JPH1022602A - Electronic component mounting board and manufacture - Google Patents

Electronic component mounting board and manufacture

Info

Publication number
JPH1022602A
JPH1022602A JP19401296A JP19401296A JPH1022602A JP H1022602 A JPH1022602 A JP H1022602A JP 19401296 A JP19401296 A JP 19401296A JP 19401296 A JP19401296 A JP 19401296A JP H1022602 A JPH1022602 A JP H1022602A
Authority
JP
Japan
Prior art keywords
electronic component
electrode
terminal
substrate
mounting board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19401296A
Other languages
Japanese (ja)
Inventor
Hirokazu Tanaka
宏和 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Priority to JP19401296A priority Critical patent/JPH1022602A/en
Publication of JPH1022602A publication Critical patent/JPH1022602A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To surely make possible mechanical and electrical connection only by forcible bonding force, by constituting the thickness and the form of a conducting pattern turning to electrodes in configuration suitable for caulking forcible bonding. SOLUTION: In the facing end portions of a conducting pattern 12 on a board 10, a pair of electrode parts 14 higher than the end portions are protrusively formed. A chip component 16 which is packaged or molded in a rectangular parallelopide is arranged between the electrode parts 14. On both end surfaces in the longitudinal direction of the chip component 16, terminals 18 connected with both of the electrodes parts 14 are protruded from the same surface. While a chip mounter 20 is fixed, stamping jigs 22 arranged around the chip mounter 20 are pressed against the upper surface of the electrode parts 14. Thereby the electrode parts 14 are flexibly deformed in a flat type. As a result, superfouous thickness moving the terminal 18 side make the gap margin between the chip component 16 and the electrode parts 14 zero, permeates into the gap between 3 step part 22a inside the stamping jigs 22 and the chip component 16, and is forcibly bonded to the outside surfaces of the terminals 18. Thereby connection is surely possible.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】この発明は、半田接合するこ
となしにチップ部品などの電子部品を基板上に接続する
ための構造および方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure and a method for connecting an electronic component such as a chip component on a substrate without soldering.

【０００２】[0002]

【従来の技術】一般に、リード線を持った電子部品の基
板への実装方法としては、これらを基板に装着後、溶融
半田槽に通ずることで、基板裏面側に突出するリード線
を、半田パターンに沿って接続するものが知られてい
る。2. Description of the Related Art Generally, as a method for mounting electronic parts having lead wires on a board, these are mounted on the board and then passed through a molten solder bath so that the lead wires projecting to the back side of the board are soldered. Are known along the way.

【０００３】これに対し、半導体チップなどの小形チッ
プ部品の端子や、基板上面にのみ接続するための変形端
子を備えた小形電子部品では、半田ペーストを基板上に
塗布し、該当する電子部品をマウンターなどを用いて基
板上に設置固定後、リフロー炉を通すことで加熱して、
半田を溶融させて基板上の電極に接合する方法が採られ
ている。On the other hand, in the case of terminals of small chip components such as semiconductor chips and small electronic components having deformed terminals for connecting only to the upper surface of the substrate, solder paste is applied on the substrate and the corresponding electronic components are applied. After mounting and fixing it on the substrate using a mounter etc., heat it by passing it through a reflow furnace,
A method has been adopted in which solder is melted and joined to an electrode on a substrate.

【０００４】しかしながら、以上の方法では、リフロー
炉に通ずることで基板上に実装される他の素子にも熱負
荷がかかることになり、信頼性を損う原因となってい
た。[0004] However, in the above-described method, a thermal load is applied to other elements mounted on the substrate by passing through the reflow furnace, which causes a loss of reliability.

【０００５】なお、この種の熱負荷をかけない実装構造
として、コネクタなどによる機械的接続手段がある。し
かし、極く小さな部品をこの種の実装構造とすること
は、コスト的、あるいは大きさなどの制約によって非現
実的である。As a mounting structure which does not apply a thermal load, there is a mechanical connection means such as a connector. However, it is impractical to make a very small component into this type of mounting structure due to cost or size restrictions.

【０００６】また、これに対し、圧着端子などと同様、
圧入、あるいは圧着方法による実装も考えられないわけ
ではないが、リード線接続とは異なり、この種の小形電
子部品では、ギャップ精度などによる制約や、圧入時の
加圧力による変形応力や歪みにより素子が損傷するおそ
れなどがあり、大きな加圧力をかけられず、しかも加圧
力が小さい場合には接続の信頼性が低いなどの理由で、
採用されていないか、あるいはこの種の小形電子部品の
実装構造としては一般には考えられてはいなかった。On the other hand, like a crimp terminal,
Although it is not inconceivable that press-fitting or mounting by crimping method is not conceivable, unlike lead wire connection, this type of small electronic component is limited by gap accuracy and other factors, and deformation stress and strain due to pressurizing force during press-fitting. May be damaged, and if a large pressing force cannot be applied, and if the pressing force is small, the reliability of the connection is low,
It has not been adopted or has not been generally considered as a mounting structure for such a small electronic component.

【０００７】[0007]

【発明が解決しようとする課題】そこで、この発明は、
電極となる導電パターンの厚みや形状をかしめ圧着に好
適な形態に形成しておくことで、ギャップ精度に影響さ
れることなく、また素子自体に直接的な大きな加圧力が
加わることがなく、圧着力のみにより機械的、電気的接
続を確実に行えるようにした電子部品実装基板およびそ
の製造方法を提供するものである。SUMMARY OF THE INVENTION Therefore, the present invention
By caulking the thickness and shape of the conductive pattern that will become the electrode and forming it in a form suitable for crimping, it is not affected by the gap accuracy and without applying a large pressing force directly to the element itself, It is an object of the present invention to provide an electronic component mounting board capable of reliably performing mechanical and electrical connection only by force and a method of manufacturing the same.

【０００８】[0008]

【課題を解決するための手段】前記目的を達成するた
め、この発明のうち、請求項１に記載の発明による電子
部品実装基板は、両端に端子を有する電子部品が基板に
搭載され、かつ基板面から突出し、前記電子部品の端子
に加圧接触させた電極を有することを特徴とするもので
ある。According to one aspect of the present invention, there is provided an electronic component mounting board according to the present invention, wherein an electronic component having terminals at both ends is mounted on the board. An electrode protruding from a surface and having a pressure contact with a terminal of the electronic component is provided.

【０００９】この発明で言う、「電子部品」とは、半導
体素子などのチップ部品、あるいは、他の電子部品であ
って、リード線やリード端子、ラグ端子などを持たず
に、両側に端子部を突設しただけの形状の小形電子部品
を広く総称するものである。The term "electronic component" as used in the present invention refers to a chip component such as a semiconductor element or another electronic component, having no terminal wire, lead terminal, lug terminal, etc., and having terminal portions on both sides. Are generally generically referred to as small electronic components having a shape merely projecting.

【００１０】この発明で言う「基板面から突出し、〜電
極」とは、基板にエッチングなどにより形成される導電
パターンのうち、前記端子部に接続する電極部を基板か
ら突出させた状態に予め形成したもを指すもので、導電
パターンとしては、一般に可撓性の高い銅が用いられ
る。In the present invention, the term "protruding from the substrate surface to an electrode" means that, of the conductive patterns formed on the substrate by etching or the like, an electrode portion connected to the terminal portion is formed in advance in a state of protruding from the substrate. Generally, highly flexible copper is used as the conductive pattern.

【００１１】それゆえ、この請求項１に記載の発明で
は、この銅素材からなる電極が端子に加圧接触すること
によって、電極自体が可撓変形し、端子に対し機械的、
電気的な接続を得られることになる。Therefore, according to the first aspect of the present invention, when the electrode made of the copper material comes into pressure contact with the terminal, the electrode itself is flexibly deformed, and the electrode itself is mechanically and mechanically deformed.
You will get an electrical connection.

【００１２】この発明のうち、請求項２に記載の発明で
は、前記請求項１に記載の発明における前記基板の電極
が、電子部品の端子と接触する高い段を有することを特
徴とするものである。According to a second aspect of the present invention, in the first aspect of the present invention, the electrode of the substrate has a high step in contact with a terminal of an electronic component. is there.

【００１３】それゆえ、この請求項２に記載の発明で
は、電極が端子周囲を包持するようにして接続されるた
め、より確実な機械的、電気的接続状態を得られる。According to the second aspect of the present invention, since the electrodes are connected so as to surround the terminals, a more reliable mechanical and electrical connection state can be obtained.

【００１４】この発明のうち、請求項３に記載の発明で
は、前記請求項１に記載の発明において、前記電子部品
の端子の前記基板側電極との接触面が傾斜しており、基
板に接触している前記電子部品の底面が電子部品の底面
より大きい台形状であることを特徴とするものである。According to a third aspect of the present invention, in the first aspect of the present invention, a contact surface of the terminal of the electronic component with the substrate-side electrode is inclined, and the terminal of the electronic component contacts the substrate. The bottom surface of the electronic component has a trapezoidal shape larger than the bottom surface of the electronic component.

【００１５】それゆえ、この請求項３に記載の発明で
は、電子部品の抜出方向に対し逆テーパとなるため、機
械的な抵抗力が増し、さらに強固な機械的接続を得られ
ることになる。Therefore, according to the third aspect of the present invention, since the taper is reversely tapered in the direction in which the electronic component is pulled out, the mechanical resistance is increased, and a stronger mechanical connection can be obtained. .

【００１６】この発明のうち、請求項４に記載の発明で
は、前記請求項１に記載の発明において、前記電子部品
の端子の前記電極と接触する面に凹部または凸部を有す
ることを特徴とするものである。According to a fourth aspect of the present invention, in the first aspect of the present invention, the terminal of the electronic component has a concave portion or a convex portion on a surface in contact with the electrode. Is what you do.

【００１７】それゆえ、この請求項４に記載の発明で
は、その凹部または凸部に電極が食込むことによるアン
カー効果により、抜出方向に対して機械的な抵抗力が増
し、さらに強固な機械的接続を得ることが出来る。Therefore, in the invention according to the fourth aspect, the anchoring effect due to the electrode biting into the concave portion or the convex portion increases the mechanical resistance in the pull-out direction, and further enhances the mechanical strength. Connection can be obtained.

【００１８】この発明のうち、請求項５に記載の発明で
は、前記請求項１に記載の発明において、前記電極頂面
には上下を縦通する穴があいていることを特徴とするも
のである。According to a fifth aspect of the present invention, in the first aspect of the present invention, the electrode has a hole vertically passing through the top and bottom of the electrode top surface. is there.

【００１９】中実な電極素材を可撓変形させる場合に比
べ中空の電極素材の場合には可撓変形面積が小さく、よ
り小さな力で大きな変形量を得られる。それゆえ、この
請求項５に記載の発明ではそれだけ電子部品側に加わる
変形応力が少なくなる。In the case of a hollow electrode material, the area of flexible deformation is smaller than when a solid electrode material is flexibly deformed, and a large amount of deformation can be obtained with a smaller force. Therefore, according to the fifth aspect of the invention, the deformation stress applied to the electronic component side is reduced accordingly.

【００２０】この発明のうち、請求項６に記載の発明
は、前記請求項５に記載の発明において、前記基板の電
極が、電子部品の端子と接触する高い段を有することを
特徴とするものである。According to a sixth aspect of the present invention, in the fifth aspect of the present invention, the electrode of the substrate has a high step for contacting a terminal of an electronic component. It is.

【００２１】それゆえ、この請求項６に記載の発明で
は、請求項５に記載発明の効果に加えて、請求項２に記
載の発明の効果を得られる。Therefore, according to the invention of claim 6, in addition to the effect of the invention of claim 5, the effect of the invention of claim 2 can be obtained.

【００２２】この発明のうち、請求項７に記載の発明
は、請求項５に記載の発明において、前記電子部品の端
子における前記基板側電極との接触面は傾斜しており、
基板に接触している前記電子部品の底面が電子部品の底
面より大きいことを特徴とするものである。According to a seventh aspect of the present invention, in the invention according to the fifth aspect, a contact surface of the terminal of the electronic component with the substrate-side electrode is inclined,
The bottom surface of the electronic component in contact with the substrate is larger than the bottom surface of the electronic component.

【００２３】それゆえ、この請求項７に記載の発明で
は、請求項５に記載の発明の効果に加えて、請求項３に
記載の発明の効果を得られる。Therefore, according to the seventh aspect of the invention, the effect of the third aspect of the invention can be obtained in addition to the effect of the fifth aspect of the invention.

【００２４】この発明のうち、請求項８に記載の発明
は、請求項５に記載の発明において、前記電子部品の端
子の前記電極と接触する面に凹部または凸部を有するこ
とを特徴とするものである。According to an eighth aspect of the present invention, in the fifth aspect of the present invention, the terminal of the electronic component has a concave portion or a convex portion on a surface in contact with the electrode. Things.

【００２５】それゆえ、この請求項８に記載の発明で
は、前期請求項５に記載の発明の効果に加えて請求項４
に記載の発明の効果を得ることが出来る。Therefore, according to the invention described in claim 8, in addition to the effect of the invention described in claim 5, a fourth aspect of the present invention is provided.
The effects of the invention described in (1) can be obtained.

【００２６】この発明のうち、請求項９に記載の電子部
品の実装方法にあっては、基板面から突出した電極を少
なくとも２つ有する基板に、両端に端子を有する電子部
品を前記基板の電極間に搭載し、前記電極を前記端子に
対して変形させて押付けることにより、機械的、電気的
接合を行うことを特徴とするものである。According to the present invention, in the electronic component mounting method according to the ninth aspect, an electronic component having terminals at both ends is provided on a substrate having at least two electrodes protruding from the substrate surface. It is characterized in that mechanical and electrical bonding is performed by being mounted in between and deforming and pressing the electrode against the terminal.

【００２７】したがって、この請求項９に記載の発明方
法では、設置と、圧着の二つの工程により電子部品の実
装が終了するため、実装作業が極めて簡単で、半田ペー
ストなどの融着手段、加熱手段を必要とせず、材料費が
かからず、作業時間の短縮を図ることが出来、熱による
影響がないなどの特徴がある。Therefore, in the method according to the ninth aspect of the present invention, the mounting of the electronic component is completed by the two steps of installation and crimping, so that the mounting operation is extremely simple, and a fusion means such as a solder paste, heating, and the like. It does not require any means, does not require material costs, can shorten the working time, and has the characteristics of being free from heat.

【００２８】この発明方法のうち、請求項１０に記載の
発明は、前記請求項９に記載の発明において、前記電極
は、前記電子部品の端子と接触する側に高い段を有する
電極であって、前記電極の高い段を前記端子側へ押付け
ることにより機械的、電気的接合を行うことを特徴とす
るものである。According to a tenth aspect of the present invention, in the ninth aspect, the electrode is an electrode having a high step on a side in contact with a terminal of the electronic component. And mechanically and electrically joining by pressing a high step of the electrode toward the terminal.

【００２９】それゆえ、この請求項１０に記載の発明方
法では、請求項９に記載発明の効果に加えて、圧着作業
後は、電極変形面が端子周囲を包持する形態となるた
め、機械的、電気的な接続を確実に出来る。Therefore, in the method according to the tenth aspect of the present invention, in addition to the effect of the ninth aspect of the present invention, after the crimping operation, the deformed surface of the electrode has a form that surrounds the periphery of the terminal. And electrical connection can be ensured.

【００３０】この発明方法のうち、請求項１１に記載の
発明にあっては、請求項９に記載の発明において、電子
部品と接触する側に近い面にテーパを有する押しつけ部
によって押付けることを特徴とするものである。According to the eleventh aspect of the present invention, in the ninth aspect, it is preferable that the pressing is performed by a pressing portion having a taper on a surface near a side in contact with the electronic component. It is a feature.

【００３１】それゆえ、この請求項１１に記載の発明方
法は、請求項９に記載発明の効果に加え、圧着作業後
は、電子部品の端子部側にのみ圧着力を加えることが出
来るため、機械的接続強度をさらに増すことが出来る。Therefore, the method according to the eleventh aspect has the effect of the ninth aspect, and furthermore, after the crimping operation, the crimping force can be applied only to the terminal portion side of the electronic component. The mechanical connection strength can be further increased.

【００３２】この発明方法のうち請求項１２に記載の発
明では、請求項９に記載の発明において、前記電極の高
さは電子部品の端子よりも高く、前記電極を押付けるこ
とにより電子部品の上面の少なくとも一部を覆うことを
特徴とするものである。According to a twelfth aspect of the present invention, in the ninth aspect, the height of the electrode is higher than that of the terminal of the electronic component. It is characterized by covering at least a part of the upper surface.

【００３３】それゆえ、この請求項１２に記載の発明で
は、請求項９に記載の発明の効果に加え、圧着作業後
は、電極の上部変形端の余肉が端子の上部にオーバハン
グ状態に覆い被さるため、機械的接続強度をさらに増す
ことが出来る。Therefore, according to the twelfth aspect of the present invention, in addition to the effects of the ninth aspect, after the crimping operation, the excess thickness of the upper deformed end of the electrode covers the terminal in an overhang state. Therefore, the mechanical connection strength can be further increased.

【００３４】この発明方法のうち、請求項１３に記載の
発明は、前記請求項９に記載の発明において、前記電極
の頂面には上下を縦通する穴があいており、電子部品を
基板にマウントした後、前記穴周囲の頂面周囲を拡幅さ
せて電極を端子に押付けることを特徴とするものであ
る。According to a thirteenth aspect of the present invention, in the thirteenth aspect of the present invention, the top surface of the electrode is provided with a vertically extending hole on the top surface, and the electronic component is mounted on the substrate. Then, the electrode is pressed against the terminal by widening the periphery of the top surface around the hole.

【００３５】それゆえ、この請求項１３に記載の発明で
は、前記請求項９に記載発明の効果に加えて、圧着力が
小さくてもより大きな変形量を得ることで出来、確実な
機械的、電気的接続を得ることが出来る。Therefore, according to the thirteenth aspect of the present invention, in addition to the effect of the ninth aspect of the present invention, it is possible to obtain a larger amount of deformation even if the pressing force is small, so that reliable mechanical and An electrical connection can be obtained.

【００３６】この発明方法のうち、請求項１５に記載の
発明方法は、前記請求項１３に記載の発明において、前
記電極の高さは電子部品の端子よりも高く、前記穴周囲
を拡幅することで電極の変形部分が電子部品の上面の少
なくとも一部を覆うことを特徴とするものである。In the method of the present invention, the height of the electrode is higher than that of the terminal of the electronic component and the area around the hole is widened. Wherein the deformed portion of the electrode covers at least a part of the upper surface of the electronic component.

【００３７】それゆえ、この請求項１５に記載の発明で
は、請求項１３に記載の発明の効果に加え、電極の上部
変形端の余肉が端子の上部にオーバハング状態に覆い被
さるため、機械的接続強度をさらに増すことが出来る。According to the fifteenth aspect of the present invention, in addition to the effect of the thirteenth aspect, since the excess thickness of the upper deformed end of the electrode covers the upper part of the terminal in an overhang state, mechanical The connection strength can be further increased.

【００３８】この発明の方法のうち、請求項１６に記載
の発明は、前記請求項１３に記載の発明において、電子
部品を保持する設置治具と、設置治具の両端に設けられ
た位置決めおよび固定兼用の突起とを備え、前記突起を
前記電極の穴に向けて下降させて電子部品を両電極間に
位置決めし、次いで設置治具を下降させて電子部品のみ
を両電極間の基板上に設置固定し、しかる後前記両端突
起を前記穴内に挿通し、電極の頂面における穴周囲を拡
幅させることを特徴とするものである。According to a sixteenth aspect of the present invention, in the thirteenth aspect, in the thirteenth aspect, an installation jig for holding an electronic component and positioning and jigs provided at both ends of the installation jig are provided. A projection for both fixing and fixing, the projection is lowered toward the hole of the electrode to position the electronic component between the two electrodes, and then the installation jig is lowered to place only the electronic component on the substrate between the two electrodes. It is characterized in that it is installed and fixed, and then the two-sided projections are inserted into the holes to widen the periphery of the holes on the top surface of the electrode.

【００３９】この請求項１６に記載の発明方法は、請求
項１３に記載の発明方法のより具体的な態様について述
べており、突起によって電子部品を電極間の正しい位置
に位置決めし、次いで基板に固定後は、同突起により穴
をその状態に保持しつつ周囲を圧着することで拡幅し、
位置精度を十分に保った上で、二段階作業によりワンタ
ッチで電子部品を基板上に位置決め接続できる。This invention method according to claim 16 describes a more specific embodiment of the invention method according to claim 13, wherein the electronic component is positioned at the correct position between the electrodes by the projections, and then the substrate is mounted on the substrate. After fixing, the width is increased by crimping the periphery while holding the hole in that state with the same projection,
With sufficient positional accuracy, the electronic components can be positioned and connected on the board with one touch by two-step work.

【００４０】[0040]

【発明の実施の形態】以下、本発明の好ましい実施の形
態について添付図面を参照して詳細に説明する。図１は
この発明によるチップ部品の実装構造を示す分解斜視
図、図２（ａ）〜（ｄ）は同実装構造による実装方法の
第一の実施形態を示す断面図である。Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an exploded perspective view showing a mounting structure of a chip component according to the present invention, and FIGS. 2A to 2D are cross-sectional views showing a first embodiment of a mounting method using the mounting structure.

【００４１】図において、１０は基板、１２は基板１０
上に、フォトエッチング法、メッキ、蒸着などによって
形成された銅などの可撓性があり、しかも導電性の高い
金属素材からなる一対の導電パターンであり、導電パタ
ーン１２の対向する端部には、これより一段高い電極部
１４がそれぞれ一体に突出形成されている。In the figure, 10 is a substrate, 12 is a substrate 10
On the upper side, there is a pair of conductive patterns made of a metal material having high flexibility such as copper formed by a photo etching method, plating, vapor deposition, and the like. The electrode portions 14 which are one step higher than this are integrally formed to protrude.

【００４２】電極部１４を一段高く形成する方法として
は、エッチング法の場合には、電極部分をマスキングし
ておき、他の部分を薄くなるようにエッチングする、メ
ッキ法においては、ある程度の厚みまでメッキした後
に、導電パターンをマスキングし、電極部分のみを盛上
げる方法、蒸着法においてもメッキ方法と同様の手法と
することで電極部１４を突出して形成できる。As a method of forming the electrode portion 14 one step higher, in the case of the etching method, the electrode portion is masked, and the other portion is etched so as to be thin. After plating, the conductive portion is masked, and only the electrode portion is raised, and the electrode portion 14 can be formed to protrude by using the same method as the plating method in the vapor deposition method.

【００４３】この電極部１４の間において、基板１０上
には、直方体形状にパッケージ乃至成形されたチップ部
品１６が設置される。A chip component 16 packaged or formed into a rectangular parallelepiped is placed on the substrate 10 between the electrode portions 14.

【００４４】このチップ部品１６の長手方向両端面には
両電極部１４に接続される端子１８が同一面上に突設さ
れている。Terminals 18 connected to the two electrode portions 14 are provided on the same surface on both end surfaces in the longitudinal direction of the chip component 16.

【００４５】なお、図においては、両電極部１４の間隔
がチップ部品１６の長さと等しく描かれているが、実際
には僅かな隙間を開けて配置される。また、両電極部１
４の厚み（高さ）は少なくともチップ部品１６の厚みの
１／２以上に設定されることが好ましい。Although the space between the two electrode portions 14 is illustrated as being equal to the length of the chip component 16 in the drawing, they are actually arranged with a slight gap therebetween. Also, both electrode portions 1
It is preferable that the thickness (height) of 4 is set to at least １ ／ or more of the thickness of the chip component 16.

【００４６】以上の構成における実装方法は、図２
（ａ）に示すように、チップマウンター２０により、チ
ップ部品１６を両電極部１４間の直上におき、次いで
（ｂ）に示すように、これを下降させて両電極部１４間
に設置し、この状態でチップマウンター２０を固定した
まま、（ｃ）に示すように、チップマウンター２０の周
囲に配置されたスタンピング治具２２を電極部１４の上
面に押付ける。The mounting method in the above configuration is shown in FIG.
As shown in (a), the chip component 16 is placed directly above the two electrode portions 14 by the chip mounter 20 and then lowered and placed between the two electrode portions 14 as shown in (b). In this state, while the chip mounter 20 is fixed, the stamping jig 22 arranged around the chip mounter 20 is pressed against the upper surface of the electrode section 14 as shown in FIG.

【００４７】これによって、電極部１４は、扁平状に可
撓変形し、その結果、余肉が図の水平矢印の左右方向に
流動する。端子１８側に移動する余肉は、チップ部品１
６と電極部１４との隙間しろを０とし、スタンピング治
具２２の内側の段部２２ａとチップ部品１６の隙間に入
り込み、端子１８の外側面に圧着する。As a result, the electrode portion 14 is flexibly deformed into a flat shape, and as a result, excess thickness flows in the horizontal direction of the horizontal arrow in the figure. The excess that moves to the terminal 18 side is the chip component 1
The gap between the electrode 6 and the electrode portion 14 is set to 0, the gap enters the gap between the step portion 22 a inside the stamping jig 22 and the chip component 16, and is crimped to the outer surface of the terminal 18.

【００４８】（ｄ）は圧着作業後の形態を示しており、
流動した余肉１４ｂは、端子１８の外側面上部に圧着し
ており、この圧着効果により、電気的な接続を得られる
と同時に強固な機械強度によりチップ部品１８を狭持固
定することになる。(D) shows the form after the crimping operation.
The flowing excess space 14b is pressed against the upper portion of the outer surface of the terminal 18, and by this pressing effect, electrical connection can be obtained, and at the same time, the chip component 18 is held and fixed with strong mechanical strength.

【００４９】なお、端子１４の材質も前記電極部１４の
材質と同様、銅などの可撓性のある素材によって構成さ
れており、圧着による押圧力による歪みや応力はこの部
分で吸収され、パッケージ内部まで伝播されることない
ので、チップ部品を構成する素子を安全に保護すること
が出来る。The material of the terminal 14 is also made of a flexible material such as copper, similarly to the material of the electrode portion 14, and the distortion and stress due to the pressing force due to the pressure bonding are absorbed in this portion, and the package is formed. Since it is not propagated to the inside, the elements constituting the chip component can be protected safely.

【００５０】図３（ａ），（ｂ）は、この発明による実
装方法の第二実施形態を示している。なお、前記第一実
施形態と同一部分には同一符号を付し、異なる部分にの
み異なる符号を用いて説明する。FIGS. 3A and 3B show a second embodiment of the mounting method according to the present invention. The same portions as those in the first embodiment are denoted by the same reference numerals, and only different portions will be described using different reference numerals.

【００５１】図において、スタンピング治具３０の底面
外側には、導電部１２を押付ける押付け部３０ａを形成
し、その内側には電極部１４の上面全体を押付ける段部
３０ｂを形成している。In the drawing, a pressing portion 30a for pressing the conductive portion 12 is formed outside the bottom surface of the stamping jig 30, and a step portion 30b for pressing the entire upper surface of the electrode portion 14 is formed inside the pressing portion 30a. .

【００５２】そして、前記と同様な手順によりチップ部
品１６を電極部１４間に設置し、スタンピング治具３０
を押付けると、（ａ）に示すように、電極部１４の可撓
変形による余肉の流動方向は、矢印に示すように端子１
８側のみに向い、その結果端子１８と段部３０ｂの内側
の隙間を伝って余肉が流動し、（ｂ）に示すように、端
子１８の外側面上部に余肉１４ａが付着圧接することに
なる。Then, the chip component 16 is placed between the electrode portions 14 in the same procedure as described above, and the stamping jig 30
Is pressed, as shown in (a), the flow direction of the excess thickness due to the flexible deformation of the electrode portion 14 is changed to the terminal 1 as shown by the arrow.
8, and as a result, the excess material flows along the gap between the terminal 18 and the inside of the step portion 30 b, and as shown in FIG. become.

【００５３】図４（ａ），（ｂ）は、第二実施形態の変
形例を示している。図において、スタンピング治具４０
の底部には内側上部に向けて傾斜する円弧面４０ａが形
成されている。従って、このスタンピング治具４０を押
付けると、（ａ）に示すように、電極部１４の可撓変形
による余肉の流動方向は、矢印に示すように端子１８側
のみに向い、その結果端子１８と円弧面４０ａの内側の
隙間を伝って余肉が流動し、（ｂ）に示すように、端子
１８の外側面上部に円弧面４０ａの傾斜に沿った形状の
余肉１４ａが付着することになる。FIGS. 4A and 4B show a modification of the second embodiment. In the figure, the stamping jig 40
An arc surface 40a that is inclined toward the inner upper side is formed at the bottom of. Therefore, when the stamping jig 40 is pressed, as shown in (a), the flow direction of the excess thickness due to the flexible deformation of the electrode portion 14 is directed only to the terminal 18 side as shown by the arrow, and as a result, the terminal The excess flows along the gap between the inner surface of the terminal 18 and the arc surface 40a, and as shown in FIG. 3B, the excess material 14a having a shape along the slope of the arc surface 40a adheres to the upper portion of the outer surface of the terminal 18, as shown in FIG. become.

【００５４】図５（ａ），（ｂ）は、実装方法の第三実
施形態を示している。この実施形態では電極部５０の厚
みは、チップ部品１６の厚みより厚く設定されている。
従って、（ａ）に示すようにチップ部品１６を位置決め
設置し、図３と同様なスタンピング治具３０で電極部５
０を押付けると、内側の余肉５０ａは端子１８の上面に
まで流動してこれの周囲にオーバハング状に覆い被さ
り、上部周縁をかしめつけた状態で電気的接続ととも
に、機械的接続を強固に行い、抜け方向に対して大きな
抵抗を与えることになり、さらに機械的接続強度を向上
することになる。FIGS. 5A and 5B show a third embodiment of the mounting method. In this embodiment, the thickness of the electrode portion 50 is set to be larger than the thickness of the chip component 16.
Therefore, as shown in FIG. 3A, the chip component 16 is positioned and installed, and the stamping jig 30 similar to FIG.
When 0 is pressed, the inner surplus 50a flows up to the upper surface of the terminal 18 and covers the periphery of the terminal 18 in an overhanging manner. With the upper periphery crimped, the electric connection and the mechanical connection are firmly performed. As a result, a large resistance is given in the pull-out direction, and the mechanical connection strength is further improved.

【００５５】図６（ａ），（ｂ）は、以上の各実装方法
において、実装時の接続強化を図るためのチップ部品の
形状変更例を示している。まず、（ａ）におけるチップ
部品６０は断面台形状であって、これの両側面に平行し
て端子６２が一体化され、台形の底部を１０上に設置し
ている。FIGS. 6 (a) and 6 (b) show examples of changing the shape of a chip component in order to strengthen the connection during mounting in each of the above mounting methods. First, the chip component 60 in (a) has a trapezoidal cross section, and the terminals 62 are integrated in parallel with both side surfaces of the chip component 60, and the trapezoidal bottom is set on 10.

【００５６】従って、以上の形状のチップ部品６０を第
二実施形態と同様な実装方法によりその電極部１４を端
子に押付けると、電極部１４の余肉１４ａは、端子６２
と電極部１４の内側との間に形成されたくさび状の隙間
部分に流動し、この隙間を埋めることになり、実装完了
後は、図示のごとくチップ部品６０の上方への引抜きに
対して大きな抵抗力を与え、さらに機械的接続強度を増
すことになる。Accordingly, when the electrode part 14 is pressed against the terminal by the same mounting method as that of the second embodiment, the excess part 14a of the electrode part 14
Flows into a wedge-shaped gap formed between the chip part 60 and the inside of the electrode part 14, and fills this gap. After the mounting is completed, the chip part 60 is largely prevented from being pulled out upward as shown in the figure. It provides resistance and further increases the mechanical connection strength.

【００５７】次に（ｂ）はチップ部品１６の両側端子６
４の外側に突起部６６を突出形成した例を示している。
この場合にあっては、図示しないが、前記各実装方法の
実施により、余肉は突起部６６に食込んだ状態で流動
し、これと一体化されるため、アンカー効果による機械
的接続強度の増強とともに、凹凸による接触面積の増加
によって、電気的接続もさらに確実となる。なお、この
例では突起部としたが、凹部でも良いことは勿論であ
る。Next, (b) shows both terminals 6 of the chip component 16.
4 shows an example in which a projection 66 is formed so as to protrude from the outside of FIG.
In this case, although not shown, by the implementation of each of the above mounting methods, the excess thickness flows while being bitten into the protrusions 66 and is integrated therewith, so that the mechanical connection strength due to the anchor effect is reduced. The electrical connection is further ensured by the increase in the contact area due to the unevenness together with the reinforcement. In this example, the protrusion is used, but it is needless to say that a recess may be used.

【００５８】図７はこの発明によるチップ部品の実装構
造の他の例を示す分解斜視図、図８は同実装構造におけ
る実装方法を示す断面説明図である。なお、図におい
て、前記各実施形態と同一箇所には同一符号を付し、異
なる部分あるいは新たに付加された部分にのみ新たな符
号を設けて説明する。FIG. 7 is an exploded perspective view showing another example of a mounting structure of a chip component according to the present invention, and FIG. 8 is an explanatory sectional view showing a mounting method in the mounting structure. In the drawings, the same parts as those in the above embodiments are denoted by the same reference numerals, and only different parts or newly added parts are provided with new reference numerals.

【００５９】図において、各電極部７０の厚みは、チッ
プ部品１６の厚みより厚く形成されているとともに、そ
の頂面にはチップ部品１６の位置決めと、圧着ガイドを
兼用した穴７２が開口形成され、基板１０の上面まで到
達している。In the figure, the thickness of each electrode portion 70 is formed larger than the thickness of the chip component 16, and a hole 72 is formed on the top surface thereof for positioning the chip component 16 and also serving as a crimping guide. , The upper surface of the substrate 10.

【００６０】この各穴７２には、前記チップマウンタ２
０を中央に挿通した断面略逆凹字形のガイド金具兼用ス
タンピング治具７４の下端に一体化された一対のテーパ
状の位置決め突起７６が一体に突設されている。Each of the holes 72 is provided with the chip mounter 2.
A pair of tapered positioning projections 76 are integrally formed at the lower end of a guide metal stamping jig 74 having a substantially inverted concave cross-section with 0 inserted in the center.

【００６１】以上の構成における実装作業手順は、まず
（ａ）に示すように、チップマウンタ２０によりチップ
部品１６を電極部７０間の上部に配置する。このとき、
チップ部品１６の位置が正確に電極部７０間の上部に位
置していない状態では、突起７６は、穴７２のずれた位
置に位置するが、そのままの状態でさらに下降させる
と、（ｂ）に示すように、突起７６はテーパ形状に沿っ
て穴７２に差込まれることによりチップ部品１６は、正
確な位置に矯正される。In the mounting operation procedure in the above configuration, first, as shown in FIG. 7A, the chip component 16 is arranged above the electrode portions 70 by the chip mounter 20. At this time,
In a state where the position of the chip component 16 is not accurately located at the upper portion between the electrode portions 70, the projection 76 is located at a position where the hole 72 is displaced. As shown, the projection 76 is inserted into the hole 72 along the tapered shape, so that the chip component 16 is corrected to an accurate position.

【００６２】その後、（ｃ）に示すように、チップマウ
ンタ２０のみを下降させれば、チップ部品１６は、電極
部７０間の基板上に位置決め固定される。Thereafter, as shown in (c), if only the chip mounter 20 is lowered, the chip component 16 is positioned and fixed on the substrate between the electrode portions 70.

【００６３】その後、固定状態を保持したまま、スタン
ピング治具７４を下降させ、電極の上面に加圧力を加え
れば、電極部７０は（ｄ）に示すように、平坦状に可撓
変形し、これによって流動した余肉７０ａがチップ部品
１６の上部周縁にオーバハング状に移動し、周囲をかし
めつけたような状態で、一体化される。Thereafter, while keeping the fixed state, the stamping jig 74 is lowered and a pressing force is applied to the upper surface of the electrode, whereby the electrode portion 70 is flexibly deformed to a flat shape as shown in FIG. As a result, the surplus fluid 70a that has flowed moves to the upper peripheral edge of the chip component 16 in an overhanging manner, and is integrated with a crimped periphery.

【００６４】その後は、チップマウンタ２０に反力をと
ってスタンピング治具７４を上昇させ、次いでチップマ
ウンタ２０を上昇させれば、（ｅ）に示すように、実装
作業を完了する。Thereafter, when the stamping jig 74 is raised by applying a reaction force to the chip mounter 20, and then the chip mounter 20 is raised, the mounting operation is completed as shown in FIG.

【００６５】なお、この実施形態においても、図６
（ａ），（ｂ）に示すチップ部品の形状手することが出
来ることは勿論である。また、電極部の厚みがチップ部
品の厚みより薄くても同様に実施できることは勿論であ
る。In this embodiment, FIG.
Of course, the shapes of the chip components shown in FIGS. Further, it goes without saying that the same operation can be performed even when the thickness of the electrode portion is smaller than the thickness of the chip component.

【００６６】[0066]

【発明の効果】以上各実施形態により詳細に説明したよ
うに、この発明にかかる電子部品実装基板にあっては、
電極が端子に加圧接触することによって、電極自体が可
撓変形し、端子に対し機械的、電気的な接続を得られる
ことになるため、従来に比べて半田を使用する必要がな
く、材料費の節減を図ることが出来、半田溶融に伴う、
他の素子に対する熱負荷などの問題も生ずることがない
ため、小形チップ部品や、その他小形電子部品の実装構
造として好適である。As described in detail in the above embodiments, the electronic component mounting board according to the present invention has the following features.
When the electrode comes into pressure contact with the terminal, the electrode itself is flexibly deformed, and mechanical and electrical connection to the terminal can be obtained. The cost can be reduced, and the solder melting
Since there is no problem such as thermal load on other elements, it is suitable as a mounting structure for small chip components and other small electronic components.

【００６７】また、この発明にかかる電子部品実装基板
の製造方法では、電子部品の位置決めと加圧の二段階工
程で実装が完了するため、製造時間も短縮され留などの
利点がある。In the method of manufacturing an electronic component mounting board according to the present invention, mounting is completed in a two-step process of positioning and pressing the electronic component.

【図面の簡単な説明】[Brief description of the drawings]

【図１】この発明によるチップ部品の実装構造を示す分
解斜視図である。FIG. 1 is an exploded perspective view showing a mounting structure of a chip component according to the present invention.

【図２】（ａ）〜（ｄ）は図１の実装構造における実装
方法の第一実施形態を示す断面説明図である。FIGS. 2A to 2D are cross-sectional explanatory views showing a first embodiment of a mounting method in the mounting structure of FIG.

【図３】（ａ）〜（ｃ）は同実装方法の第二実施形態を
示す断面説明図である。FIGS. 3A to 3C are cross-sectional explanatory views showing a second embodiment of the mounting method.

【図４】（ａ），（ｂ）は第二実施形態の変形例を示す
断面説明図である。FIGS. 4A and 4B are cross-sectional explanatory views showing a modification of the second embodiment.

【図５】（ａ），（ｂ）はこの発明による実装方法の第
三実施形態を示す断面説明図である。FIGS. 5A and 5B are cross-sectional views showing a third embodiment of the mounting method according to the present invention.

【図６】（ａ），（ｂ）は、実装持における接続強化を
図ったチップ部品の形状例を示す断面図および斜視図で
ある。FIGS. 6A and 6B are a cross-sectional view and a perspective view showing an example of the shape of a chip component in which connection is strengthened during mounting.

【図７】この発明によるチップ部品の実装構造の他の例
を示す分解斜視図である。FIG. 7 is an exploded perspective view showing another example of a mounting structure of a chip component according to the present invention.

【図８】（ａ）〜（ｅ）は図７における実装構造の実装
方法を示す断面説明図である。8 (a) to 8 (e) are cross-sectional explanatory views showing a mounting method of the mounting structure in FIG. 7;

【符号の説明】[Explanation of symbols]

１０ 基板 １２ 導電パターン １４，５０，７０ 電極部 １６，６０ チップ部品（電子部品） １８，６４ 端子 ２０ チップマウンタ ２２，３０，４０，７４ スタンピング治具 ３０ｂ 段部 ４０ａ 傾斜面 ７６ 位置決め突起 DESCRIPTION OF SYMBOLS 10 Substrate 12 Conductive pattern 14, 50, 70 Electrode part 16, 60 Chip component (electronic component) 18, 64 Terminal 20 Chip mounter 22, 30, 40, 74 Stamping jig 30b Step 40a Inclined surface 76 Positioning protrusion

Claims (16)

【特許請求の範囲】[Claims] 【請求項１】 両端に端子を有する電子部品が基板に搭
載され、基板面から突出し、前記電子部品の端子に加圧
接触させた電極を有することを特徴とする電子部品実装
基板。1. An electronic component mounting board comprising: an electronic component having terminals at both ends mounted on a substrate; and an electrode protruding from a substrate surface and having an electrode pressed into contact with a terminal of the electronic component. 【請求項２】 前記基板の電極は、電子部品の端子と接
触する高い段を有することを特徴とする請求項１に記載
の電子部品実装基板。2. The electronic component mounting board according to claim 1, wherein the electrode of the substrate has a high step that contacts a terminal of the electronic component. 【請求項３】 前記電子部品の端子の前記基板側電極と
の接触面は傾斜しており、基板に接触している前記電子
部品の底面が電子部品の底面より大きい台形状であるこ
とを特徴とする請求項１に記載の電子部品実装基板。3. A contact surface of the terminal of the electronic component with the substrate-side electrode is inclined, and a bottom surface of the electronic component in contact with the substrate has a trapezoidal shape larger than a bottom surface of the electronic component. The electronic component mounting board according to claim 1. 【請求項４】 前記電子部品の端子の前記電極と接触す
る面に凹部または凸部を有することを特徴とする請求項
１に記載の電子部品実装基板。4. The electronic component mounting board according to claim 1, wherein a surface of the terminal of the electronic component that contacts the electrode has a concave portion or a convex portion. 【請求項５】 前記両電極の頂部には上下方向に縦通す
る穴があいていることを特徴とする請求項１に記載の電
子部品実装基板。5. The electronic component mounting board according to claim 1, wherein a hole vertically extending in a vertical direction is formed in a top portion of the two electrodes. 【請求項６】 前記基板の電極は、電子部品の端子と接
触する高い段を有することを特徴とする請求項５に記載
の電子部品実装基板。6. The electronic component mounting board according to claim 5, wherein the electrode of the substrate has a high step in contact with a terminal of the electronic component. 【請求項７】 前記電子部品の端子における前記基板側
電極との接触面は傾斜しており、基板に接触している前
記電子部品の底面が電子部品の底面より大きいことを特
徴とする請求項５に記載の電子部品実装基板。7. A terminal of the electronic component, wherein a contact surface of the terminal with the substrate-side electrode is inclined, and a bottom surface of the electronic component in contact with the substrate is larger than a bottom surface of the electronic component. 6. The electronic component mounting board according to 5. 【請求項８】 前記電子部品の端子の前記電極と接触す
る面に凹部または凸部を有することを特徴とする請求項
５に記載の電子部品実装基板。8. The electronic component mounting board according to claim 5, wherein a concave portion or a convex portion is provided on a surface of the terminal of the electronic component that contacts the electrode. 【請求項９】 基板面から突出した電極を少なくとも２
つ有する基板に、両端に端子を有する電子部品を前記基
板の電極間に搭載し、前記電極を前記端子に対して変形
させて押付けることにより、機械的、電気的接合を行う
ことを特徴とする電子部品実装基板の製造方法。9. At least two electrodes protruding from the substrate surface
Electronic components having terminals at both ends are mounted between the electrodes of the substrate, and the electrodes are deformed and pressed against the terminals to perform mechanical and electrical bonding. Manufacturing method of electronic component mounting board. 【請求項１０】 前記電極は、前記電子部品の端子と接
触する側に高い段を有する電極であって、前記電極の高
い段を前記端子側へ押付けることにより機械的、電気的
接合を行うことを特徴とする請求項９に記載の電子部品
実装基板の製造方法。10. The electrode according to claim 1, wherein the electrode has a high step on a side contacting a terminal of the electronic component, and performs mechanical and electrical bonding by pressing the high step of the electrode toward the terminal. The method of manufacturing an electronic component mounting board according to claim 9, wherein: 【請求項１１】 電子部品と接触する側の近い面にテー
パを有する押しつけ部によって押付けることを特徴とす
る請求項９に記載の電子部品実装基板の製造方法。11. The method of manufacturing an electronic component mounting board according to claim 9, wherein the pressing is performed by a pressing portion having a taper on a surface close to a side contacting the electronic component. 【請求項１２】 前記電極の高さは電子部品の端子より
も高く、前記電極を押付けることにより電子部品の上面
の少なくとも一部を覆うことを特徴とする請求項９に記
載の電子部品実装基板の製造方法。12. The electronic component mounting according to claim 9, wherein a height of the electrode is higher than a terminal of the electronic component, and the electrode is pressed to cover at least a part of an upper surface of the electronic component. Substrate manufacturing method. 【請求項１３】 前記電極の頂面には上下を縦通する穴
があいており、電子部品を基板にマウントした後前記穴
周囲を拡幅させて電極を端子に押付けることを特徴とす
る請求項９に記載の電子部品実装基板の製造方法。13. A top surface of the electrode is provided with a hole extending vertically, and after mounting an electronic component on a substrate, the periphery of the hole is widened and the electrode is pressed to a terminal. Item 10. The method for manufacturing an electronic component mounting board according to Item 9. 【請求項１４】 前記電極は、前記電子部品の端子と接
触する側に高い段を有する電極であって、前記電極の高
い段に上下を縦通する穴が設けられていることを特徴と
する請求項１３に記載の電子部品実装基板の製造方法。14. An electrode having a high step on a side in contact with a terminal of the electronic component, wherein the high step of the electrode is provided with a hole vertically extending vertically. A method for manufacturing the electronic component mounting board according to claim 13. 【請求項１５】 前記電極の高さは電子部品の端子より
も高く、前記穴周囲を拡幅することで電極の変形部分が
電子部品の上面の少なくとも一部を覆うことを特徴とす
る請求項１３に記載の電子部品実装基板の製造方法。15. The electronic device according to claim 13, wherein the height of the electrode is higher than that of the terminal of the electronic component, and the deformed portion of the electrode covers at least a part of the upper surface of the electronic component by widening around the hole. 3. The method for manufacturing an electronic component mounting board according to claim 1. 【請求項１６】 電子部品を保持する設置治具と、設置
治具の両端に設けられた位置決めおよび固定兼用の突起
とを備え、前記突起を前記電極の穴に向けて下降させ
て、電子部品を両電極間に位置決めし、次いで設置治具
を下降させて電子部品のみを両電極間の基板上に設置固
定し、しかる後前記両端突起を前記穴内に挿通した状態
でその頂部を圧着し、電極を拡幅させることを特徴とす
る請求項１３に記載の電子部品実装基板の製造方法。16. An electronic component, comprising: an installation jig for holding an electronic component; and positioning and fixing projections provided at both ends of the installation jig. Is positioned between the two electrodes, and then the installation jig is lowered and only the electronic component is installed and fixed on the substrate between the two electrodes, and then the top is crimped in a state where the both end projections are inserted into the holes, 14. The method for manufacturing an electronic component mounting board according to claim 13, wherein the electrodes are widened.
JP19401296A 1996-07-04 1996-07-04 Electronic component mounting board and manufacture Pending JPH1022602A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19401296A JPH1022602A (en) 1996-07-04 1996-07-04 Electronic component mounting board and manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19401296A JPH1022602A (en) 1996-07-04 1996-07-04 Electronic component mounting board and manufacture

Publications (1)

Publication Number Publication Date
JPH1022602A true JPH1022602A (en) 1998-01-23

Family

ID=16317495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19401296A Pending JPH1022602A (en) 1996-07-04 1996-07-04 Electronic component mounting board and manufacture

Country Status (1)

Country Link
JP (1) JPH1022602A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008084957A (en) * 2006-09-26 2008-04-10 Olympus Corp Mounting structure and mounting method for actuator
JPWO2014192298A1 (en) * 2013-05-30 2017-02-23 富士電機株式会社 Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008084957A (en) * 2006-09-26 2008-04-10 Olympus Corp Mounting structure and mounting method for actuator
JPWO2014192298A1 (en) * 2013-05-30 2017-02-23 富士電機株式会社 Semiconductor device
US9773767B2 (en) 2013-05-30 2017-09-26 Fuji Electric Co., Ltd. Semiconductor device

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