polishing method and a hole polishing apparatus capable of processing a larger number of works with a single polishing tool without causing the finished inner diameter of the work to become small even if the number of workpieces advances.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明による穴研磨装置の一実施例を示す全体
図である。FIG. 1 is an overall view showing an embodiment of a hole polishing apparatus according to the present invention.

【図２】従来技術の研磨方法を表す概念図である。FIG. 2 is a conceptual diagram showing a conventional polishing method.

【図３】従来技術の研磨方法の自動化を目指した研磨装
置の全体図である。FIG. 3 is an overall view of a polishing apparatus aiming at automation of a conventional polishing method.

【図４】本発明による穴研磨装置に使用する研磨工具の
摩耗進行状況を示すグラフである。FIG. 4 is a graph showing the progress of wear of the polishing tool used in the hole polishing apparatus according to the present invention.

【図５】本発明による穴研磨装置の負荷検知部の正面図
である。FIG. 5 is a front view of a load detection unit of the hole polishing apparatus according to the present invention.

【図６】本発明によるクランク機構部の詳細図である。FIG. 6 is a detailed view of a crank mechanism portion according to the present invention.

【図７】従来技術で研磨を繰返した場合のワーク仕上が
り内径の変化を示すグラフである。FIG. 7 is a graph showing changes in the finished inner diameter of the work when polishing is repeated in the conventional technique.

【図８】本発明による穴研磨装置で研磨を繰返した場合
のワーク仕上がり内径の変化を示すグラフである。FIG. 8 is a graph showing changes in the finished inner diameter of a workpiece when polishing is repeatedly performed by the hole polishing apparatus according to the present invention.

【図９】本発明による穴研磨装置の研磨を開始してから
の時間と負荷の発生状況および研磨工具の送り状況を示
すグラフである。FIG. 9 is a graph showing the time from the start of polishing by the hole polishing apparatus according to the present invention, the load generation state, and the polishing tool feed state.

【符号の説明】[Explanation of symbols]

１…チャック、２…スピンドル、３…タイミングプー
リ、４…タイミングベルト、５…研磨工具、６…工具ホ
ルダ、７…軸、８…糸、９…バネ、１０…ストッパ、１
１…クランク機構、１２…支持ブロック、１３…プレー
ト、１４…ボールネジ、１５…挿入ガイド、１６…研磨
液供給部、Ｗ…ワーク、Ｍ１、Ｍ２、Ｍ３…モータ、Ｓ
１、Ｓ２、Ｓ３…センサ、Ｋ１、Ｋ２…切欠き1 ... Chuck, 2 ... Spindle, 3 ... Timing pulley, 4 ... Timing belt, 5 ... Polishing tool, 6 ... Tool holder, 7 ... Shaft, 8 ... Thread, 9 ... Spring, 10 ... Stopper, 1
DESCRIPTION OF SYMBOLS 1 ... Crank mechanism, 12 ... Support block, 13 ... Plate, 14 ... Ball screw, 15 ... Insertion guide, 16 ... Polishing liquid supply part, W ... Work, M1, M2, M3 ... Motor, S
1, S2, S3 ... Sensor, K1, K2 ... Notch

フロントページの続き Ｆターム(参考） 2H036 QA12 QA16 QA20 3C034 AA13 AA19 BB92 BB93 CA08 CA16 CB02 3C043 AC03 AC09 AC28 CC07 CC13 3C058 AA07 AA09 AC02 BA01 BA06 BA09 BB02 BC02 CA01 CA05 CB01 Continued front page    F-term (reference) 2H036 QA12 QA16 QA20                 3C034 AA13 AA19 BB92 BB93 CA08                       CA16 CB02                 3C043 AC03 AC09 AC28 CC07 CC13                 3C058 AA07 AA09 AC02 BA01 BA06                       BA09 BB02 BC02 CA01 CA05                       CB01

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 下穴を有するワークを保持する保持手段
と、前記下穴の軸心と自らの軸心が略同一線上に存在す
るように配置される研磨工具と、前記ワークと前記研磨
工具の少なくとも一方を前記軸心を中心として回転させ
る回転手段と、前記ワークと前記研磨工具の少なくとも
一方を前記軸心に沿って移動させる駆動手段とを備えた
穴研磨装置において、前記研磨工具の摩耗を検出する工
具摩耗検出手段を備え、前記工具摩耗手段の出力に基い
て前記駆動手段の研磨終了位置を移動させることを特徴
とする穴研磨装置。1. A holding means for holding a work having a prepared hole, a polishing tool arranged such that the axis of the prepared hole and its own axis are substantially on the same line, the work and the polishing tool. Of the polishing tool, comprising: a rotating means for rotating at least one of the two around the axis, and a driving means for moving at least one of the work and the polishing tool along the axis. A hole-polishing device comprising: tool-wear detecting means for detecting the movement of the polishing means, and moving the polishing-finishing position of the drive means based on the output of the tool-wearing means. 【請求項２】 前記穴研磨装置において、前記工具摩耗
検出手段は、研磨したワークの数に基いて前記研磨工具
の摩耗を推測することを特徴とする請求項１記載の穴研
磨装置。2. The hole polishing apparatus according to claim 1, wherein in the hole polishing apparatus, the tool wear detection means estimates the wear of the polishing tool based on the number of polished works. 【請求項３】 前記穴研磨装置において、前記工具摩耗
検出手段は、ワークの研磨に費やした積算時間に基いて
前記研磨工具の摩耗を推測することを特徴とする請求項
１記載の穴研磨装置。3. The hole polishing apparatus according to claim 1, wherein in the hole polishing apparatus, the tool wear detecting means estimates the wear of the polishing tool based on an integrated time spent polishing the work. . 【請求項４】 前記穴研磨装置において、研磨中に前記
ワークもしくは前記研磨工具にかかる研磨負荷を検知す
る負荷検知手段を備え、前記工具摩耗検出手段は、前記
研磨負荷の低下に基いて前記研磨工具の摩耗を推測する
ことを特徴とする請求項１記載の穴研磨装置。4. The hole polishing apparatus includes load detection means for detecting a polishing load applied to the work or the polishing tool during polishing, and the tool wear detection means performs the polishing based on a decrease in the polishing load. The hole polishing apparatus according to claim 1, wherein wear of the tool is estimated. 【請求項５】 前記穴研磨装置において、前記負荷検知
手段は、前記ワークあるいは前記研磨工具にかかる前記
軸心方向の力あるいは前記軸心周方向の力の少なくとも
一方を検知することを特徴とする請求項４記載の穴研磨
装置。5. In the hole polishing apparatus, the load detection means detects at least one of a force in the axial direction and a force in the axial circumferential direction applied to the work or the polishing tool. The hole polishing apparatus according to claim 4. 【請求項６】 下穴を有するワークと研磨工具とを前記
下穴と前記研磨工具の軸心が略同一線上に存在するよう
に配置し、前記ワークと前記研磨工具の少なくとも一方
を前記軸心を中心として回転させ、前記ワークと前記研
磨工具の少なくとも一方を前記軸心に沿って移動させる
とともに、前記研磨工具の摩耗に応じて研磨終了位置を
移動させることを特徴とする穴研磨方法。6. A work having a prepared hole and a polishing tool are arranged so that axes of the prepared hole and the polishing tool are substantially on the same line, and at least one of the work and the polishing tool is provided with the axis. Is rotated about the axis to move at least one of the work and the polishing tool along the axis, and the polishing end position is moved according to wear of the polishing tool.
JP2002005571A 2002-01-15 2002-01-15 Bore polishing method and bore polishing device Pending JP2003205458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002005571A JP2003205458A (en) 2002-01-15 2002-01-15 Bore polishing method and bore polishing device

Publications (1)

Publication Number Publication Date
JP2003205458A true JP2003205458A (en) 2003-07-22

Family

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Application Number Title Priority Date Filing Date
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Country Link
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CN101559577B (en) * 2009-06-02 2012-05-30 于伟忱 Honing method for realizing control of grinding force
CN103072054A (en) * 2011-11-21 2013-05-01 常熟市创新陶瓷有限公司 Ceramic pipe grinding device
CN103612179A (en) * 2013-11-07 2014-03-05 宁波宁创自动化设备有限公司 PC spherical surface manufacturing machine for ceramic inserting core
CN103612200A (en) * 2013-11-07 2014-03-05 宁波宁创自动化设备有限公司 Automatic feeding mechanism for processing machine for PC spherical surface of ceramic inserting core
CN104493653A (en) * 2014-11-29 2015-04-08 域鑫科技（惠州）有限公司 Inner-hole grinding and polishing device
CN105033792A (en) * 2015-06-03 2015-11-11 苏州睿绮电子有限公司 Anti-oxidation grinding machine with target locating and automatic fine correcting function
CN105290959A (en) * 2015-10-11 2016-02-03 宁波博莱特光电科技有限公司 PC spherical surface processing device for ceramic ferrule
CN115070602A (en) * 2022-07-26 2022-09-20 九江七所精密机电科技有限公司 Semi-automatic grinding device
CN115365913A (en) * 2022-10-26 2022-11-22 山东伟盛铝业有限公司 A integrative grinding device for double-deck aluminum alloy casing
CN117140224A (en) * 2023-10-27 2023-12-01 威飞海洋装备制造有限公司 Grinding device for metal sealing surface in deep hole of Christmas tree body

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101559577B (en) * 2009-06-02 2012-05-30 于伟忱 Honing method for realizing control of grinding force
CN103072054A (en) * 2011-11-21 2013-05-01 常熟市创新陶瓷有限公司 Ceramic pipe grinding device
CN103612179A (en) * 2013-11-07 2014-03-05 宁波宁创自动化设备有限公司 PC spherical surface manufacturing machine for ceramic inserting core
CN103612200A (en) * 2013-11-07 2014-03-05 宁波宁创自动化设备有限公司 Automatic feeding mechanism for processing machine for PC spherical surface of ceramic inserting core
CN104493653A (en) * 2014-11-29 2015-04-08 域鑫科技（惠州）有限公司 Inner-hole grinding and polishing device
CN105033792A (en) * 2015-06-03 2015-11-11 苏州睿绮电子有限公司 Anti-oxidation grinding machine with target locating and automatic fine correcting function
CN105290959A (en) * 2015-10-11 2016-02-03 宁波博莱特光电科技有限公司 PC spherical surface processing device for ceramic ferrule
CN105290959B (en) * 2015-10-11 2017-10-31 宁波博莱特光电科技股份有限公司 A kind of ceramic insertion core PC device for machining spherical surface
CN115070602A (en) * 2022-07-26 2022-09-20 九江七所精密机电科技有限公司 Semi-automatic grinding device
CN115365913A (en) * 2022-10-26 2022-11-22 山东伟盛铝业有限公司 A integrative grinding device for double-deck aluminum alloy casing
CN117140224A (en) * 2023-10-27 2023-12-01 威飞海洋装备制造有限公司 Grinding device for metal sealing surface in deep hole of Christmas tree body
CN117140224B (en) * 2023-10-27 2024-02-23 中海石油(中国)有限公司海南分公司 Grinding device for metal sealing surface in deep hole of Christmas tree body

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