JP2002233033A - Forming method for circuit and circuit formed by the method - Google Patents
Forming method for circuit and circuit formed by the methodInfo
- Publication number
- JP2002233033A JP2002233033A JP2001028370A JP2001028370A JP2002233033A JP 2002233033 A JP2002233033 A JP 2002233033A JP 2001028370 A JP2001028370 A JP 2001028370A JP 2001028370 A JP2001028370 A JP 2001028370A JP 2002233033 A JP2002233033 A JP 2002233033A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- substrate
- wiring member
- circuit body
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は回路体の形成方法お
よび該方法で形成された回路体に関し、特に、自動車の
ジャンクションボックス内部に積層配置する回路体とし
て好適に用いられるもので、絶縁樹脂板からなる基板上
に配線する配線材を接続して所要の分岐・接続回路を設
けるものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a circuit body and a circuit body formed by the method, and more particularly, to an insulating resin plate suitably used as a circuit body to be stacked inside a junction box of an automobile. The wiring material to be wired on the substrate made of is connected to provide a required branching / connection circuit.
【０００２】[0002]
【従来の技術】従来、自動車に搭載されるジャンクショ
ンボックスには、絶縁樹脂製の基板上に導電性金属板を
回路形状に金型で打抜加工したバスバーを固定した回路
体を設け、複数の回路体を積層配置している。2. Description of the Related Art Conventionally, a junction box mounted on an automobile is provided with a circuit body in which a bus bar formed by stamping a conductive metal plate into a circuit shape with a mold on an insulating resin substrate is provided. Circuits are stacked and arranged.
【０００３】[0003]
【発明が解決しようとする課題】上記絶縁板上にバスバ
ーを固定して回路体を形成する場合、バスバーを形成す
るための金型製作費が高価となるため、容易に回路変更
できない問題がある。また、回路形状に金属板を打ち抜
くと、回路部以外の部分は廃棄しなければならず、無駄
が多くなって、その分、コスト増になる。さらに、バス
バーを絶縁板に固定するため、絶縁基板よりリブを突設
し、このリブをバスバーに穿設している穴を挿入した
後、リブを加締めて固定しているため、絶縁板へのバス
バーの固定に手数がかかる問題がある。When a circuit body is formed by fixing a bus bar on the insulating plate, there is a problem that the circuit cannot be easily changed because the cost of manufacturing a mold for forming the bus bar is high. . Also, if a metal plate is punched into a circuit shape, parts other than the circuit part must be discarded, resulting in increased waste and a corresponding increase in cost. Furthermore, in order to fix the bus bar to the insulating plate, a rib is protruded from the insulating substrate, and after inserting the hole formed in the bus bar, the rib is caulked and fixed. There is a problem that it takes time to fix the bus bar.
【０００４】上記バスバーに代えて、安価な電線を絶縁
板上に布線し、該電線に圧接端子を圧接接続させ、異層
の圧接端子同士を中継端子を介して接続することによ
り、複数の回路体を積層する方法や、絶縁板上で電線同
士を直接溶接する方法が提案されている。[0004] Instead of the bus bar, an inexpensive electric wire is laid on an insulating plate, a press contact terminal is press-connected to the electric wire, and press contact terminals of different layers are connected to each other via a relay terminal. A method of laminating circuit bodies and a method of directly welding wires on an insulating plate have been proposed.
【０００５】しかしながら、電線に圧接端子を圧接接続
させる場合には、別部品の圧接端子や中継端子が必要と
なると共に、電線に圧接端子を圧接接続する作業も必要
となる。また、電線の導体同士を直接溶接する方法とし
ては、超音波溶接、抵抗溶接、レーザー溶接、機械的接
続等の方法があるが、いずれも絶縁被覆が存在している
場合には導体同士の溶接が容易でなく、電気接続信頼性
の点でも問題がある。そのため、絶縁被覆を予め皮剥ぎ
して導体を露出させておく前工程が必要となる。また、
絶縁被覆がない単芯線のみの裸電線を用いると皮剥ぎの
必要はないが、単芯線を絶縁するために単芯線の配線側
を更に絶縁板で閉鎖しなければならず、単芯線が高価で
あることも合わせてコスト増になると共に、積層状態で
の高さが大となり、ジャンクションボックスが大型化す
る問題がある。However, in order to press-connect a press-connecting terminal to an electric wire, a press-connecting terminal and a relay terminal as separate components are required, and an operation of press-connecting the press-contact terminal to the electric wire is also required. Methods for directly welding the conductors of electric wires include ultrasonic welding, resistance welding, laser welding, mechanical connection, and the like. In all cases, when an insulating coating is present, the conductors are welded to each other. However, there is a problem in terms of electrical connection reliability. Therefore, a pre-process is required in which the conductor is exposed by peeling off the insulating coating in advance. Also,
If you use a bare wire with only a single-core wire without insulation coating, you do not need to strip the skin, but the wiring side of the single-core wire must be further closed with an insulating plate to insulate the single-core wire. In addition to the above, there is a problem that the cost is increased and the height in the stacked state is increased, so that the junction box is enlarged.
【０００６】本発明は上記した問題に鑑みてなされたも
ので、特に、ジャンクションボックス等の電気接続箱に
積層配置される回路体の導体を電線等の配線材で構成す
る場合において、圧接端子や中継端子を介することな
く、また、前工程で配線材の絶縁被覆を剥離して芯線を
露出させておくことなく、配線材の導体同士を簡単に接
続できるようにすることを課題としている。SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems. Particularly, when a conductor of a circuit body laminated and arranged on an electric connection box such as a junction box is formed of a wiring material such as an electric wire, the pressure contact terminal or the like is required. An object of the present invention is to make it possible to easily connect conductors of a wiring member without using a relay terminal and without exposing a core wire by removing an insulating coating of the wiring member in a previous process.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するた
め、本発明は、絶縁樹脂からなる基板の上面にＸ、Ｙ方
向に延在する配線材ガイド溝を交差させて設けており、
第１の上記基板のＸ、Ｙ方向のいずれか一方に導体のみ
或いは導体を絶縁樹脂で被覆した第１配線材を挿入して
配線する一方、いずれか他方に導体を絶縁樹脂で被覆し
た第２配線材を挿入して配線し、交差位置では第１、第
２配線材を重ね、次いで、上記第１の基板の配線側に第
２の基板を配置して上記第１の基板の配線材ガイド溝に
配線した第１、第２配線材を第１、第２の基板で挟持
し、上記第１配線材と第２配線材の所要の交差位置に、
上記第２の基板の外面より超音波振動を負荷して、上記
第２配線材の絶縁被覆あるいは第１配線材が絶縁被覆で
被覆した配線材の場合は該第１配線材と第２配線材の両
方の絶縁被覆を除去して、第１配線材と第２配線材の導
体同士を圧接させて電気接続させると共に、第１と第２
の基板の当接面を融着させて第１の回路体を形成し、そ
の後、第２の基板の上面に第３の基板あるいは樹脂板を
配置して、第２の基板の配線材ガイド溝に挿入した第
１、第２配線材を挟持した状態として、第３の基板ある
いは樹脂板側から上記第１、第２配線材の所要の交差位
置に超音波振動を負荷して配線材の導体同士を接続させ
て第２の回路体を形成し、これを繰り返すことにより、
複数の回路体を積層した状態で形成している回路体の形
成方法を提供している。According to the present invention, a wiring member guide groove extending in the X and Y directions is provided on an upper surface of a substrate made of an insulating resin so as to intersect with each other.
A first wiring member in which only a conductor or a conductor is coated with an insulating resin is inserted into one of the X and Y directions of the first substrate and wired, and a second in which a conductor is coated with an insulating resin on the other is provided. A wiring member is inserted and wired, and at the intersection position, the first and second wiring members are overlapped. Then, a second substrate is arranged on the wiring side of the first substrate, and a wiring member guide of the first substrate is provided. The first and second wiring members wired in the grooves are sandwiched between the first and second substrates, and at the required intersections between the first and second wiring members,
When an ultrasonic vibration is applied from the outer surface of the second substrate, the first wiring member and the second wiring member are covered with the insulating coating of the second wiring member or the first wiring member. Are removed, the conductors of the first wiring member and the second wiring member are brought into pressure contact with each other to electrically connect the first and second wiring members, and the first and second wiring members are electrically connected.
The first circuit body is formed by fusing the contact surfaces of the first substrate and the third substrate or the resin plate is disposed on the upper surface of the second substrate, and the wiring member guide groove of the second substrate is formed. When the first and second wiring members inserted into the first and second wiring members are sandwiched, ultrasonic vibration is applied from the third substrate or the resin plate side to a required intersection of the first and second wiring members, and the conductors of the wiring members are applied. By connecting each other to form a second circuit body and repeating this,
A method for forming a circuit body in which a plurality of circuit bodies are formed in a stacked state is provided.
【０００８】上記電線配線側に配置する第２の基板の上
面より超音波ホーンで超音波振動を負荷する時、下方の
第１の基板の下面には超音波振動発生機のアンビルを配
置しても良いし、単なる支持用平板で第１の基板を支持
してもよい。When an ultrasonic vibration is applied by the ultrasonic horn from the upper surface of the second substrate disposed on the wire wiring side, an anvil of an ultrasonic vibration generator is disposed on the lower surface of the lower first substrate. it also good, may support the first substrate just supporting plates.
【０００９】上記のように、本発明では、絶縁樹脂製の
基板上にＸ、Ｙ方向の配線材ガイド溝をクロスさせて設
けておき、これら配線材ガイド溝に絶縁被覆された配線
材、好ましくは電線を挿入して配線し、交差位置ではＸ
−Ｙ方向の電線を重ねている。 この状態で、積層する
回路体の基板（第２の基板）を配線側に配置して、電線
の上下を基板で挟み、上方の第２の基板側から所要の交
差位置に超音波振動を負荷することにより、超音波振動
で電線の絶縁被覆が破壊・溶融により除去さると同時
に、露出する導体同士が接触させて電気接続される。即
ち、電線の絶縁被覆の除去と導体同士の接続とが同時に
行える。よって、従来必要とされた絶縁被覆の皮剥ぎ作
業が不要となり、作業を非常に簡単とすることができ
る。また、超音波振動を加えることにより、接続位置の
周囲の上下の基板が振動摩擦による発熱で軟化溶融して
接合し、導体同士の接触部を上下から押さえ付ける形で
互いに融着するため、接触状態を確実に保持すると共に
絶縁性も確保することができる。As described above, according to the present invention, wiring material guide grooves in the X and Y directions are provided crosswise on a substrate made of an insulating resin, and the wiring material insulated and coated with these wiring material guide grooves is preferable. Is inserted and wired, and at the intersection, X
The wires in the -Y direction are stacked. In this state, the board (second board) of the circuit body to be laminated is arranged on the wiring side, the upper and lower sides of the electric wires are sandwiched by the boards, and ultrasonic vibration is applied from the upper second board side to a required intersection position. By doing so, the insulating coating of the electric wire is removed by destruction and melting by ultrasonic vibration, and at the same time, the exposed conductors are brought into contact with each other to be electrically connected. That is, the removal of the insulating coating of the electric wire and the connection of the conductors can be performed simultaneously. Therefore, the work of stripping the insulation coating, which has been conventionally required, becomes unnecessary, and the work can be extremely simplified. Further, by applying ultrasonic vibration, since the upper and lower substrates around the connection position is bonded by softening and melting in the heat generated by the vibration friction, fuse together in a manner to press the contact portion between conductors from above and below, contact The state can be reliably maintained and the insulation can be ensured.
【００１０】さらに、基板に配線材ガイド溝を設けて電
線等の配線材を予め挿入しているため、超音波振動を加
える時に、配線材の保持手段を設ける必要はなく、か
つ、配線側は積層する基板を利用して閉鎖して配線材を
挟持しているため、配線側を閉鎖するためだけの基板は
不要となり、積層構造において、その高さを低くするこ
とができる。Further, since wiring material guide grooves are provided on the substrate and wiring materials such as electric wires are inserted in advance, it is not necessary to provide a wiring material holding means when applying ultrasonic vibration, and the wiring side is not provided. Since the wiring member is closed by using the substrate to be laminated and the wiring material is sandwiched, a substrate only for closing the wiring side becomes unnecessary, and the height of the laminated structure can be reduced.
【００１１】また、上記のように、超音波振動で接続す
る電線等の配線材は、両方を絶縁被覆された配線材と
し、両方の配線材の絶縁被覆を超音波振動で除去して接
続することができる。この場合には、互いに接続する配
線材とも前工程で皮剥ぎする工程が不要となる。 な
お、一方は絶縁被覆されていない導体のみからなる電線
としてもよい。上記のように超音波振動で導体同士を接
触させる配線材は、電線に限定されず、銅箔を並設して
樹脂フィルムで挟持したＦＦＣや、丸導体を並設して樹
脂フィルムで挟持したＦＣ（所謂リボン電線）を用いて
もよい。Further, as described above, the wiring members such as electric wires to be connected by ultrasonic vibration are both wiring members coated with insulation, and the insulation coating of both wiring members is removed by ultrasonic vibration and connected. be able to. In this case, the step of peeling off the wiring members connected to each other in the previous step is not required. One may be an electric wire composed of only a conductor that is not coated with insulation. The wiring material for bringing the conductors into contact with each other by ultrasonic vibration as described above is not limited to an electric wire, and an FFC in which copper foils are juxtaposed and held by a resin film, and a round conductor is juxtaposed and held by a resin film. FC (so-called ribbon electric wire) may be used.
【００１２】上記基板に設けるＸ、Ｙ方向の配線材ガイ
ド溝は、いずれか一方の配線材ガイド溝の深さを他方よ
り深くして、交差位置で重なる配線材が基板表面より突
出しない構成としている。これにより、積層する基板に
隙間を発生させずに当接させて、超音波振動を下方の基
板に伝播させることができる。The X- and Y-direction wiring member guide grooves provided on the substrate are configured such that one of the wiring member guide grooves has a depth greater than the other so that wiring members overlapping at the intersection position do not protrude from the substrate surface. I have. Thus, the ultrasonic vibration can be propagated to the lower substrate by causing the laminated substrate to contact the substrate without generating a gap.
【００１３】上記絶縁樹脂製の基板は、その軟化温度
が、電線等の配線材の絶縁樹脂の軟化温度より高いもの
を用いている。電線の絶縁被覆としては一般にＰＶＣが
使用されており、これより軟化温度が高い樹脂材で基板
として好適に用いられるものとして、ＰＢＴ，ＡＳＢ，
ＰＡ（ナイロン），ＰＣ，ＰＰ，ＨＤ，ＬＤ等が挙げら
れる。The above-mentioned insulating resin substrate has a softening temperature higher than the softening temperature of the insulating resin of the wiring material such as an electric wire. In general, PVC is used as an insulating coating for electric wires. PBT, ASB, and PBT are preferably used as a substrate made of a resin material having a higher softening temperature.
PA (nylon), PC, PP, HD, LD and the like.
【００１４】上記温度設定とすることにより、先に軟化
された絶縁被覆（あるいは絶縁フィルム）は、未だ軟化
されていない基板から伝わる超音波振動により、接点位
置から押し出されるように容易に除去できる。By setting the temperature as described above, the insulating coating (or insulating film) softened earlier can be easily removed so as to be pushed out from the contact position by the ultrasonic vibration transmitted from the substrate which has not been softened yet.
【００１５】上記基板には、電気接続される第１配線材
と第２配線材の交差位置に配線材ガイド溝と連続させて
拡大させた窪みを設けており、該窪みに上記超音波によ
り溶融剥離された樹脂を収容している。[0015] The substrate is provided with a recess which is continuous with the wiring material guide groove and is enlarged at the intersection of the first wiring material and the second wiring material to be electrically connected, and which is melted by the ultrasonic wave. Contains peeled resin.
【００１６】上記窪みは除去される絶縁被覆の体積分を
収容できる大きさに設定している。このような窪みを設
けると、超音波振動で剥離除去された樹脂を収容でき、
無制限に広がるのを防止できる。これにより、この剥離
除去された樹脂が上下の基板の間にはみ出して基板の接
合面に隙間があいてガタつきが生じるのを防止できる。The recess is set to have a size that can accommodate the volume of the insulating coating to be removed. By providing such a depression, the resin removed and removed by ultrasonic vibration can be accommodated,
It can be prevented from spreading indefinitely. Thereby, it is possible to prevent the peeled and removed resin from protruding between the upper and lower substrates and leaving a gap in the joint surface of the substrates to cause rattling.
【００１７】さらに、上記窪みの周囲に、上記超音波振
動の伝播を遮断する縁切り溝を設けることが好ましい。
上記縁切り溝は細いスリット状の溝とすることが好まし
く、窪みを囲む形状であれば方形でも円形でもよく、形
状は限定されない。Further, it is preferable to provide an edge groove around the depression to block propagation of the ultrasonic vibration.
The edge cutting groove is preferably a thin slit-shaped groove, and may be square or circular as long as it surrounds the depression, and the shape is not limited.
【００１８】上記縁切り溝を設けると、超音波振動の伝
播を縁切り溝の位置で遮断でき、広い範囲に超音波振動
エネルギーが分散するのを防止でき、接続位置の周囲の
上下の基板に集中的に振動エネルギーを負荷して、これ
ら第１と第２基板を強固に融着することができる。さら
に、基板への振動エネルギーの伝播を遮断することによ
り、基板の配線材ガイド溝に挿通させている接続位置以
外の配線材部分への振動の伝播も遮断でき、接続位置以
外の部分の電線にダメージを与えないようにすることも
できる。[0018] The provision of the edge cutting grooves, the propagation of the ultrasonic vibration can be blocked at the position of the edge cutting grooves, wide range possible to prevent the ultrasonic vibration energy is distributed intensively in the upper and lower substrates around the connection position The first and second substrates can be firmly fused by applying vibration energy to the first and second substrates. Furthermore, by blocking the propagation of vibration energy to the board, the propagation of vibration to the wiring material portion other than the connection position inserted into the wiring material guide groove of the board can also be blocked, and the electric wire in the portion other than the connection position can be blocked. it is also possible to prevent damage.
【００１９】上記第１配線材および第２配線材としては
単芯線からなる被覆電線を用いることが好ましい。多数
の素線を撚った多芯線からなる場合、振動摩擦により剥
離されて溶融した樹脂が素線の間に混入する恐れがある
が、単芯線とするとこの問題はなく、互いに接触する芯
線（導体）同士の接触面積を確実に一定面積とすること
ができる。また、超音波振動に対して単芯線の方が強度
的に強い点も有利となる。As the first and second wiring members, it is preferable to use a coated electric wire composed of a single core wire. In the case of a multi-core wire formed by twisting a large number of wires, there is a possibility that molten resin separated by vibration friction may be mixed between the wires. However, a single-core wire does not have this problem. The contact area between the conductors can be reliably set to a constant area. It is also advantageous that the single-core wire is stronger in strength against ultrasonic vibration.
【００２０】本発明は上記方法で形成された回路体を提
供しており、該回路体は積層された構成で、ジャンクシ
ョンボックス等の電気接続箱内に好適に収容されるもの
である。The present invention provides a circuit body formed by the above-described method, and the circuit body has a laminated structure and is suitably housed in an electric junction box such as a junction box.
【００２１】[0021]
【発明の実施の形態】以下、本発明の実施形態を図面を
参照して説明する。図１乃至図４は第一実施形態を示
し、図１は回路体１０、１１が積層された状態を示し、
各回路体１０、１１はそれぞれ基板１上にＸ方向の第１
電線Ｗ１とＹ方向の第２電線Ｗ２とをクロス配線し、所
要交差位置で第１電線Ｗ１と第２電線Ｗ２の導体同士を
接触させて電気接続して分岐・接続回路を構成してい
る。なお、図１には２層の回路体を図示しているが、回
路体１１の上面にも回路体を積層し、３層以上の多層と
している。Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show a first embodiment, FIG. 1 shows a state in which circuit bodies 10 and 11 are stacked,
Each of the circuit bodies 10 and 11 is placed on the substrate 1 in the first direction in the X direction.
The electric wire W1 and the second electric wire W2 in the Y direction are cross-wired, and the conductors of the first electric wire W1 and the second electric wire W2 are brought into contact with each other at a required intersection to electrically connect them, thereby forming a branching / connection circuit. Although FIG. 1 shows a two-layer circuit body, the circuit body is also stacked on the upper surface of the circuit body 11 so as to have three or more layers.
【００２２】上記回路体１０、１１の基板１（即ち、下
層の回路板１０の第１の基板１Ａ、上層の回路体１１の
第２の基板１Ｂ）は図２に示す同一の形状からなる。即
ち、基板１の表面に、Ｘ方向の配線材ガイド溝１ａを一
定ピッチで複数列凹設していると共に、Ｙ方向の配線材
ガイド溝１ｂを一定ピッチで複数列凹設し、これらＸ、
Ｙ方向の配線材ガイド溝１ａと１ｂとを交差させてい
る。上記Ｘ方向の配線材ガイド溝１ａはＹ方向の配線材
ガイド溝１ｂよりも深く凹設し、交差位置Ｐで重なる第
１電線Ｗ１、第２電線Ｗ２が基板１の上面より突出しな
いように設定している。The substrates 1 of the circuit bodies 10 and 11 (ie, the first substrate 1A of the lower circuit board 10 and the second substrate 1B of the upper circuit body 11) have the same shape as shown in FIG. That is, a plurality of rows of X direction wiring material guide grooves 1a are recessed at a constant pitch on the surface of the substrate 1, and a plurality of rows of Y direction wiring material guide grooves 1b are recessed at a constant pitch.
The wiring guide grooves 1a and 1b in the Y direction intersect. The wiring member guide groove 1a in the X direction is recessed deeper than the wiring member guide groove 1b in the Y direction, and is set so that the first electric wire W1 and the second electric wire W2 overlapping at the intersection position P do not protrude from the upper surface of the substrate 1. are doing.
【００２３】上記第１、第２電線Ｗ１、Ｗ２は単芯線か
らなる導体ａを絶縁被覆ｂで被覆した電線からなる。絶
縁被覆ｂはＰＶＣ（ポリ塩化ビニル）からなる一方、上
記基板１はＰＶＣよりも軟化温度が低いＰＢＴ（ポリブ
チルテレフタレート）より成形している。Each of the first and second electric wires W1 and W2 is an electric wire in which a conductor a composed of a single core wire is covered with an insulating coating b. The insulating coating b is made of PVC (polyvinyl chloride), while the substrate 1 is made of PBT (polybutyl terephthalate) having a softening temperature lower than that of PVC.
【００２４】回路体１０、１１を順次形成していくに
は、図３（Ａ）に示すように、下層の回路体１０の第１
の基板１ＡのＸ方向の配線材ガイド溝１ａに第１電線Ｗ
１を挿入して配線し、Ｙ方向の配線材ガイド溝１ｂに第
２電線Ｗ２を挿入して配線し、交差位置Ｐでは、第１電
線Ｗ１の上面に第２電線Ｗ２を重ねている。次いで、図
３（Ｂ）に示すように、第１の基板１Ａの上面に第２の
基板１Ｂを載せ、第１の基板１Ａの配線材ガイド溝１
ａ、１ｂに配線した第１、第２電線Ｗ１、Ｗ２を第１、
第２の基板１Ａと１Ｂとで挟持する。In order to form the circuit bodies 10 and 11 sequentially, as shown in FIG.
The first electric wire W into the wiring member guide groove 1a in the X direction of the substrate 1A
1 is inserted and wired, and the second electric wire W2 is inserted and wired in the wiring member guide groove 1b in the Y direction. At the intersection position P, the second electric wire W2 is overlaid on the upper surface of the first electric wire W1. Next, as shown in FIG. 3B, the second substrate 1B is placed on the upper surface of the first substrate 1A, and the wiring member guide groove 1 of the first substrate 1A is formed.
a, 1b, the first and second electric wires W1, W2 are connected to the first,
It is sandwiched between the second substrates 1A and 1B.
【００２５】この状態で、第１の基板１Ａを支持用平板
５上に載置し、第１電線Ｗ１と第２電線Ｗ２の所要の交
差位置Ｐ’には上方の第２の基板１Ｂの上面より超音波
ホーン６を配置し、該超音波ホーン６の先端を第２の基
板１Ｂの交差位置Ｐ’の外面に接触させて、電線Ｗ１、
Ｗ２を上下の基板１Ｂと１Ａで押さえ付けた状態で超音
波を発振させる。In this state, the first substrate 1A is placed on the supporting flat plate 5, and the upper surface of the upper second substrate 1B is located at a required intersection P 'between the first electric wire W1 and the second electric wire W2. The ultrasonic horn 6 is further arranged, and the tip of the ultrasonic horn 6 is brought into contact with the outer surface of the intersection position P ′ of the second substrate 1B, so that the electric wires W1,
Ultrasonic waves are oscillated while W2 is pressed by the upper and lower substrates 1B and 1A.
【００２６】第１、第２電線Ｗ１、Ｗ２が重ねられた交
差位置Ｐ’では、上方の第２の基板１Ｂ→第２電線Ｗ２
→第１電線Ｗ１→下方の第１の基板１Ａへと超音波が伝
播する。第１電線Ｗ１と第２電線Ｗ２との当接位置には
振動摩擦が発生し、第１、第２電線Ｗ１、Ｗ２の絶縁被
覆ｂが図４に示すように、破壊されると共に摩擦熱によ
り溶融して、電線Ｗ１、Ｗ２より絶縁被覆ｂが除去され
る。このように、接合位置の絶縁被覆ｂが除去されるこ
とにより単芯線からなる導体ａ、ａが露出して、これら
導体同士が圧接して電気接続される。At the intersection P 'where the first and second electric wires W1 and W2 overlap, the upper second substrate 1B → the second electric wire W2
→ The first electric wire W1 → The ultrasonic wave propagates to the first substrate 1A below. Vibration friction occurs at the contact position between the first electric wire W1 and the second electric wire W2, and the insulating coating b of the first and second electric wires W1, W2 is destroyed as shown in FIG. After melting, the insulation coating b is removed from the electric wires W1 and W2. In this manner, the conductors a, which are made of a single-core wire, are exposed by removing the insulating coating b at the joining position, and these conductors are pressed and electrically connected.
【００２７】上記絶縁被覆ｂの溶融した状態で除去され
る部分ｂ−１は圧接される導体ａ、ａの回りを取り囲
む。また、第１の基板１Ａと第２の基板１Ｂの表面も当
接しているため、振動摩擦が発生し、この摩擦熱により
当接する基板１Ａと１Ｂの表面同士が融着する。The portion b-1 of the insulating coating b which is removed in a molten state surrounds the conductors a to be pressed. Further, since the contact surface of the first substrate 1A and the second substrate 1B also those, vibration friction occurs and the surface between the substrate 1A and 1B in contact with the frictional heat fused.
【００２８】このように、第１、第２電線Ｗ１、Ｗ２の
導体ａ、ａは互いに圧接された状態で溶着されていない
が、その回りを除去された絶縁被覆ｂ、ｂで囲むと共に
第１、第２基板が交差位置Ｐ’の回りで融着されること
により、導体同士の圧接状態を保持し、電気接続信頼性
を確保できる。As described above, the conductors a and a of the first and second electric wires W1 and W2 are not welded in a state where they are pressed against each other, but are surrounded by the removed insulating coatings b and b, and the first and second electric wires W1 and W2 are not welded. Since the second substrate is fused around the intersection position P ', the press-contact state between the conductors is maintained, and the electrical connection reliability can be secured.
【００２９】上記超音波による導体同士の接続作業時に
おいて、絶縁被覆ｂの軟化温度より基板１Ａ、１Ｂの軟
化温度を高く設定しているため、先に軟化する絶縁被覆
ｂが軟化していない基板１Ａ、１Ｂからの振動により、
破壊および溶融して除去される絶縁被覆部分ｂ−１を容
易に押し出すことができる。When the conductors are connected with each other by the ultrasonic wave, the softening temperature of the substrates 1A and 1B is set higher than the softening temperature of the insulating coating b, so that the insulating coating b which softens first is not softened. By vibration from 1A and 1B,
The insulating coating portion b-1 which is broken and melted and removed can be easily extruded.
【００３０】このように、第１の基板１Ａ上にＸ−Ｙの
第１、第２の電線Ｗ１、Ｗ２をクロス配線して、所要の
交差位置Ｐ’で導体ａ，ａを電気接続させた回路体１０
を、上層の回路体１１の第２の基板１Ｂを利用して形成
する。その後、第２の基板１ＢのＸ−Ｙの第１、第２の
電線Ｗ１、Ｗ２を配線材ガイド溝１ａ、１ｂに挿入して
配線する。この第２の基板１Ｂの上面に上層の基板（図
示せず）を配置し、前記と同様に所定の交差位置Ｐ’に
超音波振動を負荷して第１、第２電線Ｗ１、Ｗ２の絶縁
被覆ｂを剥離して導体ａ同士を接触させて電気接続す
る。As described above, the X and Y first and second electric wires W1 and W2 are cross-wired on the first substrate 1A, and the conductors a and a are electrically connected at the required intersection position P '. Circuit body 10
Is formed using the second substrate 1B of the upper circuit body 11. After that, the XY first and second electric wires W1 and W2 of the second substrate 1B are inserted into the wiring member guide grooves 1a and 1b and wired. An upper substrate (not shown) is disposed on the upper surface of the second substrate 1B, and the first and second electric wires W1, W2 are insulated by applying ultrasonic vibration to a predetermined intersection position P 'in the same manner as described above. The coating b is peeled off and the conductors a are brought into contact with each other to make an electrical connection.
【００３１】最上層の回路体では、基板にＸ−Ｙの第
１、第２電線を配線材ガイド溝に挿入して配線した後、
平板形状の絶縁樹脂製の基板１Ｃを配置して、該基板の
上面から超音波振動を負荷して電線同士を接続してい
る。なお、最上層の回路体の電線配線側に載置する基板
として、配線材ガイド溝を設けた基板を用いても良いこ
とは言うまでもない。In the circuit body of the uppermost layer, the first and second X-Y electric wires are inserted into the wiring member guide grooves on the substrate and wired.
A board 1C made of a flat insulating resin is arranged, and the electric wires are connected by applying ultrasonic vibration from the upper surface of the board. Needless to say, a substrate provided with a wiring material guide groove may be used as a substrate to be placed on the wire wiring side of the uppermost circuit body.
【００３２】図５および図６は第二実施形態を示し、基
板１には、配線材ガイド溝１ａと１ｂとの交差位置Ｐの
部分に、この交差位置Ｐを中心とした円形の窪み１ｃを
ガイド溝１ａ、１ｂと連続させて凹設している。この窪
み１ｃの容積は後述する電線Ｗ１、Ｗ２の絶縁被覆ｂ、
ｂの除去部分の体積分に相当させている。FIGS. 5 and 6 show a second embodiment. In the substrate 1, a circular recess 1c centered on the intersection P is provided at the intersection P of the wiring member guide grooves 1a and 1b. It is recessed so as to be continuous with the guide grooves 1a and 1b. The volume of the depression 1c is equal to the insulation coating b of the electric wires W1 and W2 described later.
This corresponds to the volume of the removed portion of b.
【００３３】さらに、上記窪み１ｃを所要空間Ｓをあけ
て囲むように超細幅のスリット状の縁切り溝１ｄを方形
状に切り込んで形成している。Further, a very narrow slit-shaped kerf 1d is cut into a square shape so as to surround the recess 1c with a required space S therebetween.
【００３４】上記窪み１ｃおよび縁切り溝１ｄを設ける
と、絶縁被覆ｂの溶融した状態で除去される部分ｂ−１
は窪み１ｃに丁度充填された状態となり、圧接される導
体ａ、ａの回りを取り囲む。また、窪み１ｃを囲む第１
の基板１Ａと第２の基板１Ｂの隙間に溶融した絶縁被覆
が流出しないため、基板１Ａと１Ｂの表面を確実に当接
させて振動摩擦を発生させ、この摩擦熱により当接する
基板１Ａと１Ｂの表面同士が確実に融着させることがで
きる。When the recess 1c and the edge groove 1d are provided, a portion b-1 of the insulating coating b which is removed in a molten state is provided.
Is just filled in the recess 1c and surrounds the conductors a, a to be pressed. In addition, the first surrounding the depression 1c
Since the molten insulating coating does not flow into the gap between the first substrate 1A and the second substrate 1B, the surfaces of the substrates 1A and 1B are securely brought into contact with each other to generate vibrational friction, and the frictional heat causes the substrates 1A and 1B to come into contact with each other. Can be reliably fused together.
【００３５】また、窪み１ｃの回りには縁切り溝１ｄを
設けているため、負荷される超音波振動は縁切り溝１ｄ
の位置で伝播が遮断され、図６中に斜線で示す交差位置
Ｐ’の回りの一定範囲の基板１Ａ、１Ｂおよび電線Ｗ
１，Ｗ２に集中的に負荷でき、他の部位の電線および基
板１Ａ、１Ｂに損傷を発生させない。Also, since the kerf 1d is provided around the recess 1c, the ultrasonic vibration to be applied is not affected by the kerf 1d.
, The propagation is cut off, and a certain range of the substrates 1A and 1B and the electric wires W around the intersection position P ′ indicated by oblique lines in FIG.
1, W2 can be intensively loaded, and does not cause damage to the electric wires and the substrates 1A, 1B in other parts.
【００３６】なお、本発明は上記実施形態に限定され
ず、Ｘ，Ｙ方向に配線材ガイド溝に配線する一方の電線
を絶縁被覆した電線とする一方、他方の電線は絶縁被覆
していない単芯線のみからなる裸電線としてもよい。ま
た、配線材として、ＦＦＣやＦＣを用い、これらの導体
がＸ−Ｙ方向にクロス配線されるように基板上に配置し
て用いてもよい。The present invention is not limited to the above-described embodiment. One of the wires to be wired in the wiring member guide grooves in the X and Y directions is an insulated wire, and the other is a non-insulated wire. It may be a bare electric wire consisting only of a core wire. Also, FFC or FC may be used as a wiring material, and these conductors may be arranged on a substrate so as to be cross-wired in the XY directions.
【００３７】[0037]
【発明の効果】以上の説明より明らかなように、本発明
によれば、通常汎用されている安価な被覆電線等からな
る配線材を用い、この被覆電線の絶縁被覆を前工程で皮
剥ぎすることなく、超音波振動を利用して電線の絶縁被
覆の除去と導体同士の接合を同時に行って電気接続を図
ることができる。このように、電線コスト、および作業
コストを低減できため、回路体を安価に提供することが
できる。As is apparent from the above description, according to the present invention, a wiring member made of a generally used inexpensive coated electric wire or the like is used, and the insulating coating of the coated electric wire is stripped in the previous step. Without the use of ultrasonic vibration, the electrical connection can be achieved by simultaneously removing the insulating coating of the electric wire and joining the conductors. As described above, the cost of the electric wire and the operation can be reduced, so that the circuit body can be provided at low cost.
【００３８】また、積層する上層の回路体の基板を利用
して、電線等の配線材の上下を基板で挟み、上方の基板
側から所要の交差位置に超音波振動を負荷することによ
り、超音波振動で配線材の絶縁被覆を破壊・溶融により
除去すると同時に露出する導体同士を接触させて電気接
続しているため、配線側を保持するための絶縁板を別個
に設ける必要はなく、その分、１つの回路体の高さを低
くでき、積層状態での全体高さを低減できる。Further, by using the circuit board of the upper layer circuit body to be laminated, the upper and lower wiring members such as electric wires are sandwiched between the substrates, and the ultrasonic vibration is applied to the required crossing position from the upper substrate side. Since the insulating coating of the wiring material is removed by destruction and melting by sonic vibration, the exposed conductors are brought into contact with each other to make electrical connection, so there is no need to separately provide an insulating plate for holding the wiring side. (1) The height of one circuit body can be reduced, and the overall height in a stacked state can be reduced.
【００３９】さらに、超音波振動を加えることにより、
接続位置の周囲の絶縁樹脂製の上下の基板が振動摩擦に
よる発熱で軟化溶融して接合し、導体同士の接合部を上
下から押さえ付ける形で互いに融着するため、接合状態
を確実に保持すると共に絶縁性も確保することができ
る。Further, by applying ultrasonic vibration,
The upper and lower substrates made of insulating resin around the connection position are softened and melted by the heat generated by vibrational friction and joined, and are fused to each other in such a way that the joints between the conductors are pressed down from above and below, so that the joined state is securely maintained. In addition, insulation can be ensured.
【００４０】さらにまた、軟化溶融して除去される絶縁
被覆分を交差位置に設けた窪みに収容すると、上下の回
路体の基板の間に除去された絶縁樹脂が介在することを
防止でき、がたつきなく接合できる。さらにまた、上記
窪みの外周に縁切り溝を設けると、超音波振動を電気接
続する交差位置に集中させ、無制限に振動が伝播するこ
とを防止することができる。Further, when the insulating coating removed by softening and melting is accommodated in the recess provided at the intersection, the interposed insulating resin can be prevented from intervening between the substrates of the upper and lower circuit bodies. Can be joined without rattling. Furthermore, by providing an edge groove on the outer periphery of the depression, the ultrasonic vibration can be concentrated at the intersection where the electrical connection is made, and the vibration can be prevented from propagating indefinitely.
【図１】 本発明の第一実施形態を示す斜視図である。FIG. 1 is a perspective view showing a first embodiment of the present invention.
【図２】 （Ａ）は上記実施形態で用いる基板を示す斜
視図、（Ｂ）は一部正面図である。FIG. 2A is a perspective view showing a substrate used in the embodiment, and FIG. 2B is a partial front view.
【図３】（Ａ）は基板上に電線を配線した状態の斜視
図、（Ｂ）は基板の間に電線を挟んで超音波ホーンで超
音波振動を負荷する状態を示す斜視図、（Ｃ）は（Ｂ）
のＡ−Ａ線断面図である。3 (A) is a perspective view of a state where the wire a wire on a substrate, (B) is a perspective view showing a state of loading the ultrasonic vibration by the ultrasonic horn across the wire between the substrates, (C ) Is (B)
FIG. 4 is a sectional view taken along line AA of FIG.
【図４】（Ａ）は交差位置で被覆電線の絶縁被覆が除去
されて導体が露出する状態を示す斜視図、（Ｂ）は電線
同士の接触状態を示す断面図である。FIG. 4A is a perspective view showing a state in which an insulating coating of a covered electric wire is removed at a crossing position and a conductor is exposed, and FIG. 4B is a cross-sectional view showing a contact state between the electric wires.
【図５】 第二実施形態の基板を示し、（Ａ）は平面
図、（Ｂ）は一部拡大図である。5A and 5B show a substrate according to a second embodiment, wherein FIG. 5A is a plan view and FIG. 5B is a partially enlarged view.
【図６】 縁切り溝の作用を示す図面である。FIG. 6 is a view showing the operation of a kerf.
１ 基板 １Ａ 第１の基板 １Ｂ 第２の基板 １ａ Ｘ方向の配線材ガイド溝 １ｂ Ｙ方向の配線材ガイド溝 １ｃ 窪み １ｄ 縁切り溝 １０、１１ 回路体 ６ 超音波ホーン Ｗ１ 第１電線（被覆電線） Ｗ２ 第２電線（被覆電線あるいは裸線） DESCRIPTION OF SYMBOLS 1 board 1A 1st board 1B 2nd board 1a X direction wiring member guide groove 1b Y direction wiring member guide groove 1c recess 1d edge cutting groove 10, 11 Circuit body 6 Ultrasonic horn W1 1st electric wire (coated electric wire) W2 2nd wire (covered wire or bare wire)
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０２Ｇ 15/16 Ｈ０２Ｇ 15/16 ５Ｇ３５５ Ｈ０５Ｋ 3/10 Ｈ０５Ｋ 3/10 Ａ ５Ｇ３６１ 3/46 3/46 Ｊ ５Ｇ３７５ Ｍ // Ｂ２３Ｋ 101:42 Ｂ２３Ｋ 101:42 (72)発明者 上野 隆 三重県四日市市西末広町１番14号 住友電 装株式会社内 Ｆターム(参考） 4E067 BF00 BF03 DA13 DA17 EA07 EB09 EC12 5E051 LA04 LB01 5E085 BB02 BB05 BB06 CC03 DD03 DD19 HH11 JJ04 JJ38 5E343 AA02 AA12 BB03 BB69 DD65 GG11 5E346 AA12 AA15 AA22 AA32 AA35 AA51 BB11 BB15 BB17 CC08 DD35 EE47 FF22 GG28 HH32 5G355 AA03 BA01 BA11 CA15 5G361 BA06 BB02 BC01 5G375 AA02 CA02 CA12 EA17 ────────────────────────────────────────────────── ─── of the front page continued (51) Int.Cl. 7 identification mark FI theme Court Bu (reference) H02G 15/16 H02G 15/16 5G355 H05K 3/10 H05K 3/10 a 5G361 3/46 3/46 J 5G375 M // B23K 101: 42 B23K 101: 42 (72) inventor Takashi Ueno Yokkaichi, Mie Prefecture Nishisuehiro-cho, No. 1, No. 14 Sumitomo electric instrumentation Co., Ltd. in the F-term (reference) 4E067 BF00 BF03 DA13 DA17 EA07 EB09 EC12 5E051 LA04 LB01 5E085 BB02 BB05 BB06 CC03 DD03 DD19 HH11 JJ04 JJ38 5E343 AA02 AA12 BB03 BB69 DD65 GG11 5E346 AA12 AA15 AA22 AA32 AA35 AA51 BB11 BB15 BB17 CC08 DD35 EE47 FF22 GG28 AH15G02A035
Claims (4)
向に延在する配線材ガイド溝を交差させて設けており、 第１の上記基板のＸ、Ｙ方向のいずれか一方に導体のみ
或いは導体を絶縁樹脂で被覆した第１配線材を挿入して
配線する一方、いずれか他方に導体を絶縁樹脂で被覆し
た第２配線材を挿入して配線し、交差位置では第１、第
２配線材を重ね、 次いで、上記第１の基板の配線側に第２の基板を配置し
て上記第１の基板の配線材ガイド溝に配線した第１、第
２配線材を第１、第２の基板で挟持し、 上記第１配線材と第２配線材の所要の交差位置に、上記
第２の基板の外面より超音波振動を負荷して、上記第２
配線材の絶縁被覆あるいは第１配線材が絶縁被覆で被覆
した配線材の場合は該第１配線材と第２配線材の両方の
絶縁被覆を除去して、第１配線材と第２配線材の導体同
士を圧接させて電気接続させると共に、第１と第２の基
板の当接面を融着させて第１の回路体を形成し、 その後、第２の基板の上面に第３の基板あるいは樹脂板
を配置して、第２の基板の配線材ガイド溝に挿入した第
１、第２配線材を挟持した状態として、第３の基板ある
いは樹脂板側から上記第１、第２配線材の所要の交差位
置に超音波振動を負荷して配線材の導体同士を接続させ
て第２の回路体を形成し、 これを繰り返すことにより、複数の回路体を積層した状
態で形成している回路体の形成方法。1. A wiring member guide groove extending in the X and Y directions is provided to intersect on an upper surface of a substrate made of an insulating resin, and only a conductor is provided in one of the X and Y directions of the first substrate. Alternatively, a first wiring member having a conductor coated with an insulating resin is inserted and wired, while a second wiring member having a conductor coated with an insulating resin is inserted and wired into one of the other, and the first and second wires are inserted at intersections. Wiring members are stacked, and then a second substrate is arranged on the wiring side of the first substrate, and the first and second wiring members wired in the wiring member guide grooves of the first substrate are first and second wiring members. Ultrasonic vibration is applied from the outer surface of the second substrate to a required intersection position between the first wiring member and the second wiring member,
If the wiring material is an insulating coating or the first wiring material is a wiring material covered with an insulating coating, the insulating coating of both the first wiring material and the second wiring material is removed, and the first wiring material and the second wiring material are removed. Are pressed against each other to make electrical connection, and the contact surfaces of the first and second substrates are fused to form a first circuit body. Thereafter, the third substrate is placed on the upper surface of the second substrate. Alternatively, the first and second wiring members are placed from the third substrate or the resin plate side in a state where the first and second wiring members inserted into the wiring member guide grooves of the second substrate are sandwiched by disposing a resin plate. A second circuit body is formed by applying ultrasonic vibration to the required intersection position to connect the conductors of the wiring members, and by repeating this, a plurality of circuit bodies are formed in a stacked state. A method for forming a circuit body.
回路体。2. A circuit formed by the method according to claim 1.
イド溝は、いずれか一方の配線材ガイド溝の深さを他方
より深くして、交差位置で重なる配線材が基板表面より
突出しない構成としている請求項２に記載の回路体。3. A wiring member guide groove in the X and Y directions provided on the substrate, wherein one of the wiring member guide grooves has a depth greater than the other, so that wiring members overlapping at the intersection position do not protrude from the substrate surface. The circuit body according to claim 2, wherein the circuit body has a configuration.
続される交差位置あるいはＸ，Ｙ方向の配線材ガイド溝
の全交差位置には、配線材ガイド溝と連続させて拡大さ
せた窪みを設け、該窪みに上記超音波により溶融剥離さ
れた樹脂を収容し、かつ、上記窪みの周囲に超音波振動
の伝達を遮断する縁切り溝を設けている請求項２または
請求項３に記載の回路体。4. At a crossing point where the first wiring member and the second wiring member are electrically connected or at an entire crossing position of the wiring member guiding groove in the X and Y directions, the wiring member is enlarged continuously with the wiring member guiding groove. 4. A recessed portion, wherein the recess contains the resin melted and separated by the ultrasonic wave, and a rim groove for blocking transmission of ultrasonic vibration is provided around the recessed portion. The described circuit body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001028370A JP2002233033A (en) | 2001-02-05 | 2001-02-05 | Forming method for circuit and circuit formed by the method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001028370A JP2002233033A (en) | 2001-02-05 | 2001-02-05 | Forming method for circuit and circuit formed by the method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002233033A true JP2002233033A (en) | 2002-08-16 |
Family
ID=18892879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001028370A Abandoned JP2002233033A (en) | 2001-02-05 | 2001-02-05 | Forming method for circuit and circuit formed by the method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002233033A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004119190A (en) * | 2002-09-26 | 2004-04-15 | Yazaki Corp | Ultrasonic joining device |
| JP2008529263A (en) * | 2005-01-24 | 2008-07-31 | ユマテック ゲーエムベーハー | Method for continuous wiring of conductors on a printed circuit board and apparatus for carrying out said method |
| JP2013538689A (en) * | 2010-08-18 | 2013-10-17 | シュンク・ソノシステムズ・ゲーエムベーハー | Method and apparatus for welding electrical conductors |
-
2001
- 2001-02-05 JP JP2001028370A patent/JP2002233033A/en not_active Abandoned
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004119190A (en) * | 2002-09-26 | 2004-04-15 | Yazaki Corp | Ultrasonic joining device |
| JP2008529263A (en) * | 2005-01-24 | 2008-07-31 | ユマテック ゲーエムベーハー | Method for continuous wiring of conductors on a printed circuit board and apparatus for carrying out said method |
| US8076612B2 (en) | 2005-01-24 | 2011-12-13 | Jumatech Gmbh | Method for the continuous laying of a conductor on a printed circuit board and device for carrying out said method |
| JP4909906B2 (en) * | 2005-01-24 | 2012-04-04 | ユマテック ゲーエムベーハー | Printed circuit board manufacturing method and apparatus for carrying out the method |
| JP2013538689A (en) * | 2010-08-18 | 2013-10-17 | シュンク・ソノシステムズ・ゲーエムベーハー | Method and apparatus for welding electrical conductors |
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