JP2531060B2 - Method for manufacturing printed wiring board - Google Patents
Method for manufacturing printed wiring boardInfo
- Publication number
- JP2531060B2 JP2531060B2 JP4117276A JP11727692A JP2531060B2 JP 2531060 B2 JP2531060 B2 JP 2531060B2 JP 4117276 A JP4117276 A JP 4117276A JP 11727692 A JP11727692 A JP 11727692A JP 2531060 B2 JP2531060 B2 JP 2531060B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pad
- component
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は印刷配線板の製造方法に
関し、特に表面部品実装用のパッドの形状を改良する印
刷配線板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a printed wiring board for improving the shape of pads for mounting surface components.
【０００２】[0002]
【従来の技術】図２（ａ）は従来の印刷配線板の一例に
部品を実装する状態を示す斜視図、同図（ｂ）は従来例
の印刷配線板の要部拡大断面図である。2. Description of the Related Art FIG. 2 (a) is a perspective view showing a state in which components are mounted on an example of a conventional printed wiring board, and FIG. 2 (b) is an enlarged sectional view of a main part of a conventional printed wiring board.
【０００３】従来、この種の印刷配線板は、図２（ａ）
に示すように、印刷配線板本体１１の表面に設けた表面
部品実装用のパッド１３の表面に集積回路などの表面実
装部品２０のリード端子２０ａの先端を面接触で半田付
けする都合上、パッド１３の表面を平面形状で設けて、
図２（ｂ）に示す如く、パッド１３とリード端子２０ａ
とを半田１４で半田付け接続するようになっていた。Conventionally, a printed wiring board of this type is shown in FIG.
As shown in FIG. 2, the pads 13 are provided on the surface of the printed wiring board main body 11 for soldering the tip of the lead terminal 20a of the surface mounting component 20 such as an integrated circuit to the surface of the pad 13 for mounting the surface component by surface contact. The surface of 13 is provided in a plane shape,
As shown in FIG. 2B, the pad 13 and the lead terminal 20a
It was designed to be soldered and connected with the solder 14.
【０００４】[0004]
【発明が解決しようとする課題】前述した従来の印刷配
線板の製造方法では、表面部品実装用のパッドの表面が
平面形状となっているので、部品実装時に部品のリード
端子がパッドの中心部に乗らずにずれを生じ易く、また
半田付け時の半田流れによるパッド間ショートの危険性
があるという欠点がある。In the conventional method of manufacturing a printed wiring board described above, since the surface of the pad for mounting the surface component has a planar shape, the lead terminal of the component is mounted on the center portion of the pad when mounting the component. However, there is a drawback in that a shift easily occurs without riding on the board and there is a risk of short circuit between pads due to a solder flow at the time of soldering.
【０００５】本発明の目的は、このような従来の欠点を
解消する印刷配線板の製造方法を提供することにある。An object of the present invention is to provide a method of manufacturing a printed wiring board which eliminates the above-mentioned conventional drawbacks.
【０００６】[0006]
【課題を解決するための手段】本発明の印刷配線板の製
造方法の構成は、印刷配線板本体上の回路パターンと接
続された表面実装部品用のパッドの表面に、前記表面実
装部品のリード端子の径より大きい凹部を、金型により
押打して形成することを特徴とする。According to the present invention, there is provided a method for producing a printed wiring board, comprising: a surface of a pad for a surface mounting component connected to a circuit pattern on a printed wiring board main body; It is characterized in that a recess larger than the diameter of the terminal is formed by pressing with a die.
【０００７】[0007]
【実施例】次に本発明について図面を参照して説明す
る。The present invention will be described below with reference to the drawings.
【０００８】図１（ａ）は本発明の一実施例の印刷配線
板の製造方法で製作した印刷配線板を示す斜視図であ
る。図１（ｂ）は図１（ａ）の印刷配線板に部品を実装
する状態を示す斜視図、図１（ｃ）は部品をパッドに半
田付けした状態を示す断面図である。FIG. 1A is a perspective view showing a printed wiring board manufactured by the method for manufacturing a printed wiring board according to an embodiment of the present invention. FIG. 1B is a perspective view showing a state where components are mounted on the printed wiring board of FIG. 1A, and FIG. 1C is a sectional view showing a state where components are soldered to pads.
【０００９】図１（ａ）において、本実施例では、印刷
配線板本体１の主面上の回路パターン２に接続されたパ
ッド３に、押打により、凹部３ａを形成する。In FIG. 1A, in this embodiment, a recess 3a is formed by pressing on a pad 3 connected to a circuit pattern 2 on a main surface of a printed wiring board body 1.
【００１０】本実施例においては、従来のエッチング手
段により印刷配線板本体１の表面に、回路パターン２の
形成と同時に表面部品実装用の複数個のパッド３を形成
した後、外形加工時のプレス金型等によりパッド３の表
面を軽く押打させ、パッド３の表面中心部に四角形の凹
部３ａを設ける。In this embodiment, a plurality of pads 3 for mounting surface components are formed simultaneously with the formation of the circuit pattern 2 on the surface of the printed wiring board main body 1 by the conventional etching means, and then a press is applied at the time of outer shape processing. The surface of the pad 3 is lightly pressed by a die or the like to form a rectangular recess 3a in the center of the surface of the pad 3.
【００１１】このような構成の本実施例によれば、図１
（ｂ）に示すように、逆Ｌ字状のリード端子２０ａを有
する表面実装部品２０を印刷配線板本体１の上方から実
装して行くと、図１（ｃ）に示すように、表面実装部品
２０のリード端子２０ａの先端部が、パッド３の表面に
設けられた凹部３ａ内に位置合せ挿入され、その後、半
田４で半田付け接続を行うことにより、確実な部品実装
を行うことができる。According to this embodiment having such a configuration, as shown in FIG.
As shown in FIG. 1B, when the surface mount component 20 having the inverted L-shaped lead terminals 20a is mounted from above the printed wiring board body 1, as shown in FIG. The tip end portion of the lead terminal 20a of 20 is aligned and inserted into the concave portion 3a provided on the surface of the pad 3, and thereafter, soldering connection is performed with the solder 4, so that reliable component mounting can be performed.
【００１２】なお、本実施例では、パット３の凹部３ａ
の形状を四角形で例示したが、表面実装部品２０のリー
ド端子２０ａの形状に応じて円形または三角形などにし
てもよいことはもちろんである。In this embodiment, the recess 3a of the pad 3 is used.
Although the shape is illustrated as a quadrangle, it is needless to say that the shape may be a circle or a triangle depending on the shape of the lead terminal 20a of the surface mount component 20.
【００１３】[0013]
【発明の効果】以上説明したように、本発明は、印刷配
線板の表面部品実装用のパッドの表面に凹部を設けるこ
とにより、次のような効果が得られる。As described above, according to the present invention, the following effects can be obtained by providing the concave portion on the surface of the pad for mounting the surface component of the printed wiring board.
【００１４】（ｉ）表面実装部品のリード端子が、パッ
ド中心部に正確に接続できる。(I) The lead terminal of the surface mount component can be accurately connected to the center of the pad.
【００１５】（ｉｉ）部品実装時に半田がパッドの凹部
に溜まるので、半田付け性が向上すると共にパッド間シ
ョートの危険性が無くなる。また、表面が平面形状のパ
ッドに比べてリード端子との接触面積が大きくなるの
で、接続信頼性が向上する。(Ii) Solder collects in the recesses of the pads during component mounting, so that solderability is improved and the risk of short-circuiting between pads is eliminated. Further, since the contact area with the lead terminal is larger than that of the pad having a flat surface, the connection reliability is improved.
【００１６】（ｉｉｉ）パッド表面の凹部にリード端子
が挿入された状態になるため、部品の実装高さを低くで
きる。(Iii) Since the lead terminals are inserted in the recesses on the pad surface, the mounting height of the component can be reduced.
【００１７】（ｉｖ）凹部の形成のために、新たに製造
工程を追加する必要がなく、従って、製造コストがアッ
プする心配がない。本発明では、印刷配線板本体の外形
加工用のプレス金型内に、凹部形成のための金型を設定
できるから、なんら工程追加につながらない。(Iv) It is not necessary to newly add a manufacturing process for forming the recess, and therefore, there is no concern that the manufacturing cost will increase. In the present invention, since a die for forming the recess can be set in the press die for external processing of the printed wiring board body, no additional process is required.
【００１８】（ｖ）軽く一回押打するだけで、凹部を形
成できるから、レジスト膜形成や、エッチング除去，洗
浄等のような多数の工程を追加する必要がない。(V) Since the recess can be formed by only one light pressing, it is not necessary to add many steps such as resist film formation, etching removal, and cleaning.
【００１９】（ｖｉ）凹部内の側面だけでなく、底面ま
でも、溶融した半田とよくなじむため、電気的及び機械
的接続関係が良好である。(Vi) Since not only the side surface in the recess but also the bottom surface is well compatible with the melted solder, the electrical and mechanical connection relationship is good.
【図１】（ａ），（ｂ），（ｃ）は本発明の一実施例の
印刷配線板の製造方法により製作された印刷配線板を示
す斜視図、この印刷配線板に部品を実装する状態を示す
斜視図およびその部品を半田付けした状態を示す断面
図。1A, 1B, and 1C are perspective views showing a printed wiring board manufactured by a method for manufacturing a printed wiring board according to an embodiment of the present invention, and components are mounted on the printed wiring board. The perspective view which shows a state, and sectional drawing which shows the state which soldered the component.
【図２】（ａ），（ｂ）は従来の印刷配線板の一例に部
品を実装する状態を示す斜視図およびその印刷配線板の
要部拡大断面図である。2 (a) and 2 (b) are a perspective view showing a state in which components are mounted on an example of a conventional printed wiring board and an enlarged sectional view of an essential part of the printed wiring board.
１，１１ 印刷配線板本体 ２ 回路パターン ３，１３ パッド ３ａ 凹部 ４，１４ 半田 ２０ 表面実装部品 ２０ａ リード端子 1,11 Printed wiring board body 2 Circuit pattern 3,13 Pad 3a Recess 4,4 Solder 20 Surface mount component 20a Lead terminal
Claims (1)
と同時に表面部品実装用の複数個のパッドを形成した
後、前記パッドの表面に、前記表面実装部品のリード端
子の径より大きい凹部を、外形加工時のプレス金型によ
り押打して形成することを特徴とする印刷配線板の製造
方法。1. A formation of circuit patterns in the printed circuit board on the body
Simultaneously formed multiple pads for mounting surface components
Then, a method of manufacturing a printed wiring board, characterized in that a recess larger than the diameter of the lead terminal of the surface-mounted component is formed on the surface of the pad by pressing with a pressing die during external processing .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4117276A JP2531060B2 (en) | 1992-05-11 | 1992-05-11 | Method for manufacturing printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4117276A JP2531060B2 (en) | 1992-05-11 | 1992-05-11 | Method for manufacturing printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07193364A JPH07193364A (en) | 1995-07-28 |
| JP2531060B2 true JP2531060B2 (en) | 1996-09-04 |
Family
ID=14707752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4117276A Expired - Lifetime JP2531060B2 (en) | 1992-05-11 | 1992-05-11 | Method for manufacturing printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2531060B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5094476A (en) * | 1973-11-28 | 1975-07-28 | ||
| US4351580A (en) * | 1980-05-15 | 1982-09-28 | Augat Inc. | Carrier socket for leadless integrated circuit devices |
| JPS5941209A (en) * | 1982-08-31 | 1984-03-07 | 松下電工株式会社 | Decorative veneer and its manufacture |
-
1992
- 1992-05-11 JP JP4117276A patent/JP2531060B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07193364A (en) | 1995-07-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960423 |