JP2001319715A - Electronic parts for surface mounting and electrode of circuit board - Google Patents
Electronic parts for surface mounting and electrode of circuit boardInfo
- Publication number
- JP2001319715A JP2001319715A JP2000136050A JP2000136050A JP2001319715A JP 2001319715 A JP2001319715 A JP 2001319715A JP 2000136050 A JP2000136050 A JP 2000136050A JP 2000136050 A JP2000136050 A JP 2000136050A JP 2001319715 A JP2001319715 A JP 2001319715A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- circuit board
- joint
- solder
- junction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術の分野】本発明は、回路基板に表面
実装されるコネクタやＩＣ等の表面実装用電子部品及び
回路基板の電極に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounting electronic component such as a connector or an IC mounted on a circuit board, and an electrode of the circuit board.
【０００２】[0002]
【従来の技術】従来のコネクタやＩＣ等の電子部品の端
子２１は、通常金属板からプレス金型により打ち抜かれ
て成形されるものであるため、図８（ａ）に示すように
板状や角柱状に形成されており、回路基板の電極に半田
付けされる接合部２２の形状も板状や角柱状のような矩
形状となっていた。2. Description of the Related Art Conventionally, terminals 21 of electronic parts such as connectors and ICs are usually formed by punching out a metal plate by a press die, and as shown in FIG. It was formed in a prismatic shape, and the shape of the joint portion 22 to be soldered to the electrode of the circuit board was also a rectangular shape such as a plate shape or a prism shape.
【０００３】このような断面が矩形状の接合部２２は、
回路基板２３の電極２４に半田付けすると、図８（ｂ）
に示すように、接合部２２と電極２４との間に半田２５
が入り込みにくく、両者の接合状態が良好ではなかっ
た。従って、従来の電子部品の端子２１は、通常全体的
にニッケルメッキを施し、端子２１が他の端子と接触す
る部分に金メッキを施した後に、接合部２２と電極２４
との接合状態を良好にするために、接合部２２を溶融し
た半田にくぐらせるいわゆる半田メッキを施すことが必
要であった。このように、従来の電子部品の端子では、
接合部２２に半田メッキを行う工程が必要であったた
め、工程が煩雑になるという不都合があった。[0003] Such a joint portion 22 having a rectangular cross section is
When soldered to the electrodes 24 of the circuit board 23, FIG.
As shown in FIG.
Were hard to enter, and the joint state of both was not good. Therefore, the terminal 21 of the conventional electronic component is generally plated with nickel, and the portion where the terminal 21 contacts another terminal is plated with gold.
In order to improve the bonding state with the solder, it was necessary to apply so-called solder plating for passing the bonding portion 22 through the molten solder. Thus, in the terminal of the conventional electronic component,
Since a step of performing solder plating on the joint portion 22 was required, there was an inconvenience that the step became complicated.
【０００４】また、半田は柔らかいものであるため、半
田メッキを行うと、端子２１を運搬する際や端子２１を
コネクタやＩＣ等の電子部品に組み込む際に半田カスが
発生することがある。この場合、半田カスをそのまま放
置すると、電子部品の短絡等の不具合を生じさせるた
め、この半田カスを取り除く工程が必要であった。[0004] Further, since the solder is soft, solder plating may generate solder scum when the terminals 21 are carried or when the terminals 21 are incorporated into electronic components such as connectors and ICs. In this case, if the solder residue is left as it is, a problem such as a short circuit of an electronic component occurs, so that a step of removing the solder residue is required.
【０００５】また、断面が矩形状の接合部２２は、図８
（ｂ）に示すように接合部２２と電極２４との間に半田
２５が入り込みにくいため、電極２４の幅を接合部２２
の幅よりも広くして半田２５が盛られる領域を確保する
必要があった。このため、基板２３上に電極２４を形成
する場合は、接合部２２の幅よりも電極２４の幅を広く
する必要があり、回路基板２３の小型化の妨げとなって
いた。[0005] Further, the joint portion 22 having a rectangular cross section is formed as shown in FIG.
As shown in (b), since the solder 25 is hard to enter between the joint 22 and the electrode 24, the width of the electrode 24 is reduced.
It is necessary to secure a region in which the solder 25 is piled up by making the width larger than the width of the solder 25. For this reason, when the electrodes 24 are formed on the substrate 23, the width of the electrodes 24 needs to be wider than the width of the bonding portion 22, which hinders miniaturization of the circuit board 23.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、回路基板に
表面実装される電子部品の改良を目的とし、さらに詳し
くは前記不都合を解消するために、半田により容易にか
つ確実に回路基板の電極に接合することができる電子部
品を提供することを目的とする。また、小型化が可能な
回路基板の電極を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to improve an electronic component surface-mounted on a circuit board. More specifically, in order to solve the above-mentioned inconveniences, the electrodes of the circuit board are easily and reliably soldered. It is an object of the present invention to provide an electronic component that can be joined to a semiconductor device. It is another object of the present invention to provide a circuit board electrode that can be reduced in size.
【０００７】[0007]
【課題を解決するための手段】前記目的を達成するため
に、本発明の電子部品は、回路基板の電極に半田付けさ
れる接合部を有する端子を備え、該接合部が円柱状に形
成されていることを特徴とする。本願発明者等によれ
ば、前記接合部を円柱状にすることにより半田ののりが
よくなり、該接合部と前記電極とを容易に接合できるこ
とが知見された。本発明の電子部品は、前記接合部を円
柱状にしているため、前記接合部と前記電極との接合が
容易となる。また、前記接合部を円柱状に形成すること
により、該接合部の外周と前記電極との間隙に半田が流
れ込むために、前記接合部と前記電極とが強固に接合さ
れる。さらに、前記接合部と前記電極との接合が容易に
なるため、前記接合部に半田メッキをすることが不要と
なる。従って、半田メッキ工程及び半田カスを取り除く
工程が不要となるため、端子の製造工程を簡素化するこ
とができる。In order to achieve the above object, an electronic component according to the present invention includes a terminal having a joint to be soldered to an electrode of a circuit board, and the joint is formed in a cylindrical shape. It is characterized by having. According to the inventors of the present application, it has been found that the soldering is improved by forming the joining portion in a columnar shape, and the joining portion and the electrode can be easily joined. In the electronic component according to the aspect of the invention, since the bonding portion has a columnar shape, the bonding between the bonding portion and the electrode is facilitated. Further, by forming the joint in a columnar shape, the solder flows into the gap between the outer periphery of the joint and the electrode, so that the joint and the electrode are firmly joined. Furthermore, since the joining portion and the electrode are easily joined, it is not necessary to perform solder plating on the joining portion. Therefore, the solder plating step and the step of removing the solder residue become unnecessary, so that the terminal manufacturing step can be simplified.
【０００８】本発明の表面実装用電子部品の端子におい
ては、前記接合部を含む端子の外周に粗面部を設けるこ
とが好ましい。このように、前記端子の外周に粗面部を
設けたときは、前記接合部を前記回路基板の電極に半田
付けした際に、溶融した半田が前記粗面部に流れ込み、
その状態で半田が硬化するので、前記回路基板の電極と
前記接合部を含む端子との接合が強化される。従って、
前記電子部品を容易に、且つ確実に前記回路基板に表面
実装することができる。In the terminal of the electronic component for surface mounting according to the present invention, it is preferable that a rough surface portion is provided on the outer periphery of the terminal including the joint. Thus, when a rough surface portion is provided on the outer periphery of the terminal, when the joint portion is soldered to an electrode of the circuit board, the molten solder flows into the rough surface portion,
Since the solder is hardened in that state, the bonding between the electrode of the circuit board and the terminal including the bonding portion is strengthened. Therefore,
The electronic component can be easily and reliably surface-mounted on the circuit board.
【０００９】また、本発明の回路基板の電極は、表面実
装用電子部品の端子の接合部が円柱状に形成され、該接
合部が半田付けされる回路基板の電極であって、該電極
の幅を前記接合部の幅と略同一の幅に形成したことを特
徴とする。Further, the electrode of the circuit board of the present invention is an electrode of a circuit board to which a joint of a terminal of a surface mounting electronic component is formed in a columnar shape and the joint is soldered. The width is formed to be substantially the same as the width of the joint.
【００１０】前記電子部品の端子の接合部が円柱状に形
成されているときは、該接合部と前記回路基板の電極と
の間隙に半田が入り込むため、前記電極を前記接合部の
幅よりも広くする必要がなく、前記電極の幅を前記接合
部の幅と略同一の幅に形成することができる。従って、
前記電極間の幅も狭くすることができるので、前記電子
部品の端子間の幅も前記電極に合わせて狭くすることが
でき、電子部品及び回路基板の小型化を図ることができ
る。When the joint of the terminal of the electronic component is formed in a columnar shape, the solder enters the gap between the joint and the electrode of the circuit board, so that the electrode is larger than the width of the joint. It is not necessary to increase the width, and the width of the electrode can be formed to be substantially the same as the width of the joint. Therefore,
Since the width between the electrodes can be reduced, the width between the terminals of the electronic component can also be reduced in accordance with the electrodes, and the electronic component and the circuit board can be reduced in size.
【００１１】[0011]
【発明の実施の形態】次に、本発明の表面実装用電子部
品及び回路基板の電極の実施形態の一例について、図１
乃至図７を参照して説明する。図１は本発明の第１の実
施形態のコネクタを示す説明図、図２は図１のコネクタ
の一部拡大断面図、図３は電子部品の端子の製造工程を
示す説明図、図４はコネクタと回路基板の電極との接合
状態を示す説明図、図５は図４のＶ−Ｖ線端面図、図６
は第２の実施形態のＩＣ及び電極を示す説明図、図７は
他の実施形態の電子部品の端子を示す説明図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of an electrode of a surface mounting electronic component and a circuit board according to the present invention will be described with reference to FIG.
This will be described with reference to FIGS. 1 is an explanatory diagram showing a connector according to a first embodiment of the present invention, FIG. 2 is a partially enlarged cross-sectional view of the connector of FIG. 1, FIG. 3 is an explanatory diagram showing a manufacturing process of a terminal of an electronic component, and FIG. FIG. 5 is an explanatory view showing a bonding state between a connector and an electrode of a circuit board. FIG. 5 is an end view taken along line VV of FIG.
Is an explanatory diagram showing ICs and electrodes according to the second embodiment, and FIG. 7 is an explanatory diagram showing terminals of an electronic component according to another embodiment.
【００１２】まず、第１の実施形態においては、電子部
品として回路基板に表面実装される表面実装用のコネク
タ１を例にして説明する。本実施形態におけるコネクタ
１は、図１及び図２に示すように、絶縁性の合成樹脂に
より形成されたケース２と、このケース２に複数並設さ
れて上下２段に嵌合された端子３とを備えている。端子
３の後方部分は、後述する回路基板７の電極８に半田付
けされる接合部４となっており、この接合部４は円柱状
に形成されている。また、接合部４にはその外周にリン
グ状の溝部（粗面部）５が設けられている。First, in the first embodiment, a description will be given of an example of a surface mounting connector 1 which is mounted on a circuit board as an electronic component. As shown in FIGS. 1 and 2, the connector 1 according to the present embodiment includes a case 2 formed of an insulating synthetic resin, and a plurality of terminals 3 arranged in parallel with the case 2 and fitted in two upper and lower stages. And The rear part of the terminal 3 is a joint 4 to be soldered to an electrode 8 of a circuit board 7 described later, and the joint 4 is formed in a columnar shape. Further, the joint 4 is provided with a ring-shaped groove (rough surface) 5 on the outer periphery thereof.
【００１３】本実施形態における端子３は、図３の上図
に示すように、まず、薄板状の金属板を図示しないプレ
ス金型により角柱状に打ち抜く。このとき、端子３は、
キャリア６により互いに連結されている。そして、この
状態から、図３の下図に示すように、図示しないプレス
金型によりプレス加工を行う。これにより、端子３の接
合部４を含む後方部分を円柱状に形成すると共に、接合
部４にリング状の溝部５を形成している。尚、このプレ
ス加工は、粗プレス、中間プレス及び仕上げプレスの３
段階に分けて行っている。As shown in the upper view of FIG. 3, the terminal 3 in the present embodiment is formed by first punching a thin metal plate into a prism shape by a press die (not shown). At this time, the terminal 3
They are connected to each other by a carrier 6. Then, from this state, as shown in the lower diagram of FIG. 3, press working is performed by a press die (not shown). Thus, the rear portion including the joint 4 of the terminal 3 is formed in a columnar shape, and the joint 4 has the ring-shaped groove 5 formed therein. In addition, this press work is a rough press, an intermediate press, and a finish press.
It is divided into stages.
【００１４】次に、端子３がキャリア６により連結され
た状態で、端子３の全体にニッケルメッキを施し、その
後端子３の全体に金メッキを施す。本実施形態における
端子３は、接合部４と電極８とが容易に接合されるた
め、半田メッキを行う工程が不要となると共に、半田カ
スを取り除く工程も不要となるので、製造工程を簡略化
することができる。また、端子３は、図３のように直線
の状態でケース２に嵌合され、図示しない曲げ加工装置
により図１及び図２に示すように曲げ加工がなされる。Next, in a state where the terminals 3 are connected by the carrier 6, the entire terminals 3 are plated with nickel, and thereafter the entire terminals 3 are plated with gold. In the terminal 3 according to the present embodiment, since the bonding portion 4 and the electrode 8 are easily bonded, the step of performing solder plating is not required, and the step of removing solder residue is not required. can do. The terminal 3 is fitted into the case 2 in a straight line as shown in FIG. 3, and is bent by a bending device (not shown) as shown in FIGS.
【００１５】上記工程により形成されたコネクタ１は、
図４及び図５に示すように、回路基板７の表面に設けら
れた電極８に半田付けされて表面実装される。本実施形
態においては、回路基板７上の電極８は、円柱状に形成
された接合部４の幅と略同一の幅に形成されている。本
実施形態のコネクタ１及び電極８によれば、図５に示す
ように、半田９は端子３の接合部４と電極８との間隙に
入り込んでいるので、接合部４と電極８とは強固に接合
されている。また、接合部４にはリング状の溝部５が設
けられているため、接合部４の表面積が増加する。これ
により、接合部４と半田９とが接触する面積が増加する
ので、接合部４と電極８との接合が強化される。さら
に、溶融した半田９が当該溝部５に流れ込んで接合部４
の全周にまわりやすくなり、その状態で半田９が硬化す
るので、接合部４と電極８とが確実に接合される。The connector 1 formed by the above steps is
As shown in FIGS. 4 and 5, it is soldered to electrodes 8 provided on the surface of the circuit board 7 and surface-mounted. In the present embodiment, the electrode 8 on the circuit board 7 is formed to have substantially the same width as the width of the joint 4 formed in a columnar shape. According to the connector 1 and the electrode 8 of the present embodiment, as shown in FIG. 5, since the solder 9 enters the gap between the joint 4 of the terminal 3 and the electrode 8, the joint 4 and the electrode 8 are firmly connected. Is joined to. Further, since the joint 4 is provided with the ring-shaped groove 5, the surface area of the joint 4 increases. As a result, the area of contact between the joint 4 and the solder 9 increases, so that the joint between the joint 4 and the electrode 8 is strengthened. Further, the molten solder 9 flows into the groove 5 and the joint 4
And the solder 9 is hardened in that state, so that the joint 4 and the electrode 8 are securely joined.
【００１６】また、通常表面実装用の電子部品を回路基
板７に接合する場合、塗布装置（図示せず）により定量
のクリーム半田を接合部４に塗布し、リフローを通して
加熱することにより接合部４と電極８とを半田付けして
いる。本実施形態のコネクタ１では接合部４に溝部５を
設けているので、クリーム半田が溶融した場合はこの溝
部５に流れ込む。従って、この溝部５を設けていない場
合に比べて半田の側方への張り出しが押さえられるた
め、硬化した状態の半田９の断面は、図５に示すように
内側に窪んだ状態となる。従って、確実に隣接する接合
部４との距離を保つことができるので、短絡等の不具合
が生じるおそれがない。また、半田９の張り出しによる
半田９の無駄が生じないので、効率の良い半田付けが可
能となる。In general, when electronic components for surface mounting are joined to the circuit board 7, a fixed amount of cream solder is applied to the joint 4 by a coating device (not shown), and the solder is heated through reflow. And the electrode 8 are soldered. In the connector 1 according to the present embodiment, the groove portion 5 is provided in the joint portion 4, so that when the cream solder is melted, it flows into the groove portion 5. Therefore, the protrusion of the solder to the side is suppressed as compared with the case where the groove 5 is not provided, so that the cross section of the solder 9 in a hardened state is depressed inward as shown in FIG. Therefore, the distance between the adjacent joints 4 can be reliably maintained, and there is no possibility that a problem such as a short circuit occurs. Also, since the solder 9 is not wasted due to the overhang of the solder 9, efficient soldering can be performed.
【００１７】また、接合部４を円柱状にすることによ
り、電極８の幅を狭くすることができるため、コネクタ
１において各端子３間の幅も従来のものに比べて狭くす
ることができる。このため、従来のコネクタ１よりも小
型のコネクタを製造することができ、狭い接合部４の幅
に対応した電極８を形成することにより、回路基板７も
小型化することができる。Further, since the width of the electrode 8 can be reduced by forming the joint portion 4 into a columnar shape, the width between the terminals 3 in the connector 1 can be reduced as compared with the conventional one. For this reason, a connector smaller than the conventional connector 1 can be manufactured, and the circuit board 7 can be downsized by forming the electrodes 8 corresponding to the narrow width of the joint 4.
【００１８】次に、本発明の第２の実施形態について説
明する。本実施形態では、電子部品としてＩＣ１０を例
にして説明する。本実施形態のＩＣ１０は、図６に示す
ように、本体の側方から突出する端子１１を備えてお
り、端子１１は回路基板７の電極８に半田付けされる接
合部４と、この接合部４から上方に起立する起立部１２
とを備えている。本実施形態においては、図６に示すよ
うに、回路基板７の小型化のために、電極８及びこの電
極８に半田付けされる接合部４が短く形成されている。
また、端子１１の外周には、接合部４から起立部１２に
かけて、螺旋状に連続する溝部（粗面部）１３が設けら
れている。尚、本実施形態においても、端子１１の接合
部４と溝部１３とを形成する工程とニッケルメッキ及び
金メッキを行う工程は、上記第１の実施形態と同様に行
われる。Next, a second embodiment of the present invention will be described. In the present embodiment, an IC 10 will be described as an example of an electronic component. As shown in FIG. 6, the IC 10 of the present embodiment includes a terminal 11 protruding from the side of the main body. The terminal 11 is connected to the joint 4 that is to be soldered to the electrode 8 of the circuit board 7. Standing part 12 standing upward from 4
And In the present embodiment, as shown in FIG. 6, in order to reduce the size of the circuit board 7, the electrode 8 and the joint 4 to be soldered to the electrode 8 are formed short.
On the outer periphery of the terminal 11, a groove portion (rough surface portion) 13 that is spirally continuous from the joint portion 4 to the upright portion 12 is provided. In this embodiment, the steps of forming the joint 4 and the groove 13 of the terminal 11 and performing the steps of nickel plating and gold plating are performed in the same manner as in the first embodiment.
【００１９】本実施形態における端子１１の接合部４を
回路基板７の電極８に半田付けすると、溶融した半田９
が接合部４と電極８との間隙に入り込むので、接合部４
と電極８とは強固に接合される。また、溶融した半田が
端子１１の接合部４及び起立部１２の外周に設けられた
螺旋状の溝部１３に沿って起立部１２を上方に向かって
流れ込んで硬化する。これにより、電極８は、端子１１
の接合部４のみならず起立部１２とも半田９により接合
されるので、電極８と端子１１とは強固に電極８に接合
される。When the joint 4 of the terminal 11 in this embodiment is soldered to the electrode 8 of the circuit board 7, the molten solder 9
Enters the gap between the joint 4 and the electrode 8, so that the joint 4
And the electrode 8 are firmly joined. Further, the molten solder flows upward through the upstanding portion 12 along the spiral groove 13 provided on the outer periphery of the joining portion 4 of the terminal 11 and the upstanding portion 12 and is hardened. Thereby, the electrode 8 is connected to the terminal 11
The electrode 8 and the terminal 11 are firmly joined to the electrode 8 because the solder 9 is joined not only to the joining portion 4 but also to the upright portion 12.
【００２０】尚、上記実施形態においては、接合部４の
断面形状が円形のものについて説明したが、これに限ら
ず接合部の断面形状を楕円形としてもよい。また、上記
実施形態では粗面部としてリング状の溝部５と螺旋状の
溝部１３について説明したが、これに限らず、図７
（ａ）に示すように、接合部４の外周に横方向に直線状
の溝部１４としてもよく、図７（ｂ）に示すように格子
状の溝部１５としてもよい。In the above-described embodiment, the joint 4 has a circular cross section. However, the present invention is not limited to this, and the cross section of the joint may be elliptical. In the above embodiment, the ring-shaped groove 5 and the spiral groove 13 have been described as the roughened surface. However, the present invention is not limited to this.
As shown in FIG. 7A, a groove 14 may be formed in the outer periphery of the joint 4 in a straight line in the lateral direction.
【図１】本発明の第１の実施形態のコネクタを示す説明
図。FIG. 1 is an explanatory view showing a connector according to a first embodiment of the present invention.
【図２】図１のコネクタの一部拡大断面図。FIG. 2 is a partially enlarged cross-sectional view of the connector of FIG.
【図３】電子部品の端子の製造工程を示す説明図。FIG. 3 is an explanatory view showing a manufacturing process of the terminal of the electronic component.
【図４】コネクタと回路基板の電極との接合状態を示す
説明図。FIG. 4 is an explanatory view showing a bonding state between a connector and an electrode of a circuit board.
【図５】図４のＶ−Ｖ線端面図。FIG. 5 is an end view taken along line VV of FIG. 4;
【図６】第２の実施形態のＩＣ及び電極を示す説明図。FIG. 6 is an explanatory view showing an IC and electrodes according to a second embodiment.
【図７】他の実施形態の電子部品の端子を示す説明図。FIG. 7 is an explanatory view showing terminals of an electronic component according to another embodiment.
【図８】従来の電子部品の端子を示す説明図。FIG. 8 is an explanatory view showing terminals of a conventional electronic component.
１…コネクタ（電子部品）、３…端子、４…接合部、７
…回路基板、８…電極、９…半田。DESCRIPTION OF SYMBOLS 1 ... Connector (electronic component), 3 ... Terminal, 4 ... Junction, 7
... circuit board, 8 ... electrodes, 9 ... solder.
Claims (3)
有する端子を備え、該接合部が円柱状に形成されている
ことを特徴とする表面実装用電子部品。An electronic component for surface mounting, comprising: a terminal having a joint to be soldered to an electrode of a circuit board, wherein the joint is formed in a columnar shape.
けられていることを特徴とする請求項１に記載の表面実
装用電子部品。2. The surface-mounted electronic component according to claim 1, wherein a rough surface portion is provided on an outer periphery of the terminal including the bonding portion.
状に形成され、該接合部が半田付けされる回路基板の電
極であって、 該電極の幅を前記接合部の幅と略同一の幅に形成したこ
とを特徴とする回路基板の電極。3. The electrode of a circuit board to which a joint of a terminal of a surface mounting electronic component is formed in a cylindrical shape, and the joint is soldered, wherein the width of the electrode is substantially equal to the width of the joint. An electrode of a circuit board, wherein the electrode has the same width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000136050A JP2001319715A (en) | 2000-05-09 | 2000-05-09 | Electronic parts for surface mounting and electrode of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000136050A JP2001319715A (en) | 2000-05-09 | 2000-05-09 | Electronic parts for surface mounting and electrode of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001319715A true JP2001319715A (en) | 2001-11-16 |
Family
ID=18644051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000136050A Pending JP2001319715A (en) | 2000-05-09 | 2000-05-09 | Electronic parts for surface mounting and electrode of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001319715A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005167156A (en) * | 2003-12-05 | 2005-06-23 | Tokyo Coil Engineering Kk | Surface-mounting coil component |
| JP2007080662A (en) * | 2005-09-14 | 2007-03-29 | Sumitomo Wiring Syst Ltd | Connector for circuit board |
| JP2019021443A (en) * | 2017-07-13 | 2019-02-07 | 株式会社オートネットワーク技術研究所 | Terminal and terminal-equipped board |
-
2000
- 2000-05-09 JP JP2000136050A patent/JP2001319715A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005167156A (en) * | 2003-12-05 | 2005-06-23 | Tokyo Coil Engineering Kk | Surface-mounting coil component |
| JP2007080662A (en) * | 2005-09-14 | 2007-03-29 | Sumitomo Wiring Syst Ltd | Connector for circuit board |
| JP4696802B2 (en) * | 2005-09-14 | 2011-06-08 | 住友電装株式会社 | Board connector |
| JP2019021443A (en) * | 2017-07-13 | 2019-02-07 | 株式会社オートネットワーク技術研究所 | Terminal and terminal-equipped board |
| CN110832705A (en) * | 2017-07-13 | 2020-02-21 | 株式会社自动网络技术研究所 | Terminal and substrate with terminal |
| US10965046B2 (en) | 2017-07-13 | 2021-03-30 | Autonetworks Technologies, Ltd. | Board with terminal |
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